5962R9319302KYC [ETC]
DC to DC Converter ; 直流到直流转换器\n
| 型号： | 5962R9319302KYC |
| 厂家： | 
ETC |
| 描述： | DC to DC Converter
|
| 文件： | 总19页 (文件大小：373K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
REVISIONS
LTR
DESCRIPTION
DATE (YR-MO-DA)
APPROVED
A
B
C
Changes in accordance with NOR 5962-R252-94.
Add case outlines T, U, Y, and Z.
94-07-25
98-02-23
02-06-21
K. A. Cottongim
K. A. Cottongim
Raymond Monnin
Added device type 02. Updated table I for the addition of RadHard
limits for the device type 02. Updated paragraph 4.3.5 to add the
RadHard requirements. Redrew entire document. -sld.
REV
SHEET
REV
C
C
C
SHEET
15
16
17
REV STATUS
OF SHEETS
REV
C
1
C
2
C
3
C
4
C
5
C
6
C
7
C
8
C
9
C
C
C
C
C
SHEET
10
11
12
13
14
PMIC N/A
PREPARED BY
Steve L. Duncan
DEFENSE SUPPLY CENTER COLUMBUS
POST OFFICE BOX 3990
STANDARD
MICROCIRCUIT
DRAWING
CHECKED BY
Michael Jones
COLUMBUS, OHIO 43216-5000
http://www.dscc.dla.mil
THIS DRAWING IS
AVAILABLE
FOR USE BY ALL
DEPARTMENTS
APPROVED BY
Kendall A. Cottongim
MICROCIRCUIT, HYBRID, LINEAR, 15 VOLT,
DUAL CHANNEL, DC-DC CONVERTER
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
DRAWING APPROVAL DATE
94-05-27
AMSC N/A
REVISION LEVEL
SIZE
A
CAGE CODE
67268
C
5962-93193
SHEET
1 OF 17
DSCC FORM 2233
APR 97
5962-E452-02
DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.
1. SCOPE
1.1 Scope. This drawing documents five product assurance classes as defined in paragraph 1.2.3 and MIL-PRF-38534. A
choice of case outlines and lead finishes which are available and are reflected in the Part or Identifying Number (PIN). When
available, a choice of radiation hardness assurance levels are reflected in the PIN.
1.2 PIN. The PIN shall be as shown in the following example:
5962
-
93193
01
H
X
X
Federal
stock class
designator
\
RHA
designator
(see 1.2.1)
Device
type
(see 1.2.2)
Device
class
designator
(see 1.2.3)
Case
outline
(see 1.2.4)
Lead
finish
(see 1.2.5)
/
\/
Drawing number
1.2.1 Radiation hardness assurance (RHA) designator. RHA marked devices shall meet the MIL-PRF-38534 specified RHA
levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device type(s). The device type(s) identify the circuit function as follows:
Device type
Generic number
Circuit function
01
02
MFL2815D
SMFL2815D
DC-DC converter, 65 W, ±15 V outputs
DC-DC converter, 65 W, ±15 V outputs
1.2.3 Device class designator. This device class designator shall be a single letter identifying the product assurance level.
All levels are defined by the requirements of MIL-PRF-38534 and require QML Certification as well as qualification (Class H, K,
and E) or QML Listing (Class G and D). The product assurance levels are as follows:
Device class
K
Device performance documentation
Highest reliability class available. This level is intended for use in space
applications.
H
G
Standard military quality class level. This level is intended for use in applications
where non-space high reliability devices are required.
Reduced testing version of the standard military quality class. This level uses the
Class H screening and In-Process Inspections with a possible limited temperature
range, manufacturer specified incoming flow, and the manufacturer guarantees (but
may not test) periodic and conformance inspections (Group A, B, C and D).
E
D
Designates devices which are based upon one of the other classes (K, H, or G)
with exception(s) taken to the requirements of that class. These exception(s) must
be specified in the device acquisition document; therefore the acquisition document
should be reviewed to ensure that the exception(s) taken will not adversely affect
system performance.
Manufacturer specified quality class. Quality level is defined by the manufacturers
internal, QML certified flow. This product may have a limited temperature range.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-93193
A
REVISION LEVEL
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
C
2
DSCC FORM 2234
APR 97
1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
Descriptive designator
Terminals
Package style
T
U
X
Y
Z
See figure 1
See figure 1
See figure 1
See figure 1
See figure 1
12
12
12
12
12
Tabbed flange mount, lead formed up
Flange mount, lead formed down
Flange mount, short lead
Tabbed flange mount, short lead
Tabbed flange mount, lead formed down
1.2.5 Lead finish. The lead finish shall be as specified in MIL-PRF-38534.
1.3 Absolute maximum ratings. 1/
Input voltage range (VIN)............................................................
Power dissipation (PD):
-0.5 V dc to +50 V dc
Device types 01and 02 (non-RHA) ........................................
Device type 02 (RHA level R) ................................................
Lead soldering temperature (10 seconds).................................
Storage temperature range .......................................................
16 W
18 W
+300°C
-65°C to +150°C
1.4 Recommended operating conditions.
Input voltage range (VIN)............................................................
Output power.............................................................................
Case operating temperature range (TC) ....................................
+16 V dc to +40 V dc
≤ 65 W
-55°C to +125°C
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a
part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in
the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the
solicitation.
SPECIFICATION
DEPARTMENT OF DEFENSE
MIL-PRF-38534 - Hybrid Microcircuits, General Specification for.
STANDARDS
DEPARTMENT OF DEFENSE
MIL-STD-883 - Test Method Standard Microcircuits.
MIL-STD-1835 - Interface Standard for Electronic Component Case Outlines.
HANDBOOKS
1/ Stresses above the absolute maximum ratings may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
SIZE
STANDARD
5962-93193
A
MICROCIRCUIT DRAWING
REVISION LEVEL
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
C
3
DSCC FORM 2234
APR 97
DEPARTMENT OF DEFENSE
MIL-HDBK-103 - List of Standard Microcircuit Drawings.
MIL-HDBK-780 - Standard Microcircuit Drawings.
(Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item performance requirements for device classes D, E, G, H, and K shall be in
accordance with MIL-PRF-38534. Compliance with MIL-PRF-38534 may include the performance of all tests herein or as
designated in the device manufacturer's Quality Management (QM) plan or as designated for the applicable device class.
Therefore, the tests and inspections herein may not be performed for the applicable device class (see MIL-PRF-38534).
Furthermore, the manufacturer may take exceptions or use alternate methods to the tests and inspections herein and not
perform them. However, the performance requirements as defined in MIL-PRF-38534 shall be met for the applicable device
class.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38534 and herein.
3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein and figure 1.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2.
3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are
as specified in table I and shall apply over the full specified operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical
tests for each subgroup are defined in table I.
3.5 Marking of device(s). Marking of device(s) shall be in accordance with MIL-PRF-38534. The device shall be marked
with the PIN listed in 1.2 herein. In addition, the manufacturer's vendor similar PIN may also be marked in MIL-HDBK-103 and
QML-38534.
3.6 Data. In addition to the general performance requirements of MIL-PRF-38534, the manufacturer of the device described
herein shall maintain the electrical test data (variables format) from the initial quality conformance inspection group A lot
sample, for each device type listed herein. Also, the data should include a summary of all parameters manually tested, and for
those which, if any, are guaranteed. This data shall be maintained under document revision level control by the manufacturer
and be made available to the preparing activity (DSCC-VA) upon request.
3.7 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to supply to this
drawing. The certificate of compliance (original copy) submitted to DSCC-VA shall affirm that the manufacturer's product meets
the performance requirements of MIL-PRF-38534 and herein.
3.8 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38534 shall be provided with each lot of
microcircuits delivered to this drawing.
4. QUALITY ASSURANCE PROVISIONS
4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38534 or as
modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the
form, fit, or function as described herein.
SIZE
STANDARD
5962-93193
A
MICROCIRCUIT DRAWING
REVISION LEVEL
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
C
4
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics.
Test
Symbol
Conditions 1/
Group A
subgroups
Device
types
Limits
Unit
V
-55°C ≤ T ≤ +125°C
C
VIN = 28 V dc ±0.5 V dc
no external sync, CL = 0
unless otherwise specified
Min
Max
Output voltage
VOUT
IOUT = ±2.17 A dc, (main)
1
01,02
+14.85
+15.15
2,3
1,2,3
1
+14.55
+14.10
-14.77
+15.45
+15.90
-15.23
R
02
IOUT = ±2.17 A dc, (dual)
01,02
2,3
-14.47
-14.02
0.0
-15.53
-15.90
4.34
R
1,2,3
1,2,3
02
Output current 2/
VOUT ripple voltage
IOUT
VIN = 16 V, 28 V, and 40 V
dc, sum of both outputs
01,02
A
R
1,2,3
1
02
0.0
4.34
100
VRIP
01,02
mVp-p
IOUT = ±2.17 A, (main)
B.W. = 10 kHz to 2 MHz
2,3
1,2,3
1
150
175
100
R
02
01,02
IOUT = ±2.17 A, (dual)
B.W. = 10 kHz to 2 MHz
2,3
150
175
R
1,2,3
1,2,3
02
VOUT line regulation
VRLINE
IOUT = ±2.17 A, (main)
VIN =16 V dc to 40 V dc
01,02
mV
50
R
1,2,3
1,2,3
02
100
100
IOUT
=
±2.17 A, (dual)
01,02
VIN =16 V dc to 40 V dc
R
1,2,3
02
150
See footnotes at end of table.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-93193
A
REVISION LEVEL
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
C
5
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics - Continued.
Test
Symbol
Conditions 1/
Group A
subgroups
Device
types
Limits
Unit
mV
-55°C ≤ T ≤ +125°C
C
VIN = 28 V dc ±0.5 V dc
no external sync, CL = 0
unless otherwise specified
Min
Max
50
VOUT load regulation
VRLOAD
IOUT = 0 to ±2.17 A, (main)
1,2,3
01,02
R
1,2,3
1,2,3
02
100
150
IOUT = 0 to ±2.17 A, (dual)
01,02
R
1,2,3
1,2,3
02
250
14
Input current
IIN
IOUT = 0 A, Inhibit 1 (pin 4) =
0
01,02
mA
R
1,2,3
1,2,3
02
17
70
IOUT = 0 A, Inhibit 2 (pin12)
= 0
01,02
R
1,2,3
1,2,3
02
90
01,02
100
IOUT = 0 A, Inhibit 1 (pin 4)
and inhibit 2 (pin 12) = open
R
1,2,3
1
02
130
45
IIN ripple current
Efficiency
IRIP
IOUT = ±2.17 A,
B.W. = 10 kHz to 10 MHz
01,02
mAp-p
2,3
1,2,3
1
50
75
R
02
01
Eff
IOUT = ±2.17 A
84
%
02
01
02
02
82
82
80
79
2,3
R
1,2,3
See footnotes at end of table.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-93193
A
REVISION LEVEL
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
C
6
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics - Continued.
Test
Symbol
Conditions 1/
Group A
subgroups
Device
types
Limits
Unit
-55°C ≤ T ≤ +125°C
C
VIN = 28 V dc ±0.5 V dc
no external sync, CL = 0
unless otherwise specified
Min
100
100
Max
Isolation
ISO
Input to output or any pin to
case at 500 V dc, TC =
+25°C
1
01,02
MΩ
R
1
4
02
Capacitive load 3/ 4/
(each output)
CL
No effect on dc
performance, TC = +25°C
01,02
500
µF
R
4
1
02
500
14
PD
Short circuit
01,02
W
Power dissipation load
fault
2,3
16
18
R
1,2,3
4,5,6
02
Switching frquency
FS
IOUT = ±2.17 A
01,02
525
675
kHz
kHz
R
4,5,6
4,5,6
02
500
525
700
675
External sync range 5/
FSYNC
IOUT = ±2.17 A, TTL level to
pin 6
01,02
R
4,5,6
4,5,6
02
525
675
VOUT step load transient 6/ VTLOAD
50 percent load to/from 100
percent load
01,02
-600
+600
mV pk
R
4,5,6
4,5,6
02
-900
+900
3.0
VOUT step load transient
recovery 4/ 6/ 7/
TTLOAD
50 percent load to/from 100
percent load
01,02
ms
R
4,5,6
4,5,6
02
4.0
VOUT step line transient 4/
8/
VTLINE
IOUT = ±2.17 A, Input step
from 16 V dc to 40 V dc
01,02
-400
+400
mV pk
R
4,5,6
4,5,6
02
-500
-400
+500
+400
IOUT = ±2.17 A, Input step
from 40 V dc to 16 V dc
01,02
R
4,5,6
02
-500
+500
See footnotes at end of table.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-93193
A
REVISION LEVEL
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
C
7
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics - Continued.
Test
Symbol
Conditions 1/
Group A
subgroups
Device
types
Limits
Unit
-55°C ≤ T ≤ +125°C
C
VIN = 28 V dc ±0.5 V dc
no external sync, CL = 0
unless otherwise specified
Min
Max
VOUT step line transient
TTLINE
IOUT = ±2.17 A, Input step
from 16 V dc to 40 V dc
4,5,6
01,02
-300
+300
µs
recovery
4/ 7/
R
4,5,6
4,5,6
02
-400
-300
+400
+300
IOUT = ±2.17 A, Input step
from 40 V dc to 16 V dc
01,02
R
4,5,6
4,5,6
02
-400
+400
Start up overshoot 4/
Start up delay 9/
VtonOS
TonD
TrLF
IOUT = ±2.17 A, VIN = 0 to 28
01,02
±50
mV pk
ms
V dc
R
4,5,6
4,5,6
02
±75
IOUT = ±2.17 A, VIN = 0 to 28
01,02
6
V dc
R
4,5,6
4,5,6
02
12
4
Load fault recovery 4/
IOUT = ±2.17 A
01,02
ms
R
4,5,6
02
8
1/ Post irradiation testing shall be in accordance with 4.3.5 herein.
2/ The output power available from either output is limited to 45.5 watts (i.e. 70 percent of the total output power).
3/ Capacitive load may be any value from 0 to the maximum limit without compromising dc performance.
4/ Parameter shall be tested as part of design characterization and after design or process changes; therefore, the parameter
shall be guaranteed to limits specified in table I.
5/ A TTL level waveform (VIH = 4.5 V minimum, VIL = 0.8 V maximum) with a 50 percent ±10 percent duty cycle applied to the
sync input pin (pin 6) within the the sync range frequency shall cause the converter's switching frequency to become
synchronous with the frequency applied to the sync input pin (pin 6).
6/ Load step transition time is 10 microseconds minimum.
7/ Recovery time is measured from the initiation of the transient until VOUT has returned to within ±1 percent of its final value.
8/ Input step transition time greater than 10 microseconds.
9/ Turn-on delay time measurement is either for a step application of power at the input or the removal of a ground signal from
the inhibit 1 pin (pin 4) or inhibit 2 pin (pin 12) while power is applied to the input.
SIZE
STANDARD
5962-93193
A
MICROCIRCUIT DRAWING
REVISION LEVEL
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
C
8
DSCC FORM 2234
APR 97
Case outline T.
Symbol
Millimeters
Inches
Min
Max
10.16
5.84
Min
Max
.400
.230
A
A1
φb
D
D1
e
5.33
0.89
.210
.035
1.14
.045
50.55
37.85
51.05
38.35
1.990
1.490
2.010
1.510
5.08 BSC
.200 BSC
E
E1
F
69.85
63.25
1.14
72.39
63.75
1.40
2.750
2.490
.045
2.850
2.510
.055
L
6.10
6.60
.240
.260
φP
q/q1
q2
s
3.43
3.68
.135
.145
44.20
28.96
6.10
44.70
29.46
6.60
1.740
1.140
.240
1.760
1.160
.260
T
10.92
11.43
.430
.450
NOTES:
1. The U.S. government preferred system of measurement is the metric SI. This item was designed using inch-
pound units of measurement. In case of problems involving conflicts between the metric and inch-pound
units, the inch-pound units shall rule.
2. Device weight: 86 grams maximum.
FIGURE 1. Case outline(s).
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-93193
A
REVISION LEVEL
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
C
9
DSCC FORM 2234
APR 97
Case outline U.
Symbol
Millimeters
Inches
Min
Max
10.16
5.72
1.14
38.23
Min
Max
.400
.225
.045
1.505
A
A1
φb
D
5.46
0.89
37.97
.215
.035
1.495
e
e1
E
E1
E2
F
5.08 BSC
3.30 BSC
.200 BSC
.130 BSC
87.38
87.88
76.45
63.63
1.40
3.440
3.460
3.010
2.505
.055
75.95
63.37
1.14
2.990
2.495
.045
L
6.10
6.60
.240
.260
L1
φP
q
q1
S
11.94
3.12
31.88
69.85
6.22
12.19
3.38
32.13
70.36
6.48
.470
.123
1.255
2.750
.245
.480
.133
1.265
2.770
.255
T
5.84
6.86
.230
.270
NOTES:
1. The U.S. government preferred system of measurement is the metric SI. This item was designed using inch-
pound units of measurement. In case of problems involving conflicts between the metric and inch-pound
units, the inch-pound units shall rule.
2. Device weight: 86 grams maximum.
FIGURE 1. Case outline(s) - Continued.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-93193
A
REVISION LEVEL
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
C
10
DSCC FORM 2234
APR 97
Case outline X.
Symbol
Millimeters
Inches
Min
Max
10.16
5.72
1.14
38.23
Min
Max
.400
.225
.045
1.505
A
A1
φb
D
5.46
0.89
37.97
.215
.035
1.495
e
e1
E
E1
F
5.08 BSC
3.30 BSC
.200 BSC
.130 BSC
75.95
76.45
63.63
1.40
2.990
3.010
2.505
.055
63.37
1.14
2.495
.045
L
6.10
6.60
.240
.260
L1
φP
q
q1
S
5.58
3.12
31.88
69.85
6.22
6.10
3.38
32.13
70.36
6.48
.220
.123
1.255
2.750
.245
.240
.133
1.265
2.770
.255
NOTES:
1. The U.S. government preferred system of measurement is the metric SI. This item was designed using inch-
pound units of measurement. In case of problems involving conflicts between the metric and inch-pound
units, the inch-pound units shall rule.
2. Device weight: 86 grams maximum.
FIGURE 1. Case outline(s) - Continued.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-93193
A
REVISION LEVEL
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
C
11
DSCC FORM 2234
APR 97
Case outline Y.
Symbol
Millimeters
Inches
Min
Max
10.16
5.84
Min
Max
.400
.230
A
A1
φb
D
D1
e
5.33
0.89
.210
.035
1.14
.045
50.55
37.85
51.05
38.35
1.990
1.490
2.010
1.510
5.08 BSC
.200 BSC
E
F
L
63.25
1.14
6.99
63.75
1.40
8.26
2.490
.045
.275
2.510
.055
.325
L1
φP
q/q1
q2
s
6.10
3.43
44.20
28.96
6.10
6.60
3.68
44.70
29.46
6.60
.240
.135
1.740
1.140
.240
.260
.145
1.760
1.160
.260
NOTES:
1. The U.S. government preferred system of measurement is the metric SI. This item was designed using inch-
pound units of measurement. In case of problems involving conflicts between the metric and inch-pound
units, the inch-pound units shall rule.
2. Device weight: 86 grams maximum.
FIGURE 1. Case outline(s) - Continued.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-93193
A
REVISION LEVEL
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
C
12
DSCC FORM 2234
APR 97
Case outline Z.
Symbol
Millimeters
Inches
Min
Max
10.16
5.84
Min
Max
.400
.230
A
A1
φb
D
D1
e
5.33
0.89
.210
.035
1.14
.045
50.55
37.85
51.05
38.35
1.990
1.490
2.010
1.510
5.08 BSC
.200 BSC
E
E1
F
69.85
63.25
1.14
72.39
63.75
1.40
2.750
2.490
.045
2.850
2.510
.055
L
6.10
6.60
.240
.260
φP
q/q1
q2
s
3.43
3.68
.135
.145
44.20
28.96
6.10
44.70
29.46
6.60
1.740
1.140
.240
1.760
1.160
.260
T
8.64
9.65
.340
.380
NOTES:
1. The U.S. government preferred system of measurement is the metric SI. This item was designed using inch-
pound units of measurement. In case of problems involving conflicts between the metric and inch-pound
units, the inch-pound units shall rule.
2. Device weight: 86 grams maximum.
FIGURE 1. Case outline(s) - Continued.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-93193
A
REVISION LEVEL
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
C
13
DSCC FORM 2234
APR 97
Device types
Case outlines
01 and 02
T, U, X, Y, and Z
Terminal number
Terminal symbol
1
2
3
Input
Input common
Tri
4
Inhibit 1
5
6
Sync output
Sync input
7
8
9
10
11
12
Positive output
Output common
Negative output
No connection
Slave to master
Master to slave/ Inhibit 2
NOTES:
1. Multiple devices may be used in parallel to drive a common load. When using this mode of operation the load current
is shared by two or three devices. In the current sharing mode, one device is designated as the master. The slave to
master pin (pin 11) of the master device is not connected and the master to slave/inhibit 2 pin (pin 12) of the master is
connected to the slave to master pin (pin 11) of the slave device(s). The device(s) designated as slave(s) have the
master to slave/inhibit 2 pin (pin 11) connected to the output common pin (pin 8).
2. A second slave device may be placed in parallel with a master and slave device, this requires the Tri pin (pin 3) of the
master device to be connected to the output common pin (pin 8). When paralleled, 95 percent of the sum of the power
of the devices is available at the load. This means that 185 watts at 15 volts is available for three devices in parallel.
3. The device has a sync input pin (pin 6) and a sync output pin (pin 5) which allows multiple devices, whether they're in a
single unit or master/slave configurations to be synchronized to a system clock or each other. Two or more devices
may be synchronized to each other by connecting the sync output pin (pin 5) of one to the sync input pin (pin 6) of
another.
4. The device has two inhibit options, one is ground referenced to the input common and the other is referenced to the
output common. The output referred inhibit pin uses the master to slave/inhibit 2 pin (pin 12). This pin is normally
used to parallel devices, and a TTL compatiable open collector low will inhibit the device when applied to this pin.
FIGURE 2. Terminal connections.
SIZE
STANDARD
5962-93193
A
MICROCIRCUIT DRAWING
REVISION LEVEL
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
C
14
DSCC FORM 2234
APR 97
TABLE II. Electrical test requirements.
MIL-PRF-38534 test requirements
Subgroups
(in accordance with
MIL-PRF-38534, group A
test table)
Interim electrical parameters
Final electrical parameters
Group A test requirements
- - -
1*, 2, 3, 4, 5, 6
1, 2, 3, 4, 5, 6
1
Group C end-point electrical
parameters
End-point electrical parameters
for radiation hardness assurance
(RHA) devices
1, 2, 3, 4, 5, 6
* PDA applies to subgroup 1.
4.2 Screening. Screening shall be in accordance with MIL-PRF-38534. The following additional criteria shall apply:
a. Burn-in test, method 1015 of MIL-STD-883.
(1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level
control and shall be made available to either DSCC-VA or the acquiring activity upon request. Also, the test circuit
shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent
specified in test method 1015 of MIL-STD-883.
(2) T as specified in accordance with table I of method 1015 of MIL-STD-883.
A
b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter
tests prior to burn-in are optional at the discretion of the manufacturer.
4.3 Conformance and periodic inspections. Conformance inspection (CI) and periodic inspection (PI) shall be in accordance
with MIL-PRF-38534 and as specified herein.
4.3.1 Group A inspection (CI). Group A inspection shall be in accordance with MIL-PRF-38534 and as follows:
a. Tests shall be as specified in table II herein.
b. Subgroups 7, 8, 9, 10, and 11 shall be omitted.
4.3.2 Group B inspection (PI). Group B inspection shall be in accordance with MIL-PRF-38534.
SIZE
STANDARD
5962-93193
A
MICROCIRCUIT DRAWING
REVISION LEVEL
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
C
15
DSCC FORM 2234
APR 97
4.3.3 Group C inspection (PI). Group C inspection shall be in accordance with MIL-PRF-38534 and as follows:
a. End-point electrical parameters shall be as specified in table II herein.
b. Steady-state life test, method 1005 of MIL-STD-883.
(1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level
control and shall be made available to either DSCC-VA or the acquiring activity upon request. Also, the test circuit
shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent
specified in test method 1005 of MIL-STD-883.
(2) T as specified in accordance with table I of method 1005 of MIL-STD-883.
A
(3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883.
4.3.4 Group D inspection (PI). Group D inspection shall be in accordance with MIL-PRF-38534.
4.3.5. Radiation hardness assurance (RHA). RHA qualification is required only for those devices with the RHA designator as
specified herein.
RHA level R
100
Units
Total ionizing dose
tolerance level
kRad (Si)
Single event upset
survival level (LET)
40
MeV
a. Radiation dose rate is in accordance with condition C of method 1019 of MIL-STD-883. Unless otherwise specified,
components are tested at a rate of 9 rad(Si)/s, in accordance with method 1019 of MIL-STD-750 or MIL-STD-883, as
applicable.
b. The manufacturer shall perform a worst-case and radiation susceptibility analysis on the device. This analysis shall
show that the minimum performance requirements of each component has adequate design margin under worst-case
operating conditions (extremes of line voltage, temperatures, load, frequency, radiation environment, etc.). This
analysis guarantees the post-irradiation parameter limits specified in table I.
c. RHA testing shall be performed at the component level for initial device qualification, and after design changes that
may affect the RHA performance of the device. As an alternative to testing, components may be procured to
manufacturer radiation guarantees that meet the minimum performance requirements. Component radiation
performance guarantees shall be established in compliance with MIL-PRF-19500, Group D or MIL-PRF-38535, Group
E, as applicable. For components with less than adequate performance margin, component lot radiation acceptance
screening shall be performed.
d. The manufacturer shall establish procedures controlling component radiation testing, and shall establish radiation test
plans used to implement component lot qualification during procurement. Test plans and test reports shall be filed and
controlled in accordance with the manufacturer's configuration management system.
e. The device manufacturer shall designate a RHA program manager to oversee component lot qualification, and to
monitor design changes for continued compliance to RHA requirements.
5. PACKAGING
5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38534.
SIZE
STANDARD
5962-93193
A
MICROCIRCUIT DRAWING
REVISION LEVEL
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
C
16
DSCC FORM 2234
APR 97
6. NOTES
6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications
(original equipment), design applications, and logistics purposes.
6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor-
prepared specification or drawing.
6.3 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for
the individual documents. This coordination will be accomplished in accordance with MIL-PRF-38534.
6.4 Record of users. Military and industrial users shall inform Defense Supply Center Columbus when a system application
requires configuration control and the applicable SMD. DSCC will maintain a record of users and this list will be used for
coordination and distribution of changes to the drawings. Users of drawings covering microelectronic devices (FSC 5962)
should contact DSCC-VA, telephone (614) 692-0544.
6.5 Comments. Comments on this drawing should be directed to DSCC-VA, Post Office Box 3990, Columbus, Ohio 43216-
5000, or telephone (614) 692-1081.
6.6 Sources of supply. Sources of supply are listed in MIL-HDBK-103 and QML-38534. The vendors listed in MIL-HDBK-
103 and QML-38534 have submitted a certificate of compliance (see 3.7 herein) to DSCC-VA and have agreed to this drawing.
SIZE
STANDARD
5962-93193
A
MICROCIRCUIT DRAWING
REVISION LEVEL
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
C
17
DSCC FORM 2234
APR 97
STANDARD MICROCIRCUIT DRAWING BULLETIN
DATE: 02-06-21
Approved sources of supply for SMD 5962-93193 are listed below for immediate acquisition information only and
shall be added to MIL-HDBK-103 and QML-38534 during the next revisions. MIL-HDBK-103 and QML-38534 will be
revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a
certificate of compliance has been submitted to and accepted by DSCC-VA. This bulletin is superseded by the next
dated revisions of MIL-HDBK-103 and QML-38534.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
similar
PIN 2/
5962-9319301HTA
5962-9319301HTC
5962-9319302HTA
5962-9319302HTC
5962R9319302HTA
5962R9319302HTC
5962R9319302KTA
5962R9319302KTC
50821
50821
50821
50821
50821
50821
50821
50821
MFL2815DW/883
MFL2815DW/883
SMFL2815DW/HO
SMFL2815DW/HO
SMFL2815DW/HR
SMFL2815DW/HR
SMFL2815DW/KR
SMFL2815DW/KR
5962-9319301HUA
5962-9319301HUC
5962-9319302HUA
5962-9319302HUC
5962R9319302HUA
5962R9319302HUC
5962R9319302KUA
5962R9319302KUC
50821
50821
50821
50821
50821
50821
50821
50821
MFL2815DV/883
MFL2815DV/883
SMFL2815DV/HO
SMFL2815DV/HO
SMFL2815DV/HR
SMFL2815DV/HR
SMFL2815DV/KR
SMFL2815DV/KR
5962-9319301HXA
5962-9319301HXC
5962-9319302HXA
5962-9319302HXC
5962R9319302HXA
5962R9319302HXC
5962R9319302KXA
5962R9319302KXC
50821
50821
50821
50821
50821
50821
50821
50821
MFL2815D/883
MFL2815D/883
SMFL2815D/HO
SMFL2815D/HO
SMFL2815D/HR
SMFL2815D/HR
SMFL2815D/KR
SMFL2815D/KR
5962-9319301HYA
5962-9319301HYC
5962-9319302HYA
5962-9319302HYC
5962R9319302HYA
5962R9319302HYC
5962R9319302KYA
5962R9319302KYC
50821
50821
50821
50821
50821
50821
50821
50821
MFL2815DY/883
MFL2815DY/883
SMFL2815DY/HO
SMFL2815DY/HO
SMFL2815DY/HR
SMFL2815DY/HR
SMFL2815DY/KR
SMFL2815DY/KR
5962-9319301HZA
5962-9319301HZC
5962-9319302HZA
5962-9319302HZC
5962R9319302HZA
5962R9319302HZC
5962R9319302KZA
5962R9319302KZC
50821
50821
50821
50821
50821
50821
50821
50821
MFL2815DZ/883
MFL2815DZ/883
SMFL2815DZ/HO
SMFL2815DZ/HO
SMFL2815DZ/HR
SMFL2815DZ/HR
SMFL2815DZ/KR
SMFL2815DZ/KR
1/ The lead finish shown for each PIN representing a hermetic package is the most readily available from the
manufacturer listed for that part. If the desired lead finish is not listed contact the Vendor to determine its
availability.
2/ Caution. Do not use this number for item acquisition. Items acquired to this number may not satisfy the
performance requirements of this drawing.
1 of 2
STANDARD MICROCIRCUIT DRAWING BULLETIN - CONTINUED.
DATE: 02-06-21
Vendor CAGE
number
Vendor name
and address
50821
Interpoint Corporation
10301 Willows Road
Redmond, WA 98073-9705
The information contained herein is disseminated for convenience only and the
Government assumes no liability whatsoever for any inaccuracies in the
information bulletin.
2 of 2
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