5962-9325801VCA [ETC]
Operational Amplifier ; 运算放大器\n
| 型号： | 5962-9325801VCA |
| 厂家： | 
ETC |
| 描述： | Operational Amplifier
|
| 文件： | 总12页 (文件大小：60K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
REVISIONS
LTR
DESCRIPTION
DATE (YR-MO-DA)
APPROVED
A
B
C
Change to the supply current test, ICC, in table I. Update boilerplate. -rrp
Add radiation hardness requirements. Add case outline D. Add table IIB. -rrp
99-11-16
00-05-05
01-10-17
R. MONNIN
R. MONNIN
R. MONNIN
Add footnote to the supply voltage test in section 1.3. Add footnote to the
supply current and power supply rejection ratio test in table I. Update
boilerplate. –rrp
D
01-11-15
R. MONNIN
Change to the post irradiation test limits in table I for I , I , A , and I
.
IO IB VO
CC
Removed accelerated aging and dose rate burnout provisions in section 4. –rrp
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
REV
D
1
D
2
D
3
D
4
D
5
D
6
D
7
D
8
D
9
D
D
SHEET
10
11
PREPARED BY
RICK C. OFFICER
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216
CHECKED BY
STANDARD
MICROCIRCUIT
DRAWING
RAJESH R. PITHADIA
http://www.dscc.dla.mil
APPROVED BY
MICHAEL A. FRYE
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
MICROCIRCUIT, LINEAR, RADIATION
HARDENED, PRECISION, HIGH SPEED, QUAD
OPERATIONAL AMPLIFIER, MONOLITHIC
SILICON
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
DRAWING APPROVAL DATE
94-03-02
AMSC N/A
REVISION LEVEL
D
SIZE
A
CAGE CODE
5962-93258
67268
SHEET
1
OF
11
DSCC FORM 2233
APR 97
5962-E081-02
DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.
1. SCOPE
1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and
M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the
Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the
PIN.
1.2 PIN. The PIN is as shown in the following example:
5962
R
93258
01
V
C
X
Federal
RHA
designator
(see 1.2.1)
Device
type
(see 1.2.2)
Device
class
designator
(see 1.2.3)
Case
outline
(see 1.2.4)
Lead
finish
(see 1.2.5)
stock class
designator
\
/
\/
Drawing number
1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and
are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A
specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device type(s). The device type(s) identify the circuit function as follows:
Device type
01
Generic number
OP467
Circuit function
High speed, quad, operational amplifier
1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as
follows:
Device class
M
Device requirements documentation
Vendor self-certification to the requirements for MIL-STD-883 compliant,
non-JAN class level B microcircuits in accordance with MIL-PRF-38535,
appendix A
Q or V
Certification and qualification to MIL-PRF-38535
1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
Descriptive designator
Terminals
Package style
C
D
2
GDIP1-T14 or CDIP2-T14
GDFP1-F14 or CDFP2-F14
CQCC1-N20
14
14
20
Dual-in-line
Flat pack
Square leadless chip carrier
1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535,
appendix A for device class M.
SIZE
STANDARD
5962-93258
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
D
SHEET
2
DSCC FORM 2234
APR 97
1.3 Absolute maximum ratings. 1/
Supply voltage (VCC) 2/ ............................................................................... ±18 V
Differential input voltage 3/ ......................................................................... ±26 V
Input voltage 3/ ........................................................................................... ±18 V
Output short-circuit duration ........................................................................ Limited
Storage temperature range ......................................................................... -65°C to +175°C
Lead temperature (soldering, 60 seconds) ................................................. +300°C
Junction temperature (TJ) ............................................................................ -65°C to +175°C
Thermal resistance, junction-to-case (θJC) .................................................. See MIL-STD-1835
Thermal resistance, junction-to-ambient (θJA):
Case C ..................................................................................................... 94°C/W
Case D ..................................................................................................... 140°C/W
Case 2 ..................................................................................................... 78°C/W
1.4 Recommended operating conditions.
Supply voltage (VCC) ................................................................................... ±15 V
Ambient operating temperature range (TA) ................................................. -55°C to +125°C
1.5 Radiation features.
Maximum total dose available (dose rate = 50 – 300 rads(Si)/s)................. 100 Krads 4/
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a
part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in
the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the
solicitation.
SPECIFICATION
DEPARTMENT OF DEFENSE
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
STANDARDS
DEPARTMENT OF DEFENSE
MIL-STD-883
-
Test Method Standard Microcircuits.
MIL-STD-1835 - Interface Standard Electronic Component Case Outlines.
HANDBOOKS
DEPARTMENT OF DEFENSE
MIL-HDBK-103 - List of Standard Microcircuit Drawings.
MIL-HDBK-780 - Standard Microcircuit Drawings.
(Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
2/ For proper operation the positive supply must be sequenced ON before the negative supply.
3/ For supply voltages less than ±18 V, the absolute maximum input voltage is equal to the supply voltage.
4/ These parts may be dose rate sensitive in a space environment and may demonstrate enhanced low dose rate effects.
Radiation end point limits for the noted parameters are guaranteed only for the conditions specified in MIL-STD-883, method
1019, condition A.
SIZE
STANDARD
5962-93258
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
D
SHEET
3
DSCC FORM 2234
APR 97
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with
MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The
modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for
device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified
herein.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M.
3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.
3.2.3 Radiation exposure circuit. The radiation exposure circuit shall be as specified on figure 2.
3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the
electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full
ambient operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical
tests for each subgroup are defined in table I.
3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be
marked as listed in MIL-HDBK-103. For packages where marking of the entire SMD PIN number is not feasible due to space
limitations, the manufacturer has the option of not marking the "5962-" on the device. For RHA product using this option, the
RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535.
Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A.
3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in
MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535, appendix A.
3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535
listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of
compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see
6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this
drawing shall affirm that the manufacturer's product meets, for device classes Q and V, the requirements of MIL-PRF-38535
and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein.
3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in
MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered
to this drawing.
3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2
herein) involving devices acquired to this drawing is required for any change as defined in MIL-PRF-38535, appendix A.
3.9 Verification and review for device class M. For device class M, DSCC, DSCC's agent, and the acquiring activity retain
the option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made
available onshore at the option of the reviewer.
3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in
microcircuit group number 49 (see MIL-PRF-38535, appendix A).
SIZE
STANDARD
5962-93258
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
D
SHEET
4
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics.
Conditions 1/ 2/
-55°C ≤ TA ≤ +125°C
unless otherwise specified
Group A
subgroups
Device
type
Limits 3/
Min Max
Unit
Test
Symbol
Input offset voltage
VIO
1
01
0.5
mV
VCC = ±5 V
2, 3
1.0
1
0.5
1.0
VCC = ±15 V
2, 3
M,D,P,L,R
1
1
1.5
Input offset current
IIO
01
100
nA
VCC = ±5 V,
VCM = 0 V
2, 3
1
150
100
VCC = ±15 V,
VCM = 0 V
2, 3
150
M,D,P,L,R
1
1
300
600
Input bias current
IIB
01
nA
VCC = ±5 V,
CM = 0 V
V
2, 3
1
700
600
VCC = ±15 V,
VCM = 0 V
2, 3
700
M,D,P,L,R
CC = ±5 V, VCM = ±2 V 4/
1
2000
Common mode rejection
ratio
CMRR
1, 2, 3
01
01
76
80
dB
dB
V
VCC = ±15 V, VCM = ±12 V
4/
Large signal voltage gain
AVO
4
80
VCC = ±5 V, RL = 2 kΩ
5, 6
4
74
83
VCC = ±15 V, RL = 2 kΩ
5, 6
77.5
M,D,P,L,R
4
63
Output voltage swing
VOUT
4, 5, 6
01
V
VCC = ±5 V, RL = 2 kΩ 4/
±3.0
4
VCC = ±15 V, RL = 2 kΩ 4/
±13
5, 6
±12.9
See footnotes at end of table.
SIZE
STANDARD
5962-93258
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
D
SHEET
5
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics – Continued.
Conditions 1/ 2/
-55°C ≤ TA ≤ +125°C
unless otherwise specified
Group A
subgroups
Device
type
Limits 3/
Min Max
Unit
Test
Symbol
Supply current
ICC
1
2, 3
1
01
10
12
10
mA
V
CC = ±5 V, VOUT = 0 V 5/
VCC = ±15 V, VOUT = 0 V
5/
2, 3
13
11
M,D,P,L,R
1
1
Power supply rejection ratio PSRR
01
92
dB
VCC = ±4.5 V to ±5.5 V
4/ 5/
2, 3
1
83
96
VCC = ±4.5 V to ±18 V
4/ 5/
2, 3
8
86
Input offset voltage drift
Gain bandwidth product
TCVIO
01
01
5
VCC = ±15 V,
µV/°C
TA = +125°C, -55°C 4/
VCC = ±5 V, AV = +1,
GBWP
7
16
21
85
MHz
CL = 30 pF, TA = +25°C 4/
VCC = ±15 V, AV = +1,
CL = 30 pF, TA = +25°C 4/
VCC = ±5 V, VIN = 5 V step,
AV = +1, RL = 2 kΩ,
Slew rate
SR
7
01
01
V/µs
CL = 30 pF, TA = +25°C 4/
VCC = ±15 V, AV = +1,
125
VIN = 10 V step, RL = 2 kΩ,
CL = 30 pF, TA = +25°C 4/
VCC = ±15 V, AV = +1,
Settling time
tS
9
300
ns
VIN = 10 V step to 0.01% of
the final value,
TA = +25°C
4/
1/ Devices supplied to this drawing will meet all levels M, D, P, L, R of irradiation. However, this device is only tested at
the ‘R’ level. Pre and Post irradiation values are identical unless otherwise specified in table I. When performing post
irradiation electrical measurements for any RHA level, T = +25°C.
A
2/ These parts may be dose rate sensitive in a space environment and may demonstrate enhanced low dose rate effects.
Radiation end point limits for the noted parameters are guaranteed only for the conditions specified in MIL-STD-883, method
1019, condition A.
3/ The limiting terms “min” (minimum) and “max” (maximum) shall be considered to apply to magnitudes only. Negative
current shall be defined as conventional current flow out of a device terminal.
4/ This parameter is not tested post-irradiation.
5/ For proper operation the positive supply must be sequenced ON before the negative supply.
SIZE
STANDARD
5962-93258
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
D
SHEET
6
DSCC FORM 2234
APR 97
Device type
01
Case outlines
Terminal number
C and D
Terminal symbol
2
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
OUTPUT A
-INPUT A
+INPUT A
+VCC
+INPUT B
-INPUT B
OUTPUT B
OUTPUT C
-INPUT C
+INPUT C
-VCC
NC
OUTPUT A
-INPUT A
+INPUT A
NC
+VCC
NC
+INPUT B
-INPUT B
OUTPUT B
NC
OUTPUT C
-INPUT C
+INPUT C
NC
-VCC
NC
+INPUT D
-INPUT D
OUTPUT D
+INPUT D
-INPUT D
OUTPUT D
----
----
----
----
----
----
NC = No connection
FIGURE 1. Terminal connections.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-93258
A
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
D
SHEET
7
DSCC FORM 2234
APR 97
FIGURE 2. Radiation exposure circuit.
SIZE
STANDARD
5962-93258
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
D
SHEET
8
DSCC FORM 2234
APR 97
4. QUALITY ASSURANCE PROVISIONS
4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with
MIL-PRF-38535 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan
shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be
in accordance with MIL-PRF-38535, appendix A.
4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted
on all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in
accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection.
4.2.1 Additional criteria for device class M.
a. Burn-in test, method 1015 of MIL-STD-883.
(1) Test condition B. The test circuit shall be maintained by the manufacturer under document revision level control
and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the
inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test
method 1015.
(2) TA = +125°C, minimum.
b. Interim and final electrical test parameters shall be as specified in table IIA herein.
4.2.2 Additional criteria for device classes Q and V.
a. The burn-in test duration, test condition and test temperature, or approved alternatives shall be as specified in the
device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained under
document revision level control of the device manufacturer's Technology Review Board (TRB) in accordance with
MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall
specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test
method 1015 of MIL-STD-883.
b. Interim and final electrical test parameters shall be as specified in table IIA herein.
c. Additional screening for device class V beyond the requirements of device class Q shall be as specified in
MIL-PRF-38535, appendix B.
4.3 Qualification inspection for device classes Q and V. Qualification inspection for device classes Q and V shall be in
accordance with MIL-PRF-38535. Inspections to be performed shall be those specified in MIL-PRF-38535 and herein for
groups A, B, C, D, and E inspections (see 4.4.1 through 4.4.4).
4.4 Conformance inspection. Technology conformance inspection for classes Q and V shall be in accordance with
MIL-PRF-38535 including groups A, B, C, D, and E inspections and as specified herein. Quality conformance inspection for
device class M shall be in accordance with MIL-PRF-38535, appendix A and as specified herein. Inspections to be performed
for device class M shall be those specified in method 5005 of MIL-STD-883 and herein for groups A, B, C, D, and E inspections
(see 4.4.1 through 4.4.4).
4.4.1 Group A inspection.
a. Tests shall be as specified in table IIA herein.
b. Subgroups 10 and 11 in table I, method 5005 of MIL-STD-883 shall be omitted.
SIZE
STANDARD
5962-93258
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
D
SHEET
9
DSCC FORM 2234
APR 97
TABLE IIA. Electrical test requirements.
Subgroups
Test requirements
Subgroups
(in accordance with
MIL-STD-883,
(in accordance with
MIL-PRF-38535, table III)
method 5005, table I)
Device
class M
Device
class Q
Device
class V
Interim electrical
1
1
1
parameters (see 4.2)
Final electrical
parameters (see 4.2)
1,2,3,4,5,6 1/
1,2,3,4,5,6 1/
1,2,3,4, 1/ 2/
5,6
Group A test
requirements (see 4.4)
1,2,3,4,5,6,7,8,9
1,2,3,4,5,
6,7,8,9
1
1,2,3,4,5,
6,7,8,9
Group C end-point electrical
parameters (see 4.4)
1
1
1
1
2/
Group D end-point electrical
parameters (see 4.4)
1
1
Group E end-point electrical
parameters (see 4.4)
----
----
1/ PDA applies to subgroup 1. Exclude delta from PDA.
2/ See table IIB for delta measurement parameters.
Table IIB. 240 hour burn-in and group C end-point electrical parameters.
Unit
Parameter
Device type
End-Point
Min Max
Delta
Max
VIO
IIB
01
01
0.5
±0.2
mV
nA
600
±250
4.4.2 Group C inspection. The group C inspection end-point electrical parameters shall be as specified in table IIA herein.
4.4.2.1 Additional criteria for device class M. Steady-state life test conditions, method 1005 of MIL-STD-883:
a. Test condition B. The test circuit shall be maintained by the manufacturer under document revision level control and
shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs,
outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1005 of
MIL-STD-883.
b. TA = +125°C, minimum.
c. Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883.
4.4.2.2 Additional criteria for device classes Q and V. The steady-state life test duration, test condition and test temperature,
or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The
test circuit shall be maintained under document revision level control by the device manufacturer's TRB in accordance with
MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify
the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1005 of
MIL-STD-883.
4.4.3 Group D inspection. The group D inspection end-point electrical parameters shall be as specified in table IIA herein.
SIZE
STANDARD
5962-93258
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
D
SHEET
10
DSCC FORM 2234
APR 97
4.4.4 Group E inspection. Group E inspection is required only for parts intended to be marked as radiation hardness
assured (see 3.5 herein). RHA levels for device classes M, Q, and V shall be as specified in MIL-PRF-38535. End-point
electrical parameters shall be as specified in table IIA herein.
4.4.4.1 Total dose irradiation testing. Total dose irradiation testing shall be performed in accordance with MIL-STD-883
method 1019 condition A and as specified herein.
5. PACKAGING
5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535 for device
classes Q and V or MIL-PRF-38535, appendix A for device class M.
6. NOTES
6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications
(original equipment), design applications, and logistics purposes.
6.1.1 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor
prepared specification or drawing.
6.1.2 Substitutability. Device class Q devices will replace device class M devices.
6.2 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for
the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal.
6.3 Record of users. Military and industrial users should inform Defense Supply Center Columbus when a system
application requires configuration control and which SMD's are applicable to that system. DSCC will maintain a record of users
and this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering
microelectronic devices (FSC 5962) should contact DSCC-VA, telephone (614) 692-0544.
6.4 Comments. Comments on this drawing should be directed to DSCC-VA , Columbus, Ohio 43216-5000, or telephone
(614) 692-0547.
6.5 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein are defined in
MIL-PRF-38535 and MIL-HDBK-1331.
6.6 Sources of supply.
6.6.1 Sources of supply for device classes Q and V. Sources of supply for device classes Q and V are listed in QML-38535.
The vendors listed in QML-38535 have submitted a certificate of compliance (see 3.6 herein) to DSCC-VA and have agreed to
this drawing.
6.6.2 Approved sources of supply for device class M. Approved sources of supply for class M are listed in MIL-HDBK-103.
The vendors listed in MIL-HDBK-103 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has been
submitted to and accepted by DSCC-VA.
SIZE
STANDARD
5962-93258
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
D
SHEET
11
DSCC FORM 2234
APR 97
STANDARD MICROCIRCUIT DRAWING BULLETIN
DATE: 01-11-15
Approved sources of supply for SMD 5962-93258 are listed below for immediate acquisition information only and
shall be added to MIL-HDBK-103 and QML-38535 during the next revision. MIL-HDBK-103 and QML-38535 will be
revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a
certificate of compliance has been submitted to and accepted by DSCC-VA. This bulletin is superseded by the next
dated revision of MIL-HDBK-103 and QML-38535.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
similar
PIN 2/
5962-9325801MCA
5962-9325801M2A
5962-9325801VCA
5962-9325801V2A
5962R9325801VDA
5962R9325801VCA
24355
24355
24355
24355
24355
24355
OP467AY/883
OP467ARC/883
OP467AY/QMLV
OP467ARC/QMLV
OP467AM/QMLR
OP467AY/QMLR
1/ The lead finish shown for each PIN representing
a hermetic package is the most readily available
from the manufacturer listed for that part. If the
desired lead finish is not listed contact the vendor
to determine its availability.
2/ Caution. Do not use this number for item
acquisition. Items acquired to this number may not
satisfy the performance requirements of this drawing.
Vendor CAGE
number
Vendor name
and address
24355
Analog Devices
RT 1 Industrial Park
PO Box 9106
Norwood, MA 02062
Point of contact: 1500 Space Park Drive
P.O. Box 58020
Santa Clara, CA 95052-8020
The information contained herein is disseminated for convenience only and the
Government assumes no liability whatsoever for any inaccuracies in the
information bulletin.
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