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5962-8860503QLC [ETC]

Buffer/Driver ; 缓冲器/驱动器\n
5962-8860503QLC
型号： 5962-8860503QLC
厂家： ETC    ETC
描述：

Buffer/Driver
缓冲器/驱动器\n

驱动器 逻辑集成电路
文件： 总14页 (文件大小：73K)
中文：  中文翻译
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REVISIONS  
LTR  
A
DESCRIPTION  
DATE (YR-MO-DA)  
90-08-14  
APPROVED  
Paragraph 1.3 absolute maximum, correct input voltage range. Editorial  
changes throughout.  
W. K. Heckman  
B
Add vendor cage 0DKS7. Add device type 03. Update boilerplate to  
MIL-PRF-38535 requirements. Editorial changes throughout – jak.  
01-03-05  
Thomas M. Hess  
REV  
SHEET  
REV  
SHEET  
REV STATUS  
OF SHEETS  
REV  
B
1
B
2
B
3
B
4
B
5
B
6
B
7
B
8
B
9
B
B
B
B
SHEET  
10  
11  
12  
13  
PMIC N/A  
PREPARED BY  
Greg A. Pitz  
DEFENSE SUPPLY CENTER COLUMBUS  
COLUMBUS, OHIO 43216  
http://www.dscc.dla.mil  
CHECKED BY  
Raymond Monnin  
STANDARD  
MICROCIRCUIT  
DRAWING  
APPROVED BY  
Michael A. Frye  
MICROCIRCUIT, DIGITAL, BIPOLAR HIGH  
PERFORMANCE 10-BIT BUFFER, MONOLITHIC  
SILICON  
THIS DRAWING IS  
AVAILABLE  
FOR USE BY ALL  
DEPARTMENTS  
AND AGENCIES OF THE  
DEPARTMENT OF DEFENSE  
DRAWING APPROVAL DATE  
88-03-08  
AMSC N/A  
SIZE  
A
CAGE CODE  
REVISION LEVEL  
B
5962-88605  
67268  
SHEET  
1
OF  
13  
DSCC FORM 2233  
APR 97  
5962-E051-01  
DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.  
1. SCOPE  
1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M)  
and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or  
Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.  
1.2 PIN. The PIN is as shown in the following examples.  
For devices 01 - 02:  
5962-88605  
01  
L
X
Drawing number  
For device 03  
Device type  
(see 1.2.2)  
Case outline  
(see 1.2.4)  
Lead finish  
(see 1.2.5)  
5962  
-
88605  
01  
Q
L
X
Federal  
stock class  
designator  
\
RHA  
designator  
(see 1.2.1)  
Device  
type  
(see 1.2.2)  
Device  
class  
designator  
(see 1.2.3)  
Case  
outline  
(see 1.2.4)  
Lead  
finish  
(see 1.2.5)  
/
\/  
Drawing number  
1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are  
marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A  
specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.  
1.2.2 Device type(s). The device type(s) identify the circuit function as follows:  
Device type  
Generic number  
Circuit function  
01  
02  
03  
29827A  
29828A  
29827A  
High performance 10-bit inverting buffer, three-state  
High performance 10-bit inverting buffer, three-state  
High performance 10-bit inverting buffer, three-state  
1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as listed  
below. Since the device class designator has been added after the original issuance of this drawing, for device types 01 and 02  
device classes M and Q designators will not be included in the PIN and will not be marked on the device.  
Device class  
M
Device requirements documentation  
Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN  
class level B microcircuits in accordance with MIL-PRF-38535, appendix A  
Q or V  
Certification and qualification to MIL-PRF-38535  
1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:  
Outline letter  
Descriptive designator  
Terminals  
Package style  
K
L
3
GDFP2-F24 or CDFP3-F24  
GDIP3-T24 or CDIP4-T24  
CQCC1-N28  
24  
24  
28  
Flat pack  
Dual-in-line  
Square leadless chip carrier  
SIZE  
STANDARD  
MICROCIRCUIT DRAWING  
5962-88605  
A
DEFENSE SUPPLY CENTER COLUMBUS  
COLUMBUS, OHIO 43216-5000  
REVISION LEVEL  
B
SHEET  
2
DSCC FORM 2234  
APR 97  
1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535,  
appendix A for device class M.  
1.3 Absolute maximum ratings. 1/  
Supply voltage range (VCC)............................................................................. -0.5 V dc to +7.0 V dc  
DC input voltage range (VIN)............................................................................ -1.5 V dc to 6.0 V dc  
DC output voltage range (VOUT)....................................................................... -0.5 V dc to 5.5 V dc  
DC output current into output........................................................................... +100 mA  
DC output current out of output........................................................................ -50 mA  
DC input current into input................................................................................ -30 mA to +5.0 mA  
Storage temperature range (TSTG).................................................................... -65°C to +150°C  
Maximum power dissipation (PD) 2/................................................................ 1.82 W  
Lead temperature (soldering, 10 seconds)....................................................... +300°C  
Thermal resistance, junction-to-case (qJC) ....................................................... See MIL-STD-1835  
Junction temperature (TJ)................................................................................. +150°C  
1.4 Recommended operating conditions.  
Supply voltage (VCC) ......................................................................................... +4.5 V dc to +5.5 V dc  
Minimum high level input voltage (VIH)............................................................. 2.0 V dc  
Maximum low level input voltage (VIL)............................................................... 0.7 V dc  
Case temperature operating range (TC) ........................................................... -55°C to +125°C  
2. APPLICABLE DOCUMENTS  
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of  
this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the issue  
of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the solicitation.  
SPECIFICATION  
DEPARTMENT OF DEFENSE  
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.  
STANDARDS  
DEPARTMENT OF DEFENSE  
MIL-STD-883  
MIL-STD-1835  
-
-
Test Method Standard Microcircuits.  
Interface Standard Electronic Component Case Outlines.  
HANDBOOKS  
DEPARTMENT OF DEFENSE  
MIL-HDBK-103 - List of Standard Microcircuit Drawings.  
MIL-HDBK-780 - Standard Microcircuit Drawings.  
(Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization  
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)  
1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the  
maximum levels may degrade performance and affect reliability.  
2/ Must withstand the added PD due to short circuit test, e.g., IOS  
.
SIZE  
STANDARD  
MICROCIRCUIT DRAWING  
5962-88605  
A
DEFENSE SUPPLY CENTER COLUMBUS  
COLUMBUS, OHIO 43216-5000  
REVISION LEVEL  
B
SHEET  
3
DSCC FORM 2234  
APR 97  
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of  
this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific  
exemption has been obtained.  
3. REQUIREMENTS  
3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with  
MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The  
modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device  
class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein.  
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in  
MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M.  
3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein.  
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.  
3.2.3 Truth tables. The truth tables shall be as specified on figure 2.  
3.2.4 Logic diagrams. The logic diagram shall be as specified on figure 3.  
3.2.5 Switching waveforms and test circuit. The switching waveforms and test circuit shall be as specified on figure 4.  
3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical  
performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full case operating  
temperature range.  
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests  
for each subgroup are defined in table I.  
3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be marked  
as listed in MIL-HDBK-103. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the  
manufacturer has the option of not marking the "5962-" on the device. For RHA product using this option, the RHA designator  
shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M  
shall be in accordance with MIL-PRF-38535, appendix A.  
3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in  
MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535, appendix A.  
3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed  
manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of  
compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see  
6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing  
shall affirm that the manufacturer's product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or  
for device class M, the requirements of MIL-PRF-38535, appendix A and herein.  
3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in  
MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to  
this drawing.  
3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein)  
involving devices acquired to this drawing is required for any change as defined in MIL-PRF-38535, appendix A.  
3.9 Verification and review for device class M. For device class M, DSCC, DSCC's agent, and the acquiring activity retain the  
option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made available  
onshore at the option of the reviewer.  
3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit  
group number 2 (see MIL-PRF-38535, appendix A).  
SIZE  
STANDARD  
MICROCIRCUIT DRAWING  
5962-88605  
A
DEFENSE SUPPLY CENTER COLUMBUS  
COLUMBUS, OHIO 43216-5000  
REVISION LEVEL  
B
SHEET  
4
DSCC FORM 2234  
APR 97  
TABLE I. Electrical performance characteristics.  
Test  
Symbol  
VOH  
Test conditions  
Device  
types  
Group A  
subgroups  
Limits  
Unit  
V
-55°C £ TC £ +125°C  
+4.5 V £ VCC £ +5.5 V  
unless otherwise specified  
Min  
2.4  
Max  
High level output  
voltage  
VCC = 4.5 V  
IOH = -15 mA  
IOH = -24 mA  
All  
1, 2, 3  
VIL = 0.8 V  
VIH = 2.0 V  
2.0  
Low level output  
voltage  
VOL  
VCC = 4.5 V, VIH = 2.0 V,  
VIL = 0.8 V, IOL = 32 mA  
VCC = 4.5 V  
All  
All  
1, 2, 3  
1, 2, 3  
0.5  
V
V
Input clamp voltage  
VIC  
-1.2  
IIN = -18 mA  
Input hysteresis  
VHYST  
01, 02  
03  
1, 2, 3  
1, 2, 3  
1, 2, 3  
200  
150  
mV  
Low level input current IIL  
VCC = 5.5 V, VIN = 0.4 V  
VCC = 5.5 V, VIN 2.7 V  
VCC = 5.5 V, VIN 5.5 V  
VCC = 5.5 V, VOUT 2.7 V  
VCC = 5.5 V, VOUT = 0.4 V  
VCC = 5.5 V, VOUT = 0.0 V  
All  
-0.5  
50  
mA  
High level input current IIH1  
All  
All  
All  
1, 2, 3  
1, 2, 3  
1, 2, 3  
mA  
IIH2  
Offstate output current IOZH  
IOZL  
100  
50  
mA  
-50  
-250  
Short circuit output  
current  
IOS  
1/  
All  
1, 2, 3  
1, 2, 3  
-75  
mA  
Bus leakage current  
Supply current  
IOFF  
VCC = 0.0 V, VOUT = 2.9 V  
All  
All  
All  
All  
100  
80.0  
55.0  
70.0  
mA  
ICC  
VCC = 5.5 V  
Outputs open  
VIL = 0.8 V  
VIH = 2.0 V  
Outputs logic low  
mA  
Outputs logic high  
Outputs logic  
three-state  
Functional tests  
VCC = 5.5 V  
See 4.4.1c  
All  
7, 8  
L
H
See footnotes at end of table.  
SIZE  
STANDARD  
MICROCIRCUIT DRAWING  
5962-88605  
A
DEFENSE SUPPLY CENTER COLUMBUS  
COLUMBUS, OHIO 43216-5000  
REVISION LEVEL  
B
SHEET  
5
DSCC FORM 2234  
APR 97  
TABLE I. Electrical performance characteristics - Continued.  
Test  
Symbol  
Test conditions  
Device  
types  
Group A  
subgroups  
Limits  
Unit  
ns  
-55°C £ TC £ +125°C  
+4.5 V £ VCC £ +5.5 V  
unless otherwise specified  
Min  
Max  
9.0  
Propagation delay time, tPLH  
from Di to Yi  
VCC = 5.0 V  
01, 03  
02  
9, 10, 11  
9, 10, 11  
9, 10, 11  
9, 10, 11  
9, 10, 11  
9, 10, 11  
CL = 50 pF ±10%  
R1 = 500W, R2 = 500W  
See figure 4  
8.0  
tPHL  
01, 03  
02  
9.0  
10.0  
12.0  
14.0  
13.0  
15.0  
10.0  
Propagation delay time, tPZH  
output enable, from  
VCC = 5.0 V  
01, 02  
03  
ns  
ns  
CL = 50 pF ±10%  
R1 = 500W, R2 = 500W  
See figure 4  
OEi to Yi or Yi  
tPZL  
01, 02  
03  
Propagation delay time, tPHZ  
output disable, from  
VCC = 5.0 V  
All  
CL = 50 pF ±10%  
R1 = 500W, R2 = 500W  
See figure 4  
OEi to Yi or Yi  
tPLZ  
01, 02  
03  
10.0  
12.0  
1/ Not more than one output should be shorted at a time and the duration of the short circuit condition should not exceed 100  
milliseconds.  
SIZE  
STANDARD  
MICROCIRCUIT DRAWING  
5962-88605  
A
DEFENSE SUPPLY CENTER COLUMBUS  
COLUMBUS, OHIO 43216-5000  
REVISION LEVEL  
B
SHEET  
6
DSCC FORM 2234  
APR 97  
01, 03  
02  
01, 03  
02  
Device types  
Case outlines  
K and L  
3
Terminal symbol  
Terminal number  
1
OE1  
D0  
D1  
D2  
D3  
D4  
D5  
D6  
D7  
D8  
D9  
GND  
OE2  
Y9  
OE1  
D0  
D1  
D2  
D3  
D4  
D5  
D6  
D7  
D8  
D9  
GND  
OE2  
Y9  
NC  
NC  
OE1  
D0  
D1  
D2  
D3  
D4  
NC  
D5  
D6  
D7  
2
OE1  
D0  
D1  
D2  
D3  
D4  
NC  
D5  
D6  
D7  
3
4
5
6
7
8
9
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
D8  
D9  
GND  
NC  
OE2  
Y9  
D8  
D9  
GND  
NC  
OE2  
Y9  
Y8  
Y8  
Y7  
Y7  
Y6  
Y6  
Y5  
Y5  
Y8  
Y8  
Y4  
Y4  
Y7  
Y7  
Y3  
Y3  
Y6  
Y6  
Y2  
Y2  
Y5  
Y5  
Y1  
Y1  
NC  
Y4  
NC  
Y4  
Y0  
Y0  
VCC  
- - -  
- - -  
- - -  
- - -  
VCC  
- - -  
- - -  
- - -  
- - -  
Y3  
Y3  
Y2  
Y2  
Y1  
Y1  
Y0  
Y0  
VCC  
VCC  
NC = no connection  
FIGURE 1. Terminal connections.  
SIZE  
STANDARD  
MICROCIRCUIT DRAWING  
5962-88605  
A
DEFENSE SUPPLY CENTER COLUMBUS  
COLUMBUS, OHIO 43216-5000  
REVISION LEVEL  
B
SHEET  
7
DSCC FORM 2234  
APR 97  
Device types 01 and 03  
Ouputs  
Inputs  
OE2  
L
Function  
OE1  
L
Di  
H
Yi  
H
Data output  
Transparent  
L
X
H
L
H
X
L
X
X
L
Z
Z
High impedance  
High impedance  
Device type 02  
Inputs  
OE2  
L
Ouputs  
Function  
OE1  
L
Di  
H
Yi  
L
Data output  
Transparent  
L
X
H
L
H
X
L
X
X
H
Z
Z
High impedance  
High impedance  
H = High voltage level  
L = Low level voltage  
X = Irrelevant  
Z = High impedance  
Figure 2. Truth tables.  
SIZE  
STANDARD  
MICROCIRCUIT DRAWING  
5962-88605  
A
DEFENSE SUPPLY CENTER COLUMBUS  
COLUMBUS, OHIO 43216-5000  
REVISION LEVEL  
B
SHEET  
8
DSCC FORM 2234  
APR 97  
FIGURE 3. Logic diagrams.  
SIZE  
STANDARD  
MICROCIRCUIT DRAWING  
5962-88605  
A
DEFENSE SUPPLY CENTER COLUMBUS  
COLUMBUS, OHIO 43216-5000  
REVISION LEVEL  
B
SHEET  
9
DSCC FORM 2234  
APR 97  
FIGURE 4. Switching waveforms and test circuit.  
SIZE  
STANDARD  
MICROCIRCUIT DRAWING  
5962-88605  
A
DEFENSE SUPPLY CENTER COLUMBUS  
COLUMBUS, OHIO 43216-5000  
REVISION LEVEL  
B
SHEET  
10  
DSCC FORM 2234  
APR 97  
4. QUALITY ASSURANCE PROVISIONS  
4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with MIL-  
PRF-38535 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not  
affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be in accordance  
with MIL-PRF-38535, appendix A.  
4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted on  
all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in accordance with  
method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection.  
4.2.1 Additional criteria for device class M.  
a. Burn-in test, method 1015 of MIL-STD-883.  
(1) Test condition A, B, C or D. The test circuit shall be maintained by the manufacturer under document revision level  
control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify  
the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test  
method 1015.  
(2) TA = +125°C, minimum.  
b. Interim and final electrical test parameters shall be as specified in table II herein.  
4.2.2 Additional criteria for device classes Q and V.  
a. The burn-in test duration, test condition and test temperature, or approved alternatives shall be as specified in the device  
manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained under document  
revision level control of the device manufacturer's Technology Review Board (TRB) in accordance with  
MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall  
specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test  
method 1015 of MIL-STD-883.  
b. Interim and final electrical test parameters shall be as specified in table II herein.  
c. Additional screening for device class V beyond the requirements of device class Q shall be as specified in  
MIL-PRF-38535, appendix B.  
4.3 Qualification inspection for device classes Q and V. Qualification inspection for device classes Q and V shall be in  
accordance with MIL-PRF-38535. Inspections to be performed shall be those specified in MIL-PRF-38535 and herein for groups  
A, B, C, D, and E inspections (see 4.4.1 through 4.4.4).  
4.4 Conformance inspection. Technology conformance inspection for classes Q and V shall be in accordance with  
MIL-PRF-38535 including groups A, B, C, D, and E inspections and as specified herein except where option 2 of  
MIL-PRF-38535 permits alternate in-line control testing. Quality conformance inspection for device class M shall be in accordance  
with MIL-PRF-38535, appendix A and as specified herein. Inspections to be performed for device class M shall be those specified  
in method 5005 of MIL-STD-883 and herein for groups A, B, C, D, and E inspections (see 4.4.1 through 4.4.4).  
4.4.1 Group A inspection.  
a. Tests shall be as specified in table II herein.  
b. Subgroups 4, 5, and 6 are omitted.  
c. Subgroups 7 and 8 tests shall verify the truth tables.  
4.4.2 Group C inspection. The group C inspection end-point electrical parameters shall be as specified in table II herein.  
SIZE  
STANDARD  
MICROCIRCUIT DRAWING  
5962-88605  
A
DEFENSE SUPPLY CENTER COLUMBUS  
COLUMBUS, OHIO 43216-5000  
REVISION LEVEL  
B
SHEET  
11  
DSCC FORM 2234  
APR 97  
TABLE II. Electrical test requirements.  
Test requirements  
Subgroups  
Subgroups  
(in accordance with  
MIL-STD-883,  
(in accordance with  
MIL-PRF-38535, table III)  
method 5005, table I)  
Device  
class M  
Device  
class Q  
Device  
class V  
Interim electrical  
1
1
1
parameters (see 4.2)  
Final electrical  
1/  
1, 2, 3,  
1/  
1, 2, 3,  
1/  
1, 2, 3,  
parameters (see 4.2)  
7, 8, 9, 10, 11  
1, 2, 3, 7, 8,  
9, 10, 11  
7, 8, 9, 10, 11  
1, 2, 3, 7, 8,  
9, 10, 11  
7, 8, 9, 10, 11  
1, 2, 3, 7, 8,  
9, 10, 11  
Group A test  
requirements (see 4.4)  
Group C end-point electrical  
parameters (see 4.4)  
1, 2, 3  
1, 2, 3  
1, 2, 3  
Group D end-point electrical  
parameters (see 4.4)  
1, 2, 3  
----  
1, 2, 3  
----  
1, 2, 3  
----  
Group E end-point electrical  
parameters (see 4.4)  
1/ PDA applies to subgroup 1.  
4.4.2.1 Additional criteria for device class M. Steady-state life test conditions, method 1005 of MIL-STD-883:  
a. Test condition A, B, C or D. The test circuit shall be maintained by the manufacturer under document revision level control  
and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs,  
outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1005 of MIL-  
STD-883.  
b. TA = +125°C, minimum.  
c. Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883.  
4.4.2.2 Additional criteria for device classes Q and V. The steady-state life test duration, test condition and test temperature, or  
approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The test  
circuit shall be maintained under document revision level control by the device manufacturer's TRB in accordance with  
MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the  
inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1005 of MIL-  
STD-883.  
4.4.3 Group D inspection. The group D inspection end-point electrical parameters shall be as specified in table II herein.  
4.4.4 Group E inspection. Group E inspection is required only for parts intended to be marked as radiation hardness assured  
(see 3.5 herein).  
a. End-point electrical parameters shall be as specified in table II herein.  
b. For device classes Q and V, the devices or test vehicle shall be subjected to radiation hardness assured tests as specified  
in MIL-PRF-38535 for the RHA level being tested. For device class M, the devices shall be subjected to radiation  
hardness assured tests as specified in MIL-PRF-38535, appendix A for the RHA level being tested. All device classes  
must meet the postirradiation end-point electrical parameter limits as defined in table I at  
TA = +25°C ±5°C, after exposure, to the subgroups specified in table II herein.  
c. When specified in the purchase order or contract, a copy of the RHA delta limits shall be supplied.  
SIZE  
STANDARD  
MICROCIRCUIT DRAWING  
5962-88605  
A
DEFENSE SUPPLY CENTER COLUMBUS  
COLUMBUS, OHIO 43216-5000  
REVISION LEVEL  
B
SHEET  
12  
DSCC FORM 2234  
APR 97  
5. PACKAGING  
5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535 for device classes Q  
and V or MIL-PRF-38535, appendix A for device class M.  
6. NOTES  
6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original  
equipment), design applications, and logistics purposes.  
6.1.1 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor prepared  
specification or drawing.  
6.1.2 Substitutability. Device class Q devices will replace device class M devices.  
6.2 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for the  
individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal.  
6.3 Record of users. Military and industrial users should inform Defense Supply Center Columbus when a system application  
requires configuration control and which SMD's are applicable to that system. DSCC will maintain a record of users and this list will  
be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronic devices (FSC  
5962) should contact DSCC-VA, telephone (614) 692-0544.  
6.4 Comments. Comments on this drawing should be directed to DSCC-VA , Columbus, Ohio 43216-5000, or telephone (614)  
692-0674.  
6.5 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein are defined in  
MIL-PRF-38535 and MIL-HDBK-1331.  
6.6 Sources of supply.  
6.6.1 Sources of supply for device classes Q and V. Sources of supply for device classes Q and V are listed in QML-38535. The  
vendors listed in QML-38535 have submitted a certificate of compliance (see 3.6 herein) to DSCC-VA and have agreed to this  
drawing.  
6.6.2 Approved sources of supply for device class M. Approved sources of supply for class M are listed in MIL-HDBK-103. The  
vendors listed in MIL-HDBK-103 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has been submitted to  
and accepted by DSCC-VA.  
SIZE  
STANDARD  
MICROCIRCUIT DRAWING  
5962-88605  
A
DEFENSE SUPPLY CENTER COLUMBUS  
COLUMBUS, OHIO 43216-5000  
REVISION LEVEL  
B
SHEET  
13  
DSCC FORM 2234  
APR 97  
STANDARD MICROCIRCUIT DRAWING BULLETIN  
DATE: 01-03-05  
Approved sources of supply for SMD 5962-88605 are listed below for immediate acquisition information only and shall  
be added to MIL-HDBK-103 and QML 38535 during the next revision. MIL-HDBK-103 and QML 38535 will be revised  
to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate of  
compliance has been submitted to and accepted by DSCC-VA. This bulletin is superseded by the next dated revision of  
MIL-HDBK-103. and QML 38535  
Standard  
microcircuit drawing  
PIN 1/  
Vendor  
CAGE  
number  
Vendor similar  
PIN 2/  
Generic  
Part number  
2/  
5962-8860501LX  
5962-8860501KX  
5962-88605013X  
5962-8860502LX  
5962-8860502KX  
5962-88605023X  
5962-8860503QLA  
5962-8860503QLC  
5962-8860503QKA  
5962-8860503QKC  
3/  
3/  
AM29827A/BLA  
AM29827A/BKA  
AM29827A/B3A  
AM29828A/BLA  
AM29828A/BKA  
AM29828A/B3A  
GEM19303QLA  
GEM19303QLC  
GEM19303QKA  
GEM19303QKC  
3/  
3/  
3/  
3/  
0DKS7  
0DKS7  
0DKS7  
0DKS7  
29827A  
29827A  
29827A  
29827A  
1/ The lead finish shown for each PIN representing  
a hermetic package is the most readily available  
from the manufacturer listed for that part. If the  
desired lead finish is not listed contact the vendor  
to determine its availability.  
2/ Caution. Do not use this number for item  
acquisition. Items acquired to this number may not  
satisfy the performance requirements of this drawing.  
3/ Not available from an approved source of supply.  
Vendor CAGE  
number  
Vendor name  
and address  
0DKS7  
David Sarnoff Research Center  
201 Washington Road  
Princeton, NJ 08540-5300  
The information contained herein is disseminated for convenience only and the  
Government assumes no liability whatsoever for any inaccuracies in the  
information bulletin.  

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