5962R9316302KZC [ETC]

DC to DC Converter ; 直流到直流转换器\n
5962R9316302KZC
型号: 5962R9316302KZC
厂家: ETC    ETC
描述:

DC to DC Converter
直流到直流转换器\n

转换器 局域网
文件: 总19页 (文件大小:373K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
REVISIONS  
LTR  
DESCRIPTION  
DATE (YR-MO-DA)  
APPROVED  
A
B
C
Changes in accordance with NOR 5962-R247-94.  
Add case outlines T, U, Y, and Z.  
94-07-25  
98-02-23  
02-06-21  
K. A. Cottongim  
K. A. Cottongim  
Raymond Monnin  
Added device type 02. Updated table I for the addition of RadHard  
limits for the device type 02. Updated paragraph 4.3.5 to add the  
RadHard requirements. Redrew entire document. -sld.  
REV  
SHEET  
REV  
C
C
C
SHEET  
15  
16  
17  
REV STATUS  
OF SHEETS  
REV  
C
1
C
2
C
3
C
4
C
5
C
6
C
7
C
8
C
9
C
C
C
C
C
SHEET  
10  
11  
12  
13  
14  
PMIC N/A  
PREPARED BY  
Steve Duncan  
DEFENSE SUPPLY CENTER COLUMBUS  
POST OFFICE BOX 3990  
STANDARD  
MICROCIRCUIT  
DRAWING  
CHECKED BY  
Michael C. Jones  
COLUMBUS, OHIO 43216-5000  
http://www.dscc.dla.mil  
THIS DRAWING IS  
AVAILABLE  
FOR USE BY ALL  
DEPARTMENTS  
APPROVED BY  
Kendall A. Cottongim  
MICROCIRCUIT, HYBRID, LINEAR, 5 VOLT,  
SINGLE CHANNEL, DC-DC CONVERTER  
AND AGENCIES OF THE  
DEPARTMENT OF DEFENSE  
DRAWING APPROVAL DATE  
94-05-25  
AMSC N/A  
REVISION LEVEL  
SIZE  
A
CAGE CODE  
67268  
C
5962-93163  
SHEET  
1 OF 17  
DSCC FORM 2233  
APR 97  
5962-E451-02  
DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.  
1. SCOPE  
1.1 Scope. This drawing documents five product assurance classes as defined in paragraph 1.2.3 and MIL-PRF-38534. A  
choice of case outlines and lead finishes which are available and are reflected in the Part or Identifying Number (PIN). When  
available, a choice of radiation hardness assurance levels are reflected in the PIN.  
1.2 PIN. The PIN shall be as shown in the following example:  
5962  
-
93163  
01  
H
X
X
Federal  
stock class  
designator  
\
RHA  
designator  
(see 1.2.1)  
Device  
type  
(see 1.2.2)  
Device  
class  
designator  
(see 1.2.3)  
Case  
outline  
(see 1.2.4)  
Lead  
finish  
(see 1.2.5)  
/
\/  
Drawing number  
1.2.1 Radiation hardness assurance (RHA) designator. RHA marked devices shall meet the MIL-PRF-38534 specified RHA  
levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.  
1.2.2 Device type(s). The device type(s) identify the circuit function as follows:  
Device type  
Generic number  
Circuit function  
01  
02  
MFL2805S  
SMFL2805S  
DC-DC converter, 50 W, +5 V output  
DC-DC converter, 50 W, +5 V output  
1.2.3 Device class designator. This device class designator shall be a single letter identifying the product assurance level.  
All levels are defined by the requirements of MIL-PRF-38534 and require QML Certification as well as qualification (Class H, K,  
and E) or QML Listing (Class G and D). The product assurance levels are as follows:  
Device class  
K
Device performance documentation  
Highest reliability class available. This level is intended for use in space  
applications.  
H
G
Standard military quality class level. This level is intended for use in applications  
where non-space high reliability devices are required.  
Reduced testing version of the standard military quality class. This level uses the  
Class H screening and In-Process Inspections with a possible limited temperature  
range, manufacturer specified incoming flow, and the manufacturer guarantees (but  
may not test) periodic and conformance inspections (Group A, B, C and D).  
E
D
Designates devices which are based upon one of the other classes (K, H, or G)  
with exception(s) taken to the requirements of that class. These exception(s) must  
be specified in the device acquisition document; therefore the acquisition document  
should be reviewed to ensure that the exception(s) taken will not adversely affect  
system performance.  
Manufacturer specified quality class. Quality level is defined by the manufacturers  
internal, QML certified flow. This product may have a limited temperature range.  
SIZE  
STANDARD  
MICROCIRCUIT DRAWING  
5962-93163  
A
REVISION LEVEL  
SHEET  
DEFENSE SUPPLY CENTER COLUMBUS  
COLUMBUS, OHIO 43216-5000  
C
2
DSCC FORM 2234  
APR 97  
1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:  
Outline letter  
Descriptive designator  
Terminals  
Package style  
T
U
X
Y
Z
See figure 1  
See figure 1  
See figure 1  
See figure 1  
See figure 1  
12  
12  
12  
12  
12  
Tabbed flange mount, lead formed up  
Flange mount, lead formed down  
Flange mount, short lead  
Tabbed flange mount, short lead  
Tabbed flange mount, lead formed down  
1.2.5 Lead finish. The lead finish shall be as specified in MIL-PRF-38534.  
1.3 Absolute maximum ratings. 1/  
Input voltage range 2/...............................................................  
Power dissipation (PD):  
-0.5 V dc to +50 V dc  
Device types 01and 02 (non-RHA) ........................................  
Device type 02 (RHA level R) ................................................  
Lead soldering temperature (10 seconds).................................  
Storage temperature range .......................................................  
18 W  
20 W  
+300°C  
-65°C to +150°C  
1.4 Recommended operating conditions.  
Input voltage range (VIN)............................................................  
Output power.............................................................................  
Case operating temperature range (TC) ....................................  
+16 V dc to +40 V dc  
50 W  
-55°C to +125°C  
2. APPLICABLE DOCUMENTS  
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a  
part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in  
the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the  
solicitation.  
SPECIFICATION  
DEPARTMENT OF DEFENSE  
MIL-PRF-38534 - Hybrid Microcircuits, General Specification for.  
STANDARDS  
DEPARTMENT OF DEFENSE  
MIL-STD-883 - Test Method Standard Microcircuits.  
MIL-STD-1835 - Interface Standard for Electronic Component Case Outlines.  
HANDBOOKS  
1/ Stresses above the absolute maximum ratings may cause permanent damage to the device. Extended operation at the  
maximum levels may degrade performance and affect reliability.  
2/ An undervoltage lockout circuit shuts the unit off when the input voltage drops to approximately 12 volts. Operation of the  
unit between 12 volts and 16 volts is nondestructive at reduced output power, but performance is not guaranteed.  
SIZE  
STANDARD  
5962-93163  
A
MICROCIRCUIT DRAWING  
REVISION LEVEL  
SHEET  
DEFENSE SUPPLY CENTER COLUMBUS  
COLUMBUS, OHIO 43216-5000  
C
3
DSCC FORM 2234  
APR 97  
DEPARTMENT OF DEFENSE  
MIL-HDBK-103 - List of Standard Microcircuit Drawings.  
MIL-HDBK-780 - Standard Microcircuit Drawings.  
(Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization  
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)  
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text  
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a  
specific exemption has been obtained.  
3. REQUIREMENTS  
3.1 Item requirements. The individual item performance requirements for device classes D, E, G, H, and K shall be in  
accordance with MIL-PRF-38534. Compliance with MIL-PRF-38534 may include the performance of all tests herein or as  
designated in the device manufacturer's Quality Management (QM) plan or as designated for the applicable device class.  
Therefore, the tests and inspections herein may not be performed for the applicable device class (see MIL-PRF-38534).  
Furthermore, the manufacturer may take exceptions or use alternate methods to the tests and inspections herein and not  
perform them. However, the performance requirements as defined in MIL-PRF-38534 shall be met for the applicable device  
class.  
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified  
in MIL-PRF-38534 and herein.  
3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein and figure 1.  
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2.  
3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are  
as specified in table I and shall apply over the full specified operating temperature range.  
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical  
tests for each subgroup are defined in table I.  
3.5 Marking of device(s). Marking of device(s) shall be in accordance with MIL-PRF-38534. The device shall be marked  
with the PIN listed in 1.2 herein. In addition, the manufacturer's vendor similar PIN may also be marked in MIL-HDBK-103 and  
QML-38534.  
3.6 Data. In addition to the general performance requirements of MIL-PRF-38534, the manufacturer of the device described  
herein shall maintain the electrical test data (variables format) from the initial quality conformance inspection group A lot  
sample, for each device type listed herein. Also, the data should include a summary of all parameters manually tested, and for  
those which, if any, are guaranteed. This data shall be maintained under document revision level control by the manufacturer  
and be made available to the preparing activity (DSCC-VA) upon request.  
3.7 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to supply to this  
drawing. The certificate of compliance (original copy) submitted to DSCC-VA shall affirm that the manufacturer's product meets  
the performance requirements of MIL-PRF-38534 and herein.  
3.8 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38534 shall be provided with each lot of  
microcircuits delivered to this drawing.  
4. QUALITY ASSURANCE PROVISIONS  
4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38534 or as  
modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the  
form, fit, or function as described herein.  
SIZE  
STANDARD  
5962-93163  
A
MICROCIRCUIT DRAWING  
REVISION LEVEL  
SHEET  
DEFENSE SUPPLY CENTER COLUMBUS  
COLUMBUS, OHIO 43216-5000  
C
4
DSCC FORM 2234  
APR 97  
TABLE I. Electrical performance characteristics.  
Test  
Symbol  
Conditions 1/  
Group A  
subgroups  
Device  
types  
Limits  
Unit  
-55°C T +125°C  
C
VIN = 28 V dc ±0.5 V  
no external sync  
unless otherwise specified  
Min  
Max  
5.05  
Output voltage  
VOUT  
IOUT = 10 A dc  
1
01,02  
4.95  
V
A
2,3  
4.875  
4.70  
0.0  
5.125  
5.30  
10  
R
1,2,3  
1,2,3  
02  
Output current  
IOUT  
VIN = 16 V dc to 40V dc  
01,02  
R
1,2,3  
1
02  
0.0  
10  
35  
VOUT ripple voltage  
VRIP  
01,02  
mVp-p  
mV  
IOUT = 10 A,  
B.W. = 10 kHz to 2 MHz  
2,3  
50  
75  
R
1,2,3  
1,2,3  
02  
VOUT line regulation  
VRLINE  
IOUT = 10 A,  
VIN =16V dc to 40V dc  
01,02  
20  
R
R
1,2,3  
1,2,3  
02  
30  
20  
VOUT load regulation  
Input current  
VRLOAD  
IOUT = 0 to 5 A  
01,02  
mV  
mA  
1,2,3  
1,2,3  
02  
30  
IIN  
IOUT = 0 A, Inhibit (pin 4 and  
pin 12) = open  
01,02  
120  
R
1,2,3  
1,2,3  
02  
150  
14  
IOUT = 0 A, Inhibit 1(pin4)  
tied to input return (pin 2)  
01,02  
R
1,2,3  
1,2,3  
02  
17  
70  
IOUT = 0 A, Inhibit 2 (pin 12)  
tied to output return (pin 8)  
01,02  
R
1,2,3  
1,2,3  
02  
90  
12  
Short circuit current  
ISC  
VOUT < 1.0 V dc  
01,02  
8.8  
8.8  
A
1,2,3  
02  
12  
R
See footnotes at end of table.  
SIZE  
STANDARD  
MICROCIRCUIT DRAWING  
5962-93163  
A
REVISION LEVEL  
SHEET  
DEFENSE SUPPLY CENTER COLUMBUS  
COLUMBUS, OHIO 43216-5000  
C
5
DSCC FORM 2234  
APR 97  
TABLE I. Electrical performance characteristics - Continued.  
Test  
Symbol  
Conditions 1/  
Group A  
subgroups  
Device  
types  
Limits  
Unit  
-55°C T +125°C  
C
VIN = 28 V dc ±0.5 V  
no external sync  
unless otherwise specified  
Min  
Max  
45  
IIN ripple current  
IRIP  
IOUT = 10 A,  
B.W. = 10 kHz to 10 MHz  
1
01,02  
mAp-p  
2,3  
1,2,3  
1
50  
75  
R
02  
01  
Efficiency  
Eff  
IOUT = 10 A  
77  
%
02  
01  
75  
75  
2,3  
02  
73  
R
1,2,3  
1
02  
72  
Isolation  
ISO  
Input to output or any pin to  
case at 500 V dc, TC =  
+25°C  
01,02  
100  
MΩ  
R
1
4
02  
100  
Capacitive load 2/ 3/  
CL  
No effect on dc  
performance, TC = +25°C  
01,02  
1000  
µF  
R
4
1
02  
1000  
16  
PD  
Short circuit  
01,02  
W
Power dissipation load  
fault  
2,3  
1,2,3  
4
18  
20  
R
02  
Switching frquency  
FS  
IOUT = 10 A  
01,02  
550  
650  
kHz  
kHz  
5,6  
525  
500  
525  
675  
700  
675  
R
4,5,6  
4,5,6  
02  
External sync range 4/  
FSYNC  
IOUT = 10 A, TTL level to pin  
6
01,02  
R
4,5,6  
02  
525  
675  
See footnotes at end of table.  
SIZE  
STANDARD  
MICROCIRCUIT DRAWING  
5962-93163  
A
REVISION LEVEL  
SHEET  
DEFENSE SUPPLY CENTER COLUMBUS  
COLUMBUS, OHIO 43216-5000  
C
6
DSCC FORM 2234  
APR 97  
TABLE I. Electrical performance characteristics - Continued.  
Test  
Symbol  
Conditions 1/  
Group A  
subgroups  
Device  
types  
Limits  
Unit  
-55°C T +125°C  
C
VIN = 28 V dc ±0.5 V  
no external sync  
Min  
Max  
unless otherwise specified  
VOUT step load transient 5/  
VTLOAD  
IOUT = 5 A to 10 A  
4,5,6  
01  
-350  
+350  
mV pk  
02  
01  
02  
02  
-500  
-350  
+500  
+350  
+500  
IOUT = 10 A to 5 A  
-500  
IOUT = 5 A to 10 A  
OUT = 10 A to 5 A  
R
4,5,6  
4,5,6  
-1200  
+1200  
I
VOUT step load transient  
recovery 3/ 5/ 6/  
TTLOAD  
IOUT = 5 A to 10 A  
01,02  
3.0  
ms  
R
R
4,5,6  
4,5,6  
02  
4.0  
3.0  
IOUT = 10 A to 5 A  
01,02  
4,5,6  
4,5,6  
02  
4.0  
VOUT step line transient 3/ 7/  
VTLINE  
IOUT = 10 A, Input step 16 V  
dc to 40 V dc  
01,02  
300  
mV pk  
R
4,5,6  
4,5,6  
02  
400  
300  
IOUT = 10 A, Input step 40 V  
dc to 16 V dc  
01,02  
R
4,5,6  
4,5,6  
02  
400  
300  
VOUT step line transient  
recovery 3/ 6/ 7/  
TTLINE  
IOUT = 10 A, Input step 16 V  
dc to 40 V dc  
01,02  
µs  
R
4,5,6  
4,5,6  
02  
400  
300  
IOUT = 10 A, Input step 40 V  
dc to 16 V dc  
01,02  
R
4,5,6  
4,5,6  
02  
400  
25  
Start up overshoot 3/  
VtonOS  
IOUT = 10 A, VIN = 0 to 40 V  
dc  
01,02  
mV pk  
R
4,5,6  
02  
50  
See footnotes at end of table.  
SIZE  
STANDARD  
MICROCIRCUIT DRAWING  
5962-93163  
A
REVISION LEVEL  
SHEET  
DEFENSE SUPPLY CENTER COLUMBUS  
COLUMBUS, OHIO 43216-5000  
C
7
DSCC FORM 2234  
APR 97  
TABLE I. Electrical performance characteristics - Continued.  
Test  
Symbol  
Conditions 1/  
Group A  
subgroups  
Device  
types  
Limits  
Unit  
-55°C T +125°C  
C
VIN = 28 V dc ±0.5 V  
no external sync  
unless otherwise specified  
Min  
Max  
6
Start up delay 8/  
TonD  
TrLF  
IOUT = 10 A, VIN = 0 to 28 V  
dc  
4,5,6  
01,02  
ms  
R
4,5,6  
4,5,6  
02  
12  
4
Load fault recovery 3/  
IOUT = 10 A  
01,02  
ms  
R
4,5,6  
02  
8
1/ Post irradiation testing shall be in accordance with 4.3.5 herein.  
2/ Capacitive load may be any value from 0 to the maximum limit without compromising dc performance.  
3/ Parameter shall be tested as part of design characterization and after design or process changes; therefore, the parameter  
shall be guaranteed to limits specified in table I.  
4/ A TTL level waveform (VIH = 4.5 V minimum, VIL = 0.8 V maximum) with a 50 percent ±10 percent duty cycle applied to the  
sync input pin (pin 6) within the the sync range frequency shall cause the converter's switching frequency to become  
synchronous with the frequency applied to the sync input pin (pin 6).  
5/ Load step transition time is between 2 and 10 microseconds.  
6/ Recovery time is measured from the initiation of the transient until VOUT has returned to within ±1 percent of its final value.  
7/ Input step transition time greater than 10 microseconds.  
8/ Turn-on delay time measurement is either for a step application of power at the input or the removal of a ground signal from  
the inhibit 1 pin (pin 4) or inhibit 2 pin (pin 12) while power is applied to the input  
SIZE  
STANDARD  
5962-93163  
A
MICROCIRCUIT DRAWING  
REVISION LEVEL  
SHEET  
DEFENSE SUPPLY CENTER COLUMBUS  
COLUMBUS, OHIO 43216-5000  
C
8
DSCC FORM 2234  
APR 97  
Case outline T.  
Symbol  
Millimeters  
Inches  
Min  
Max  
10.16  
5.84  
Min  
Max  
.400  
.230  
A
A1  
φb  
D
D1  
e
5.33  
0.89  
.210  
.035  
1.14  
.045  
50.55  
37.85  
51.05  
38.35  
1.990  
1.490  
2.010  
1.510  
5.08 BSC  
.200 BSC  
E
E1  
F
69.85  
63.25  
1.14  
72.39  
63.75  
1.40  
2.750  
2.490  
.045  
2.850  
2.510  
.055  
L
6.10  
6.60  
.240  
.260  
φP  
q/q1  
q2  
s
3.43  
3.68  
.135  
.145  
44.20  
28.96  
6.10  
44.70  
29.46  
6.60  
1.740  
1.140  
.240  
1.760  
1.160  
.260  
T
10.92  
11.43  
.430  
.450  
NOTES:  
1. The U.S. government preferred system of measurement is the metric SI. This item was designed using inch-  
pound units of measurement. In case of problems involving conflicts between the metric and inch-pound  
units, the inch-pound units shall rule.  
2. Device weight: 86 grams maximum.  
FIGURE 1. Case outline(s).  
SIZE  
STANDARD  
MICROCIRCUIT DRAWING  
5962-93163  
A
REVISION LEVEL  
SHEET  
DEFENSE SUPPLY CENTER COLUMBUS  
COLUMBUS, OHIO 43216-5000  
C
9
DSCC FORM 2234  
APR 97  
Case outline U.  
Symbol  
Millimeters  
Inches  
Min  
Max  
10.16  
5.72  
1.14  
38.23  
Min  
Max  
.400  
.225  
.045  
1.505  
A
A1  
φb  
D
5.46  
0.89  
37.97  
.215  
.035  
1.495  
e
e1  
E
E1  
E2  
F
5.08 BSC  
3.30 BSC  
.200 BSC  
.130 BSC  
87.38  
87.88  
76.45  
63.63  
1.40  
3.440  
3.460  
3.010  
2.505  
.055  
75.95  
63.37  
1.14  
2.990  
2.495  
.045  
L
6.10  
6.60  
.240  
.260  
L1  
φP  
q
q1  
S
11.94  
3.12  
31.88  
69.85  
6.22  
12.19  
3.38  
32.13  
70.36  
6.48  
.470  
.123  
1.255  
2.750  
.245  
.480  
.133  
1.265  
2.770  
.255  
T
5.84  
6.86  
.230  
.270  
NOTES:  
1. The U.S. government preferred system of measurement is the metric SI. This item was designed using inch-  
pound units of measurement. In case of problems involving conflicts between the metric and inch-pound  
units, the inch-pound units shall rule.  
2. Device weight: 86 grams maximum.  
FIGURE 1. Case outline(s) - Continued.  
SIZE  
STANDARD  
MICROCIRCUIT DRAWING  
5962-93163  
A
REVISION LEVEL  
SHEET  
DEFENSE SUPPLY CENTER COLUMBUS  
COLUMBUS, OHIO 43216-5000  
C
10  
DSCC FORM 2234  
APR 97  
Case outline X.  
Symbol  
Millimeters  
Inches  
Min  
Max  
10.16  
5.72  
1.14  
38.23  
Min  
Max  
.400  
.225  
.045  
1.505  
A
A1  
φb  
D
5.46  
0.89  
37.97  
.215  
.035  
1.495  
e
e1  
E
E1  
F
5.08 BSC  
3.30 BSC  
.200 BSC  
.130 BSC  
75.95  
76.45  
63.63  
1.40  
2.990  
3.010  
2.505  
.055  
63.37  
1.14  
2.495  
.045  
L
6.10  
6.60  
.240  
.260  
L1  
φP  
q
q1  
S
5.58  
3.12  
31.88  
69.85  
6.22  
6.10  
3.38  
32.13  
70.36  
6.48  
.220  
.123  
1.255  
2.750  
.245  
.240  
.133  
1.265  
2.770  
.255  
NOTES:  
1. The U.S. government preferred system of measurement is the metric SI. This item was designed using inch-  
pound units of measurement. In case of problems involving conflicts between the metric and inch-pound  
units, the inch-pound units shall rule.  
2. Device weight: 86 grams maximum.  
FIGURE 1. Case outline(s) - Continued.  
SIZE  
STANDARD  
MICROCIRCUIT DRAWING  
5962-93163  
A
REVISION LEVEL  
SHEET  
DEFENSE SUPPLY CENTER COLUMBUS  
COLUMBUS, OHIO 43216-5000  
C
11  
DSCC FORM 2234  
APR 97  
Case outline Y.  
Symbol  
Millimeters  
Inches  
Min  
Max  
10.16  
5.84  
Min  
Max  
.400  
.230  
A
A1  
φb  
D
D1  
e
5.33  
0.89  
.210  
.035  
1.14  
.045  
50.55  
37.85  
51.05  
38.35  
1.990  
1.490  
2.010  
1.510  
5.08 BSC  
.200 BSC  
E
F
L
63.25  
1.14  
6.99  
63.75  
1.40  
8.26  
2.490  
.045  
.275  
2.510  
.055  
.325  
L1  
φP  
q/q1  
q2  
s
6.10  
3.43  
44.20  
28.96  
6.10  
6.60  
3.68  
44.70  
29.46  
6.60  
.240  
.135  
1.740  
1.140  
.240  
.260  
.145  
1.760  
1.160  
.260  
NOTES:  
1. The U.S. government preferred system of measurement is the metric SI. This item was designed using inch-  
pound units of measurement. In case of problems involving conflicts between the metric and inch-pound  
units, the inch-pound units shall rule.  
2. Device weight: 86 grams maximum.  
FIGURE 1. Case outline(s) - Continued.  
SIZE  
STANDARD  
MICROCIRCUIT DRAWING  
5962-93163  
A
REVISION LEVEL  
SHEET  
DEFENSE SUPPLY CENTER COLUMBUS  
COLUMBUS, OHIO 43216-5000  
C
12  
DSCC FORM 2234  
APR 97  
Case outline Z.  
Symbol  
Millimeters  
Inches  
Min  
Max  
10.16  
5.84  
Min  
Max  
.400  
.230  
A
A1  
φb  
D
D1  
e
5.33  
0.89  
.210  
.035  
1.14  
.045  
50.55  
37.85  
51.05  
38.35  
1.990  
1.490  
2.010  
1.510  
5.08 BSC  
.200 BSC  
E
E1  
F
69.85  
63.25  
1.14  
72.39  
63.75  
1.40  
2.750  
2.490  
.045  
2.850  
2.510  
.055  
L
6.10  
6.60  
.240  
.260  
φP  
q/q1  
q2  
s
3.43  
3.68  
.135  
.145  
44.20  
28.96  
6.10  
44.70  
29.46  
6.60  
1.740  
1.140  
.240  
1.760  
1.160  
.260  
T
8.64  
9.65  
.340  
.380  
NOTES:  
1. The U.S. government preferred system of measurement is the metric SI. This item was designed using inch-  
pound units of measurement. In case of problems involving conflicts between the metric and inch-pound  
units, the inch-pound units shall rule.  
2. Device weight: 86 grams maximum.  
FIGURE 1. Case outline(s) - Continued.  
SIZE  
STANDARD  
MICROCIRCUIT DRAWING  
5962-93163  
A
REVISION LEVEL  
SHEET  
DEFENSE SUPPLY CENTER COLUMBUS  
COLUMBUS, OHIO 43216-5000  
C
13  
DSCC FORM 2234  
APR 97  
Device types  
Case outlines  
01 and 02  
T, U, X, Y, and Z  
Terminal number  
Terminal symbol  
1
2
3
Input  
Input common  
Tri  
4
Inhibit 1  
5
Sync output  
6
Sync input  
7
8
9
10  
11  
12  
Positive output  
Output common  
Remote sense return  
Positive remote sense  
Slave to master  
Master to slave/ Inhibit 2  
NOTES:  
1. Multiple devices may be used in parallel to drive a common load. When using this mode of operation the load current  
is shared by two or three devices. In the current sharing mode, one device is designated as the master. The slave to  
master pin (pin 11) of the master device is not connected and the master to slave/inhibit 2 pin (pin 12) of the master is  
connected to the slave to master pin (pin 11) of the slave device(s). The device(s) designated as slave(s) have the  
master to slave/inhibit 2 pin (pin 11) connected to the remote sense return pin (pin 9).  
2. A second slave device may be placed in parallel with a master and slave device, this requires the Tri pin (pin 3) of the  
master device to be connected to the remote sense pin (pin 9). When paralleled, 95 percent of the sum of the power  
of the devices is available at the load. This means that 143 watts at 5 volts is available for three devices in parallel.  
When using remote sense in parallel operation, only the master device should have its remote sense pins (pins 9 and  
10) connected to the load, and the slave devices should have the remote sense pins (pins 9 and 10) connected to the  
output power pins (pins 7 and 8).  
3. The device has a sync input pin (pin 6) and a sync output pin (pin 5) which allows multiple devices, whether they're in a  
single unit or master/slave configurations to be synchronized to a system clock or each other. Two or more devices  
may be synchronized to each other by connecting the sync output pin (pin 5) of one to the sync input pin (pin 6) of  
another.  
4. The device has two inhibit options, one is ground referenced to the input common and the other is referenced to the  
output common. The output referred inhibit pin uses the master to slave/inhibit 2 pin (pin 12). This pin is normally  
used to parallel devices, and a TTL compatiable open collector low will inhibit the device when applied to this pin.  
FIGURE 2. Terminal connections.  
SIZE  
STANDARD  
5962-93163  
A
MICROCIRCUIT DRAWING  
REVISION LEVEL  
SHEET  
DEFENSE SUPPLY CENTER COLUMBUS  
COLUMBUS, OHIO 43216-5000  
C
14  
DSCC FORM 2234  
APR 97  
TABLE II. Electrical test requirements.  
MIL-PRF-38534 test requirements  
Subgroups  
(in accordance with  
MIL-PRF-38534, group A  
test table)  
Interim electrical parameters  
Final electrical parameters  
Group A test requirements  
- - -  
1*, 2, 3, 4, 5, 6  
1, 2, 3, 4, 5, 6  
1
Group C end-point electrical  
parameters  
End-point electrical parameters  
for radiation hardness assurance  
(RHA) devices  
1, 2, 3, 4, 5, 6  
* PDA applies to subgroup 1.  
4.2 Screening. Screening shall be in accordance with MIL-PRF-38534. The following additional criteria shall apply:  
a. Burn-in test, method 1015 of MIL-STD-883.  
(1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level  
control and shall be made available to either DSCC-VA or the acquiring activity upon request. Also, the test circuit  
shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent  
specified in test method 1015 of MIL-STD-883.  
(2) T as specified in accordance with table I of method 1015 of MIL-STD-883.  
A
b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter  
tests prior to burn-in are optional at the discretion of the manufacturer.  
4.3 Conformance and periodic inspections. Conformance inspection (CI) and periodic inspection (PI) shall be in accordance  
with MIL-PRF-38534 and as specified herein.  
4.3.1 Group A inspection (CI). Group A inspection shall be in accordance with MIL-PRF-38534 and as follows:  
a. Tests shall be as specified in table II herein.  
b. Subgroups 7, 8, 9, 10, and 11 shall be omitted.  
4.3.2 Group B inspection (PI). Group B inspection shall be in accordance with MIL-PRF-38534.  
SIZE  
STANDARD  
5962-93163  
A
MICROCIRCUIT DRAWING  
REVISION LEVEL  
SHEET  
DEFENSE SUPPLY CENTER COLUMBUS  
COLUMBUS, OHIO 43216-5000  
C
15  
DSCC FORM 2234  
APR 97  
4.3.3 Group C inspection (PI). Group C inspection shall be in accordance with MIL-PRF-38534 and as follows:  
a. End-point electrical parameters shall be as specified in table II herein.  
b. Steady-state life test, method 1005 of MIL-STD-883.  
(1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level  
control and shall be made available to either DSCC-VA or the acquiring activity upon request. Also, the test circuit  
shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent  
specified in test method 1005 of MIL-STD-883.  
(2) T as specified in accordance with table I of method 1005 of MIL-STD-883.  
A
(3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883.  
4.3.4 Group D inspection (PI). Group D inspection shall be in accordance with MIL-PRF-38534.  
4.3.5. Radiation hardness assurance (RHA). RHA qualification is required only for those devices with the RHA designator as  
specified herein.  
RHA level R  
100  
Units  
Total ionizing dose  
tolerance level  
kRad (Si)  
Single event upset  
survival level (LET)  
40  
MeV  
a. Radiation dose rate is in accordance with condition C of method 1019 of MIL-STD-883. Unless otherwise specified,  
components are tested at a rate of 9 rad(Si)/s, in accordance with method 1019 of MIL-STD-750 or MIL-STD-883, as  
applicable.  
b. The manufacturer shall perform a worst-case and radiation susceptibility analysis on the device. This analysis shall  
show that the minimum performance requirements of each component has adequate design margin under worst-case  
operating conditions (extremes of line voltage, temperatures, load, frequency, radiation environment, etc.). This  
analysis guarantees the post-irradiation parameter limits specified in table I.  
c. RHA testing shall be performed at the component level for initial device qualification, and after design changes that  
may affect the RHA performance of the device. As an alternative to testing, components may be procured to  
manufacturer radiation guarantees that meet the minimum performance requirements. Component radiation  
performance guarantees shall be established in compliance with MIL-PRF-19500, Group D or MIL-PRF-38535, Group  
E, as applicable. For components with less than adequate performance margin, component lot radiation acceptance  
screening shall be performed.  
d. The manufacturer shall establish procedures controlling component radiation testing, and shall establish radiation test  
plans used to implement component lot qualification during procurement. Test plans and test reports shall be filed and  
controlled in accordance with the manufacturer's configuration management system.  
e. The device manufacturer shall designate a RHA program manager to oversee component lot qualification, and to  
monitor design changes for continued compliance to RHA requirements.  
5. PACKAGING  
5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38534.  
SIZE  
STANDARD  
5962-93163  
A
MICROCIRCUIT DRAWING  
REVISION LEVEL  
SHEET  
DEFENSE SUPPLY CENTER COLUMBUS  
COLUMBUS, OHIO 43216-5000  
C
16  
DSCC FORM 2234  
APR 97  
6. NOTES  
6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications  
(original equipment), design applications, and logistics purposes.  
6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor-  
prepared specification or drawing.  
6.3 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for  
the individual documents. This coordination will be accomplished in accordance with MIL-PRF-38534.  
6.4 Record of users. Military and industrial users shall inform Defense Supply Center Columbus when a system application  
requires configuration control and the applicable SMD. DSCC will maintain a record of users and this list will be used for  
coordination and distribution of changes to the drawings. Users of drawings covering microelectronic devices (FSC 5962)  
should contact DSCC-VA, telephone (614) 692-0544.  
6.5 Comments. Comments on this drawing should be directed to DSCC-VA, Post Office Box 3990, Columbus, Ohio 43216-  
5000, or telephone (614) 692-1081.  
6.6 Sources of supply. Sources of supply are listed in MIL-HDBK-103 and QML-38534. The vendors listed in MIL-HDBK-  
103 and QML-38534 have submitted a certificate of compliance (see 3.7 herein) to DSCC-VA and have agreed to this drawing.  
SIZE  
STANDARD  
5962-93163  
A
MICROCIRCUIT DRAWING  
REVISION LEVEL  
SHEET  
DEFENSE SUPPLY CENTER COLUMBUS  
COLUMBUS, OHIO 43216-5000  
C
17  
DSCC FORM 2234  
APR 97  
STANDARD MICROCIRCUIT DRAWING BULLETIN  
DATE: 02-06-21  
Approved sources of supply for SMD 5962-93163 are listed below for immediate acquisition information only and  
shall be added to MIL-HDBK-103 and QML-38534 during the next revisions. MIL-HDBK-103 and QML-38534 will be  
revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a  
certificate of compliance has been submitted to and accepted by DSCC-VA. This bulletin is superseded by the next  
dated revisions of MIL-HDBK-103 and QML-38534.  
Standard  
microcircuit drawing  
PIN 1/  
Vendor  
CAGE  
number  
Vendor  
similar  
PIN 2/  
5962-9316301HTA  
5962-9316301HTC  
5962-9316302HTA  
5962-9316302HTC  
5962R9316302HTA  
5962R9316302HTC  
5962R9316302KTA  
5962R9316302KTC  
50821  
50821  
50821  
50821  
50821  
50821  
50821  
50821  
MFL2805SW/883  
MFL2805SW/883  
SMFL2805SW/HO  
SMFL2805SW/HO  
SMFL2805SW/HR  
SMFL2805SW/HR  
SMFL2805SW/KR  
SMFL2805SW/KR  
5962-9316301HUA  
5962-9316301HUC  
5962-9316302HUA  
5962-9316302HUC  
5962R9316302HUA  
5962R9316302HUC  
5962R9316302KUA  
5962R9316302KUC  
50821  
50821  
50821  
50821  
50821  
50821  
50821  
50821  
MFL2805SV/883  
MFL2805SV/883  
SMFL2805SV/HO  
SMFL2805SV/HO  
SMFL2805SV/HR  
SMFL2805SV/HR  
SMFL2805SV/KR  
SMFL2805SV/KR  
5962-9316301HXA  
5962-9316301HXC  
5962-9316302HXA  
5962-9316302HXC  
5962R9316302HXA  
5962R9316302HXC  
5962R9316302KXA  
5962R9316302KXC  
50821  
50821  
50821  
50821  
50821  
50821  
50821  
50821  
MFL2805S/883  
MFL2805S/883  
SMFL2805S/HO  
SMFL2805S/HO  
SMFL2805S/HR  
SMFL2805S/HR  
SMFL2805S/KR  
SMFL2805S/KR  
5962-9316301HYA  
5962-9316301HYC  
5962-9316302HYA  
5962-9316302HYC  
5962R9316302HYA  
5962R9316302HYC  
5962R9316302KYA  
5962R9316302KYC  
50821  
50821  
50821  
50821  
50821  
50821  
50821  
50821  
MFL2805SY/883  
MFL2805SY/883  
SMFL2805SY/HO  
SMFL2805SY/HO  
SMFL2805SY/HR  
SMFL2805SY/HR  
SMFL2805SY/KR  
SMFL2805SY/KR  
5962-9316301HZA  
5962-9316301HZC  
5962-9316302HZA  
5962-9316302HZC  
5962R9316302HZA  
5962R9316302HZC  
5962R9316302KZA  
5962R9316302KZC  
50821  
50821  
50821  
50821  
50821  
50821  
50821  
50821  
MFL2805SZ/883  
MFL2805SZ/883  
SMFL2805SZ/HO  
SMFL2805SZ/HO  
SMFL2805SZ/HR  
SMFL2805SZ/HR  
SMFL2805SZ/KR  
SMFL2805SZ/KR  
1/ The lead finish shown for each PIN representing a hermetic package is the most readily available from the  
manufacturer listed for that part. If the desired lead finish is not listed contact the Vendor to determine its  
availability.  
2/ Caution. Do not use this number for item acquisition. Items acquired to this number may not satisfy the  
performance requirements of this drawing.  
1 of 2  
STANDARD MICROCIRCUIT DRAWING BULLETIN - CONTINUED.  
DATE: 02-06-21  
Vendor CAGE  
number  
Vendor name  
and address  
50821  
Interpoint Corporation  
10301 Willows Road  
Redmond, WA 98073-9705  
The information contained herein is disseminated for convenience only and the  
Government assumes no liability whatsoever for any inaccuracies in the  
information bulletin.  
2 of 2  

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