5962-9458502H9C [ETC]
EEPROM ; EEPROM\n
| 型号： | 5962-9458502H9C |
| 厂家： | 
ETC |
| 描述： | EEPROM
|
| 文件： | 总42页 (文件大小：374K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
REVISIONS
LTR
E
DESCRIPTION
DATE (YR-MO-DA)
99-05-14
APPROVED
Added device type 06 for vendor cages 54230 and 88379. Added
vendor cage 0EU86 for device types 01 through 06. Figure 1,
changed case outline M to reflect package is available in either a
single or dual cavity. -sld
K. A. Cottongim
F
Added case outline 9.
00-04-06
02-01-31
Raymond Monnin
Raymond Monnin
G
Added device types 07, 08, and 09 for vendor cage 0EU86. Made
changes to table I to include the addition of device types 07, 08, and
09. Added a min limit to the table I for the ILI, and the ILO tests. Made
changes to Figures 2, 3, 4, 5, 6, and 8. -sld
H
Added case outline Z. Updated paragraph 1.2.4, 1.3, figures 1, 2,
and 8. -sld
02-06-04
Raymond Monnin
REV
H
SHEET
35
REV
H
H
H
H
H
H
H
21
H
H
22
H
H
23
H
H
24
H
H
25
H
H
26
H
H
27
H
H
28
H
H
29
H
H
30
H
H
31
H
H
32
H
H
33
H
H
34
H
SHEET
15
16
17
18
19
20
REV STATUS
OF SHEETS
REV
SHEET
1
2
3
4
5
6
7
8
9
10
11
12
13
14
PMIC N/A
PREPARED BY
Gary Zahn
DEFENSE SUPPLY CENTER COLUMBUS
POST OFFICE BOX 3990
STANDARD
MICROCIRCUIT
DRAWING
CHECKED BY
Michael C. Jones
COLUMBUS, OHIO 43216-5000
THIS DRAWING IS
AVAILABLE
FOR USE BY ALL
DEPARTMENTS
APPROVED BY
Kendall A. Cottongim
MICROCIRCUIT, HYBRID, MEMORY,
DIGITAL, 128K x 32-BIT, ELECTRICALLY
ERASABLE/PROGRAMMABLE READ ONLY
MEMORY
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
DRAWING APPROVAL DATE
94-08-02
AMSC N/A
REVISION LEVEL
SIZE
A
CAGE CODE
5962-94585
67268
H
SHEET
1 OF 35
DSCC FORM 2233
APR 97
5962-E373-02
DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.
1. SCOPE
1.1 Scope. This drawing documents five product assurance classes as defined in paragraph 1.2.3 and MIL-PRF-38534. A
choice of case outlines and lead finishes which are available and are reflected in the Part or Identifying Number (PIN). When
available, a choice of radiation hardness assurance levels are reflected in the PIN.
1.2 PIN. The PIN shall be as shown in the following example:
5962
-
94585
01
H
M
X
Federal
stock class
designator
RHA
designator
(see 1.2.1)
Device
type
(see 1.2.2)
Device
class
designator
(see 1.2.3)
Case
outline
(see 1.2.4)
Lead
finish
(see 1.2.5)
\
/
\/
Drawing number
1.2.1 Radiation hardness assurance (RHA) designator. RHA marked devices shall meet the MIL-PRF-38534 specified RHA
levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device type(s). The device type(s) identify the circuit function as follows:
Device type
Generic number
Circuit function
Access time
01
02
03
04
05
06
07
08
09
WE128K32-300HQ, ACT-E128K32N-300P7Q, AS8E128K32-300/883C
WE128K32-250HQ, ACT-E128K32N-250P7Q, AS8E128K32-250/883C
WE128K32-200HQ, ACT-E128K32N-200P7Q, AS8E128K32-200/883C
WE128K32-150HQ, ACT-E128K32N-150P7Q, AS8E128K32-150/883C
WE128K32-140HQ, ACT-E128K32N-140P7Q, AS8E128K32-140/883C
WE128K32-120HQ, ACT-E128K32N-120P7Q, AS8E128K32-120/883C
AS8ER128K32Q-250/883C
EEPROM, 128K x 32-bit
EEPROM, 128K x 32-bit
EEPROM, 128K x 32-bit
EEPROM, 128K x 32-bit
EEPROM, 128K x 32-bit
EEPROM, 128K x 32-bit
EEPROM, 128K x 32-bit
EEPROM, 128K x 32-bit
EEPROM, 128K x 32-bit
300 ns
250 ns
200 ns
150 ns
140 ns
120 ns
250 ns
200 ns
150 ns
AS8ER128K32Q-200/883C
AS8ER128K32Q-150/883C
1.2.3 Device class designator. This device class designator shall be a single letter identifying the product assurance level.
All levels are defined by the requirements of MIL-PRF-38534 and require QML Certification as well as qualification (Class H, K,
and E) or QML Listing (Class G and D). The product assurance levels are as follows:
Device class
K
Device performance documentation
Highest reliability class available. This level is intended for use in space
applications.
H
G
Standard military quality class level. This level is intended for use in applications
where non-space high reliability devices are required.
Reduced testing version of the standard military quality class. This level uses the
Class H screening and In-Process Inspections with a possible limited temperature
range, manufacturer specified incoming flow, and the manufacturer guarantees (but
may not test) periodic and conformance inspections (Group A, B, C and D).
E
Designates devices which are based upon one of the other classes (K, H, or G)
with exception(s) taken to the requirements of that class. These exception(s) must
be specified in the device acquisition document; therefore the acquisition document
should be reviewed to ensure that the exception(s) taken will not adversely affect
system performance.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-94585
A
REVISION LEVEL
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
H
2
DSCC FORM 2234
APR 97
D
Manufacturer specified quality class. Quality level is defined by the manufacturers
internal, QML certified flow. This product may have a limited temperature range.
1.2.4 Case outline(s). The case outline(s) shall be as designated in MIL-STD-1835 and as follows:
Outline letter
Descriptive designator
Terminals
Package style
M
N
T
U
X
Y
4
5
6
9
Z
See figure 1
See figure 1
See figure 1
See figure 1
See figure 1
See figure 1
See figure 1
See figure 1
See figure 1
See figure 1
See figure 1
68
68
66
66
66
66
66
66
66
68
68
Ceramic, single/dual cavity, quad flatpack
Ceramic, single cavity, quad flatpack
Hex-in-line, single cavity, with standoffs
Hex-in-line, single cavity, without standoffs
Hex-in-line, single cavity, with standoffs
Hex-in-line, single cavity, without standoffs
1.075", hex-in-line, single cavity, with standoffs
1.075", hex-in-line, single cavity, with standoffs
1.075", hex-in-line, single cavity, with standoffs
Ceramic, single cavity, quad flatpack
Ceramic, dual cavity, quad flatpack
1.2.5 Lead finish. The lead finish shall be as specified in MIL-PRF-38534.
1.3 Absolute maximum ratings. 1/
Supply voltage range (VCC)........................................................
Input voltage range....................................................................
Power dissipation (PD)...............................................................
Storage temperature range .......................................................
Lead temperature (soldering, 10 seconds)................................
Thermal resistance junction-to-case (θJC):
Case outlines T, X, U, and Y..................................................
Case outline M and Z.............................................................
Case outline N .......................................................................
Case outlines 4, 5, and 6 .......................................................
Case outline 9........................................................................
Data retention............................................................................
Endurance.................................................................................
-0.6 V to +6.25 V
-0.6 V to +6.25 V
1.4 W
-65°C to +150°C
+300°C
6.2°C/W
9.4°C/W
3.1°C/W
2.7°C/W
1.79°C/W
10 years minimum
10,000 cycles minimum 2/
1.4 Recommended operating conditions.
Supply voltage range (VCC)........................................................
Input low voltage range (VIL)......................................................
Input high voltage range (VIH):
Device types 01 through 06 ...................................................
Device types 07 through 09 ...................................................
Output voltage, High minimum (VOH).........................................
Output voltage, low maximum (VOL) ..........................................
Case operating temperature range (TC) ....................................
+4.5 V dc to +5.5 V dc
-0.5 V dc to +0.8 V dc
+2.0 V dc to VCC + 0.3 V dc
+2.2 V dc to VCC + 0.3 V dc
+2.4 V dc
+0.45 V dc
-55°C to +125°C
1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
2/ Device types 7 through 9 for page mode writes only.
SIZE
STANDARD
5962-94585
A
MICROCIRCUIT DRAWING
REVISION LEVEL
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
H
3
DSCC FORM 2234
APR 97
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a
part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in
the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the
solicitation.
SPECIFICATION
DEPARTMENT OF DEFENSE
MIL-PRF-38534 - Hybrid Microcircuits, General Specification for.
STANDARDS
DEPARTMENT OF DEFENSE
MIL-STD-883 - Test Method Standard Microcircuits.
MIL-STD-1835 - Interface Standard for Electronic Component Case Outlines.
HANDBOOKS
DEPARTMENT OF DEFENSE
MIL-HDBK-103 - List of Standard Microcircuit Drawings.
MIL-HDBK-780 - Standard Microcircuit Drawings.
(Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item performance requirements for device classes D, E, G, H, and K shall be in
accordance with MIL-PRF-38534. Compliance with MIL-PRF-38534 may include the performance of all tests herein or as
designated in the device manufacturer's Quality Management (QM) plan or as designated for the applicable device class.
Therefore, the tests and inspections herein may not be performed for the applicable device class (see MIL-PRF-38534).
Furthermore, the manufacturers may take exceptions or use alternate methods to the tests and inspections herein and not
perform them. However, the performance requirements as defined in MIL-PRF-38534 shall be met for the applicable device
class.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38534 and herein.
3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein and figure 1.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2.
3.2.3 Truth table(s). The truth table(s) shall be as specified on figure 3.
3.2.4 Timing diagram(s). The timing diagram(s) shall be as specified on figures 4, 5, 6, and 7.
3.2.5 Block diagram. The block diagram shall be as specified on figure 8.
3.2.5 Typical output test circuit. The typical output test circuit shall be as specified on figure 9.
3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are
as specified in table I and shall apply over the full specified operating temperature range.
SIZE
STANDARD
5962-94585
A
MICROCIRCUIT DRAWING
REVISION LEVEL
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
H
4
DSCC FORM 2234
APR 97
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical
tests for each subgroup are described in table I.
3.5 Programming procedure. The programming procedure shall be as specified by manufacturer and shall be available on
request.
3.6 Marking of device(s). Marking of device(s) shall be in accordance with MIL-PRF-38534. The device shall be marked with
the PIN listed in 1.2 herein. In addition, the manufacturer's vendor similar PIN may also be marked as listed in MIL-HDBK-103
and QML-38534.
3.7 Data. In addition to the general performance requirements of MIL-PRF-38534, the manufacturer of the device described
herein shall maintain the electrical test data (variables format) from the initial quality conformance inspection group A lot
sample, for each device type listed herein. Also, the data should include a summary of all parameters manually tested, and for
those which, if any, are guaranteed. This data shall be maintained under document revision level control by the manufacturer
and be made available to the preparing activity (DSCC-VA) upon request.
3.8 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to supply to this
drawing. The certificate of compliance (original copy) submitted to DSCC-VA shall affirm that the manufacturer's product meets
the performance requirements of MIL-PRF-38534 and herein.
3.9 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38534 shall be provided with each lot of
microcircuits delivered to this drawing.
3.10 Endurance. A reprogrammability test shall be completed as part of the vendor's reliability monitors. This
reprogrammability test shall be done for the initial characterization and after any design or process changes which may affect
the reprogrammability of the device. The methods and procedures may be vendor specific, but shall guarantee the number of
program/erase endurance cycles listed in section 1.3 herein over the full specified operating temperature range. The vendor's
procedure shall be kept under document control and shall be made available upon request of the acquiring or preparing activity.
3.11 Data retention. A data retention stress test shall be completed as part of the vendor's reliability monitors. This test shall
be done for initial characterization and after any design or process change which may affect data retention. The methods and
procedures may be vendor specific, but shall guarantee the number of years listed in section 1.3 herein over the full military
temperature range. The vendor's procedure shall be kept under document control and shall be made available upon request of
the acquiring or preparing activity.
SIZE
STANDARD
5962-94585
A
MICROCIRCUIT DRAWING
REVISION LEVEL
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
H
5
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics.
Test
Symbol
Conditions 1/ 2/
-55°C ≤ TC ≤ +125°C
Group A
subgroups
Device
types
Limits
Unit
Min
Max
+4.5 V dc ≤ VCC ≤ +5.5 V dc
unless otherwise specified
DC parameters
Supply current
ICC
CS = VIL, OE = WE = VIH,
I/O 0 through I/O 31 = open.
Inputs = VCC = +5.5 V dc,
A0 through A16 change at
f = 5 MHz CMOS levels.
1,2,3
1,2,3
All
All
250
mA
mA
Standby current
ISB
CS = VCC, OE = VIH, I/O 0
through I/O 31 = open.
5
Inputs = VCC = +5.5 V dc,
A0 through A16 change at
f = 5 MHz CMOS levels.
Input leakage current
ILI
VIN = VSS to VCC
VIN = VSS to VCC
1,2,3
1,2,3
All
-10
+10
µA
µA
IIL (RES)
7,8,9
-500
+500
Input leakage (RES pin)
Output leakage current
Input low voltage
ILO
VIL
1,2,3
1,2,3
All
All
-10
+10
0.8
µA
CS = VIH, VOUT = VSS to VCC
V
Input high voltage
VIH
VH
1,2,3
1,2,3
1-6
7-9
7-9
2.0
2.2
V
V
Input high voltage
RES signal
VCC -.5 V
VCC +1V
0.45
Output low voltage
Output high voltage
Capacitance
VOL
VOH
VCC = +4.5 V dc,
OL = 2.1 mA
1,2,3
1,2,3
All
All
V
V
I
VCC = +4.5 V dc,
OL = -400 µA
2.4
I
A0 - A16 3/
CAD
COE
V
IN = 0 V dc, f = 1.0 MHz,
4
All
50
pF
TA = +25°C
OE capacitance 3/
CCS
VIN = 0 V dc, f = 1.0 MHz,
TA = +25°C
4
4
All
All
20
20
pF
pF
CS1-4 capacitance 3/
CWE1-4
VIN = 0 V dc, f = 1.0 MHz,
TA = +25°C
WE1-4 capacitance 3/
See footnotes at end of table.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-94585
A
REVISION LEVEL
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
H
6
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics - Continued.
Test
Symbol
Conditions 1/ 2/
-55°C ≤ TC ≤ +125°C
Group A
subgroups
Device
types
Limits
Unit
Min
Max
50
+4.5 V dc ≤ VCC ≤+5.5 V dc
unless otherwise specified
Capacitance - Continued.
WE capacitance 3/
CWE
VIN = 0 V dc, f = 1.0 MHz,
TA = +25°C
4
All
pF
Case outline N, only.
I/O0-I/O31 capacitance
3/
CI/O
VOUT = 0 V dc, f = 1.0 MHz,
TA = +25°C
4
4
All
20
50
pF
pF
CRES
CRDY
7,8,9
RES and RDY/BUSY
capacitance
RES = RDY/BUSY = 0 V
Functional tests
Functional tests
See 4.3.1c
7,8A,8B
9,10,11
All
Read cycle timing characteristics
Read cycle timing
tRC
See figure 4.
01
02,07
03,08
04,09
05
300
250
200
150
140
120
ns
ns
ns
ns
06
Address access timing
Chip select access timing
tACC
tACS
tOH
See figure 4.
See figure 4.
See figure 4.
9,10,11
9,10,11
9,10,11
01
02,07
03,08
04,09
05
300
250
200
150
140
120
06
01
02,07
03,08
04,09
05
300
250
200
150
140
120
06
Output hold from address
change OE or CS
All
0
See footnotes at end of table.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-94585
A
REVISION LEVEL
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
H
7
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics - Continued.
Test
Symbol
Conditions 1/ 2/
-55°C ≤ TC ≤ +125°C
Group A
subgroups
Device
types
Limits
Unit
Min
Max
+4.5 V dc ≤ VCC ≤ +5.5 V dc
unless otherwise specified
Read cycle timing characteristics - Continued.
Out enable to output
valid
tOE
See figure 4.
See figure 4.
9,10,11
9,10,11
01
02,07
03,08
04,05
06
0
0
0
0
0
0
125
100
85
55
50
ns
09
75
Chip select or output
enable to output high - Z
3/
tDF
01-06
07-09
70
50
ns
Byte write AC timing characteristics.
Address setup time
tAS
See figure 5.
See figure 5.
9,10,11
9,10,11
01-06
07-09
01-06
07-09
All
10
0
ns
ns
Write pulse width
tWP
150
250
0
Chip select setup time
Address hold time
tCS
tAH
See figure 5.
See figure 5.
9,10,11
9,10,11
ns
ns
01-06
07-09
01-06
07-09
All
100
150
4
Output enable setup time
tOES
See figure 5.
9,10,11
ns
0
Data hold time
tDH
See figure 5.
See figure 5.
9,10,11
9,10,11
10
10
0
ns
ns
Output enable hold time
tOEH
01-06
07-09
All
Data setup time
tDS
See figure 5.
See figure 5.
See figure 5.
9,10,11
9,10,11
9,10,11
100
0
ns
ns
ns
Chip select hold time
Write pulse width high
tCSH
tWPH
All
01-06
07-09
All
50
300
Write cycle time
tWC
See figure 5.
9,10,11
10
ms
See footnotes at end of table
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-94585
A
REVISION LEVEL
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
H
8
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics - Continued.
Test
Symbol
Conditions 1/ 2/
-55°C ≤ TC ≤ +125°C
Group A
subgroups
Device
types
Limits
Unit
Min
Max
+4.5 V dc ≤ VCC ≤ +5.5 V dc
unless otherwise specified
Page mode write AC timing characteristics.
Data setup time
Data hold time
Write pulse width
tDS
tDH
tWP
See figure 6.
See figure 6.
See figure 6.
9,10,11
9,10,11
9,10,11
All
All
100
10
ns
ns
ns
01-06
150
07-09
01-06
07-09
250
Byte load cycle time
tBLC
See figure 6.
9,10,11
150
30
µs
Write pulse width high
Write cycle time
tWPH
See figure 6.
See figure 6.
9,10,11
9,10,11
01-06
07-09
All
50
ns
300
tWC
10
ms
Data polling AC timing characteristics. 3/
Data hold time
tDH
See figure 7.
See figure 7.
See figure 7.
9,10,11
9,10,11
9,10,11
All
All
All
10
10
ns
ns
ns
Output enable hold time
tOEH
tOE
Output enable to output
delay
100
Write recovery time
tWR
See figure 7.
See figure 4.
9,10,11
9,10,11
All
0
0
ns
ns
tDFR
07-09
350
450
RES low to output float
tRR
See figure 4.
9,10,11
07-09
0
ns
RES to output delay
Reset protect time
Reset high time
tRP
See figures 5 and 6.
See figures 5 and 6.
See figures 5 and 6.
9,10,11
9,10,11
9,10,11
07-09
07-09
07-09
100
µs
µs
ns
tRES
tDB
1.0
120
Time to device busy
1/ Unless otherwise specified, the AC test conditions are as follows:
Input pulse levels: VIL = 0 V and VIH = 3.0 V.
Input rise and fall times: 5 nanoseconds.
Input and output timing reference level: 1.5 V.
2/ RES and RDY/BUSY functions are applicable for device types 07 through 09 only.
3/ Guaranteed by design, but not tested.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-94585
A
REVISION LEVEL
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
H
9
DSCC FORM 2234
APR 97
Case outline M.
FIGURE 1. Case outline(s).
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-94585
A
REVISION LEVEL
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
H
10
DSCC FORM 2234
APR 97
Case outline M - Continued.
Symbol
Millimeters
Inches
Min
Max
5.08
4.72
0.51
0.43
Min
.123
.118
.000
.013
Max
.200
.186
.020
.017
A
A1
3.12
2.30
0.00
0.33
A2
b
B
0.25 REF
20.32 BSC
.010 REF
.800 BSC
D/E
D1/E1
D2/E2
D3/E3
e
22.10
22.61
25.40
24.28
.870
.890
1.000
.956
24.89
23.77
.980
.936
1.27 BSC
.050 BSC
R
0.13
0.89
.005
.035
L1
1.14
.045
NOTES:
1. The U.S. preferred system of measurement is the metric SI. This item was designed using inch-pound units of
measurement. In case of problems involving conflicts between the metric and inch-pound units, the inch-pound
units shall rule.
2. Pin numbers are for reference only.
3. Case outline M may either be a single cavity or a dual cavity package.
FIGURE 1. Case outline(s) - Continued.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-94585
A
REVISION LEVEL
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
H
11
DSCC FORM 2234
APR 97
Case outline N.
Symbol
Millimeters
Inches
Min
Min
Max
5.08
Max
.200
A
4.45
.175
A1
1.52 BSC
.060 BSC
A2
1.14
0.31
1.39
0.46
.045
.012
.055
.018
b
c
0.23
0.31
.009
.012
D/E
63.63
39.24
73.28
66.42
40.01
84.20
2.505
1.545
2.885
2.615
1.575
3.315
D1/E1
D2/E2
e
e1
j
1.27 BSC
20.32 BSC
.050 BSC
.800 BSC
4.83
5.33
38.48
13.21
.190
.210
1.515
.520
k
37.72
12.19
1.485
.480
L
S1
9.65 BSC
.380 BSC
NOTES:
1. The U.S. preferred system of measurement is the metric SI. This item was designed using inch-pound units of
measurement. In case of problems involving conflicts between the metric and inch-pound units, the inch-pound
units shall rule.
2. Pin numbers are for reference only.
FIGURE 1. Case outline(s) - Continued.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-94585
A
REVISION LEVEL
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
H
12
DSCC FORM 2234
APR 97
Case outlines T, X, 4, 5, and 6.
FIGURE 1. Case outline(s) - Continued.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-94585
A
REVISION LEVEL
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
H
13
DSCC FORM 2234
APR 97
Case outlines T and X - Continued.
Symbol Millimeters Inches
Min
Max
6.22
0.89
3.68
0.51
1.40
1.91
30.48
Min
.210
.025
.135
.016
.045
.065
1.170
Max
.245
.035
.145
.020
.055
.075
1.200
A
A1
5.33
0.64
3.42
0.41
1.14
1.65
29.72
A2
øb
øb1
øb2
D/E
D1/E1
D2
25.40 BSC
15.24 BSC
28.96 29.21
2.54 BSC
3.68 3.94
1.000 BSC
.600 BSC
1.140 1.150
.100 BSC
.145 .155
D3
e
L
Case outlines 4, 5, and 6 - Continued.
Symbol
Millimeters
Inches
Min
Max
4.60
0.89
0.51
1.40
1.91
27.56
Min
.135
.025
.016
.045
.065
1.065
Max
.181
.035
.020
.055
.075
1.085
A
A1
3.43
0.64
0.41
1.14
1.65
27.05
øb
øb1
øb2
D/E
D1/E1
D2
25.40 BSC
15.24 BSC
25.90 26.92
2.54 BSC
3.35 3.94
1.000 BSC
.600 BSC
1.020 1.060
.100 BSC
.132 .155
D3
e
L
NOTES:
1. The U.S. preferred system of measurement is the metric SI. This item was designed using inch-pound units of
measurement. In case of problems involving conflicts between the metric and inch-pound units, the inch-pound
units shall rule.
2. Pin 1 is identified by .070 inch (1.78 mm) square pad.
3. Pin numbers are for reference only.
FIGURE 1. Case outline(s) - Continued.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-94585
A
REVISION LEVEL
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
H
14
DSCC FORM 2234
APR 97
Case outlines U and Y.
Symbol
Millimeters
Inches
Min
Min
4.70
0.13
3.42
0.41
0.76
1.65
29.72
Max
5.84
0.51
3.68
0.51
1.52
1.91
30.48
Max
.230
.020
.145
.020
.060
.075
1.200
A
A1
.185
.005
.135
.016
.030
.065
1.170
A2
øb
øb1
øb2
D/E
D1/E1
D2
25.40 BSC
15.24 BSC
28.96 29.21
2.54 BSC
4.19 4.70
1.000 BSC
.600 BSC
1.140 1.150
.100 BSC
.165 .185
D3
e
L
NOTES:
1. The U.S. preferred system of measurement is the metric SI. This item was designed using inch-pound units of
measurement. In case of problems involving conflicts between the metric and inch-pound units, the inch-pound
units shall rule.
2. Pin 1 is identified by .070 inch (1.78 mm) square pad.
3. Pin numbers are for reference only.
FIGURE 1. Case outline(s) - Continued.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-94585
A
REVISION LEVEL
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
H
15
DSCC FORM 2234
APR 97
Case outline 9.
Symbol
Millimeters
Inches
Max
Min
Max
3.56
2.79
0.76
0.43
0.25
Min
A
A1
.140
.110
.030
.017
.010
A2
0.46
0.33
0.15
.018
.013
.006
b
C
D/E
D1/E1
D2/E2
e
20.32 BSC
.800 BSC
23.65
25.15
24.10
25.40
.931
.990
.949
1.000
1.27 BSC
.050 BSC
L1
0.51
1.14
.020
.045
NOTES:
1. The U.S. preferred system of measurement is the metric SI. This item was designed using inch-pound units of
measurement. In case of problems involving conflicts between the metric and inch-pound units, the inch-pound
units shall rule.
2. Pin numbers are for reference only.
FIGURE 1. Case outline(s) - Continued.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-94585
A
REVISION LEVEL
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
H
16
DSCC FORM 2234
APR 97
Case outline Z.
FIGURE 1. Case outline(s) -Continued.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-94585
A
REVISION LEVEL
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
H
17
DSCC FORM 2234
APR 97
Case Z - Continued.
Symbol
Millimeters
Inches
Min
.123
.118
.000
Min
3.12
3.00
0.00
Max
5.08
4.72
0.51
Max
.200
.186
.020
A
A1
A2
b
0.33
0.23
0.43
0.31
.013
.009
.017
.012
c
27.58
22.10
48.77
28.30
22.61
50.80
1.086
.870
1.114
.890
D/E
D1/E1
1.920
2.000
D2/E2
e
e1
j
1.27 BSC
20.32 BSC
.050 BSC
.800 BSC
4.95
5.21
22.99
8.26
.195
.205
.905
.325
k
22.73
8.00
0.13
.895
.315
.005
L
R
S1
1.02 BSC
.040 BSC
NOTES:
1. The U.S. preferred system of measurement is the metric SI. This item was designed using inch-pound units of
measurement. In case of problems involving conflicts between the metric and inch-pound units, the inch-pound
units shall rule.
2. Pin numbers are for reference only.
FIGURE 1. Case outline(s) - Continued.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-94585
A
REVISION LEVEL
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
H
18
DSCC FORM 2234
APR 97
Device
types
1-6
Device
types
1-6
Device
types
1-6
Device
types
1-6
Case
M, 9
Case
M, 9
Case
M, 9
Case
M, 9
outlines
outlines
outlines
outlines
Terminal
number
Terminal
symbol
Terminal
number
Terminal
symbol
Terminal
number
Terminal
symbol
Terminal
number
Terminal
symbol
OE
1
2
GND
18
GND
35
52
GND
CS3
CS2
19
20
I/O8
I/O9
36
37
53
54
I/O23
I/O22
3
4
5
A5
NC
WE2
WE3
A4
A3
21
22
I/O10
I/O11
38
39
55
56
I/O21
I/O20
WE4
NC
6
A2
A1
23
24
25
26
27
28
29
30
31
32
I/O12
I/O13
I/O14
I/O15
VCC
40
41
42
43
44
45
46
47
48
49
57
58
59
60
61
62
63
64
65
66
I/O19
I/O18
I/O17
I/O16
VCC
7
8
A0
NC
9
NC
NC
10
11
12
13
14
15
I/O0
I/O1
I/O2
I/O3
I/O4
I/O5
I/O31
I/O30
I/O29
I/O28
I/O27
I/O26
A11
A10
A9
A12
A13
A8
A14
A7
A15
A6
WE1
CS4
16
17
I/O6
I/O7
33
34
A16
50
51
I/O25
I/O24
67
68
CS1
NOTES:
1. NC is no connection.
2. For case outline M, device types 07 through 09, pin 9 is RES , pin 31 is A15, pin 32 is A14, and pin 43 is
RDY/BUSY .
FIGURE 2. Terminal connections.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-94585
A
REVISION LEVEL
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
H
19
DSCC FORM 2234
APR 97
Device
types
1-6
N
Device
types
1-6
N
Device
types
1-6
N
Device
types
1-6
N
Case
Case
Case
Case
outline
outline
outline
outline
Terminal
number
Terminal
symbol
Terminal
number
Terminal
symbol
Terminal
number
Terminal
symbol
Terminal
number
Terminal
symbol
OE
1
GND
18
GND
35
52
GND
CS1
A5
CS4
NC
2
3
19
20
21
22
23
24
25
26
27
28
29
3
I/O8
I/O9
36
37
38
39
40
41
42
43
44
45
46
47
48
49
53
54
55
56
57
58
59
60
61
62
63
64
65
66
I/O23
I/O22
I/O21
I/O20
I/O19
I/O18
I/O17
I/O16
VCC
4
A4
I/O10
I/O11
I/O12
I/O13
I/O14
I/O15
VCC
NC
5
A3
NC
6
A2
NC
7
A1
NC
8
A0
NC
9
NC
NC
10
11
12
13
14
15
I/O0
I/O1
I/O2
I/O3
I/O4
I/O5
I/O31
I/O30
I/O29
I/O28
I/O27
I/O26
A11
A10
A12
A9
A13
A8
31
32
A14
A7
A15
A6
WE
16
17
I/O6
I/O7
33
34
A16
50
51
I/O25
I/O24
67
68
CS2
CS3
NOTE: NC is no connection.
FIGURE 2. Terminal connections - Continued.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-94585
A
REVISION LEVEL
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
H
20
DSCC FORM 2234
APR 97
Device
types
1-6
Device
types
1-6
Device
types
1-6
Device
types
1-6
Case
outlines
T,U,X,Y,
4,5
Case
outlines
T,U,X,Y,
4,5
Case
outlines
T,U,X,Y,
4,5
Case
outlines
T,U,X,Y,
4,5
Terminal
number
Terminal
symbol
Terminal
number
Terminal
symbol
Terminal
number
Terminal
symbol
Terminal
number
Terminal
symbol
WE3
CS3
1
2
I/O8
I/O9
18
19
A12
VCC
CS1
35
36
I/O25
I/O26
52
53
3
4
5
6
7
8
9
I/O10
A13
A14
A15
A16
NC
20
21
22
23
24
25
26
37
38
39
40
41
42
43
A6
A7
54
55
56
57
58
59
60
GND
I/O19
I/O31
I/O30
I/O29
I/O28
A0
NC
I/03
NC
I/015
I/O14
I/O13
I/O12
A8
A9
I/O16
I/O17
I/O0
OE
NC
10
11
I/O1
I/O2
27
28
44
45
I/O18
VCC
61
62
A1
A2
WE2
WE1
CS4
12
29
46
63
I/O23
CS2
GND
I/O11
A10
WE4
I/O27
A3
13
14
15
16
17
30
31
32
33
34
I/O7
I/O6
I/O5
I/O4
I/O24
47
48
49
50
51
64
65
66
I/O22
I/O21
I/O20
A4
A11
A5
NOTE: Case outlines T, U, and 4, pins 8, 21, 28, and 39 are no connects (NC) and for case outlines X, Y, and 5, pins 8, 21,
28, and 39 are ground.
FIGURE 2. Terminal connections - Continued.
SIZE
STANDARD
5962-94585
A
MICROCIRCUIT DRAWING
REVISION LEVEL
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
H
21
DSCC FORM 2234
APR 97
Device
types
1-6
6
Device
types
1-6
6
Device
types
1-6
6
Device
types
1-6
6
Case
Case
Case
Case
outline
outline
outline
outline
Terminal
number
Terminal
symbol
Terminal
number
Terminal
symbol
Terminal
number
Terminal
symbol
Terminal
number
Terminal
symbol
WE3
CS3
1
2
I/O8
I/O9
18
19
A15
VCC
35
36
I/O25
I/O26
52
53
CS1
NC
3
4
5
6
7
8
9
I/O10
A14
A16
A11
A0
20
21
22
23
24
25
26
37
38
39
40
41
42
43
A7
A12
NC
54
55
56
57
58
59
60
GND
I/O19
I/O31
I/O30
I/O29
I/O28
A1
I/03
I/015
I/O14
I/O13
I/O12
A13
A8
NC
I/O16
I/O17
I/O0
OE
NC
10
11
I/O1
I/O2
27
28
44
45
I/O18
VCC
61
62
A2
A3
WE2
CS2
WE1
I/O7
I/O6
I/O5
I/O4
I/O24
CS4
12
13
14
15
16
17
29
30
31
32
33
34
46
47
48
49
50
51
63
64
65
66
I/O23
I/O22
I/O21
I/O20
WE4
GND
I/O11
A10
A9
I/O27
A4
A5
A6
NOTE: NC is no connection.
FIGURE 2. Terminal connections - Continued.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-94585
A
REVISION LEVEL
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
H
22
DSCC FORM 2234
APR 97
Device
types
7-9
Device
types
7-9
Device
types
7-9
Device
types
7-9
Case
M, Z
Case
M, Z
Case
M, Z
Case
M, Z
outline
outline
outline
outline
Terminal
number
Terminal
symbol
Terminal
number
Terminal
symbol
Terminal
number
Terminal
symbol
Terminal
number
Terminal
symbol
OE
1
2
GND
18
GND
35
52
GND
CS3
CS2
19
20
I/O8
I/O9
36
37
53
54
I/O23
I/O22
3
4
5
A5
NC
WE2
WE3
A4
A3
21
22
I/O10
I/O11
38
39
55
56
I/O21
I/O20
WE4
NC
6
7
8
A2
A1
A0
23
24
25
I/O12
I/O13
I/O14
40
41
42
57
58
59
I/O19
I/O18
I/O17
NC
RES
I/O0
I/O1
I/O2
I/O3
I/O4
I/O5
RDY/BUSY
I/O31
9
26
27
28
29
30
31
32
I/O15
VCC
43
44
45
46
47
48
49
60
61
62
63
64
65
66
I/O16
VCC
A10
A9
10
11
12
13
14
15
A11
A12
A13
A15
A14
I/O30
I/O29
I/O28
A8
I/O27
A7
I/O26
A6
WE1
CS4
16
17
I/O6
I/O7
33
34
A16
50
51
I/O25
I/O24
67
68
CS1
NOTES:
1. NC is no connection.
2. For case outline M, device types 01 through 06, pin 9 is a no connect, pin 31 is A14, pin 32 is A15, and pin 43
is a no connect.
FIGURE 2. Terminal connections - Continued.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-94585
A
REVISION LEVEL
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
H
23
DSCC FORM 2234
APR 97
Device types 01 through 06.
A0-A16
Mode
Data I/O
Device
Current
CS
OE
WE
H
L
X
L
X
H
L
X
Stable
Stable
X
Standby
Read
High Z
Data Out
Data In
High Z
Standby
Active
Active
Active
Active
Active
L
H
H
X
L
Write
X
X
X
X
H
X
Out Disable
Write Inhibit
Write Inhibit
X
X
NOTES:
1. H = VIH = High logic level
2. L = VIL = Low logic level
3. X = Do not care (either high or low)
4. High Z = High impedance state
Device types 07 trough 09.
Mode
I/O
CS
OE
WE
RES
RDY/BUSY
Read
Standby
Write
VIL
VIH
VIL
VIL
X
VIL
X
VIH
X
VH
X
High Z
High Z
Dout
High Z
DIN
VIH
VIH
X
VIL
VIH
VIH
VH
VH
X
High Z to VOL
High Z
Deselect
Write inhibit
High Z
---
---
---
Write inhibit
Data polling
Program reset
X
VIL
X
VIL
VIL
X
X
VIH
X
X
---
VH
VIL
VOL
DOUT (I/O7)
High Z
High Z
NOTES:
1. VIH = High logic "1" state.
2. VIL = Low logic "0" state.
3. X = "do not care" state.
4. High Z = High impedance state.
5. DIN = Data in, DOUT = Data out, and VH = VCC - 0.5 V to VCC +1.0 V.
FIGURE 3. Truth table.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-94585
A
REVISION LEVEL
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
H
24
DSCC FORM 2234
APR 97
NOTE: RES waveform is applicable for device types 07 through 09 only.
FIGURE 4. Read cycle timing diagram.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-94585
A
REVISION LEVEL
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
H
25
DSCC FORM 2234
APR 97
NOTE: RDY/BUSY , RES and VCC waveforms are applicable for device types 07 through 09 only.
FIGURE 5. Write cycle timing diagram WE controlled.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-94585
A
REVISION LEVEL
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
H
26
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
NOTE: RDY/BUSY , RES and VCC waveforms are applicable for device types 07 through 09 only.
FIGURE 5. Write cycle timing diagram CS controlled - Continued.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-94585
A
REVISION LEVEL
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
H
27
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
NOTES:
1. AO through A6 are used to address specific bytes within a page.
2. A7 through A16 must specify the same page address during each high to low transition of write enable or chip select.
3. RDY/BUSY , RES and VCC waveforms are applicable for device types 07 through 09 only.
FIGURE 6. Page mode write timing diagram.
SIZE
STANDARD
5962-94585
A
MICROCIRCUIT DRAWING
REVISION LEVEL
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
H
28
DSCC FORM 2234
APR 97
FIGURE 7. Data polling AC timing diagram.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-94585
A
REVISION LEVEL
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
H
29
DSCC FORM 2234
APR 97
Case outlines M, T, U, X, Y, 4, 5, 6, and 9.
Case outline N.
FIGURE 8. Block diagram(s).
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-94585
A
REVISION LEVEL
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
H
30
DSCC FORM 2234
APR 97
Case outlines M and Z, device types 07, 08, and 09 only.
FIGURE 8. Block diagram - Continued.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-94585
A
REVISION LEVEL
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
H
31
DSCC FORM 2234
APR 97
NOTES:
1. VZ is programmed from -2.0 V to +7.0 V. IOH and IOL are programmable from 0 to 16 mA.
2. Tester impedance ZO = 75 ohms
3. VZ is typically the midpoint of VOH and VOL
.
4. CL includes tester includes jig capacitance.
FIGURE 9. Typical output test circuit.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-94585
A
REVISION LEVEL
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
H
32
DSCC FORM 2234
APR 97
TABLE II. Electrical test requirements.
MIL-PRF-38534 test requirements
Subgroups
(in accordance with
MIL-PRF-38534, group
A test table)
Interim electrical parameters
Final electrical parameters
Group A test requirements
1,4,7,9
1*,2,3,4,7,8A,8B,9,10,11
1,2,3,4,7,8A,8B,9,10,11
1,2,3,4,7,8A,8B,9,10,11
Not applicable
Group C end-point electrical
parameters
End-point electrical parameters for
radiation hardness assurance
(RHA) devices
* PDA applies to subgroup 1.
4. QUALITY ASSURANCE PROVISIONS
4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38534 or as
modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the
form, fit, or function as described herein. .
4.2 Screening. Screening shall be in accordance with MIL-PRF-38534, or by the manufacturer's Quality Management (QM)
Plan in accordance with appendix B of MIL-PRF-38534. The following additional criteria shall apply:
a. Burn-in test, method 1015 of MIL-STD-883.
(1) Test condition B. The test circuit shall be maintained by the manufacturer under document revision level control
and shall be made available to either DSCC-VA or the acquiring activity upon request. Also, the test circuit shall
specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in
test method 1015 of MIL-STD-883.
(2) TA as specified in accordance with table I of method 1015 of MIL-STD-883.
b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter
tests prior to burn-in are optional at the discretion of the manufacturer.
4.3 Conformance and periodic inspections. Conformance inspection (CI) and periodic inspection (PI) shall be in accordance
with MIL-PRF-38534 and as specified herein.
SIZE
STANDARD
5962-94585
A
MICROCIRCUIT DRAWING
REVISION LEVEL
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
H
33
DSCC FORM 2234
APR 97
4.3.1 Group A inspection (CI). Group A inspection shall be in accordance with MIL-PRF-38534 and as follows:
a. Tests shall be as specified in table II herein.
b. Subgroups 5 and 6 shall be omitted.
c. Subgroups 7, 8A, and 8B shall include verification of the truth table.
d. The following data patterns shall be verified during subgroups 7, 8A, and 8B:
(1) 0's to all memory cell locations.
(2) 1's to all memory cell locations.
(3) Checkerboard pattern to entire memory array.
(4) Checkerboard compliment to entire memory array.
4.3.2 Group B inspection (PI). Group B inspection shall be in accordance with MIL-PRF-38534.
4.3.3 Group C inspection (PI). Group C inspection shall be in accordance with MIL-PRF-38534 and as follows:
a. End-point electrical parameters shall be as specified in table II herein.
b. All devices requiring end-point electrical testing shall be programmed with a checkerboard pattern of alternate rows of
AA hex and 55 hex.
c. Steady-state life test, method 1005 of MIL-STD-883.
(1) Test condition B. The test circuit shall be maintained by the manufacturer under document revision level control
and shall be made available to either DSCC-VA or the acquiring activity upon request. Also, the test circuit shall
specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in
test method 1005 of MIL-STD-883.
(2) TA as specified in accordance with table I of method 1005 of MIL-STD-883.
(3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883.
(4) The checkerboard data pattern shall be verified after burn-in as part of end-point electrical testing.
4.3.4 Group D inspection (PI). Group D inspection shall be in accordance with MIL-PRF-38534.
4.3.5 Radiation hardness assurance (RHA) insepction. RHA inspection is currently not applicable to this drawing.
5. PACKAGING
5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38534.
SIZE
STANDARD
5962-94585
A
MICROCIRCUIT DRAWING
REVISION LEVEL
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
H
34
DSCC FORM 2234
APR 97
6. NOTES
6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications
(original equipment), design applications, and logistics purposes.
6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor-
prepared specification or drawing.
6.3 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for
the individual documents. This coordination will be accomplished in accordance with MIL-PRF-38534.
6.4 Record of users. Military and industrial users shall inform Defense Supply Center Columbus when a system application
requires configuration control and the applicable SMD. DSCC will maintain a record of users and this list will be used for
coordination and distribution of changes to the drawings. Users of drawings covering microelectronic devices (FSC 5962)
should contact DSCC-VA, telephone (614) 692-0544.
6.5 Comments. Comments on this drawing should be directed to DSCC-VA, Post Office Box 3990, Columbus, Ohio 43216-
5000, or telephone (614) 692-1081.
6.6 Sources of supply. Sources of supply are listed in MIL-HDBK-103 and QML-38534. The vendors listed in MIL-HDBK-
103 and QML-38534 have submitted a certificate of compliance (see 3.7 herein) to DSCC-VA and have agreed to this drawing.
SIZE
STANDARD
5962-94585
A
MICROCIRCUIT DRAWING
REVISION LEVEL
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
H
35
DSCC FORM 2234
APR 97
STANDARD MICROCIRCUIT DRAWING BULLETIN
DATE: 02-06-04
Approved sources of supply for SMD 5962-94585 are listed below for immediate acquisition information only and shall
be added to MIL-HDBK-103 and QML-38534 during the next revisions. MIL-HDBK-103 and QML-38534 will be revised
to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate of
compliance has been submitted to and accepted by DSCC-VA. This bulletin is superseded by the next dated revisions
of MIL-HDBK-103 and QML-38534.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
similar
PIN 2/
5962-9458501HMA
5962-9458501HMC
5962-9458501HMA
5962-9458501HMC
5962-9458501HMA
5962-9458501HMC
5962-9458501HNC
5962-9458501HTA
5962-9458501HTC
5962-9458501HUA
5962-9458501HUC
5962-9458501HXA
5962-9458501HXC
5962-9458501HYA
5962-9458501HYC
5962-9458501H4A
5962-9458501H4C
5962-9458501H4A
5962-9458501H4C
5962-9458501H4A
5962-9458501H4C
5962-9458501H5A
5962-9458501H5C
5962-9458501H5A
5962-9458501H5C
5962-9458501H5A
5962-9458501H5C
5962-9458501H6A
5962-9458501H6C
5962-9458501H9A
5962-9458501H9C
0EU86
0EU86
54230
54230
88379
88379
54230
54230
54230
54230
54230
54230
54230
54230
54230
0EU86
0EU86
54230
54230
88379
88379
0EU86
0EU86
54230
54230
88379
88379
54230
54230
54230
54230
AS8E128K32Q-300/883C
AS8E128K32Q-300/883C
WE128K32-300G2Q
WE128K32-300G2Q
ACT-E128K32N-300F2Q
ACT-E128K32N-300F2Q
WE128K32-300G4Q
WE128K32N-300HQ
WE128K32N-300HQ
WE128K32N-300HQ
WE128K32N-300HQ
WE128K32-300HQ
WE128K32-300HQ
WE128K32-300HQ
WE128K32-300HQ
AS8E128K32PN-300/883C
AS8E128K32PN-300/883C
WE128K32N-300H1Q
WE128K32N-300H1Q
ACT-E128K32N-300P7Q
ACT-E128K32N-300P7Q
AS8E128K32P-300/883C
AS8E128K32P-300/883C
WE128K32-300H1Q
WE128K32-300H1Q
ACT-E128K32C-300P7Q
ACT-E128K32C-300P7Q
WE128K32NP-300H1Q
WE128K32NP-300H1Q
WE128K32-300G1UQ
WE128K32-300G1UQ
See footnotes at end of table.
1 of 7
STANDARD MICROCIRCUIT DRAWING BULLETIN - Continued.
DATE: 02-06-04
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
similar
PIN 2/
5962-9458502HMA
5962-9458502HMC
5962-9458502HMA
5962-9458502HMC
5962-9458502HMA
5962-9458502HMC
5962-9458502HNC
5962-9458502HTA
5962-9458502HTC
5962-9458502HUA
5962-9458502HUC
5962-9458502HXA
5962-9458502HXC
5962-9458502HYA
5962-9458502HYC
5962-9458502H4A
5962-9458502H4C
5962-9458502H4A
5962-9458502H4C
5962-9458502H4A
5962-9458502H4C
5962-9458502H5A
5962-9458502H5C
5962-9458502H5A
5962-9458502H5C
5962-9458502H5A
5962-9458502H5C
5962-9458502H6A
5962-9458502H6C
5962-9458502H9A
5962-9458502H9C
0EU86
0EU86
54230
54230
88379
88379
54230
54230
54230
54230
54230
54230
54230
54230
54230
0EU86
0EU86
54230
54230
88379
88379
0EU86
0EU86
54230
54230
88379
88379
54230
54230
54230
54230
AS8E128K32Q-250/883C
AS8E128K32Q-250/883C
WE128K32-250G2Q
WE128K32-250G2Q
ACT-E128K32N-250F2Q
ACT-E128K32N-250F2Q
WE128K32-300G4Q
WE128K32N-250HQ
WE128K32N-250HQ
WE128K32N-250HQ
WE128K32N-250HQ
WE128K32-250HQ
WE128K32-250HQ
WE128K32-250HQ
WE128K32-250HQ
AS8E128K32PN-250/883C
AS8E128K32PN-250/883C
WE128K32N-250H1Q
WE128K32N-250H1Q
ACT-E128K32N-250P7Q
ACT-E128K32N-250P7Q
AS8E128K32P-250/883C
AS8E128K32P-250/883C
WE128K32-250H1Q
WE128K32-250H1Q
ACT-E128K32C-250P7Q
ACT-E128K32C-250P7Q
WE128K32NP-250H1Q
WE128K32NP-250H1Q
WE128K32-250G1UQ
WE128K32-250G1UQ
See footnotes at end of table.
2 of 7
STANDARD MICROCIRCUIT DRAWING BULLETIN - Continued.
DATE: 02-06-04
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
similar
PIN 2/
5962-9458503HMA
5962-9458503HMC
5962-9458503HMA
5962-9458503HMC
5962-9458503HMA
5962-9458503HMC
5962-9458503HNC
5962-9458503HTA
5962-9458503HTC
5962-9458503HUA
5962-9458503HUC
5962-9458503HXA
5962-9458503HXC
5962-9458503HYA
5962-9458503HYC
5962-9458503H4A
5962-9458503H4C
5962-9458503H4A
5962-9458503H4C
5962-9458503H4A
5962-9458503H4C
5962-9458503H5A
5962-9458503H5C
5962-9458503H5A
5962-9458503H5C
5962-9458503H5A
5962-9458503H5C
5962-9458503H6A
5962-9458503H6C
5962-9458503H9A
5962-9458503H9C
0EU86
0EU86
54230
54230
88379
88379
54230
54230
54230
54230
54230
54230
54230
54230
54230
0EU86
0EU86
54230
54230
88379
88379
0EU86
0EU86
54230
54230
88379
88379
54230
54230
54230
54230
AS8E128K32Q-200/883C
AS8E128K32Q-200/883C
WE128K32-200G2Q
WE128K32-200G2Q
ACT-E128K32N-200F2Q
ACT-E128K32N-200F2Q
WE128K32-300G4Q
WE128K32N-200HQ
WE128K32N-200HQ
WE128K32N-200HQ
WE128K32N-200HQ
WE128K32-200HQ
WE128K32-200HQ
WE128K32-200HQ
WE128K32-200HQ
AS8E128K32PN-200/883C
AS8E128K32PN-200/883C
WE128K32N-200H1Q
WE128K32N-200H1Q
ACT-E128K32N-200P7Q
ACT-E128K32N-200P7Q
AS8E128K32P-200/883C
AS8E128K32P-200/883C
WE128K32-200H1Q
WE128K32-200H1Q
ACT-E128K32C-200P7Q
ACT-E128K32C-200P7Q
WE128K32NP-200H1Q
WE128K32NP-200H1Q
WE128K32-200G1UQ
WE128K32-200G1UQ
See footnotes at end of table.
3 of 7
STANDARD MICROCIRCUIT DRAWING BULLETIN - Continued.
DATE: 02-06-04
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
similar
PIN 2/
5962-9458504HMA
5962-9458504HMC
5962-9458504HMA
5962-9458504HMC
5962-9458504HMA
5962-9458504HMC
5962-9458504HNC
5962-9458504HTA
5962-9458504HTC
5962-9458504HUA
5962-9458504HUC
5962-9458504HXA
5962-9458504HXC
5962-9458504HYA
5962-9458504HYC
5962-9458504H4A
5962-9458504H4C
5962-9458504H4A
5962-9458504H4C
5962-9458504H4A
5962-9458504H4C
5962-9458504H5A
5962-9458504H5C
5962-9458504H5A
5962-9458504H5C
5962-9458504H5A
5962-9458504H5C
5962-9458504H6A
5962-9458504H6C
5962-9458504H9A
5962-9458504H9C
0EU86
0EU86
54230
54230
88379
88379
54230
54230
54230
54230
54230
54230
54230
54230
54230
0EU86
0EU86
54230
54230
88379
88379
0EU86
0EU86
54230
54230
88379
88379
54230
54230
54230
54230
AS8E128K32Q-150/883C
AS8E128K32Q-150/883C
WE128K32-150G2Q
WE128K32-150G2Q
ACT-E128K32N-150F2Q
ACT-E128K32N-150F2Q
WE128K32-150G4Q
WE128K32N-150HQ
WE128K32N-150HQ
WE128K32N-150HQ
WE128K32N-150HQ
WE128K32-150HQ
WE128K32-150HQ
WE128K32-150HQ
WE128K32-150HQ
AS8E128K32PN-150/883C
AS8E128K32PN-150/883C
WE128K32N-150H1Q
WE128K32N-150H1Q
ACT-E128K32N-150P7Q
ACT-E128K32N-150P7Q
AS8E128K32P-150/883C
AS8E128K32P-150/883C
WE128K32-150H1Q
WE128K32-150H1Q
ACT-E128K32C-150P7Q
ACT-E128K32C-150P7Q
WE128K32NP-150H1Q
WE128K32NP-150H1Q
WE128K32-150G1UQ
WE128K32-150G1UQ
See footnotes at end of table.
4 of 7
STANDARD MICROCIRCUIT DRAWING BULLETIN - Continued.
DATE: 02-06-04
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
similar
PIN 2/
5962-9458505HMA
5962-9458505HMC
5962-9458505HMA
5962-9458505HMC
5962-9458505HMA
5962-9458505HMC
5962-9458505HNC
5962-9458505HTA
5962-9458505HTC
5962-9458505HUA
5962-9458505HUC
5962-9458505HXA
5962-9458505HXC
5962-9458505HYA
5962-9458505HYC
5962-9458505H4A
5962-9458505H4C
5962-9458505H4A
5962-9458505H4C
5962-9458505H4A
5962-9458505H4C
5962-9458505H5A
5962-9458505H5C
5962-9458505H5A
5962-9458505H5C
5962-9458505H5A
5962-9458505H5C
5962-9458505H6A
5962-9458505H6C
5962-9458505H9A
5962-9458505H9C
0EU86
0EU86
54230
54230
88379
88379
54230
54230
54230
54230
54230
54230
54230
54230
54230
0EU86
0EU86
54230
54230
88379
88379
0EU86
0EU86
54230
54230
88379
88379
54230
54230
54230
54230
AS8E128K32Q-140/883C
AS8E128K32Q-140/883C
WE128K32-140G2Q
WE128K32-140G2Q
ACT-E128K32N-140F2Q
ACT-E128K32N-140F2Q
WE128K32-140G4Q
WE128K32N-140HQ
WE128K32N-140HQ
WE128K32N-140HQ
WE128K32N-140HQ
WE128K32-140HQ
WE128K32-140HQ
WE128K32-140HQ
WE128K32-140HQ
AS8E128K32PN-140/883C
AS8E128K32PN-140/883C
WE128K32N-140H1Q
WE128K32N-140H1Q
ACT-E128K32N-140P7Q
ACT-E128K32N-140P7Q
AS8E128K32P-140/883C
AS8E128K32P-140/883C
WE128K32-140H1Q
WE128K32-140H1Q
ACT-E128K32C-140P7Q
ACT-E128K32C-140P7Q
WE128K32NP-140H1Q
WE128K32NP-140H1Q
WE128K32-140G1UQ
WE128K32-140G1UQ
See footnotes at end of table.
5 of 7
STANDARD MICROCIRCUIT DRAWING BULLETIN - Continued.
DATE: 02-06-04
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
similar
PIN 2/
5962-9458506HMA
5962-9458506HMC
5962-9458506HMA
5962-9458506HMC
5962-9458506HMA
5962-9458506HMC
5962-9458506HNC
5962-9458506HTA
5962-9458506HTC
5962-9458506HUA
5962-9458506HUC
5962-9458506HXA
5962-9458506HXC
5962-9458506HYA
5962-9458506HYC
5962-9458506H4A
5962-9458506H4C
5962-9458506H4A
5962-9458506H4C
5962-9458506H4A
5962-9458506H4C
5962-9458506H5A
5962-9458506H5C
5962-9458506H5A
5962-9458506H5C
5962-9458506H5A
5962-9458506H5C
5962-9458506H6A
5962-9458506H6C
5962-9458506H9A
5962-9458506H9C
0EU86
0EU86
54230
54230
88379
88379
54230
54230
54230
54230
54230
54230
54230
54230
54230
0EU86
0EU86
54230
54230
88379
88379
0EU86
0EU86
54230
54230
88379
88379
54230
54230
54230
54230
AS8E128K32Q-120/883C
AS8E128K32Q-120/883C
WE128K32-120G2Q
WE128K32-120G2Q
ACT-E128K32N-120F2Q
ACT-E128K32N-120F2Q
WE128K32-120G4Q
WE128K32N-120HQ
WE128K32N-120HQ
WE128K32N-120HQ
WE128K32N-120HQ
WE128K32-120HQ
WE128K32-120HQ
WE128K32-120HQ
WE128K32-120HQ
AS8E128K32PN-120/883C
AS8E128K32PN-120/883C
WE128K32N-120H1Q
WE128K32N-120H1Q
ACT-E128K32N-120P7Q
ACT-E128K32N-120P7Q
AS8E128K32P-120/883C
AS8E128K32P-120/883C
WE128K32-120H1Q
WE128K32-120H1Q
ACT-E128K32C-120P7Q
ACT-E128K32C-120P7Q
WE128K32NP-120H1Q
WE128K32NP-120H1Q
WE128K32-120G1UQ
WE128K32-120G1UQ
5962-9458507HMA
5962-9458507HMC
5962-9458507HZC
5962-9458508HMA
5962-9458508HMC
5962-9458508HZC
5962-9458509HMA
5962-9458509HMC
5962-9458509HZC
0EU86
0EU86
0EU86
0EU86
0EU86
0EU86
0EU86
0EU86
0EU86
AS8ER128K32Q-250/883C
AS8ER128K32Q-250/883C
AS8ER128K32QB-250/883C
AS8ER128K32Q-200/883C
AS8ER128K32Q-200/883C
AS8ER128K32QB-200/883C
AS8ER128K32Q-150/883C
AS8ER128K32Q-150/883C
AS8ER128K32QB-150/883C
See footnotes at top of next page.
6 of 7
STANDARD MICROCIRCUIT DRAWING BULLETIN - Continued.
DATE: 02-06-04
1/
2/
The lead finish shown for each PIN representing a hermetic package is the most readily available from
the manufacturer listed for that part. If the desired lead finish is not listed contact the Vendor to
determine its availability.
Caution. Do not use this number for item acquisition. Items acquired to this number may not satisfy the
performance requirements of this drawing.
Vendor CAGE
number
Vendor name
and address
0EU86
54230
88379
Austin Semiconductor, Incorporated
8701 Cross Park Drive
Austin, TX 78754-4566
White Electronic Designs Corporation
3601 East University Drive
Phoenix, AZ 85034-7217
Aeroflex Circuit Technology Corporation
35 South Service Road
Plainview, NY 11803-4101
The information contained herein is disseminated for convenience only and the
Government assumes no liability whatsoever for any inaccuracies in the
information bulletin.
7 of 7
相关型号：
5962-9458502H9X
EEPROM Module, 128KX32, 250ns, Parallel, CMOS, CQFP68, 23.90 MM, CERAMIC, LQFP-68
WEDC
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