5962-8670401V2A [ETC]
SMPS Controller ; SMPS控制器\n
| 型号： | 5962-8670401V2A |
| 厂家： | 
ETC |
| 描述： | SMPS Controller
|
| 文件： | 总18页 (文件大小：88K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
REVISIONS
LTR
A
DESCRIPTION
DATE (YR-MO-DA)
87-04-16
APPROVED
M. A. Frye
Add vendor CAGE 34333. Add vendor CAGE U4637. Editorial changes
throughout.
B
C
Add device types 02, 03, and 04. Editorial changes throughout.
87-12-21
89-10-10
M. A. Frye
M. A. Frye
Change vendor CAGE 12969 to 48726. Change max duty cycle min limit. Add
vendor CAGE U4637 for additional devices, also change name form Integrated
Power to Seagate Microelectronics. Add vendor CAGE 34333 for additional
devices. Add testing for delay to output, rise time, and fall time tests. Editorial
changes throughout.
D
E
Add packages C, E, F, 2, H, and X. Changes unity gain bandwidth limit.
Editorial changes throughout.
92-11-23
93-09-10
M. A. Frye
M. A. Frye
Add device types 05, 06, 07, and 08. Add vendor CAGE 48726 for device type
05, 06, 07, and 08. Changes to table I electricals. Delete vendor CAGE U4637
from drawing. Add vendor CAGE U3158. Editorial changes throughout.
F
G
H
Changes in accordance with NOR 5962-R146-94.
Changes in accordance with NOR 5962-R251-97.
94-05-17
97-03-19
00-11-08
M. A. Frye
M. A. Frye
R. Monnin
Change vendor CAGE 48726 to 01295. Add class V for vendor CAGE 01295. .
Editorial changes throughout. – lgt
J
01-10-10
02-05-30
R. Monnin
R. Monnin
Correction to the V
MIN
changes throughout. - rrp
limit in table I for device types 03 and 06. Editorial
K
Add case outline D. - ro
CURRENT CAGE CODE 67268
THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED.
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OF SHEETS
PMIC N/A
REV
K
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PREPARED BY
DONALD R. OSBORNE
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216
CHECKED BY
D. A. DiCENZO
STANDARD
MICROCIRCUIT
DRAWING
http://www.dscc.dla.mil
APPROVED BY
N. A. HAUCK
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
MICROCIRCUIT, LINEAR, PROGRAMMABLE
PRIMARY SIDE PULSE WIDTH MODULATOR,
MONOLITHIC SILICON
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
DRAWING APPROVAL DATE
86-11-10
AMSC N/A
REVISION LEVEL
K
SIZE
A
CAGE CODE
5962-86704
14933
SHEET
1
OF
13
DSCC FORM 2233
APR 97
5962-E410-02
DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.
1. SCOPE
1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and
M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the
Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the
PIN.
1.2 PIN. The PIN is as shown in the following examples.
For device classes M and Q:
5962
-
86704
01
C
X
Federal
stock class
designator
\
RHA
designator
(see 1.2.1)
Device
type
(see 1.2.2)
Case
outline
(see 1.2.4)
Lead
finish
(see 1.2.5)
/
\/
Drawing number
For device class V:
5962
-
86704
01
V
C
X
RHA
designator
(see 1.2.1)
Federal
Device
type
(see 1.2.2)
Device
class
designator
(see 1.2.3)
Case
outline
(see 1.2.4)
Lead
finish
(see 1.2.5)
stock class
designator
\
/
\/
Drawing number
1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and
are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A
specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device type(s). The device type(s) identify the circuit function as follows:
Device type
Generic number
Circuit function
01
02
03
04
05
06
07
08
1842
1843
1844
1845
1842A
1843A
1844A
1845A
Off-line current mode pulse width modulator controller
Off-line current mode pulse width modulator controller
Off-line current mode pulse width modulator controller
Off-line current mode pulse width modulator controller
Off-line current mode pulse width modulator controller
Off-line current mode pulse width modulator controller
Off-line current mode pulse width modulator controller
Off-line current mode pulse width modulator controller
SIZE
STANDARD
5962-86704
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
SHEET
K
2
DSCC FORM 2234
APR 97
1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as listed
below. Since the device class designator has been added after the original issuance of this drawing, device classes M and Q
designators will not be included in the PIN and will not be marked on the device.
Device class
M
Device requirements documentation
Vendor self-certification to the requirements for MIL-STD-883 compliant,
non-JAN class level B microcircuits in accordance with MIL-PRF-38535,
appendix A
Q or V
Certification and qualification to MIL-PRF-38535
1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
Descriptive designator
Terminals
Package style
C
D
E
F
H
P
X
2
GDIP1-T14 or CDIP2-T14
GDFP1-F14 or CDFP2-F14
GDIP1-T16 or CDIP2-T16
GDFP2-F16 or CDFP3-F16
GDFP1-F10 or CDFP2-F10
GDIP1-T8 or CDIP2-T8
CQCC1-N20
14
14
16
16
10
8
Dual-in-line
Flat pack
Dual-in-line
Flat pack
Flat pack
Dual-in-line
Square leadless chip carrier (see figure 1)
Square leadless chip carrier (see figure 1)
20
20
CQCC1-N20
1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535,
appendix A for device class M.
1.3 Absolute maximum ratings. 1/ 2/ 3/
Supply voltage (V ) .................................................................................. 30 V
CC
Output current ............................................................................................. 1.0 A
Output energy (capacitance load) ............................................................... 5.0 µ j
Analog input voltage (pins 2 and 3) ............................................................ -0.3 V to +6.3 V
Error amplifier output sink current ............................................................... 10 mA
Power dissipation (P )(T = +25°C):
D
A
Cases C, E, F, H, P, X, and 2 .................................................................. 1.0 W 4/
Case D .................................................................................................... 700 mW 4/
Storage temperature range ......................................................................... -65°C to +150°C
Lead temperature (soldering, 10 seconds) ................................................. +300°C
Junction temperature (T ) ........................................................................... +150°C
J
Thermal resistance, junction-to-case (θJC) ................................................ See MIL-STD-1835
1.4 Recommended operating conditions.
Supply voltage (V ) .................................................................................. +15 V 5.0 percent
CC
Ambient operating temperature range (T ) ................................................ -55°C to +125°C
A
1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
2/ All voltages are with respect to ground, and all currents are positive when flowing into the specified terminal.
3/ All references to pin numbers are for case outline P.
4/ Derate at 8.0 mW/°C above T = +25°C for case P, 10 mW/°C above T = +50°C for cases C and E,
A
A
5.5 mW/°C above T = +25°C for case D, 8.7 mW/°C above T = +25°C for case F,
A
A
9.0 mW/°C above T = +40°C for cases 2 and X, and 6.9 mW/°C above T = +25°C for case H.
A
A
SIZE
STANDARD
5962-86704
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
SHEET
K
3
DSCC FORM 2234
APR 97
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a
part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in
the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the
solicitation.
SPECIFICATION
DEPARTMENT OF DEFENSE
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
STANDARDS
DEPARTMENT OF DEFENSE
MIL-STD-883
-
Test Method Standard Microcircuits.
MIL-STD-1835 - Interface Standard Electronic Component Case Outlines.
HANDBOOKS
DEPARTMENT OF DEFENSE
MIL-HDBK-103 - List of Standard Microcircuit Drawings.
MIL-HDBK-780 - Standard Microcircuit Drawings.
(Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with
MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The
modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for
device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified
herein.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M.
3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.
3.2.3 Logic diagram. The logic diagram shall be as specified on figure 2.
3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the
electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full
ambient operating temperature range.
SIZE
STANDARD
5962-86704
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
SHEET
K
4
DSCC FORM 2234
APR 97
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical
tests for each subgroup are defined in table I.
3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be
marked as listed in MIL-HDBK-103. For packages where marking of the entire SMD PIN number is not feasible due to space
limitations, the manufacturer has the option of not marking the "5962-" on the device. For RHA product using this option, the
RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535.
Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A.
3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in
MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535, appendix A.
3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535
listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of
compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see
6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this
drawing shall affirm that the manufacturer's product meets, for device classes Q and V, the requirements of MIL-PRF-38535
and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein.
3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for
device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing.
3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2
herein) involving devices acquired to this drawing is required for any change as defined in MIL-PRF-38535, appendix A.
3.9 Verification and review for device class M. For device class M, DSCC, DSCC's agent, and the acquiring activity retain
the option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made
available onshore at the option of the reviewer.
3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in
microcircuit group number 110 (see MIL-PRF-38535, appendix A).
SIZE
STANDARD
5962-86704
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
SHEET
K
5
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics.
Conditions 1/
-55°C ≤ T ≤ +125°C
Group A
subgroups
Device
type
Limits
Max
Unit
A
Test
Symbol
unless otherwise specified
Min
REFERENCE SECTION
Reference output voltage
1
All
All
All
All
4.95
5.05
20
V
mV
mV
V
V
I = 1.0 mA, T = +25°C
O J
REF
Line regulation
Load regulation
1, 2, 3
1, 2, 3
1, 2, 3
V
12 V ≤ V ≤ 25 V
IN
RLINE
RLOAD
25
V
1.0 mA ≤ I ≤ 20 mA
O
Line, load, and
4.90
5.10
Total output variation
temperature
2/
2
All
All
25
mV
mA
T = +125°C, 1000 hours,
A
Long term stability
2/
V
REF
Output short-circuit current
1, 2, 3
-30
47
-180
I
OS
OSCILLATOR SECTION
Initial accuracy
4
4, 5, 6
1
All
All
All
57
1.0
8.8
kHz
%
T = +25°C
J
3/
Voltage stability
12 V ≤ V
≤ 25 V
CC
Discharge current
7.8
7.5
mA
V
RT/CT
= 2 V Device types
05, 06, 07, and 08
2, 3
8.8
ERROR AMP SECTION
Input voltage
1, 2, 3
1, 2, 3
4, 5, 6
4, 5, 6
4, 5, 6
1, 2, 3
All
All
All
All
All
All
2.45
2.55
-1.0
V
V
V
= 2.5 V
IN
COMP
Input bias current
µA
dB
I
IB
Open loop voltage gain
Unity gain bandwidth
65
0.55
60
A
VOL
2.0 V ≤ V ≤ 4.0 V
O
GBW
2/
MHz
dB
Power supply rejection
ratio
Output sink current
PSRR
12 V ≤ V
≤ 25 V
CC
2.0
mA
I
I
V
V
V
V
V
= 2.7 V,
SINK
VFB
= 1.1 V
COMP
Output source current
1, 2, 3
All
-0.5
5.0
mA
= 2.3 V,
SOURCE
VFB
= 5.0 V
COMP
1, 2, 3
1, 2, 3
All
All
V
V
V
V
high
low
V
V
= 2.3 V, R = 15 kΩ
VFB L
OUT
OH
to ground
1.1
V
VFB
= 2.7 V, R = 15 kΩ
OUT
OL
L
to V
REF
See footnotes at end of table.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-86704
A
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
SHEET
K
6
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics – Continued.
Conditions 1/
-55°C ≤ T ≤ +125°C
Group A
subgroups
Device
type
Limits
Max
Unit
A
Test
Symbol
unless otherwise specified
Min
CURRENT SENSE SECTION
Gain
A
4/ 5/
4, 5, 6
4, 5, 6
1, 2, 3
9
All
All
All
All
2.85
0.9
3.15
1.1
V/V
V
Maximum input signal
Input bias current
Delay to output
V
COMP
= 5.0 V
4/
-10
µA
I
IB
300
400
ns
T
D
V
V
= 0 V,
2/
VFB
10, 11
= 2 V (step input)
ISENSE
OUTPUT SECTION
Output low voltage
1, 2, 3
1, 2, 3
All
All
All
All
All
0.4
2.2
V
V
V
V
I
I
I
I
= 20 mA
SINK
OL
= 200 mA
SINK
Output high voltage
Rise time
13
12
= 20 mA
OH
SOURCE
SOURCE
= 200 mA
9
150
200
150
200
1.2
ns
ns
V
t
t
C = 1000 pF
2/
2/
r
f
L
10, 11
9
Fall time
C = 1000 pF
L
10, 11
1, 2, 3
UVLO saturation voltage
UVLO
V
= 5 V, I = 10 mA,
SINK
SAT
CC
Device types 05, 06, 07,
and 08.
UNDER-VOLTAGE LOCKOUT SECTION
Start threshold
1, 2, 3
1, 2, 3
01, 03
05, 07
02, 04
06, 08
01
15
7.8
9.0
7.0
7.0
17
9.0
11
V
V
V
TH
Minimum operating
voltage
After turn-on
V
MIN
05, 03
06
8.2
8.3
07, 08
02, 04
See footnotes at end of table.
SIZE
STANDARD
5962-86704
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
SHEET
K
7
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics – Continued.
Conditions 1/
-55°C ≤ T ≤ +125°C
Group A
subgroups
Device
type
Limits
Max
Unit
A
Test
Symbol
unless otherwise specified
Min
PWM SECTION
Maximum duty cycle
1, 2, 3
1, 2, 3
01, 02
05, 06
93
46
100
%
%
t
t
/
ON
OSC
(max)
03, 04
07, 08
All
50
0
Minimum duty cycle
t
t
/
ON
OSC
(min)
TOTAL STANDBY CURRENT
Start-up current
1, 2, 3
1, 2, 3
All
All
1.0
17
mA
mA
I
I
START
CC
Operating supply current
V
VFB
= V
= 0 V
ISENSE
1/ T = T . Characteristics apply at V
= 15 V (adjust V
above the start threshold before setting at 15 V),
CC
A
J
CC
R = 10 kΩ and C = 3.3 nF unless otherwise specified.
T
T
2/ These parameters are guaranteed if not tested.
3/ Output frequency equals oscillator frequency for device types 01, 02, 05, and 06. Output frequency is one half oscillator
frequency for device types 03, 04, 07, and 08.
4/ Parameter measured at trip point of latch with V = 0 V.
FB
5/ Gain is defined as :
∆VCOMP
∆VSENSE
A =
; 0 V ≤ V
≤ 0.8 V
ISENSE
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-86704
A
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
SHEET
K
8
DSCC FORM 2234
APR 97
Device types
Case outlines
All
All
H
All
P
01, 02
2
03, 04
2
All
X
C and D
Terminal
number
Terminal symbol
1
2
COMP
NC
COMP
COMP
NC
COMP
NC
NC
NC
NC
COMP
NC
V
FB
V
FB
I
SENSE
3
COMP
NC
V
FB
I
SENSE
4
NC
NC
NC
R /C
R /C
T T
T
T
5
POWER GND
GROUND
GROUND
OUTPUT
I
V
V
V
FB
SENSE
NC
FB
FB
6
NC
NC
NC
7
OUTPUT
R /C
V
I
I
I
T
T
CC
SENSE
NC
SENSE
SENSE
NC
8
POWER GND
GROUND
V
C
V
REF
R /C
T T
9
---
NC
NC
NC
NC
NC
V
CC
10
11
12
13
14
15
16
17
18
19
20
OUTPUT
---
---
---
---
---
---
---
---
---
---
---
V
REF
R /C
T
R /C
T T
T
---
NC
NC
V
C
---
---
---
---
---
---
---
---
---
GROUND
NC
POWER GND POWER GND
V
CC
NC
GROUND
NC
GROUND
NC
NC
V
REF
---
OUTPUT
NC
OUTPUT
NC
OUTPUT
NC
---
---
---
---
---
V
CC
V
C
V
C
NC
NC
V
CC
V
CC
NC
NC
V
REF
V
REF
V
REF
NOTE : Case outlines E and F are not available from an approved source.
NC = No connect.
FIGURE 1. Terminal connections.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-86704
A
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
SHEET
K
9
DSCC FORM 2234
APR 97
NOTE : Toggle flip flop used only in device types 03, 04, 07, and 08.
FIGURE 2. Logic diagram.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-86704
A
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
SHEET
K
10
DSCC FORM 2234
APR 97
4. QUALITY ASSURANCE PROVISIONS
4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with
MIL-PRF-38535 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan
shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be
in accordance with MIL-PRF-38535, appendix A.
4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted
on all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in
accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection.
4.2.1 Additional criteria for device class M.
a. Burn-in test, method 1015 of MIL-STD-883.
(1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision
level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall
specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in
test method 1015.
(2) T = +125°C, minimum.
A
b. Interim and final electrical test parameters shall be as specified in table II herein.
4.2.2 Additional criteria for device classes Q and V.
a. The burn-in test duration, test condition and test temperature, or approved alternatives shall be as specified in the
device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained under
document revision level control of the device manufacturer's Technology Review Board (TRB) in accordance with
MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall
specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test
method 1015 of MIL-STD-883.
b. Interim and final electrical test parameters shall be as specified in table II herein.
c. Additional screening for device class V beyond the requirements of device class Q shall be as specified in
MIL-PRF-38535, appendix B.
4.3 Qualification inspection for device classes Q and V. Qualification inspection for device classes Q and V shall be in
accordance with MIL-PRF-38535. Inspections to be performed shall be those specified in MIL-PRF-38535 and herein for
groups A, B, C, D, and E inspections (see 4.4.1 through 4.4.4).
4.4 Conformance inspection. Technology conformance inspection for classes Q and V shall be in accordance with
MIL-PRF-38535 including groups A, B, C, D, and E inspections and as specified herein. Quality conformance inspection for
device class M shall be in accordance with MIL-PRF-38535, appendix A and as specified herein. Inspections to be performed
for device class M shall be those specified in method 5005 of MIL-STD-883 and herein for groups A, B, C, D, and E inspections
(see 4.4.1 through 4.4.4).
4.4.1 Group A inspection.
a. Tests shall be as specified in table II herein.
b. Subgroups 7 and 8 in table I, method 5005 of MIL-STD-883 shall be omitted.
SIZE
STANDARD
5962-86704
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
SHEET
K
11
DSCC FORM 2234
APR 97
TABLE II. Electrical test requirements.
Test requirements
Subgroups
Subgroups
(in accordance with
(in accordance with
MIL-STD-883,
MIL-PRF-38535, table III)
method 5005, table I)
Device
class M
Device
class Q
Device
class V
Interim electrical
parameters (see 4.2)
---
---
---
Final electrical
parameters (see 4.2)
1, 2, 3, 4
1/
1, 2, 3, 4
1/
1, 2, 3, 4 1/
Group A test
requirements (see 4.4)
1, 2, 3, 4, 5, 6,
9, 10, 11 2/
1, 2, 3, 4, 5, 6,
9, 10, 11 2/
1, 2, 3, 4, 5, 6,
9, 10, 11 2/
Group C end-point electrical
parameters (see 4.4)
1
1
1
Group D end-point electrical
parameters (see 4.4)
1
1
1
Group E end-point electrical
parameters (see 4.4)
---
---
---
1/ PDA applies to subgroup 1.
2/ Subgroups 9, 10, and 11 are guaranteed if not tested to the limits specified in table I.
4.4.2 Group C inspection. The group C inspection end-point electrical parameters shall be as specified in table II herein.
4.4.2.1 Additional criteria for device class M. Steady-state life test conditions, method 1005 of MIL-STD-883:
a. Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level
control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify
the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method
1005 of MIL-STD-883.
b. T = +125°C, minimum.
A
c. Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883.
4.4.2.2 Additional criteria for device classes Q and V. The steady-state life test duration, test condition and test temperature,
or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The
test circuit shall be maintained under document revision level control by the device manufacturer's TRB in accordance with
MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify
the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1005 of
MIL-STD-883.
SIZE
STANDARD
5962-86704
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
SHEET
K
12
DSCC FORM 2234
APR 97
4.4.3 Group D inspection. The group D inspection end-point electrical parameters shall be as specified in table II herein.
4.4.4 Group E inspection. Group E inspection is required only for parts intended to be marked as radiation hardness
assured (see 3.5 herein).
a. End-point electrical parameters shall be as specified in table II herein.
b. For device classes Q and V, the devices or test vehicle shall be subjected to radiation hardness assured tests as
specified in MIL-PRF-38535 for the RHA level being tested. For device class M, the devices shall be subjected to
radiation hardness assured tests as specified in MIL-PRF-38535, appendix A for the RHA level being tested. All
device classes must meet the postirradiation end-point electrical parameter limits as defined in table I at
T = +25°C 5°C, after exposure, to the subgroups specified in table II herein.
A
c. When specified in the purchase order or contract, a copy of the RHA delta limits shall be supplied.
5. PACKAGING
5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535 for device
classes Q and V or MIL-PRF-38535, appendix A for device class M.
6. NOTES
6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications
(original equipment), design applications, and logistics purposes.
6.1.1 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a
contractor-prepared specification or drawing.
6.2 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for
the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal.
6.3 Record of users. Military and industrial users should inform Defense Supply Center Columbus when a system
application requires configuration control and which SMD's are applicable to that system. DSCC will maintain a record of users
and this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering
microelectronic devices (FSC 5962) should contact DSCC-VA, telephone (614) 692-0544.
6.4 Comments. Comments on this drawing should be directed to DSCC-VA, Columbus, Ohio 43216-5000, or telephone
(614) 692-0547.
6.5 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein are defined in
MIL-PRF-38535 and MIL-HDBK-1331.
6.6 Sources of supply.
6.6.1 Sources of supply for device classes Q and V. Sources of supply for device classes Q and V are listed in QML-38535.
The vendors listed in QML-38535 have submitted a certificate of compliance (see 3.6 herein) to DSCC-VA and have agreed to
this drawing.
6.6.2 Approved sources of supply for device class M. Approved sources of supply for class M are listed in MIL-HDBK-103.
The vendors listed in MIL-HDBK-103 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has been
submitted to and accepted by DSCC-VA.
SIZE
STANDARD
5962-86704
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
SHEET
K
13
DSCC FORM 2234
APR 97
STANDARD MICROCIRCUIT DRAWING BULLETIN
DATE: 02-05-30
Approved sources of supply for SMD 5962-86704 are listed below for immediate acquisition information only and
shall be added to MIL-HDBK-103 and QML-38535 during the next revision. MIL-HDBK-103 and QML-38535 will be
revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a
certificate of compliance has been submitted to and accepted by DSCC-VA. This bulletin is superseded by the next
dated revision of MIL-HDBK-103 and QML-38535.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
similar
PIN 2/
5962-8670401CA
5962-8670401DA
5962-8670401EA
5962-8670401FA
5962-8670401HA
5962-8670401PA
34333
01295
3/
SG1842J/883B
UC1842W/883B
SG1842J/883B
SG1842F/883B
SG1842F/883B
UC1842J/883B
SG1842Y/883B
IP1842J/883B
UC1842L/883B
SG1842L/883B
UC1842JQMLV
UC1842LQMLV
SG1843J/883B
UC1843W/883B
SG1843J/883B
SG1843F/883B
3/
34333
01295
34333
U3158
01295
34333
01295
01295
34333
01295
3/
5962-8670401XA
5962-86704012A
5962-8670401VPA
5962-8670401V2A
5962-8670402CA
5962-8670402DA
5962-8670402EA
5962-8670402FA
3/
See footnotes at end of table.
1 of 5
STANDARD MICROCIRCUIT DRAWING BULLETIN – Continued.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
similar
PIN 2/
5962-8670402HA
5962-8670402PA
34333
01295
34333
U3158
01295
34333
01295
01295
34333
01295
3/
SG1843F/883B
UC1843J/883B
SG1843Y/883B
IP1843J/883B
UC1843L/883B
SG1843L/883B
UC1843JQMLV
UC1843LQMLV
SG1844J/883B
UC1844W/883B
SG1844J/883B
SG1844F/883B
SG1844F/883B
UC1844J/883B
SG1844Y/883B
IP1844J/883B
UC1844L/883B
SG1844L/883B
UC1844JQMLV
UC1844LQMLV
5962-8670402XA
5962-86704022A
5962-8670402VPA
5962-8670402V2A
5962-8670403CA
5962-8670403DA
5962-8670403EA
5962-8670403FA
5962-8670403HA
5962-8670403PA
3/
34333
01295
34333
U3158
01295
34333
01295
01295
5962-8670403XA
5962-86704032A
5962-8670403VPA
5962-8670403V2A
See footnotes at end of table.
2 of 5
STANDARD MICROCIRCUIT DRAWING BULLETIN – Continued.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
similar
PIN 2/
5962-8670404CA
5962-8670404DA
5962-8670404EA
5962-8670404FA
5962-8670404HA
5962-8670404PA
34333
01295
3/
SG1845J/883B
UC1845W/883B
SG1845J/883B
SG1845F/883B
SG1845F/883B
UC1845J/883B
SG1845Y/883B
IP1845J/883B
3/
34333
01295
34333
U3158
01295
34333
01295
01295
01295
01295
01295
01295
5962-8670404XA
5962-86704042A
5962-8670404VPA
5962-8670404V2A
5962-8670405PA
5962-8670405XA
5962-8670405VPA
5962-8670405V2A
UC1845L/883B
SG1845L/883B
UC1845JQMLV
UC1845LQMLV
UC1842AJ/883B
UC1842AL/883B
UC1842AJQMLV
UC1842ALQMLV
See footnotes at end of table.
3 of 5
STANDARD MICROCIRCUIT DRAWING BULLETIN – Continued.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
similar
PIN 2/
5962-8670406PA
5962-8670406XA
5962-8670406VPA
5962-8670406V2A
5962-8670407PA
5962-8670407XA
5962-8670407VPA
5962-8670407V2A
5962-8670408PA
5962-8670408XA
5962-8670408VPA
5962-8670408V2A
01295
01295
01295
01295
01295
01295
01295
01295
01295
01295
01295
01295
UC1843AJ/883B
UC1843AL/883B
UC1843AJQMLV
UC1843ALQMLV
UC1844AJ/883B
UC1844AL/883B
UC1844AJQMLV
UC1844ALQMLV
UC1845AJ/883B
UC1845AL/883B
UC1845AJQMLV
UC1845ALQMLV
1/ The lead finish shown for each PIN representing
a hermetic package is the most readily available
from the manufacturer listed for that part. If the
desired lead finish is not listed contact the vendor
to determine its availability.
2/ Caution. Do not use this number for item
acquisition. Items acquired to this number may not
satisfy the performance requirements of this drawing.
3/ Not available from an approved source of supply.
4 of 5
STANDARD MICROCIRCUIT DRAWING BULLETIN – Continued.
Vendor CAGE
number
Vendor name
and address
01295
Texas Instruments, Incorporated
Semiconductor Group
8505 Forest Lane
P.O. Box 660199
Dallas, TX 75243
Point of contact: U.S. Highway 75 South
P.O. Box 84, M/S 853
Sherman, TX 75090-0084
34333
U3158
Microsemi Integrated Products
11861 Western Avenue
Garden Grove, CA 92641-1816
Semelab PLC
Coventry Road, Lutterworth,
Leicestershire LE174JB
United Kingdom
Point of contact : Martinez & Associates
234 Boston Post Road
Wayland, MA 01778
The information contained herein is disseminated for convenience only and the
Government assumes no liability whatsoever for any inaccuracies in the
information bulletin.
5 of 5
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