5962-9461401H9C [ETC]
EEPROM ; EEPROM\n
| 型号： | 5962-9461401H9C |
| 厂家： | 
ETC |
| 描述： | EEPROM
|
| 文件： | 总30页 (文件大小：177K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
REVISIONS
LTR
C
DESCRIPTION
DATE (YR-MO-DA)
98-08-13
APPROVED
Added case outline Z. Corrected the true dimensioning table feature for
case outlines U, X, and Y. -sld
K.A. Cottongim
D
Added case outline 9. Added vendor cage 0EU86 for device types 01
through 03 in the Standard Microcircuit Drawing Source Approval
Bulletin. -sld
00-04-19
Raymond L. Monnin
REV
SHEET
REV
D
D
D
D
D
D
D
21
D
D
22
D
D
23
D
D
24
D
D
25
D
D
26
D
D
27
D
D
28
D
SHEET
15
16
17
18
19
20
REV STATUS
OF SHEETS
REV
D
9
D
D
D
D
D
SHEET
1
2
3
4
5
6
7
8
10
11
12
13
14
PMIC N/A
PREPARED BY
Gary Zahn
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216
STANDARD
CHECKED BY
MICROCIRCUIT DRAWING
Michael C. Jones
THIS DRAWING IS
AVAILABLE
FOR USE BY ALL
APPROVED BY
Kendall A. Cottongim
MICROCIRCUIT, HYBRID, MEMORY,
DIGITAL, 32K x 32-BIT, ELECTRICALLY
ERASABLE AND PROGRAMMABLE READ
ONLY MEMORY
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
DRAWING APPROVAL DATE
94-08-26
AMSC N/A
REVISION LEVEL
D
SIZE
A
CAGE CODE
5962-94614
67268
SHEET
1 OF 28
DSCC FORM 2233
APR 97
5962-E175-00
DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.
1. SCOPE
1.1 Scope. This drawing documents five product assurance classes, class D (lowest reliability), class E, (exceptions), class G
(lowered high reliability), class H (high reliability), and class K, (highest reliability) and a choice of case outlines and lead finishes
which are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of radiation hardness
assurance levels are reflected in the PIN.
1.2 PIN. The PIN shall be as shown in the following example:
5962
-
94614
01
H
M
X
½
½
½
½
½
½
½
½
½
½
½
½
½
½
½
½
½
½
Federal
stock class
designator
RHA
designator
(see 1.2.1)
Device
type
(see 1.2.2)
Device
class
designator
(see 1.2.3)
Case
outline
(see 1.2.4)
Lead
finish
(see 1.2.5)
\
/
\/
Drawing number
1.2.1 Radiation hardness assurance (RHA) designator. RHA marked devices shall meet the MIL-PRF-38534 specified RHA
levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device type(s). The device type(s) identify the circuit function as follows:
Device type
Generic number
Circuit function
Access time
01
02
03
WE32K32-150Q, AS8E32K32Q-150/883C
WE32K32-120Q, AS8E32K32Q-120/883C
WE32K32-90Q, AS8E32K32Q-90/883C
EEPROM, 32K x 32-bit
EEPROM, 32K x 32-bit
EEPROM, 32K x 32-bit
150 ns
120 ns
90 ns
1.2.3 Device class designator. This device class designator shall be a single letter identifying the product assurance level as
follows:
Device class
Device performance documentation
D, E, G, H, or K
Certification and qualification to MIL-PRF-38534
1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
Descriptive designator
Terminals
Package style
M
U
X
Y 1/
Z
See figure 1
See figure 1
See figure 1
See figure 1
See figure 1
68
66
66
66
68
Ceramic, dual cavity, quad flatpack
1.075", hex-in-line, single cavity, with standoffs
Hex-in-line, single cavity, with standoffs
Hex-in-line, single cavity, without standoffs
Co-fired ceramic, single cavity, ultra low profile,
quad flatpack
9
See figure 1
68
Co-fired ceramic, single cavity, quad flatpack
1.2.5 Lead finish. The lead finish shall be as specified in MIL-PRF-38534.
1/ The case outline Y is inactive for new design.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-94614
A
REVISION LEVEL
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
D
2
DSCC FORM 2234
APR 97
1.3 Absolute maximum ratings. 1/
Supply voltage range (VCC) ...........................................................
-0.6 V dc to +6.25 V dc
Input voltage range.........................................................................
Power dissipation (PD)....................................................................
Storage temperature range............................................................
Lead temperature (soldering, 10 seconds)....................................
Thermal resistance junction-to-case (qJC):
-0.6 V dc to +6.25 V dc
1.5 W
-65°C to +150°C
+300°C
Case outlines M and Z................................................................
Case outlines U, X, and Y...........................................................
Case outline 9.............................................................................
Data retention.................................................................................
Endurance......................................................................................
11.3°C/W
2.8°C/W
4.57°C/W
10 years minimum
10,000 cycles minimum
1.4 Recommended operating conditions.
Supply voltage range (VCC) ............................................................
Input low voltage range (VIL) ..........................................................
Input high voltage range (VIH) ........................................................
+4.5 V dc to +5.5 V dc
-0.5 V dc to +0.8 V dc
+2.0 V dc to VCC + 0.3 V dc
Output voltage, High minimum (VOH).............................................
Output voltage, low maximum (VOL)...............................................
Case operating temperature range (TC).........................................
+2.4 V dc
+0.45 V dc
-55°C to +125°C
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of
this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the issue
of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the solitation.
SPECIFICATION
DEPARTMENT OF DEFENSE
MIL-PRF-38534 - Hybrid Microcircuits, General Specification for.
STANDARDS
DEPARTMENT OF DEFENSE
MIL-STD-883 - Test Method Standard Microcircuits.
MIL-STD-1835 - Interface Standard for Microcircuit Case Outlines.
HANDBOOKS
DEPARTMENT OF DEFENSE
MIL-HDBK-103 - List of Standard Microcircuit Drawings (SMD's).
MIL-HDBK-780 - Standard Microcircuit Drawings.
(Unless otherwise indicated, copies of the specification, standards, and handbook are available from the Standardization
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
1/Stresses above the absolute maximum ratings may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
SIZE
STANDARD
5962-94614
A
MICROCIRCUIT DRAWING
REVISION LEVEL
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
D
3
DSCC FORM 2234
APR 97
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of
this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific
exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item performance requirements for device classes D, E, G, H, and K shall be in
accordance with MIL-PRF-38534. Compliance with MIL-PRF-38534 may include the performance of all tests herein or as
designated in the device manufacturer's Quality Management (QM) plan or as designated for the applicable device class.
Therefore, the tests and inspections herein may not be performed for the applicable device class (see MIL-PRF-38534).
Furthermore, the manufacturer may take exceptions or use alternate methods to the tests and inspections herein and not perform
them. However, the performance requirements as defined in MIL-PRF-38534 shall be met for the applicable device class.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in
MIL-PRF-38534 and herein.
3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein and figure 1.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2.
3.2.3 Truth table(s). The truth table(s) shall be as specified on figure 3.
3.2.4 Timing diagram(s). The timing diagram(s) shall be as specified on figure 4, 5, 6, and 7.
3.2.5 Block diagram. The block diagram shall be as specified on figure 8 .
3.2.6 Output test circuit. The output test circuit shall be as specified on figure 9 .
3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as
specified in table I and shall apply over the full specified operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests
for each subgroup are defined in table I.
3.5 Programming procedure. The programming procedure shall be as specified by the manufacturer and shall be available upon
request.
3.6 Marking of Device(s). Marking of device(s) shall be in accordance with MIL-PRF-38534. The device shall be marked with
the PIN listed in 1.2 herein. In addition, the manufacturer's vendor similar PIN may also be marked.
3.7 Data. In addition to the general performance requirements of MIL-PRF-38534, the manufacturer of the device described
herein shall maintain the electrical test data (variables format) from the initial quality conformance inspection group A lot sample, for
each device type listed herein. Also, the data should include a summary of all parameters manually tested, and for those which, if
any, are guaranteed. This data shall be maintained under document revision level control by the manufacturer and be made
available to the preparing activity (DSCC-VA) upon request.
3.8 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to supply to this drawing.
The certificate of compliance (original copy) submitted to DSCC-VA shall affirm that the manufacturer's product meets the
performance requirements of MIL-PRF-38534 and herein.
3.9 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38534 shall be provided with each lot of
microcircuits delivered to this drawing.
3.10 Endurance. A reprogrammability test shall be completed as part of the vendor's reliability monitors. This reprogrammability
test shall be done for the initial characterization and after any design process changes which may affect the reprogrammability of the
device. The methods and procedures may be vendor specific, but shall guarantee the number of program/erase cycles listed in
section 1.3 herein over the full military temperature range. The vendor's procedure shall be kept under document control and shall
be made available upon request of the acquiring or preparing activity.
SIZE
STANDARD
5962-94614
A
MICROCIRCUIT DRAWING
REVISION LEVEL
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
D
4
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics.
Conditions 1/
Test
Symbol
Group A
subgroups
Device
type
Limits
Unit
-55°C £ T £ +125°C
C
+4.5 V dc £ VCC £ +5.5 V dc
unless otherwise specified
Min
Max
DC Parameters
Supply current
ICC
CS = VIL, OE = WE = VIH,
IOUT = 0 mA, VCC = 5.5 V dc,
A0 through A14 and D0
through D31 change at 5
MHz CMOS levels.
1, 2, 3
1, 2, 3
01
02
03
150
200
250
mA
Standby current
ISB
CS = OE = VIH,
All
2.5
mA
IOUT = 0 mA, VCC = 5.5 V dc,
A0 through A14 and D0
through D31 change at 5
MHz CMOS levels.
Input leakage current
Output leakage current
ILI
VIN = VSS or VCC
1, 2, 3
1, 2, 3
All
All
10
mA
mA
ILO
VOUT = VSS or VCC, CS = VIH
10
Output low voltage
Output high voltage
Functional testing
Functional tests
VOL
VOH
IOL = 2.1 mA, VCC = +4.5 V
1, 2, 3
1, 2, 3
All
All
0.45
V
V
2.4
IOH = -400 mA, VCC = +4.5 V
See 4.3.1c
7, 8A, 8B
Dynamic characteristics
A0 - A14 2/
OE capacitance
CAD
COE
VIN = 0 V, f = 1.0 MHz,
TA = +25°C
4
4
4
4
All
All
All
All
50
20
20
20
pF
pF
pF
pF
CS1-4 capacitance 2/
CCS
CWE
CI/O
VIN = 0 V, f = 1.0 MHz,
TA = +25°C
WE1-4 capacitance 2/
I/O0-I/O31 capacitance 2/
See footnotes at end of table.
VIN = 0 V, f = 1.0 MHz,
TA = +25°C
VI/O = 0 V, f = 1.0 MHz,
TA = +25°C
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-94614
A
REVISION LEVEL
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
D
5
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics - Continued.
Test
Symbol
Conditions 1/
Group A
subgroups
Device
type
Limits
Unit
-55°C £ T £ +125°C
C
+4.5 V dc £ VCC £ +5.5 V dc
unless otherwise specified
Min
Max
Read cycle AC timing characteristics
Read cycle time
tRC
See figure 4
See figure 4
See figure 4
See figure 4
See figure 4
See figure 4
9,10,11
9, 10, 11
9, 10, 11
9, 10, 11
9, 10, 11
9, 10, 11
01
02
03
150
120
90
ns
Address access time
Chip select access time
tACC
tACS
tOH
tOE
01
02
03
150
120
90
ns
ns
ns
ns
ns
01
02
03
150
120
90
Output hold from address
change OE or CS
All
0
Output enable to output
valid
01
02
03
70
60
50
Chip select or Output enable
to Output high Z 2/
tDF
01
02
03
70
60
50
Byte write AC timing characteristics
Address setup time
Write pulse width
tAS
See figure 5
See figure 5
9, 10, 11
9, 10, 11
All
0
ns
ns
tWP
01 ,02
03
150
100
0
Chip select setup time
Address hold time
tCS
See figure 5
See figure 5
9, 10, 11
9, 10, 11
All
ns
ns
tAH
01, 02
03
100
50
See footnotes at end of table.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-94614
A
REVISION LEVEL
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
D
6
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics - Continued.
Test
Symbol
Conditions 1/
Group A
subgroups
Device
type
Limits
Unit
-55°C £ T £ +125°C
C
+4.5 V dc £ VCC £ +5.5 V dc
unless otherwise specified
Min
Max
Byte write AC timing characteristics - Continued
Output enable setup time
tOES
See figure 5
9, 10, 11
9, 10, 11
01, 02
03
10
4
ns
Data hold time
tDH
See figure 5
01, 02
03
10
0
ns
Output enable hold time
Data setup time
tOEH
See figure 5
See figure 5
9, 10, 11
9, 10, 11
All
10
ns
ns
tDS
01, 02
03
100
50
0
Chip select hold time
Write pulse width high
Write cycle time
tCSH
tWPH
tWC
See figure 5
See figure 5
See figure 5
9, 10, 11
9, 10, 11
9, 10, 11
All
ns
ns
ms
All
All
50
10
Page mode write AC timing characteristics
Data setup time
tDS
tDH
tWP
See figure 6
See figure 6
See figure 6
9, 10, 11
9, 10, 11
9, 10, 11
01, 02
03
100
50
ns
ns
ns
Data hold time
01, 02
03
10
0
Write pulse width
01, 02
03
150
100
See footnotes at end of table.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-94614
A
REVISION LEVEL
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
D
7
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics - Continued.
Test
Symbol
Conditions 1/
Group A
subgroups
Device
type
Limits
Unit
-55°C £ T £ +125°C
C
+4.5 V dc £ VCC £ +5.5 V dc
unless otherwise specified
Min
Max
150
Page mode write AC timing characteristics - continued
Byte load cycle time
Write pulse width high
Write cycle time
tBLC
tWPH
tWC
See figure 6
See figure 6
See figure 6
9, 10, 11
9, 10, 11
9, 10, 11
All
All
All
ms
50
ns
10
ms
Data polling AC timing characteristics
Data hold time
tDH
See figure 7
See figure 7
See figure 7
See figure 7
9, 10, 11
9, 10, 11
9, 10, 11
9, 10, 11
All
All
All
All
10
10
ns
ns
ns
ns
Output enable hold time
tOEH
Output enable to output
delay
tOE
100
Write recovery time
tWR
0
1/ Unless otherwise specified:
The DC test conditions are as follows:
Input low voltage, V = 0.3 V.
IL
Input high voltage, V = V
- 0.3 V.
CC
IH
The AC test conditions are as follows:
Input pulse levels: V = 0 V and V = 3.0 V.
IL
IH
Input rise and fall times: 5 nanoseconds.
Input and output timing reference levels: 1.5 V.
2/ Guaranteed by design, but not tested.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-94614
A
REVISION LEVEL
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
D
8
DSCC FORM 2234
APR 97
Case outline M.
FIGURE 1. Case outline(s).
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-94614
A
REVISION LEVEL
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
D
9
DSCC FORM 2234
APR 97
Case outline M - Continued.
Symbol
Millimeters
Inches
Min
4.01
3.91
0.13
0.33
0.23
Max
5.10
4.72
0.38
0.43
0.30
Min
Max
.200
.186
.015
.017
.012
A
A1
.158
.154
.005
.013
.009
A2
b
c
B
0.25 REF
20.3 BSC
.010 REF
.800 BSC
D/E
D1/E1
D2/E2
D3/E3
e
22.10
24.89
23.77
22.61
25.40
24.28
.870
.980
.936
.890
1.000
.956
1.27 BSC
.050 BSC
R
0.13
0.89
.005
.035
L1
1.14
.045
NOTES:
1. The U.S. preferred system of measurement is the metric SI. This item was designed using inch-pound units of
measurement. In case of problems involving conflicts between the metric and inch-pound units, the inch-pound
units shall rule.
2. Pin numbers are for reference only.
3. Case outline M is a dual cavity package.
FIGURE 1. Case outline(s) - Continued.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-94614
A
REVISION LEVEL
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
D
10
DSCC FORM 2234
APR 97
Case outlines U and X.
FIGURE 1. Case outline(s) - Continued.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-94614
A
REVISION LEVEL
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
D
11
DSCC FORM 2234
APR 97
Case outline U only - Continued.
Symbol
Millimeters
Inches
Min
3.43
0.64
0.41
1.14
1.65
27.05
Max
4.34
0.89
0.51
1.40
1.91
27.56
Min
.135
.025
.016
.045
.065
1.065
Max
.171
.035
.020
.055
.075
1.085
A
A1
f b
f b1
f b2
D/E
D1/E1
D2
D3
e
25.40 BSC
15.24 BSC
25.90 26.92
2.54 BSC
1.000 BSC
.600 BSC
1.020
1.060
.100 BSC
L
3.35
3.94
.132
.155
NOTES:
1. The U.S. preferred system of measurement is the metric SI. This item was designed using inch-pound units of
measurement. In case of problems involving conflicts between the metric and inch-pound units, the inch-pound
units shall rule.
2. Pin 1 is identified by a 0.070 square pad.
3. Pin numbers are for reference only.
FIGURE 1. Case outlines - Continued.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-94614
A
REVISION LEVEL
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
D
12
DSCC FORM 2234
APR 97
Case outline X only - Continued.
Symbol
Millimeters
Inches
Min
5.08
0.64
0.41
1.14
1.65
29.72
Max
6.22
0.89
0.51
1.40
1.91
30.48
Min
.200
.025
.016
.045
.065
1.170
Max
.245
.035
.020
.055
.075
1.200
A
A1
f b
f b1
f b2
D/E
D1/E1
D2
D3
e
25.40 BSC
15.24 BSC
28.96 29.21
2.54 BSC
1.000 BSC
.600 BSC
1.140
1.150
.100 BSC
L
3.68
3.94
.145
.155
NOTES:
1. The U.S. preferred system of measurement is the metric SI. This item was designed using inch-pound units of
measurement. In case of problems involving conflicts between the metric and inch-pound units, the inch-pound
units shall rule.
2. Pin 1 is identified by a 0.070 square pad.
3. Pin numbers are for reference only.
FIGURE 1. Case outlines - Continued.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-94614
A
REVISION LEVEL
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
D
13
DSCC FORM 2234
APR 97
Case outline Y.
FIGURE 1. Case outline(s) - Continued.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-94614
A
REVISION LEVEL
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
D
14
DSCC FORM 2234
APR 97
Case outline Y - Continued.
Symbol
Millimeters
Inches
Min
4.69
0.41
Max
5.84
0.51
Min
Max
.230
.020
A
f b
.185
.016
0.76 REF
.030 REF
f b1
f b2
D/E
D1/E1
D2
D3
e
1.65
1.91
.065
.075
29.72
30.48
1.170
1.200
25.40 BSC
15.24 BSC
1.000 BSC
.600 BSC
1.150
.100 BSC
28.96
29.21
1.140
.165
2.54 BSC
L
4.19
4.69
.185
NOTES:
1. The U.S. preferred system of measurement is the metric SI. This item was designed using inch-pound units of
measurement. In case of problems involving conflicts between the metric and inch-pound units, the inch-pound
units shall rule.
2. Pin 1 is identified by a 0.070 square pad.
3. Pin numbers are for reference only.
FIGURE 1. Case outline(s) - Continued.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-94614
A
REVISION LEVEL
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
D
15
DSCC FORM 2234
APR 97
Case outline Z.
FIGURE 1. Case outline(s) - Continued.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-94614
A
REVISION LEVEL
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
D
16
DSCC FORM 2234
APR 97
Case outline Z - Continued.
Symbol
Millimeters
Inches
Min
Max
3.56
0.71
0.43
0.30
Min
Max
.140
.028
.017
.012
A
A2
0.36
0.33
0.23
.014
.013
.009
b
c
D/E
D1/E1
D2/E2
e
20.32 BSC
.800 BSC
22.10
24.89
22.61
25.35
.870
.980
.890
1.000
1.27 TYP
0.13 MIN
.050 TYP
.005 MIN
R
L1
0.89
1.14
.035
.045
NOTES:
1. The U.S. preferred system of measurement is the metric SI. This item was designed using inch-pound units of
measurement. In case of problems involving conflicts between the metric and inch-pound units, the inch-pound
units shall rule.
2. Pin numbers are for reference only.
FIGURE 1. Case outline(s) - Continued.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-94614
A
REVISION LEVEL
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
D
17
DSCC FORM 2234
APR 97
Case outline 9.
FIGURE 1. Case outline(s) - Continued.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-94614
A
REVISION LEVEL
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
D
18
DSCC FORM 2234
APR 97
Case outline 9 - Continued.
Symbol
Millimeters
Inches
Min
Max
3.56
2.79
0.76
0.43
0.25
Min
Max
.140
.110
.030
.017
.010
A
A1
A2
0.46
0.33
0.15
.018
.013
.006
b
C
D/E
D1/E1
D2/E2
e
20.32 TYP
.800 TYP
.050 TYP
23.65
25.15
24.10
25.40
.931
.990
.949
1.000
1.27 TYP
L1
0.51
1.14
.020
.045
NOTES:
1. The U.S. preferred system of measurement is the metric SI. This item was designed using inch-pound units of
measurement. In case of problems involving conflicts between the metric and inch-pound units, the inch-pound
units shall rule.
2. Pin numbers are for reference only.
FIGURE 1. Case outlines - Continued.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-94614
A
REVISION LEVEL
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
D
19
DSCC FORM 2234
APR 97
Device
types
All
Device
types
All
Device
types
All
Device
types
All
Case
M, Z, 9
Case
M, Z, 9
Case
M, Z, 9
Case
M, Z, 9
outlines
outlines
outlines
outlines
Terminal
number
Terminal
symbol
Terminal
number
Terminal
symbol
Terminal
number
Terminal
symbol
Terminal
number
Terminal
symbol
1
2
GND
CS3
A5
18
19
20
21
22
23
24
25
26
27
GND
I/O8
35
36
37
38
39
40
41
42
43
44
OE
CS2
NC
52
53
54
55
56
57
58
59
60
61
GND
I/O23
I/O22
I/O21
I/O20
I/O19
I/O18
I/O17
I/O16
VCC
3
I/O9
4
A4
I/O10
I/O11
I/O12
I/O13
I/O14
I/O15
VCC
WE2
WE3
WE4
NC
5
A3
6
A2
7
A1
8
A0
NC
9
NC
I/O0
NC
10
I/O31
11
12
13
14
15
16
17
I/O1
I/O2
I/O3
I/O4
I/O5
I/O6
I/O7
28
29
30
31
32
33
34
A11
A12
A13
A14
NC
45
46
47
48
49
50
51
I/O30
I/O29
I/O28
I/O27
I/O26
I/O25
I/O24
62
63
64
65
66
67
68
A10
A9
A8
A7
A6
NC
WE1
CS4
CS1
NOTE:
1. NC is a no connect.
FIGURE 2. Terminal connections.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-94614
A
REVISION LEVEL
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
D
20
DSCC FORM 2234
APR 97
Device
type
All
Device
type
All
Device
type
All
Device
type
All
Case
U,X,Y
Case
U,X,Y
Case
U,X,Y
Case
U,X,Y
outlines
outlines
outlines
outlines
Terminal
number
Terminal
symbol
Terminal
number
Terminal
symbol
Terminal
number
Terminal
symbol
Terminal
number
Terminal
symbol
1
2
I/O8
I/O9
18
19
A12
VCC
35
36
I/O25
I/O26
52
53
WE3
CS3
3
4
I/O10
A13
A14
NC
20
21
22
23
24
25
26
27
28
CS1
NC
37
38
39
40
41
42
43
44
45
A6
A7
54
55
56
57
58
59
60
61
62
GND
I/O19
I/O31
I/O30
I/O29
I/O28
A0
5
I/03
NC
6
I/015
I/O14
I/O13
I/O12
OE
A8
7
NC
A9
8
NC
I/O16
I/O17
I/O18
VCC
9
I/O0
I/O1
I/O2
10
11
A1
NC
A2
12
13
14
15
16
17
WE2
CS2
GND
I/O11
A10
29
30
31
32
33
34
WE1
I/O7
I/O6
I/O5
I/O4
I/O24
46
47
48
49
50
51
CS4
WE4
I/O27
A3
63
64
65
66
I/O23
I/O22
I/O21
I/O20
A4
A11
A5
NOTE:
1. NC is a no connect.
FIGURE 2. Terminal connections - Continued.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-94614
A
REVISION LEVEL
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
D
21
DSCC FORM 2234
APR 97
CS
H
L
OE
X
WE
X
A0-A14
MODE
Standby
Data I/O
High Z
Device current
Standby
Active
X
L
H
Stable
Read
Data out
Data in
High Z
L
H
H
X
L
Stable
Write
Active
X
X
X
X
X
Out Disable
Write Inhibit
Write Inhibit
Active
X
H
Active
X
L
X
Active
NOTES:
1. H = V = High Logic Level
IH
2. L = V = Low Logic Level
IL
3. X = Do not care (either high or low)
4. High Z = High Impedance State
FIGURE 3. Truth table.
FIGURE 4. Read cycle timing diagram.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-94614
A
REVISION LEVEL
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
D
22
DSCC FORM 2234
APR 97
FIGURE 5. Write cycle timing diagram WE controlled.
FIGURE 5. Write cycle timing diagram CS controlled - Continued.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-94614
A
REVISION LEVEL
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
D
23
DSCC FORM 2234
APR 97
NOTES:
1. A0 through A5 are used to address specific bytes within a page.
2. A6 through A14 must specify the same page address during each high to low transition of write enable or chip select.
FIGURE 6. Page mode write timing diagram.
FIGURE 7. Data polling AC timing diagram.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-94614
A
REVISION LEVEL
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
D
24
DSCC FORM 2234
APR 97
FIGURE 8. Block diagram.
NOTES:
1. V is programmed from -2.0 V to +7.0 V. I
and I are programmable from 0 to 16 mA.
Z
OH
OL
2. Tester impedance Z = 75 Ohms.
O
3. V is typically the midpoint of V
and V
.
OL
Z
OH
4. C includes tester jig capacitance.
L
FIGURE 9. Typical output test circuit.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-94614
A
REVISION LEVEL
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
D
25
DSCC FORM 2234
APR 97
TABLE II. Electrical test requirements.
MIL-PRF-38534 test requirements
Subgroups
(in accordance with
MIL-PRF-38534, group A test
table)
Interim electrical parameters
Final electrical parameters
Group A test requirements
1, 4, 7, 9
1*, 2, 3, 4, 7, 8A, 8B, 9, 10, 11
1, 2, 3, 4, 7, 8A, 8B, 9, 10, 11
1, 2, 3, 4, 7, 8A, 8B, 9, 10, 11
Not applicable
Group C end-point electrical
parameters
End-point electrical parameters
for Radiation Hardness Assurance
(RHA) devices
* PDA applies to subgroup 1.
3.11 Data retention. A data retention stress test shall be completed as part of the vendor's reliability monitors. This test shall be
done for initial characterization and after any design process change which may affect data retention. The methods and
procedures may be vendor specific, but shall guarantee the number of years listed in section 1.3 herein over the full military
temperature range. The vendor's procedure shall be kept under document control and shall be made available upon request of the
acquiring or preparing activity.
4. QUALITY ASSURANCE PROVISIONS
4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38534 or as modified
in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or
function as described herein.
4.2 Screening. Screening shall be in accordance with MIL-PRF-38534. The following additional criteria shall apply:
a. Burn-in test, method 1015 of MIL-STD-883.
(1) Test condition B. The test circuit shall be maintained by the manufacturer under document revision level control and
shall be made available to either DSCC-VA or the acquiring activity upon request. Also, the test circuit shall specify the
inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method
1015 of MIL-STD-883.
(2) T as specified in accordance with table I of method 1015 of MIL-STD-883.
A
(3) Prior to burn-in all devices shall be programmed with a 00 hex data pattern to the entire memory array. The
resulting pattern shall be verified before and after burn-in. Devices having bits not in the proper state after burn-in
shall constitute a device failure and shall not be delivered.
b.Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests
prior to burn-in are optional at the discretion of the manufacturer.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-94614
A
REVISION LEVEL
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
D
26
DSCC FORM 2234
APR 97
4.3 Conformance and periodic inspections. Conformance inspection (CI) and periodic inspection (PI) shall be in accordance
with MIL-PRF-38534 and as specified herein.
4.3.1 Group A inspection (CI). Group A inspection shall be in accordance with MIL-PRF-38534 and as follows:
a. Tests shall be as specified in table II herein.
b.Subgroups 5 and 6 shall be omitted.
c. Subgroups 7, 8A, and 8B shall include verification of the truth table in table 3.
d.The following data patterns shall be verified during subgroups 7, 8A, and 8B.
(1) 0's to all memory cell locations.
(2) 1's to all memory cell locations.
(3) Checkerboard pattern to entire memory array.
(4) Checkerboard compliment to entire memory array.
4.3.2 Group B inspection (PI). Group B inspection shall be in accordance with MIL-PRF-38534.
4.3.3 Group C inspection (PI). Group C inspection shall be in accordance with MIL-PRF-38534 and as follows:
a. End-point electrical parameters shall be as specified in table II herein.
b.All devices requiring end-point electrical testing shall be programmed with a checkerboard pattern of alternate rows of
AA hex and 55 hex.
c. Steady-state life test, method 1005 of MIL-STD-883.
(1) Test condition B. The test circuit shall be maintained by the manufacturer under document revision level control and
shall be made available to either DSCC-VA or the acquiring activity upon request. Also, the test circuit shall specify the
inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method
1005 of MIL-STD-883.
(2) T as specified in accordance with table I of method 1005 of MIL-STD-883.
A
(3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883.
(4) The checkerboard data pattern shall be verified after burn-in as part of end-point electrical testing.
4.3.4 Group D inspection (PI). Group D inspection shall be in accordance with MIL-PRF-38534.
4.3.5 Radiation Hardness Assurance (RHA) inspection. RHA inspection is not currently applicable to this drawing.
5. PACKAGING
5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38534.
6. NOTES
6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original
equipment), design applications, and logistics purposes.
6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor-prepared
specification or drawing.
SIZE
STANDARD
5962-94614
A
MICROCIRCUIT DRAWING
REVISION LEVEL
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
D
27
DSCC FORM 2234
APR 97
6.3 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated as specified in MIL-PRF-38534..
6.4 Record of users. Military and industrial users shall inform Defense Supply Center Columbus when a system application
requires configuration control and the applicable SMD. DSCC will maintain a record of users and this list will be used for
coordination and distribution of changes to the drawings. Users of drawings covering microelectronic devices (FSC 5962) should
contact DSCC-VA, telephone (614) 692-0544.
6.5 Comments. Comments on this drawing should be directed to DSCC-VA, Columbus, Ohio 43216-5000, or telephone (614)
692-0512.
6.6 Sources of supply. Sources of supply are listed in MIL-HDBK-103 and QML-38534. The vendors listed in MIL-HDBK-103
and QML-38534 have submitted a certificate of compliance (see 3.8 herein) to DSCC-VA and have agreed to this drawing.
SIZE
STANDARD
5962-94614
A
MICROCIRCUIT DRAWING
REVISION LEVEL
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
D
28
DSCC FORM 2234
APR 97
STANDARD MICROCIRCUIT DRAWING BULLETIN
DATE: 00-04-19
Approved sources of supply for SMD 5962-94614 are listed below for immediate acquisition information only and shall be added to
MIL-HDBK-103 and QML-38534 during the next revisions. MIL-HDBK-103 and QML-38534 will be revised to include the addition
or deletion of sources. The vendors listed below have agreed to this drawing and a certificate of compliance has been submitted to
and accepted by DSCC-VA. This bulletin is superseded by the next dated revisions of MIL-HDBK-103 and QML-38534.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
similar
PIN 2/
5962-9461401HUA
5962-9461401HUA
5962-9461401HUC
5962-9461401HUC
5962-9461401HMA
5962-9461401HMC
5962-9461401HXA
5962-9461401HXC
5962-9461401HYA
5962-9461401HYC
5962-9461401HZA
5962-9461401HZA
5962-9461401HZC
5962-9461401HZC
5962-9461401H9A
5962-9461401H9C
0EU86
54230
0EU86
54230
54230
54230
54230
54230
3/
AS8E32K32P-150/883C
WE32K32-150H1Q
AS8E32K32P-150/883C
WE32K32-150H1Q
WE32K32-150G2Q
WE32K32-150G2Q
WE32K32N-150HQ
WE32K32N-150HQ
WE32K32N-150HSQ
WE32K32N-150HSQ
AS8E32K32Q-150/883C
WE32K32-150G2UQ
AS8E32K32Q-150/883C
WE32K32-150G2UQ
WE32K32-150G1UQ
WE32K32-150G1UQ
3/
0EU86
54230
0EU86
54230
54230
54230
5962-9461402HUA
5962-9461402HUA
5962-9461402HUC
5962-9461402HUC
5962-9461402HMA
5962-9461402HMC
5962-9461402HXA
5962-9461402HXC
5962-9461402HYA
5962-9461402HYC
5962-9461402HZA
5962-9461402HZA
5962-9461402HZC
5962-9461402HZC
5962-9461402H9A
5962-9461402H9C
0EU86
54230
0EU86
54230
54230
54230
54230
54230
3/
AS8E32K32P-120/883C
WE32K32-120H1Q
AS8E32K32P-120/883C
WE32K32-120H1Q
WE32K32-120G2Q
WE32K32-120G2Q
WE32K32N-120HQ
WE32K32N-120HQ
WE32K32N-120HSQ
WE32K32N-120HSQ
AS8E32K32Q-120/883C
WE32K32-120G2UQ
AS8E32K32Q-120/883C
WE32K32-120G2UQ
WE32K32-120G1UQ
WE32K32-120G1UQ
3/
0EU86
54230
0EU86
54230
54230
54230
1 of 2
STANDARD MICROCIRCUIT DRAWING BULLETIN - CONTINUED
DATE: 00-04-19
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
similar
PIN 2/
5962-9461403HUA
5962-9461403HUA
5962-9461403HUC
5962-9461403HUC
5962-9461403HMA
5962-9461403HMC
5962-9461403HXA
5962-9461403HXC
5962-9461403HYA
5962-9461403HYC
5962-9461403HZA
5962-9461403HZA
5962-9461403HZC
5962-9461403HZC
5962-9461403H9A
5962-9461403H9C
0EU86
54230
0EU86
54230
54230
54230
54230
54230
3/
AS8E32K32P-90/883C
WE32K32-90H1Q
AS8E32K32P-90/883C
WE32K32-90H1Q
WE32K32-90G2Q
WE32K32-90G2Q
WE32K32N-90HQ
WE32K32N-90HQ
WE32K32N-90HSQ
WE32K32N-90HSQ
AS8E32K32Q-90/883C
WE32K32-90G2UQ
AS8E32K32Q-90/883C
WE32K32-90G2UQ
WE32K32-90G1UQ
WE32K32-90G1UQ
3/
0EU86
54230
0EU86
54230
54230
54230
1/ The lead finish shown for each PIN representing a hermetic
package is the most readily available from the manufacturer
listed for that part. If the desired lead finish is not listed contact
the vendor to determine its availability.
2/ Caution. Do not use this number for item acquisition. Items
acquired to this number may not satisfy the performance
requirements of this drawing.
3/ No longer available from a QML source.
Vendor CAGE
number
Vendor name
and address
0EU86
Austin Semiconductor Incorporated
8701 Cross Park Drive
Austin, TX 78584-4566
54230
White Electronic Designs Corporation
3601 East University Drive
Phoenix, AZ 85034-7217
The information contained herein is disseminated for convenience only and the
Government assumes no liability whatsoever for any inaccuracies in the
information bulletin.
2 of 2
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