5962-8979806ZA [ETC]
Controller Miscellaneous - Datasheet Reference ; 控制器杂项 - 数据表参考\n
| 型号： | 5962-8979806ZA |
| 厂家： | 
ETC |
| 描述： | Controller Miscellaneous - Datasheet Reference
|
| 文件： | 总26页 (文件大小：162K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
REVISIONS
LTR
DESCRIPTION
DATE (YR-MO-DA)
APPROVED
A
B
C
Changes made in accordance with NOR 5962-R275-94.
Changes made in accordance with NOR 5962-R365-97.
94-09-14
97-06-19
98-01-15
K. A. Cottongim
K. A. Cottongim
K. A. Cottongim
Add device type 03, 04 and CAGE code 88379. Correct note 1 in
table I.
D
E
Corrections to tables I and II.
98-05-14
02-03-13
K. A. Cottongim
Add device types 05 through 07. Add case outlines T and Z. Table I,
Raymond Monnin
I
IH and IIL tests with notes 4 and 6, reverse the minimum and
maximum limits. Table I, IIH for device types 01-04 with note 6 in the
conditions column, change the minimum limit from -0.2 mA to -0.4
mA. Update drawing boilerplate.
F
Paragraph 4.2 Screening: add subparagraphs 4.2.a.3 and 4.2.c for
device types 05, 06, and 07, only. Table I, device types 05 through
07, change min/max test limits for VIH, VIL, IIH (3 places), IIL (3
places), and device types 05 and 06, change max test limits for IEE
(2 places each).
02-05-24
Raymond Monnin
REV
SHEET
REV
F
F
F
F
F
F
F
21
F
F
22
F
F
23
F
F
24
F
SHEET
15
16
17
18
19
20
REV STATUS
OF SHEETS
REV
F
5
F
6
F
7
F
8
F
9
F
F
F
F
F
SHEET
1
2
3
4
10
11
12
13
14
PMIC N/A
PREPARED BY
Steve L. Duncan
DEFENSE SUPPLY CENTER COLUMBUS
POST OFFICE BOX 3990
STANDARD
MICROCIRCUIT
DRAWING
CHECKED BY
Michael C. Jones
COLUMBUS, OHIO 43216-5000
http://www.dscc.dla.mil
APPROVED BY
Gregory Lude
THIS DRAWING IS
AVAILABLE
FOR USE BY ALL
DEPARTMENTS
MICROCIRCUIT, HYBRID, LINEAR, DUAL
REDUNDANT REMOTE TERMINAL UNIT
(RTU)
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
DRAWING APPROVAL DATE
91-11-25
AMSC N/A
REVISION LEVEL
F
SIZE
A
CAGE CODE
67268
5962-89798
SHEET
1 OF 24
DSCC FORM 2233
APR 97
5962-E423-02
DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.
1. SCOPE
1.1 Scope. This drawing describes device requirements for class H hybrid microcircuits to be processed in accordance with
MIL-PRF-38534 and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying
Number (PIN).
1.2 PIN. The PIN shall be as shown in the following example:
5962-89798
01
X
X
Drawing number
Device type
(see 1.2.1)
Case outline
(see 1.2.2)
Lead finish
(see 1.2.3)
1.2.1 Device type(s). The device type(s) shall identify the circuit function as follows:
Device type
Generic number
Circuit function
01
02
03
04
05
06
07
BUS65142, BUS65144
BUS65143, BUS65145
CT2542, CT2542-FP
CT2543, CT2543-FP
BU-65142X1
Dual redundant remote terminal unit (RTU)
Dual redundant remote terminal unit (RTU)
Dual redundant remote terminal unit (RTU)
Dual redundant remote terminal unit (RTU)
Dual redundant remote terminal unit (RTU), +5/-15 V transceiver
Dual redundant remote terminal unit (RTU), +5/-12 V transceiver
Dual redundant remote terminal unit (RTU), +5/+5 V transceiver
BU-65142X2
BU-65142X3
1.2.2 Case outline(s). The case outline(s) shall be as designated in MIL-STD-1835 and as follows:
Outline letter
Descriptive designator
Terminals
Package style
T
X
Y
Z
See figure 1
See figure 1
See figure 1
See figure 1
78
78
82
78
Dual-in-line, ceramic, staggered pins
Dual-in-line, staggered pins
Flat pack
Flat pack
1.2.3 Lead finish. The lead finish shall be as specified in MIL-PRF-38534.
1.3 Absolute maximum ratings. 1/
Logic supply voltage (VL)...........................................................
Negative supply voltage (VEE) ...................................................
Storage temperature .................................................................
Thermal rise, case to junction(∆TJ)............................................
Lead temperature (soldering, 10 seconds)................................
Power dissipation (TC = +125°C)...............................................
5.5 V dc
-18.0 V dc
-65°C to +150°C
13.9°C
+300°C
Duty cycle dependent (see table I power supplies)
1.4 Recommended operating conditions.
Logic supply voltage (VL):
Device types 01 through 04 ...................................................
Device types 05 through 07 ...................................................
Negative supply voltage (VEE):
+4.5 V dc to +5.5 V dc
+4.75 V dc to +5.25 V dc
Device types 01, 03, and 05 ..................................................
Device types 02, 04, and 06 ..................................................
Maximum differential input voltage .............................................
Case operating temperature range (TC)......................................
-14.25 V dc to -15.75 V dc
-11.4 V dc to -12.6 V dc
40 Vp-p
-55°C to +125°C
1/ Stresses above the absolute maximum ratings may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
SIZE
STANDARD
5962-89798
A
MICROCIRCUIT DRAWING
REVISION LEVEL
F
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
2
DSCC FORM 2234
APR 97
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a
part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in
the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the
solicitation.
SPECIFICATION
DEPARTMENT OF DEFENSE
MIL-PRF-38534 - Hybrid Microcircuits, General Specification for.
STANDARDS
DEPARTMENT OF DEFENSE
MIL-STD-883 - Test Method Standard Microcircuits.
MIL-STD-1553 - Interface Standard for Digital Time Division Command/Response Multiplex Data Bus
MIL-STD-1835 - Interface Standard Electronic Component Case Outlines.
HANDBOOKS
DEPARTMENT OF DEFENSE
MIL-HDBK-103 - List of Standard Microcircuit Drawings.
MIL-HDBK-780 - Standard Microcircuit Drawings.
(Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item performance requirements for device class H shall be in accordance with
MIL-PRF-38534. Compliance with MIL-PRF-38534 may include the performance of all tests herein or as designated in the
device manufacturer's Quality Management (QM) plan or as designated for the applicable device class. Therefore, the tests
and inspections herein may not be performed for the applicable device class (see MIL-PRF-38534). Furthermore, the
manufacturer may take exceptions or use alternate methods to the tests and inspections herein and not perform them.
However, the performance requirements as defined in MIL-PRF-38534 shall be met for the applicable device class.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38534 and herein.
3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein and figure 1.
3.2.2 Terminal connections and pin functions. The terminal connections and pin functions shall be as specified on figure 2.
3.2.3 Block diagram. The block diagram shall be as specified on figure 3.
3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are
as specified in table I and shall apply over the full specified operating temperature range.
SIZE
STANDARD
5962-89798
A
MICROCIRCUIT DRAWING
REVISION LEVEL
F
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
3
DSCC FORM 2234
APR 97
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical
tests for each subgroup are defined in table I.
3.5 Marking of device(s). Marking of device(s) shall be in accordance with MIL-PRF-38534. The device shall be marked
with the PIN listed in 1.2 herein. In addition, the manufacturer's vendor similar PIN may also be marked.
3.6 Data. In addition to the general performance requirements of MIL-PRF-38534, the manufacturer of the device described
herein shall maintain the electrical test data (variables format) from the initial quality conformance inspection group A lot
sample, for each device type listed herein. Also, the data should include a summary of all parameters manually tested, and for
those which, if any, are guaranteed. This data shall be maintained under document revision level control by the manufacturer
and be made available to the preparing activity (DSCC-VA) upon request.
3.7 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to supply to this
drawing. The certificate of compliance (original copy) submitted to DSCC-VA shall affirm that the manufacturer's product meets
the performance requirements of MIL-PRF-38534 and herein.
3.8 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38534 shall be provided with each lot of
microcircuits delivered to this drawing.
4. QUALITY ASSURANCE PROVISIONS
4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38534 or as
modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the
form, fit, or function as described herein.
4.2 Screening. Screening shall be in accordance with MIL-PRF-38534. The following additional criteria shall apply:
a. Burn-in test, method 1015 of MIL-STD-883.
(1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level
control and shall be made available to either DSCC-VA or the acquiring activity upon request. Also, the test circuit
shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent
specified in test method 1015 of MIL-STD-883.
(2) T as specified in accordance with table I of method 1015 of MIL-STD-883.
A
(3) Burn-in test shall be for 320 hours. (For device types 05, 06, and 07, only.)
b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter
tests prior to burn-in are optional at the discretion of the manufacturer.
c. 100% Nondestructive bond pull test. (For device types 05, 06, and 07, only.)
SIZE
STANDARD
5962-89798
A
MICROCIRCUIT DRAWING
REVISION LEVEL
F
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
4
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics.
Test
Symbol
Conditions 1/
Group A
subgroups type
Device
Limits
Unit
-55°C ≤ T ≤ +125°C
C
unless otherwise specified
Min
4
Max
Receiver
Differential input impedance
Differential input voltage
Input threshold
ZIN diff
VIN diff
VTH
DC to 1 MHz 2/
2/
1,2,3
1,2,3
4,5,6
All
All
All
kΩ
40
Vp-p
Vp-p
Direct coupled (across
1.2
35Ω load)
Transformer coupled (across
0.86
70Ω load)
Common mode rejection
ratio
CMRR
CMV
DC to 2 MHz 2/ 3/
DC to 2 MHz 2/ 3/
1,2,3
1,2,3
All
All
40
dB
Common mode voltage
-10
+10
V dc
Transmitter
Differential output voltage
VOUT diff Direct coupled (across
4,5,6
All
All
6.0
9.0
Vp-p
ns
35Ω load)
Transformer coupled (across
70Ω load)
18.0
27.0
Output rise and fall time
tr, tf
Transformer coupled (across
70Ω load) 10 to 90 percent of
full waveform peak to peak.
In accordance with MIL-STD-
1553.
9,10,11
100
300
Output noise
NOUT
Direct coupled
4,5,6
All
5
mV RMS
mV RMS
Transformer coupled 2/ 3/
14
Logic
High level input voltage
VIH
VL = 5.5 V
VL = 5.25 V
VL = 5.5 V
VL = 5.25 V
1,2,3
1,2,3
01-04
05-07
01-04
05-07
2.4
2.0
V
V
Low level input voltage
VIL
0.7
0.8
See footnotes at end of table.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-89798
A
REVISION LEVEL
F
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
5
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics - Continued.
Test
Symbol
Conditions 1/
Group A
Device
Limits
Unit
-55°C ≤ T ≤ +125°C
subgroups type
C
unless otherwise specified
Min
-0.2
Max
Logic - Continued.
High level input current 4/
IIH
VL = 5.5 V, VIH = 2.7 V
VL = 5.25 V, VIH = 2.7 V
1,2,3
1,2,3
01-04
-0.04
-50
mA
05-07
01-04
-200
-20
-0.4
µA
µA
High level input current
IIH
VL = 5.5 V,
IH = 2.7 V
5/
+20
V
6/
5/
-0.02
mA
VL = 5.25 V,
IH = 2.7 V
05-07
-10
+10
-20
µA
V
6/
-160
µA
mA
µA
µA
mA
Low level input current 4/
Low level input current
IIL
VL = 5.5 V, VIL = 0.4 V
VL = 5.25 V, VIL = 0.4 V
1,2,3
1,2,3
01-04
05-07
01-04
-0.4
-0.08
-360
-20
-100
+20
IIL
VL = 5.5 V,
VIL = 0.4 V
5/
6/
5/
6/
-0.4
-0.04
VL = 5.25 V,
VIL = 0.4 V
05-07
-10
+10
-50
µA
µA
V
-250
High level output voltage
Low level output voltage 7/
Low level output voltage 6/
VOH
VOL
VOL
VL = 4.5 V, IOH = -0.4 mA
VL = 4.75 V, IOH = -4.0 mA
VL = 4.5 V, IOL = 2.0 mA
VL = 4.75 V, IOL = 4.0 mA
VL = 4.5 V, IOL = 4.0 mA
VL = 4.75 V, IOL = 4.0 mA
1,2,3
1,2,3
1,2,3
01-04
05-07
01-04
05-07
01-04
05-07
All
2.7
4.0
0.4
V
V
0.5
0.4
0.5
Functional test 8/
7,8
4
pass/
fail
Input capacitance
CI
All
50
pF
f = 1 MHz, TA = +25°C,
see 4.3.1b
See footnotes at end of table.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-89798
A
REVISION LEVEL
F
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
6
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics - Continued.
Test
Symbol
CIO
Conditions 1/
Group A
Device
Limits
Unit
-55°C ≤ T ≤ +125°C
subgroups type
C
unless otherwise specified
Min
Max
50
Input/output capacitance 6/
f = 1 MHz, TA = +25°C,
see 4.3.1b
4
All
pF
Power supplies.
+5 V dc current drain
IL
VL = 5.5 V dc, inputs = 0 V
dc, except 12 MHz. Clock
input active. All outputs open
1,2,3
01-04
05,06
115
115
mA
VL = 5.25 V dc, inputs = 0 V
dc, except 12 MHz. Clock
input active. All outputs open
+5 V dc current drain
- idle
IL
VL = 5.25 V dc, inputs = 0 V
dc, except 12 MHz. Clock
input active. All outputs open
1,2,3
1,2,3
07
240
mA
mA
- 50% transmit
- 100% transmit
472
705
-15 V dc current drain
- idle
IEE
VEE = -15.75 V dc
01,03
05
70
50
- 50% transmit
- 100% transmit
01,03,
05
175
01,03
05
270
300
-12 V dc current drain 9/
- idle
IEE
VEE = -12.6 V dc
1,2,3
02,04
06
70
50
mA
- 50% transmit
- 100% transmit
02,04,
06
185
02,04
06
305
320
1/ VEE = -15.0 V for device types 01, 03, and 05. VEE = -12.0 V for device types 02, 04, and 06. VL = +5.0 V,
unless otherwise specified.
2/ Parameter shall be tested as part of device characterization and after design and process changes and therefore shall be
guaranteed to the limits specified in table I.
3/ Receiver and transmitter parameters are specified with transformer.
4/ IIH and IIL for input pins BRO ENA, ADDRE, ADDRC, ADDRA, ADDRD, ADDRB, and ADDRP.
(These inputs have internal pull up resistors connected.)
5/ IIH and IIL for all input pins other than in notes 4 and 6.
6/ IO parameters for pins DB0 through DB15.
7/ VOH for all output pins other than in note 6.
8/ Functional tests performed to verify functionally to MIL-STD-1553 RTU protocol.
9/ The dc current drain is only tested at 50% duty cycle with a maximum limit of 130 mA.
SIZE
STANDARD
5962-89798
A
MICROCIRCUIT DRAWING
REVISION LEVEL
F
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
7
DSCC FORM 2234
APR 97
Case outline T.
FIGURE 1. Case outline(s).
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-89798
A
REVISION LEVEL
F
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
8
DSCC FORM 2234
APR 97
Case outline T - Continued.
Symbol
Millimeters
Inches
Min
Max
Min
Max
0.210
0.020
1.800
1.655
1.505
2.100
1.905
1.805
A
øb
D
5.33
0.51
0.41
0.016
45.72
42.04
38.23
53.34
48.39
45.85
D1
D2
E
41.78
37.97
1.645
1.495
E1
E2
e
48.13
45.59
1.895
1.795
2.54 TYP
0.100 TYP
e1
e2
L
2.41
1.14
6.10
1.78
2.67
1.40
6.60
2.03
0.095
0.045
0.240
0.070
0.105
0.055
0.260
0.080
S
S1
1.91 TYP
0.075 TYP
NOTES:
1. The U.S. preferred system of measurement is the metric SI. This item was designed using inch-pound units of
measurement. In case of problems involving conflicts between the metric and inch-pound units, the inch-pound
units shall rule.
FIGURE 1. Case outline(s) - Continued.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-89798
A
REVISION LEVEL
F
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
9
DSCC FORM 2234
APR 97
Case outline X.
FIGURE 1. Case outline(s) - Continued.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-89798
A
REVISION LEVEL
F
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
10
DSCC FORM 2234
APR 97
Case outline X - Continued.
Symbol
Millimeters
Inches
Min
Max
Min
Max
0.250
0.023
1.870
1.655
1.505
2.100
1.905
1.805
A
øb
D
6.35
0.58
0.33
0.013
47.50
42.04
38.23
53.34
48.39
45.85
D1
D2
E
41.78
37.97
1.645
1.495
E1
E2
e
48.13
45.59
1.895
1.795
2.54 TYP
0.100 TYP
e1
e2
L
2.41
1.14
6.10
2.54
2.67
1.40
6.60
3.05
0.095
0.045
0.240
0.100
0.105
0.055
0.260
0.120
S
S1
1.91 TYP
0.075 TYP
NOTES:
1. The U.S. preferred system of measurement is the metric SI. This item was designed using inch-pound units of
measurement. In case of problems involving conflicts between the metric and inch-pound units, the inch-pound
units shall rule.
2. Pin 1 is indicated by either a contrasting color bead on the bottom or by ESD triangle on top of the case or both.
FIGURE 1. Case outline(s) - Continued.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-89798
A
REVISION LEVEL
F
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
11
DSCC FORM 2234
APR 97
Case outline Y.
Symbol
Millimeters
Inches
Min Max
Min
Max
4.72
A
A1
b
0.186
2.03 REF
0.080 REF
0.30
0.20
0.46
0.30
0.012
0.008
1.595
2.185
0.018
0.012
1.605
2.195
c
D
E
40.51
55.50
40.77
55.75
e
1.27 TYP
10.16
2.41 REF
0.050 TYP
0.400
0.095 REF
L
S1
NOTES:
1. The U.S. preferred system of measurement is the metric SI. This item was designed using inch-pound units of
measurement. In case of problems involving conflicts between the metric and inch-pound units, the inch-pound
units shall rule.
FIGURE 1. Case outline(s) - Continued.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-89798
A
REVISION LEVEL
F
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
12
DSCC FORM 2234
APR 97
Case outline Z.
FIGURE 1. Case outline(s) - Continued.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-89798
A
REVISION LEVEL
F
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
13
DSCC FORM 2234
APR 97
Case outline Z - Continued.
Symbol
Millimeters
Inches
Min
Max
Min
Max
0.210
0.110
A
A1
A2
A3
b
5.33
2.79
2.29
0.090
1.27 TYP
0.050 TYP
0.76
0.41
0.20
1.02
0.51
0.030
0.016
0.008
0.040
0.020
0.012
1.800
1.824
0.012
2.100
c
0.30
D
45.72
46.33
0.30
D1
D2
E
53.34
e
1.27 TYP
0.050 TYP
L
25.40
14.10
10.29
0.600
0.555
0.405
L1
L2
15.11
11.30
0.595
0.445
NOTES:
1. The U.S. preferred system of measurement is the metric SI. This item was designed using inch-pound units of
measurement. In case of problems involving conflicts between the metric and inch-pound units, the inch-pound
units shall rule.
FIGURE 1. Case outline(s) - Continued.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-89798
A
REVISION LEVEL
F
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
14
DSCC FORM 2234
APR 97
All device types
Terminal number
Function
Description
Case
Case
Case
outline
Y
outline
Z
outlines
T and X
1
3
5
1
2
3
2
4
6
A9
A7
A5
Latched output of the most significant bit (MSB) in the subaddress
field of the command word.
Latched output of the third most significant bit in the subaddress field
of the command word.
Latched output of the least significant bit (LSB) in the subaddress
field of the command word.
7
4
5
8
DB1
DB3
Bidirectional parallel data bus bit 1.
Bidirectional parallel data bus bit 3.
Bidirectional parallel data bus bit 5.
Bidirectional parallel data bus bit 7.
Bidirectional parallel data bus bit 9.
Bidirectional parallel data bus bit 11.
Bidirectional parallel data bus bit 13.
Bidirectional parallel data bus bit 15 (MSB).
9
10
12
14
16
18
20
22
24
11
13
15
17
19
21
23
6
DB5
7
DB7
8
DB9
9
DB11
DB13
DB15
BRO ENA
10
11
12
Broadcast enable - When HIGH, this input allows recognition of an
RT address of all ones in the command word as a broadcast
message. When LOW, it prevents response to RT address 31
unless it was the assigned terminal address.
25
27
29
31
13
14
15
16
26
28
30
32
ADDRE
ADDRC
Input of the MSB of the assigned terminal address.
Input of the 3rd MSB of the assigned terminal address.
Input of the 3rd MSB of the assigned terminal address.
ADDRA
RTADD ERR
Output signal used to inform subsystem of an address parity error. If
LOW, indicates parity error and the RT will not respond to any
command address to a single terminal. It will still receive broadcast
commands if BRO ENA is HIGH.
33
17
34
TXDATAOUT B
LOW output to the primary side of the coupling transformer that
connects to the B channel of the 1553 bus.
See footnotes at end of table.
FIGURE 2. Terminal connections and pin functions.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-89798
A
REVISION LEVEL
F
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
15
DSCC FORM 2234
APR 97
All device types
Terminal number
Function
Description
Case
Case
Case
outline
Y
outline
Z
outlines
T and X
35
37
39
18
19
20
36
38
40
N/C
No connection.
GND B
Power supply return connection for the B channel transceiver.
RXDATAIN B
Input from the HIGH side of the primary side of the coupling
transformer that connects to the B channel of the 1553 bus.
78
21
81
A3
Multiplexed address line output. When INCMD is LOW, or A5
through A9 are all zeroes or all ones (mode command), it represents
the latched output of the 2nd MSB in the word count field of the
command word. When INCMD is HIGH and A5 through A9 are not
all zeroes or all ones, it represents the 2nd MSB of the current word
counter. (See note 1).
76
22
79
A1
Multiplexed address line output. When INCMD is LOW, or A5
through A9 are all zeroes or all ones (mode command), it represents
the latched output of the 2nd LSB in the word count field of the
command word. When INCMD is HIGH and A5 through A9 are not
all zeroes or all ones, it represents the 2nd LSB of the current word
counter. (See note 1).
74
72
23
24
77
75
DTGRT
INCMD
Data transfer grant - Active LOW input signal from the subsystem
that informs the RT, when DTREQ is asserted, to start the transfer.
Once the transfer is started, DTGRT can be removed.
In command - HIGH level output signal used to inform the subsystem
that the RT is presently servicing a command. When low, A0-A4
(see note 1) represent the word count of the present command.
When high, A0-A4 represent the current word counter of non-mode
commands.
70
68
25
26
73
71
HS FAIL
DTSTR
Handshake fail - Output signal that goes LOW and stays LOW
whenever the subsystem fails to supply DTGRT in time to do a
successful transfer. Cleared by the next NBGT.
DATA strobe - A LOW level output pulse ( 166 ns ) present in the
middle of every data word transfer over the parallel data bus. Used
to latch or strobe the data into memory, FIFOs, registers, etc.
Recommend using the rising edge to clock data in. (See note 2).
66
64
27
28
69
67
DAT/CMD
RT FAIL
Address line output that is LOW whenever the command word is
being transferred to the subsystem over the parallel data bus, and is
HIGH whenever data words are being transferred.
Remote terminal failure - Latched active LOW output signal to the
subsystem to flag detection of a remote terminal continuous self-test
failure. Also set if the watchdog timeout circuit is activated. Cleared
by the start of the next message transmission (status word) and set if
problem is again detected.
See footnotes at end of table.
FIGURE 2. Terminal connections and pin functions - Continued.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-89798
A
REVISION LEVEL
F
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
16
DSCC FORM 2234
APR 97
All device types
Terminal number
Function
DTREQ
Description
Case
outline
Z
Case
outlines
T and X
Case
outline
Y
62
29
30
65
Data transfer request - Active LOW output signal to the subsystem
indicating that the RT has data for or needs data from the subsystem
and requests a data transfer over the parallel data bus. Will stay
LOW until transfer is completed or transfer until transfer is completed
or transfer timeout has occurred.
60
63
ADBC
Accept dynamic bus control - Active LOW input signal from
subsystem used to set the dynamic bus control acceptance bit in the
status register if the command word was a valid, legal mode
command for dynamic bus control.
58
56
54
31
32
33
61
59
57
TEST 2
A10
Factory test point - DO NOT USE. (See note 3).
Latched output of the T/R bit in the command word.
ILL CMD(ME)
Illegal command - Active LOW input signal from the subsystem,
strobed in on the rising edge of INCMD. Used to define the
command word as illegal and to set the message error bit in the
status register.
52
34
55
SS REQ
BITEN
Subsystem service request - Input from the subsystem used to
control the service request bit in the status register. If LOW when
the status word is updated, the service request bit will be set; if
HIGH, it will be cleared.
50
48
35
36
53
51
Built-in-test word enable - LOW level output pulse ( 500 ns ), present
when the built-in-test word is enabled on the parallel data bus.
(See note 4).
RXDATAIN A
VLA
Input from the LOW side of the primary side of the coupling
transformer that connects to the A channel of the 1553 bus.
46
44
37
38
49
47
+5 volt input power supply connection for the A channel transceiver.
VEEA
-15 / -12 volt input power supply connection for the A channel
transceiver. (See note 7).
42
40
39
40
45
43
TXDATAOUT A
NBGT
HIGH output to the primary side of the coupling transformer that
connects to the A channel of the 1553 bus.
New bus grant - LOW level output pulse ( 166 ns ) used to indicate
the start of a new protocol sequence in response to the command
word just received. (See note 2).
2
41
3
A8
Latched output of the 2nd MSB in the subaddress field of the
command word.
See footnotes at end of table.
FIGURE 2. Terminal connections and pin functions - Continued.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-89798
A
REVISION LEVEL
F
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
17
DSCC FORM 2234
APR 97
All device types
Terminal number
Function
A6
Description
Case
outline
Z
Case
outlines
T and X
Case
outline
Y
4
42
5
Latched output of the 2nd LSB in the subaddress field of the
command word.
6
43
44
45
46
47
48
49
50
51
52
53
54
55
7
DB0
DB2
Bidirectional parallel data bus bit 0 (LSB).
Bidirectional parallel data bus bit 2.
8
9
10
12
14
16
18
20
22
24
26
28
30
11
13
15
17
19
21
23
25
27
29
31
DB4
Bidirectional parallel data bus bit 4.
DB6
Bidirectional parallel data bus bit 6.
DB8
Bidirectional parallel data bus bit 8.
DB10
DB12
DB14
VL
Bidirectional parallel data bus bit 10.
Bidirectional parallel data bus bit 12.
Bidirectional parallel data bus bit 14.
+5 volt input power supply connection for RTU digital logic section.
Power supply return for RTU digital logic section.
Input of the 2nd MSB of the assigned terminal address.
Input of the 2nd LSB of the assigned terminal address.
GND
ADDRD
ADDRB
ADDRP
Input of address parity bit. The combination of assigned terminal
address and ADDRP must be odd parity for the RT to work.
32
34
56
57
33
35
TXDATAOUT B
HIGH, output to the primary side of the coupling transformer that
connects to the B channel of the 1553 bus.
VEEB
-15 / -12 volt input power supply connection for the B channel
transceiver. (See note 7).
36
38
58
59
37
39
VLB
+5 volt input power supply connection for the B channel transceiver.
RXDATAIN B
Input from the LOW side of primary side of the coupling transformer
that connects to the B channel of the 1553 bus.
See footnotes at end of table.
FIGURE 2. Terminal connections and pin functions - Continued.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-89798
A
REVISION LEVEL
F
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
18
DSCC FORM 2234
APR 97
All device types
Terminal number
Function
A2
Description
Case
outline
Z
Case
outlines
T and X
Case
outline
Y
77
75
73
60
61
62
80
78
76
Multiplexed address line output. When INCMD is LOW, or A5
through A9 are all zeroes or all ones (mode command), it represents
the latched output of the 3rd MSB in the word count field of the
command word. When INCMD is HIGH and A5 through A9 are not
all zeroes or all ones, it represents the 3rd MSB of the current word
counter. (See note 1).
A0
Multiplexed address line output. When INCMD is LOW, or A5
through A9 are all zeroes or all ones (mode command), it represents
the latched output of the LSB in the word count field of the
command. When INCMD is HIGH and A5 through A9 are not all
zeroes or all ones, it represents the LSB of the current word counter.
(See note 1).
DTACK
Data transfer acknowledge - Active LOW output signal during data
transfers to or from the subsystem indicating the RTU has received
the DTGRT in response to DTREQ and is presently doing the
transfer. Can be connected directly to pin 63 on case Z, pins 67 on
cases T and X or pin 66 on case Y (BUF ENA) for control of 3-state
data buffers; and to 3-state address buffer control lines, if they are
used.
71
63
74
A4
Multiplexed address line output. When INCMD is LOW or A5
through A9 are all zeroes or all ones (mode command), it represents
the latched output of the MSB in the word count field of the
command word. When INCMD is HIGH and A5 through A9 are not
all zeroes or all ones, it represents the MSB of the current word
counter. (See note 1).
69
67
64
65
72
70
R/W
Read/Write - Output signal that controls the direction of the internal
data bus buffers. Normally, the signal is LOW and the buffers drive
the data bus. When data is needed from the subsystem, it goes
HIGH to turn the buffers around and the RT now appears as an
input. The signal is HIGH only when DTREQ is active (LOW).
GBR
Good block received - LOW level output pulse ( 500 ns ) used to flag
the subsystem that a valid, legal, non-mode receive command with
the correct number of data words has been received without a
message error and successfully transferred to the subsystem.
(See note 4).
65
63
66
67
68
66
16 MHz
16 MHz clock input - Input for the master clock used to run RTU
circuits.
BUF ENA
Buffer enable - Input used to enable or 3-state the internal data bus
buffers when they are driving the bus. When LOW, the data bus
buffers are enabled. Could be connected to DTACK (pin 73 case Z),
(pin 62, cases T and X), (pin 76, case Y) if RT is sharing the same
data bus as the subsystem. (See note 5).
See footnotes at end of table.
FIGURE 2. Terminal connections and pin functions - Continued.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-89798
A
REVISION LEVEL
F
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
19
DSCC FORM 2234
APR 97
All device types
Terminal number
Function
Description
Case
Case
Case
outline
Y
outline
Z
outlines
T and X
61
59
68
69
64
62
RESET
Input resets entire RT when LOW.
RT FLAG
Remote terminal flag - Input signal used to control the terminal flag
bit in the status register. If LOW when the status word is updated,
the terminal flag bit would be set; if HIGH, it would be cleared.
Normally connected to RTFAIL (pin 64, case Z), (pin 28, cases T
and X),( pin 67, case Y).
57
55
70
71
60
58
TEST 1
Factory test point - DO NOT USE. (See note 6).
SS BUSY
Subsystem busy - Input from the subsystem used to control the busy
bit in the status register. If LOW when the status word is updated,
the busy bit will be set; if HIGH, it will be cleared. If the busy bit is
set in the status register, no data will be requested from the
subsystem in response to a transmit command. On receive
commands, data will still be transferred to subsystem.
53
72
56
SS FLAG
Subsystem flag - Input from the subsystem used to control the
subsystem flag bit in the status register. If LOW when the status
word is updated, the subsystem flag will be set; if HIGH, it will be
cleared.
51
49
73
74
54
52
MESS ERR
Message error - Output signal that goes LOW and stays low
whenever there is a format or word error with the received message
over the 1553 data bus. Cleared by the next NBGT.
RXDATAIN A
Input from the HIGH side of the primary side of the coupling
transformer that contacts to the A channel of the 1553 bus.
47
45
43
75
76
77
50
48
46
GND A
N/C
Power supply return connection for the A channel transceiver.
No connection. (See note 8).
TXDATAOUT A
LOW output to the primary side of the coupling transformer that
connects to the A channel of the 1553 bus.
41
78
44
STATEN
Status word enable - LOW level active output signal present when
the status word is enabled on the parallel data bus.
See footnotes are on next sheet.
FIGURE 2. Terminal connections and pin functions - Continued.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-89798
A
REVISION LEVEL
F
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
20
DSCC FORM 2234
APR 97
NOTES:
1. Device types 03 and 04:
When INCMD is LOW during the DTSTR immediately following NBGT, A0 through A4 are valid and equal to WC0
through WC4 of the received command word. The remaining time while INCMD is LOW and A5 through A9 are
not all zeros or ones (i.e. MODE), A0 through A4 are equal to the last current word count plus one. When INCMD
is HIGH and A5 through A9 are not MODE, A0 through A4 represent the current word counter. If A5 through A9
are equal to MODE, A0 through A4 are equal to WC0 through WC4 of the received command word, independent
of the state of INCMD.
2. Device type 03 and 04, pulse width is typically 125 ns.
3. Pin 58 for case T, pin 31 for cases X and Z, and pin 61 for case Y - (TEST 2) factory test point output: This pin
provides the output of the device BIT comparison output. It indicates the loop test results for every word transmitted
by the device. A test can be performed by actuating the RTU to transmit while the test fixture opens the receiver
lines to force an error condition. A logic 1 (high) indicates the loop test passed. Normally this pin is left open. For
device types 03 and 04, (TEST 2) is not implemented and should be left open.
4. Device type 03 and 04, pulse width is typically 375 ns.
5. Pin 63 for case T, pin 67 for cases X and Z, and pin 66 for case Y - BUF ENA: This pin is typically tied to DTACK,
causing the device to drive the shared data bus only while DTACK is active. If desired BUF ENA can be gounded.
The data will remain latched on the data bus pins for 18 µs from DTSRB and 3.5 µs, (device types 03 and 04 are 19
µs and 4 µs, respectively) for the last word of a message as the devices status word or BIT word is transferred to the
BC (STATEN or BITEN low). Once the STATUS or BIT word transfer is complete, the data bus will automatically
again contain the last data word. The device will automatically switch the direction of the internal buffers during a
transmit operation.
6. Pin 57 for case T, pin 70 for cases X and Z, and pin 60 for case Y - (TEST 1) factory test point: This test allows the
user to force the active channel to transmit indefinitely, in order to test the built-in watchdog timer feature of the
device. When this pin is grounded and the active channel is stimulated with a valid transmit command, the device
will respond with a status word and contiguous data (last data word loaded or STATUS WORD if none is loaded) until
the built-in timeout occurs. Normally this pin is left open or an optional pull-up can be used. For device types 03 and
04, (TEST 1) is not implemented and should be left open.
7. For device type 07, VEEA and VEEB are not connected.
8. For case Y, pins 1, 41, 42, and 82 are no connections.
FIGURE 2. Terminal connections and pin functions - Continued.
SIZE
STANDARD
5962-89798
A
MICROCIRCUIT DRAWING
REVISION LEVEL
F
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
21
DSCC FORM 2234
APR 97
FIGURE 3. Block diagram.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-89798
A
REVISION LEVEL
F
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
22
DSCC FORM 2234
APR 97
TABLE II. Electrical test requirements.
MIL-PRF-38534 test requirements
Subgroups
(in accordance with
MIL-PRF-38534, group A
test table)
Interim electrical parameters
Final electrical parameters
Group A test requirements
1,4,9
1*,2,3,4,5,6,7,8,9,10,11
1,2,3,4,5,6,7,8,9,10,11
1,2,3
Group C end-point electrical
parameters
End-point electrical parameters
for radiation hardness assurance
(RHA) devices
Not applicable
* PDA applies to subgroup 1.
4.3 Conformance and periodic inspections. Conformance inspection (CI) and periodic inspection (PI) shall be in accordance
with MIL-PRF-38534 and as specified herein.
4.3.1 Group A inspection (CI). Group A inspection shall be in accordance with MIL-PRF-38534 and as follows:
a. Tests shall be as specified in table II herein.
b. Subgroup 4 (CI and CIO measurement) shall be measured only for the initial test and after process or design changes
which may affect input and output capacitance.
4.3.2 Group B inspection (PI). Group B inspection shall be in accordance with MIL-PRF-38534.
4.3.3 Group C inspection (PI). Group C inspection shall be in accordance with MIL-PRF-38534 and as follows:
a. End-point electrical parameters shall be as specified in table II herein.
b. Steady-state life test, method 1005 of MIL-STD-883.
(1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level
control and shall be made available to either DSCC-VA or the acquiring activity upon request. Also, the test circuit
shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent
specified in test method 1005 of MIL-STD-883.
(2) T as specified in accordance with table I of method 1005 of MIL-STD-883.
A
(3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883.
4.3.4 Group D inspection (PI). Group D inspection shall be in accordance with MIL-PRF-38534.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-89798
A
REVISION LEVEL
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
F
23
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
4.3.5 Radiation Hardness Assurance (RHA) inspection. RHA inspection is not currently applicable to this drawing.
5. PACKAGING
5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38534.
6. NOTES
6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications
(original equipment), design applications, and logistics purposes.
6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor-
prepared specification or drawing.
6.3 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for
the individual documents. This coordination will be accomplished in accordance with MIL-PRF-38534.
6.4 Record of users. Military and industrial users shall inform Defense Supply Center Columbus when a system application
requires configuration control and the applicable SMD. DSCC will maintain a record of users and this list will be used for
coordination and distribution of changes to the drawings. Users of drawings covering microelectronic devices (FSC 5962)
should contact DSCC-VA, telephone (614) 692-0544.
6.5 Comments. Comments on this drawing should be directed to DSCC-VA, Post Office Box 3990, Columbus, Ohio 43216-
5000, or telephone (614) 692-0536.
6.6 Sources of supply. Sources of supply are listed in MIL-HDBK-103 and QML-38534. The vendors listed in MIL-HDBK-
103 and QML-38534 have submitted a certificate of compliance (see 3.7 herein) to DSCC-VA and have agreed to this drawing.
SIZE
STANDARD
5962-89798
A
MICROCIRCUIT DRAWING
REVISION LEVEL
F
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
24
DSCC FORM 2234
APR 97
STANDARD MICROCIRCUIT DRAWING BULLETIN
DATE: 02-05-24
Approved sources of supply for SMD 5962-89798 are listed below for immediate acquisition information only and
shall be added to MIL-HDBK-103 and QML-38534 during the next revisions. MIL-HDBK-103 and QML-38534 will be
revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a
certificate of compliance has been submitted to and accepted by DSCC-VA. This bulletin is superseded by the next
dated revisions of MIL-HDBK-103 and QML-38534.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
similar
PIN 2/
5962-8979801XA
5962-8979801XA
5962-8979801XA
5962-8979801XC
5962-8979801XC
5962-8979801XC
19645
19645
19645
19645
19645
19645
BUS-65142-607
BUS-65142-150
BUS-65142-140
BUS-65142-604
BUS-65142-130
BUS-65142-110
5962-8979801YA
5962-8979801YA
5962-8979801YC
5962-8979801YC
19645
19645
19645
19645
BUS-65144-150
BUS-65144-140
BUS-65144-130
BUS-65144-110
5962-8979802XC
5962-8979802XC
5962-8979802YA
5962-8979802YA
5962-8979802YC
5962-8979802YC
19645
19645
19645
19645
19645
19645
BUS-65143-130
BUS-65143-110
BUS-65145-150
BUS-65145-140
BUS-65145-130
BUS-65145-110
5962-8979803XA
5962-8979803XC
5962-8979803YA
5962-8979803YC
88379
88379
88379
88379
CT2542
CT2542
CT2542-FP
CT2542-FP
5962-8979804XA
5962-8979804XC
5962-8979804YA
5962-8979804YC
88379
88379
88379
88379
CT2543
CT2543
CT2543-FP
CT2543-FP
5962-8979805TA
5962-8979805TA
5962-8979805TC
5962-8979805TC
5962-8979805ZA
5962-8979805ZA
5962-8979805ZC
5962-8979805ZC
19645
19645
19645
19645
19645
19645
19645
19645
BU-65142D1-150
BU-65142D1-140
BU-65142D1-130
BU-65142D1-110
BU-65142F1-150
BU-65142F1-140
BU-65142F1-130
BU-65142F1-110
See footnotes at end of table.
1 of 2
STANDARD MICROCIRCUIT DRAWING BULLETIN - Continued.
DATE: 02-05-24
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
similar
PIN 2/
5962-8979806TA
5962-8979806TA
5962-8979806TC
5962-8979806TC
5962-8979806ZA
5962-8979806ZA
5962-8979806ZC
5962-8979806ZC
19645
19645
19645
19645
19645
19645
19645
19645
BU-65142D2-150
BU-65142D2-140
BU-65142D2-130
BU-65142D2-110
BU-65142F2-150
BU-65142F2-140
BU-65142F2-130
BU-65142F2-110
5962-8979807TA
5962-8979807TA
5962-8979807TC
5962-8979807TC
5962-8979807ZA
5962-8979807ZA
5962-8979807ZC
5962-8979807ZC
19645
19645
19645
19645
19645
19645
19645
19645
BU-65142D3-150
BU-65142D3-140
BU-65142D3-130
BU-65142D3-110
BU-65142F3-150
BU-65142F3-140
BU-65142F3-130
BU-65142F3-110
1/ The lead finish shown for each PIN representing a hermetic package is the most readily available from the
manufacturer listed for that part. If the desired lead finish is not listed contact the Vendor to determine its
availability.
2/ Caution. Do not use this number for item acquisition. Items acquired to this number may not satisfy the
performance requirements of this drawing.
Vendor CAGE
number
Vendor name
and address
19645
Data Device Corporation
105 Wilbur Place
Bohemia, NY 11716-2482
88379
Aeroflex Laboratories, Incorporated
35 South Service Road
Plainview, NY 11803-4193
The information contained herein is disseminated for convenience only and the
Government assumes no liability whatsoever for any inaccuracies in the
information bulletin.
2 of 2
相关型号：
©2020 ICPDF网 联系我们和版权申明