5962-8757910XA [ETC]
Transceiver ; 收发器\n
| 型号： | 5962-8757910XA |
| 厂家： | 
ETC |
| 描述： | Transceiver
|
| 文件： | 总17页 (文件大小：76K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
REVISIONS
LTR
A
DESCRIPTION
DATE (YR-MO-DA)
88-05-11
APPROVED
M. A. FRYE
Changes in table I: Page 4, input offset voltage should read +V
= 3.5 V,
= -32.5 V. Page 5, gain error, reference subgroups 4, 5, 6, as separate
CC
-V
CC
tests. Temperature limits +V
= 32.5 V should be .06 instead of .02.
CC
Page 6, changes acquisition parameters. Page 10, add replacement military
specification part number. Inactivate drawing for new design.
Editorial changes throughout.
B
C
Changes in accordance with N.O.R. 5962-R313-92.
92-10-08
94-04-19
M. A. FRYE
M. A. FRYE
Add generic part number 5537 as device type 02. Add vendor CAGE 18324.
Add case outline letter P. Make changes to 1.2.1, 1.2.2, 1.3, TABLE I, and
FIGURE 1. Redrawn.
D
Add device class level Q and V devices. Add case outline letter Z. Make
changes to 1.2.2, 1.3, figure 1, table II, and the gain error test as specified in
table I. - ro
01-05-25
R. MONNIN
THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED.
REV
SHEET
REV
D
D
SHEET
15
16
REV STATUS
OF SHEETS
PMIC N/A
REV
D
1
D
2
D
3
D
4
D
5
D
6
D
7
D
8
D
9
D
D
D
D
D
SHEET
10
11
12
13
14
PREPARED BY
MARCIA B. KELLEHER
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216
CHECKED BY
RAY MONNIN
STANDARD
MICROCIRCUIT
DRAWING
http://www.dscc.dla.mil
APPROVED BY
MICHAEL A. FRYE
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
MICROCIRCUIT, LINEAR, SAMPLE AND HOLD,
MONOLITHIC SILICON
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
DRAWING APPROVAL DATE
87-06-17
AMSC N/A
REVISION LEVEL
D
SIZE
A
CAGE CODE
5962-87608
67268
SHEET
1
OF
16
DSCC FORM 2233
APR 97
5962-E445-01
DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.
1. SCOPE
1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and
M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the
Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the
PIN.
1.2 PIN. The PIN is as shown in the following examples.
For device classes M and Q:
5962
-
87608
01
G
X
Federal
stock class
designator
\
RHA
designator
(see 1.2.1)
Device
type
(see 1.2.2)
Case
outline
(see 1.2.4)
Lead
finish
(see 1.2.5)
/
\/
Drawing number
For device class V:
5962
-
87608
01
V
Z
X
Federal
RHA
designator
(see 1.2.1)
Device
type
(see 1.2.2)
Device
class
designator
(see 1.2.3)
Case
outline
(see 1.2.4)
Lead
finish
(see 1.2.5)
stock class
designator
\
/
\/
Drawing number
1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and
are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A
specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device type(s). The device type(s) identify the circuit function as follows:
Device type
Generic number
Circuit function
01
02
LF198
5537
Sample and hold
Sample and hold
1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as listed
below. Since the device class designator has been added after the original issuance of this drawing for devices 01GA and
02PA, the device classes M and Q designators will not be included in the PIN and will not be marked on the device.
Device class
M
Device requirements documentation
Vendor self-certification to the requirements for MIL-STD-883 compliant,
non-JAN class level B microcircuits in accordance with MIL-PRF-38535,
appendix A
Q or V
Certification and qualification to MIL-PRF-38535
SIZE
STANDARD
5962-87608
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
SHEET
D
2
DSCC FORM 2234
APR 97
1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
Descriptive designator
Terminals
Package style
G
P
Z
MACY1-X8
GDIP1-T8 or CDIP2-T8
GDFP1-G14
8
8
14
Can
Dual-in-line
Flat pack with gullwing leads
1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535,
appendix A for device class M.
1.3 Absolute maximum ratings. 1/
Supply voltage (±V ) ..................................................................... ±18 V
CC
Power dissipation (P ) ..................................................................... 500 mW 2/
D
Input voltage (V ) ............................................................................ ±18 V 3/
IN
Logic to logic differential voltage ...................................................... +7 V, -30 V 4/
Output short circuit duration ............................................................. Indefinite
Hold capacitor short circuit duration ................................................. 10 seconds
Lead temperature (soldering, 10 seconds) ...................................... 300°C
Storage temperature range .............................................................. -65°C to +150°C
Junction temperature (T ) ................................................................ +150°C
J
Thermal resistance, junction-to-case (θ ):
JC
Case G .......................................................................................... 48°C/W
Case P .......................................................................................... See MIL-STD-1835
Case Z .......................................................................................... 20°C/W
Thermal resistance, junction-to-ambient (θ ):
JA
Case G .......................................................................................... 160°C/W, still air at 0.5 W
84°C/W, 500 LFPM air flow 0.5 W
Case P .......................................................................................... 120°C/W
Case Z .......................................................................................... 140°C/W, still air at 0.5 W
95°C/W, 500 LFPM air flow 0.5 W
1.4 Recommended operating conditions.
Supply voltage (±V ) ..................................................................... ±15 V
CC
Ambient operating temperature range (T ) ...................................... -55°C to +125°C
A
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a
part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in
the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the
solicitation.
1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
2/ The maximum power dissipation must be derated at elevated temperatures and is dicated by T
, θ and T .
JMAX JA A
The maximum allowable power dissipation at any temperature is P
in the absolute maximum ratings, whichever is lower.
– (T – T ) / θ or the number given
JMAX A JA
DMAX
3/ The maximum input voltage shall not exceed the power supply voltage.
4/ Although the differential voltage may not exceed the limits given, the common-mode voltage the logic pins may be equal
to the supply voltages without causing damage to the circuit. For proper logic operation, however, one of the logic pins
must always be at 2 V below the positive supply and 3 V above the negative supply.
SIZE
STANDARD
5962-87608
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
SHEET
D
3
DSCC FORM 2234
APR 97
SPECIFICATION
DEPARTMENT OF DEFENSE
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
STANDARDS
DEPARTMENT OF DEFENSE
MIL-STD-883
-
Test Method Standard Microcircuits.
MIL-STD-1835 - Interface Standard Electronic Component Case Outlines.
HANDBOOKS
DEPARTMENT OF DEFENSE
MIL-HDBK-103 - List of Standard Microcircuit Drawings.
MIL-HDBK-780 - Standard Microcircuit Drawings.
(Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with
MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The
modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for
device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified
herein.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M.
3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.
3.2.3 Logic diagrams. The logic diagrams shall be as specified on figure 2.
3.3 Electrical performance characteristics and post irradiation parameter limits. Unless otherwise specified herein, the
electrical performance characteristics and post irradiation parameter limits are as specified in table I and shall apply over the
full ambient operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical
tests for each subgroup are defined in table I.
SIZE
STANDARD
5962-87608
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
SHEET
D
4
DSCC FORM 2234
APR 97
3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be
marked as listed in MIL-HDBK-103. For packages where marking of the entire SMD PIN number is not feasible due to space
limitations, the manufacturer has the option of not marking the "5962-" on the device. For RHA product using this option, the
RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535.
Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A.
3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in
MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535, appendix A.
3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535
listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of
compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see
6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this
drawing shall affirm that the manufacturer's product meets, for device classes Q and V, the requirements of MIL-PRF-38535
and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein.
3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for
device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing.
3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2
herein) involving devices acquired to this drawing is required for any change as defined in MIL-PRF-38535, appendix A.
3.9 Verification and review for device class M. For device class M, DSCC, DSCC's agent, and the acquiring activity retain
the option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made
available onshore at the option of the reviewer.
3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in
microcircuit group number 60 (see MIL-PRF-38535, appendix A).
SIZE
STANDARD
5962-87608
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
SHEET
D
5
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics.
Conditions 1/
-55°C ≤ T ≤ +125°C
unless otherwise specified
Group A
subgroups
Device
type
Limits 2/
Unit
A
Test
Symbol
Min
Max
3
Input offset voltage
1
2,3
1
01
-3
-5
-3
-5
-3
-5
-3
-5
-3
-5
-3
-5
-3
-5
-3
-5
-3
-5
mV
V
+V
±V
+V
= 3 V, -V
= -7 V
CC
OS
CC
CC
5
3
= 15 V
2,3
1
5
3
= 3.5 V,
= -26.5 V
= ±18 V
CC
CC
2,3
1
5
-V
3
±V
CC
2,3
1
5
3
+V
= 3.5 V,
CC
2,3
1
5
-V
= -32.5 V
CC
3
+V
= 26.5 V,
= -3.5 V
= 32.5 V,
= -3.5 V
CC
2,3
1
5
-V
CC
3
+V
CC
2,3
1
5
-V
CC
3
+V
= 7 V, -V
= -3 V
CC
CC
2,3
1
5
02
01
02
01
3
±V
= ±5 V to ±18 V
CC
2,3
1,2
3
5
Positive supply current
5.5
6.5
6.5
7.5
5.5
6.5
mA
+I
V
CC
V
CC
V
CC
= ±15 V
= ±18 V
= ±18 V,
CC
1,2
3
1,2
3
mode = sample
See footnotes at end of table.
SIZE
STANDARD
5962-87608
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
SHEET
D
6
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics – Continued.
Conditions 1/
-55°C ≤ T ≤ +125°C
unless otherwise specified
Group A
subgroups
Device
type
Limits 2/
Unit
A
Test
Symbol
Min
Max
Positive supply current
1,2
3
01
01
02
01
5.5
mA
+I
V
= ±18 V,
CC
CC
mode = hold
6.5
Negative supply current
1,2
3
-5.5
-6.5
-6.5
-7.5
-5.5
-6.5
-5.5
-6.5
-25
-75
-25
-75
-25
-75
-25
-75
-25
-75
-25
-75
mA
-I
V
CC
V
CC
V
CC
= ±15 V
= ±18 V
= ±18 V,
CC
1,2
3
1,2
3
mode = sample
= ±18 V,
1,2
3
V
CC
mode = hold
Input bias current
1
01
25
75
25
75
25
75
25
75
25
75
25
75
nA
I
+V
±V
+V
= 3 V, -V
= -7 V
CC
IB
CC
CC
2,3
1
= 15 V
2,3
1
= 3.5 V,
CC
CC
2,3
1
-V
= -32.5 V
+V
= +32.5 V,
= -3.5 V
CC
CC
2,3
1
-V
+V
= 7 V, -V
= -3 V
CC
CC
2,3
1
02
±V
= ±5 V to ±18 V
CC
2,3
See footnotes at end of table.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-87608
A
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
SHEET
D
7
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics – Continued.
Conditions 1/
-55°C ≤ T ≤ +125°C
unless otherwise specified
Group A
subgroups
Device
type
Limits 2/
Unit
A
Test
Symbol
Min
-100
Max
100
Leakage current into 3/
hold capacitor
1
01
pA
I
+V
= 3 V, -V
= -7 V,
LEAK
CC
CC
T = +25°C
A
-100
100
100
100
+V
= 3.5 V,
CC
-V
CC
= -32.5 V,
T = +25°C
A
-100
-100
+V
= 32.5 V,
= -3.5 V,
CC
-V
CC
T = +25°C
A
+V
= 7 V, -V
= -3 V,
CC
CC
T = +25°C
A
Hold mode
1
2,3
1
02
01
.05
25
nA
Hold step 4/
-2
2
mV
V
HS
±V
= 15 V
CC
2,3
1
-5.6
-2.5
-5.6
-2.5
-5.6
5.6
2.5
5.6
2.5
5.6
2.0
+V
= 3.5 V,
CC
2,3
1
-V
= -26.5 V
CC
+V
= 26.5 V,
= -3.5 V
CC
2,3
1
-V
CC
02
01
V
OUT
= 0 V, T = +25°C,
A
C
H
= 0.01 µF
Input impedance
1
2,3
1
10
0.8
10
GΩ
GΩ
Z
Z
+V
+V
±V
= 8 V, -V
= -28 V
IN
CC
CC
CC
CC
= 28 V, -V
= -8 V
CC
2,3
1
0.8
Output impedance
01
2
4
= ±18 V
OUT
2,3
See footnotes at end of table.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-87608
A
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
SHEET
D
8
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics – Continued.
Conditions 1/
-55°C ≤ T ≤ +125°C
unless otherwise specified
Group A
subgroups
Device
type
Limits 2/
Unit
A
Test
Symbol
Min
Max
Output impedance
Hold mode
1
2,3
1
02
01
2
Ω
Z
OUT
4
Capacitor charging
current
-25
-25
4.5
3
-4.5
-3
mA
I
+V
= 8 V,
= -28 V
= 28 V,
= -8 V
CHRG
CC
2,3
1
-V
CC
25
25
+V
CC
2,3
1,2,3
-V
±V
CC
Logic pin current
LOGIC
01
01
10
µA
= ±18 V,
CC
mode = sample
±V
= ±18 V,
1
2,3
1
1
0.5
3.5
6
CC
mode = hold
±V
= ±15 V,
Input offset voltage
-3.5
-6
mV
V
/
OS
CC
1Drive = +1 mA
±V
= ±15 V,
2,3
1
∆V
OS
-1.1
-2
1.1
2
CC
1Drive = +1 mA to –1 mA
±V
= ±18 V,
2,3
1
Output short circuit
current
01
01
7
20
mA
+I
OS
CC
T = +25°C
A
-25
7
-I
±V
= ±18 V,
OS
CC
T = +25°C
A
Logic reference pin
current
1
-1
1
5
µA
I
±V
= ±18 V,
LOG
CC
mode = sample
2,3
-0.5
1,2,3
10
±V
= ±18 V,
CC
mode = hold
See footnotes at end of table.
SIZE
STANDARD
5962-87608
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
SHEET
D
9
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics – Continued.
Conditions 1/
-55°C ≤ T ≤ +125°C
unless otherwise specified
Group A
subgroups
Device
type
Limits 2/
Unit
A
Test
Symbol
Min
Max
Logic and logic reference
input current
1
2,3
1
02
10
µA
I
V
= 2.4 V
= 0 V
LOG
IN
IN
20
-10
-20
80
74
80
74
80
V
2,3
1
Power supply rejection
ratio
PSRR
01
dB
+V
= 10 V,
CC
2,3
1
-V
= -15 V
= 15 V,
= -10 V
CC
+V
CC
2,3
1,2,3
-V
CC
02
01
+V
= 15 V, V
= 0 V,
OUT
CC
-V
= -10 V
CC
Feed through rejection
ratio
FTRR
FTAR
1
2,3
1
86
74
86
74
86
dB
dB
+V
= 3.5 V,
CC
-V
= -32.5 V
= 32.5 V,
= -3.5 V
CC
+V
CC
2,3
1
-V
CC
Feed through attenuation
ratio
02
C
= 0.01 µF,
H
T = +25°C
A
Differential logic level 5/
1
1
All
01
0.8
-35
2.4
35
V
V
V
T = +25°C
A
TH
mV
Second stage V
+V
= 3.5 V,
OS
OS
CC
(2 nd
stage)
2,3
-50
50
-V
= -32.5 V
CC
1
2,3
1
-35
-50
-35
-50
-35
-50
35
50
35
50
35
50
+V
= 3.0 V,
= -7 V
CC
-V
CC
+V
= 32.5 V,
= -3.5 V
= 7 V,
CC
2,3
1
-V
CC
+V
CC
2,3
-V
= -3 V
CC
See footnotes at end of table.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-87608
A
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
SHEET
D
10
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics – Continued.
Conditions 1/
-55°C ≤ T ≤ +125°C
unless otherwise specified
Group A
subgroups
Device
type
Limits 2/
Min Max
Unit
A
Test
Symbol
Acquisition time 6/
4
01
6
µs
t
∆V
= 10 V,
OUT
AQ
T = +25°C,
A
C
= 1000 pF
= 10 V,
HOLD
25
∆V
OUT
T = +25°C,
A
C
HOLD
= 0.01 µF
Gain error
1
2,3
1
01
.02
.06
%
A
E
+V
= 7 V,
CC
-V
= -3 V
CC
.005
.02
+V
= 3.5 V,
= -26.5 V
= 32.5 V,
= -3.5 V
= 26.5 V,
= -3.5 V
CC
2,3
1
-V
CC
.005
.06
+V
CC
2,3
1
-V
CC
.005
.02
+V
CC
2,3
1
-V
CC
02
.007
.01
V
IN
= -10 V to 10 V,
2,3
1
R = 2 kΩ
L
.007
.01
V
IN
= -11.5 V to 11.5 V,
2,3
R = 10 kΩ
L
1/ Unless otherwise specified, V
= ±15 V, C
= 0.01 µF, and logic reference pin = 0 V. For device type 01,
CC
HOLD
R = 10 kΩ and V = 0 V. For device type 02, R = 2 kΩ, V = -11.5 V to +11.5 V and logic voltage = 2.5 V.
L
IN
L
IN
2/ The algebraic convention, whereby the most negative value is a minimum and the most positive is a maximum,
is used in this table. Negative current shall be defined as conventional current flow out of a device terminal.
3/ Leakage current is measured at a junction temperature of 25°C. The effects of junction temperature rise due to power
dissipation of elevated ambient can be calculated by doubling the 25°C value for each 11°C increase in chip temperature.
Leakage is guaranteed over full input signal range.
4/ Hold step is sensitive to stray capacitive coupling between input logic signals and the hold capacitor. One pF, for
instance, will create an additional 0.5 mV step with 5 V logic swing and a 0.01 µF hold capacitor. Magnitude of the
hold step is inversely proportional to hold capacitor value.
5/ Parameter tested go-no-go only.
6/ If not tested, shall be guaranteed to the limits specified in table I herein.
SIZE
STANDARD
5962-87608
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
SHEET
D
11
DSCC FORM 2234
APR 97
Device types
Case outlines
01
02
P
G
Z
Terminal
number
1
Terminal symbol
INPUT
+V
+V
CC
CC
2
3
OFFSET
ADJUST
+INPUT
NC
OFFSET
ADJUST
+INPUT
-V
CC
4
NC
-V
-V
CC
CC
5
OUTPUT
NC
NC
OUTPUT
6
C
H
C
H
7
LOGIC
REFERENCE
LOGIC
OUTPUT
LOGIC
REFERENCE
LOGIC
8
C
H
9
---
---
---
---
---
---
NC
---
---
---
---
---
---
10
11
12
13
14
LOGIC
REFERENCE
LOGIC
+V
CC
NC
OFFSET
ADJUST
NC = No connection
FIGURE 1. Terminal connections.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-87608
A
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
SHEET
D
12
DSCC FORM 2234
APR 97
FIGURE 2. Logic diagram.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-87608
A
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
SHEET
D
13
DSCC FORM 2234
APR 97
4. QUALITY ASSURANCE PROVISIONS
4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with
MIL-PRF-38535 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan
shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be
in accordance with MIL-PRF-38535, appendix A.
4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted
on all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in
accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection.
4.2.1 Additional criteria for device class M.
a. Burn-in test, method 1015 of MIL-STD-883.
(1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision
level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall
specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in
test method 1015.
(2) T = +125°C, minimum.
A
b. Interim and final electrical test parameters shall be as specified in table IIA herein.
4.2.2 Additional criteria for device classes Q and V.
a. The burn-in test duration, test condition and test temperature, or approved alternatives shall be as specified in the
device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained under
document revision level control of the device manufacturer's Technology Review Board (TRB) in accordance with
MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall
specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test
method 1015 of MIL-STD-883.
b. Interim and final electrical test parameters shall be as specified in table IIA herein.
c. Additional screening for device class V beyond the requirements of device class Q shall be as specified in
MIL-PRF-38535, appendix B.
4.3 Qualification inspection for device classes Q and V. Qualification inspection for device classes Q and V shall be in
accordance with MIL-PRF-38535. Inspections to be performed shall be those specified in MIL-PRF-38535 and herein for
groups A, B, C, D, and E inspections (see 4.4.1 through 4.4.4).
4.4 Conformance inspection. Technology conformance inspection for classes Q and V shall be in accordance with
MIL-PRF-38535 including groups A, B, C, D, and E inspections and as specified herein. Quality conformance inspection for
device class M shall be in accordance with MIL-PRF-38535, appendix A and as specified herein. Inspections to be performed
for device class M shall be those specified in method 5005 of MIL-STD-883 and herein for groups A, B, C, D, and E inspections
(see 4.4.1 through 4.4.4).
4.4.1 Group A inspection.
a. Tests shall be as specified in table IIA herein.
b. Subgroups 7, 8, 9, 10, and 11 in table I, method 5005 of MIL-STD-883 shall be omitted.
SIZE
STANDARD
5962-87608
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
SHEET
D
14
DSCC FORM 2234
APR 97
TABLE IIA. Electrical test requirements.
Test requirements
Subgroups
Subgroups
(in accordance with
(in accordance with
MIL-STD-883,
MIL-PRF-38535, table III)
method 5005, table I)
Device
class M
Device
class Q
Device
class V
Interim electrical
1
1
1
parameters (see 4.2)
Final electrical
parameters (see 4.2)
1,2,3,4 1/
1,2,3,4 1/
1,2,3,4 1/
1,2,3,4
1,2,3 2/
1,2,3
Group A test
requirements (see 4.4)
1,2,3,4
1,2,3,4
Group C end-point electrical
parameters (see 4.4)
1
1
1
1
1
1
Group D end-point electrical
parameters (see 4.4)
Group E end-point electrical
parameters (see 4.4)
1
1/ PDA applies to subgroup 1.
2/ Delta limits as specified in table IIB shall be required where specified, and the delta limits
shall be computed with reference to the previous endpoint electrical parameters.
Table IIB. Group C end-point electrical parameters. T = 25°C
A
Parameter
Device type 01
Conditions
Delta limit
Min
Max
-0.5 mV
0.5 mV
V
+V
+V
= 15 V, -V
= 15 V, -V
= -15 V
= -15 V
IO
CC
CC
CC
-2.5 nA
2.5 nA
I
IB
CC
4.4.2 Group C inspection. The group C inspection end-point electrical parameters shall be as specified in table IIA herein.
4.4.2.1 Additional criteria for device class M. Steady-state life test conditions, method 1005 of MIL-STD-883:
a. Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level
control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify
the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method
1005 of MIL-STD-883.
b. T = +125°C, minimum.
A
c. Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-87608
A
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
SHEET
D
15
DSCC FORM 2234
APR 97
4.4.2.2 Additional criteria for device classes Q and V. The steady-state life test duration, test condition and test temperature,
or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The
test circuit shall be maintained under document revision level control by the device manufacturer's TRB in accordance with
MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify
the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1005 of
MIL-STD-883.
4.4.3 Group D inspection. The group D inspection end-point electrical parameters shall be as specified in table IIA herein.
4.4.4 Group E inspection. Group E inspection is required only for parts intended to be marked as radiation hardness
assured (see 3.5 herein).
a. End-point electrical parameters shall be as specified in table IIA herein.
b. For device classes Q and V, the devices or test vehicle shall be subjected to radiation hardness assured tests as
specified in MIL-PRF-38535 for the RHA level being tested. For device class M, the devices shall be subjected to
radiation hardness assured tests as specified in MIL-PRF-38535, appendix A for the RHA level being tested. All
device classes must meet the post irradiation end-point electrical parameter limits as defined in table I at
T = +25°C ±5°C, after exposure, to the subgroups specified in table IIA herein.
A
c. When specified in the purchase order or contract, a copy of the RHA delta limits shall be supplied.
5. PACKAGING
5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535 for device
classes Q and V or MIL-PRF-38535, appendix A for device class M.
6. NOTES
6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications
(original equipment), design applications, and logistics purposes.
6.1.1 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a
contractor-prepared specification or drawing.
6.2 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for
the individual documents. This coordination will be accomplished DD Form 1692, Engineering Change Proposal.
6.3 Record of users. Military and industrial users should inform Defense Supply Center Columbus when a system
application requires configuration control and which SMD's are applicable to that system. DSCC will maintain a record of users
and this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering
microelectronic devices (FSC 5962) should contact DSCC-VA, telephone (614) 692-0544.
6.4 Comments. Comments on this drawing should be directed to DSCC-VA, Columbus, Ohio 43216-5000, or telephone
(614) 692-0547.
6.5 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein are defined in
MIL-PRF-38535 and MIL-HDBK-1331.
6.6 Sources of supply.
6.6.1 Sources of supply for device classes Q and V. Sources of supply for device classes Q and V are listed in QML-38535.
The vendors listed in QML-38535 have submitted a certificate of compliance (see 3.6 herein) to DSCC-VA and have agreed to
this drawing.
6.6.2 Approved sources of supply for device class M. Approved sources of supply for class M are listed in MIL-HDBK-103.
The vendors listed in MIL-HDBK-103 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has been
submitted to and accepted by DSCC-VA.
SIZE
STANDARD
5962-87608
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
SHEET
D
16
DSCC FORM 2234
APR 97
STANDARD MICROCIRCUIT DRAWING BULLETIN
DATE: 01-05-24
Approved sources of supply for SMD 5962-87608 are listed below for immediate acquisition information only and
shall be added to MIL-HDBK-103 and QML-38535 during the next revision. MIL-HDBK-103 and QML-38535 will be
revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a
certificate of compliance has been submitted to and accepted by DSCC-VA. This bulletin is superseded by the next
dated revision of MIL-HDBK-103 and QML-38535.
Reference
military specification
PIN
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
similar
PIN 2/
M38510/12501BGA
5962-8760801GA
5962-8760802PA
5962-8760801QZA
5962-8760801VZA
27014
3/
LF198H/883
5537/BPA
M38510/12502BPA
---
---
27014
27104
LF198WG/883
LF198WG-QMLV
1/ The lead finish shown for each PIN representing a hermetic package is the most
readily available from the manufacturer listed for that part. If the desired lead
finish is not listed contact the vendor to determine its availability.
2/ Caution. Do not use this number for item acquisition. Items acquired to this
number may not satisfy the performance requirements of this drawing.
3/ Not available from an approved source of supply.
Vendor CAGE
number
Vendor name
and address
27014
National Semiconductor Corporation
2900 Semiconductor Drive
P.O. Box 58090
Santa Clara, CA 95052-8090
The information contained herein is disseminated for convenience only and the
Government assumes no liability whatsoever for any inaccuracies in the
information bulletin.
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