8200C [ETC]
ELECTRICALLY CONDUCTIVE DIE ATTACH ADHESIVE; 导电芯片粘接剂
| 型号： | 8200C |
| 厂家： | 
ETC |
| 描述： | ELECTRICALLY CONDUCTIVE DIE ATTACH ADHESIVE |
| 文件： | 总3页 (文件大小：345K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
PILOT TECHNICAL DATASHEET
ABLEBOND® 8200C
ELECTRICALLY CONDUCTIVE DIE ATTACH ADHESIVE
DESCRIPTION
ABLEBOND® 8200C low bleed die attach adhesive is
designed for small and medium sized dies across a
variety of leadframes including PPF, Cu and Ag. This
electrically conductive adhesive offers improved JEDEC
performance on QFN type packages.
ABLEBOND 8200C adhesive is a new version of the
RP-751 series that provides improved MRT on silver
and pre-plated leadframe.
FEATURES
• HIgh electrical conductivity
• Excellent adhesion to silver and pre-plated leadframe
• Oven and snap curable
Test
Test Description
Typical Uncured Properties
8200C
Method
Filler Type
Silver
11,500 cP
5.0
Viscosity @ 25ºC
Thixotropic Index
Work Life @ 25ºC
Est. Storage Life @ -40ºC
Brookfield CP51 @ 5 rpm
ATM-0018
ATM-0089
ATM-0087
ATM-0068
Viscosity @ 0.5/Viscosity @ 5 rpm
25% increase in viscosity @ RT
24 hours
1 year
Test
Method
Cure Process Data
8200C
Test Description
Weight Loss on Cure
7%
10 x 10 mm Si die on glass slide
ATM-0031
Recommended Cure Condition
30 minutes ramp to 175ºC + 15 minutes @ 175ºC
Zone Number
1
2
3
4
5
6
7
Time
Snap Cure Profile
Temp ºC 140 150 160 200 220 220 220 120 sec
N2 Flow
10 liters/minute @ 150ºC
Physiochemical Properties
- Post Cure
Test
Method
8200C
Test Description
Ionics
Chloride
Sodium
Potassium
< 10 ppm
< 10 ppm
< 10 ppm
Teflon flask 5 gm sample / 20-40
mesh 50 gm DI water 100ºC for
24 hours
ATM-0007
ATM-0073
Weight Loss @ 300ºC
1%
Thermogravimetric Analysis
Typical properties are not intended for use as specification limits. If you need to write a specification, ask for our
Standard Release Specification. This is a Pilot product that has been converted to high volume manufacturing and
is being monitored for process stability. During this monitoring period, certain properties may be adjusted slightly.
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02/06
8200C
Physiochemical Properties
- Post Cure
Test
Method
8200C
Test Description
Glass Transition Temperature
190ºC
Dynamic mechanical thermal analysis ATM-0112
Below Tg
Above Tg
60 ppm/ºC
Coefficient of Thermal Expansion
TMA expansion mode
ATM-0055
130 ppm/ºC
@ 25ºC
@ 150ºC
@ 250ºC
4630 MPa (670,000 psi)
1170 MPa (170,000 psi)
780 MPa (110,000 psi)
Dynamic
mechanical thermal
analysis using
Dynamic Tensile Modulus
ATM-0112
ATM-0093
< 0.5mm thick sample
Dynamic vapor sorption after 85ºC/
85% RH exposure
MoistureAbsorption @ Saturation
0.20%
Thermal/Electrical Properties-
Post Cure
Test
Method
8200C
Test Description
Volume Resistivity
0.00017 ohm-cm
1.2 W/mK
4-point probe
Laser Flash
ATM-0020
ATM-0116
Thermal Conductivity
Mechanical Properties-
Post Cure
Test
Method
8200C
Test Description
@25ºC
19.1 kg
Die Shear Strength (kgf/die)
vs. Temperature
3 x 3 mm (120 x 120 mil) Si die
on SPCLF
ATM-0052
ATM-0059
ATM-0059
Chip Size
Warpage
0.38mm (15mil)
thick Si die on
0.2mm Ag/Cu LF
Chip Warpage @ 25ºC
vs. Chip Size
7.6x7.6mm
(300 x 300 mil)
16 µm
Post Dia Attach Cure
6.7 µm
Chip Warpage
Post Mold Bake (4 hrs @ 175ºC) 10.9 µm
APPLICATION GUIDELINES
SHIPMENT
UNPACKING
Transfer the syringes from the dry ice to a -40°C freezer
This Ablestik product is packed and shipped in dry ice without ANY delays. Freeze-thaw voids will form in
at -80°C. Inside every dry ice shipment of Ablestik’s the syringes if the syringes are repeatedly thawed and
products is a small packet containing the ABLECUBE. refrozen.
This is a small blue cube which retains its shape at
-40°C. If the ABLECUBE is exposed to temperatures STORAGE
higher than -40°C, the cube will melt.
This Ablestik product must be stored at -40°C. The shelf
life of the material is only valid when the material has
Please check the state of the ABLECUBE to ensure the been stored at the specified storage condition. Incorrect
integrity of the shipment. If the ABLECUBE has melted storage conditions will degrade the performance of the
upon Receiving Inspection, place the entire shipment material in both handling (e.g. dispensing or screen
in a -40°C freezer and contact your Ablestik Customer printing) and final cured properties.
Service or Sales Representative.
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8200C
THAWING
Apply enough adhesive to achieve a 25-50 µm (1-2 mil) wet
Allow the container to reach room temperature before bondline thickness, dispensed with approximately 25% - 50%
use. After removing from the freezer, set the syringes filleting on all sides of the die. Alternate dispense amounts
to stand vertically while thawing. Refer to Syringe Thaw may be used depending on the application requirements.
Time chart for the thaw time recommendation.
Star or cross shaped dispense patterns will yield fewer
bondline voids than the matrix style of dispense pattern.
DO NOT open the container before contents reach
ambient temperature. Any moisture that collects on the Contact Ablestik Technical Service Department for detailed
thawed container should be removed prior to opening recommendation on adhesive application, including
the container.
dispensing.
DO NOT re-freeze. Once thawed to room temperature, CURE
the adhesive should not be re-frozen.
This adhesive can be cured in box or in-line ovens. The
recommended box oven cure temperature for this adhesive
is 175°C.
ADHESIVE APPLICATION
Thawed adhesive should be immediately placed
on dispense equipment for use. If the adhesive is AVAILABILITY
®
transferred to a final dispensing reservoir, care must be ABLEBOND adhesives are packaged in syringes or jars
exercised to avoid entrapment of contaminants and/or per customer specification. Available package sizes range
air into the adhesive. Adhesive must be completely from 1cc to 30cc and 1 ounce to 1 pound. For details, refer
used within the product’s recommended work life of >24 to the Ablestik Standard Package Data Set or contact your
hours.
Customer Service Representative.
CAUTION: This product may cause skin irritation in sensitive persons. Avoid skin contact. If contact does occur, wash area
immediately with soap and water. Please refer to the Material Safety Data Sheet for more details.
20021 Susana Road, Rancho Dominguez, CA 90221
(310) 764-4600 Fax (310) 764-2545 Customer Service Fax (310) 764-1783
For a technical contact nearest you, visit
www.ablestik.com
The information given and the recommendations made herein are believed to be accurate but no guarantee of their accuracy is made. In every
case we recommend that purchasers before using any product conduct their own tests to determine whether the product is suitable for their
particular purposes under their own operating conditions. No representative of ours has any authority to waive or change the foregoing provisions
but, subject to such provisions, our engineers are available to assist purchasers in adapting our products to their needs. Nothing contained
herein shall be construed to imply the nonexistence of any relevant patents or to constitute a permission, inducement or recommendation
to practice any invention covered by any patent, without the authority from the owner of this patent. These materials are not designed or
manufactured for implantation in the human body. Approval from FDA for such use as part of any product to be implanted in the human body
has NOT been sought nor received. We also expect purchasers to use our products in accordance with the guiding principles of the American
®
Chemistry Council’s Responsible Care program.
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