AM29SL800CB-100WBI [ETC]
x8/x16 Flash EEPROM ; X8 / X16闪存EEPROM型号: | AM29SL800CB-100WBI |
厂家: | ETC |
描述: | x8/x16 Flash EEPROM
|
文件: | 总43页 (文件大小:919K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Am29SL800C
8 Megabit (1 M x 8-Bit/512 K x 16-Bit)
CMOS 1.8 Volt-only Super Low Voltage Flash Memory
DISTINCTIVE CHARACTERISTICS
■ Single power supply operation
■ Embedded Algorithms
— 1.8 to 2.2 V for read, program, and erase
operations
— Embedded Erase algorithm automatically
preprograms and erases the entire chip or any
combination of designated sectors
— Ideal for battery-powered applications
■ Manufactured on 0.32 µm process technology
— Compatible with 0.35 µm Am29SL800B device
■ High performance
— Embedded Program algorithm automatically
writes and verifies data at specified addresses
■ Minimum 1,000,000 write cycle guarantee per
sector
— Access times as fast as 100 ns
■ 20-year data retention at 125°C
■ Package option
■ Ultra low power consumption (typical values at 5
MHz)
— 48-pin TSOP
— 1 µA Automatic Sleep Mode current
— 1 µA standby mode current
— 5 mA read current
— 48-ball FBGA
■ Compatibility with JEDEC standards
— 20 mA program/erase current
— Pinout and software compatible with single-
power supply Flash
■ Flexible sector architecture
— Superior inadvertent write protection
— One 16 Kbyte, two 8 Kbyte, one 32 Kbyte, and
fifteen 64 Kbyte sectors (byte mode)
■ Data# Polling and toggle bits
— One 8 Kword, two 4 Kword, one 16 Kword, and
fifteen 32 Kword sectors (word mode)
— Provides a software method of detecting program
or erase operation completion
— Supports full chip erase
■ Ready/Busy# pin (RY/BY#)
— Sector Protection features:
— Provides a hardware method of detecting
program or erase cycle completion
A hardware method of locking a sector to prevent
any program or erase operations within that
sector
■ Erase Suspend/Erase Resume
— Suspends an erase operation to read data from,
or program data to, a sector that is not being
erased, then resumes the erase operation
Sectors can be locked in-system or via
programming equipment
Temporary Sector Unprotect feature allows code
changes in previously locked sectors
■ Hardware reset pin (RESET#)
— Hardware method to reset the device to reading
array data
■ Unlock Bypass Program Command
— Reduces overall programming time when issuing
multiple program command sequences
■ Top or bottom boot block configurations
available
Publication# 22230 Rev: D Amendment/+2
Issue Date: November 14, 2000
This Data Sheet states AMD’s current specifications regarding the Products described herein. This Data Sheet may
be revised by subsequent versions or modifications due to changes in technical specifications.
Refer to AMD’s Website (www.amd.com) for the latest information.
GENERAL DESCRIPTION
The Am29SL800C is an 8 Mbit, 1.8 V volt-only Flash
memory organized as 1,048,576 bytes or 524,288
words. The device is offered in 48-pin TSOP and 48-
ball FBGA packages. The word-wide data (x16)
appears on DQ15–DQ0; the byte-wide (x8) data
appears on DQ7–DQ0. This device is designed to be
programmed and erased in-system with a single 1.8
volt VCC supply. No VPP is for write or erase operations.
The device can also be programmed in standard
EPROM programmers.
During erase, the device automatically times the erase
pulse widths and verifies proper cell margin.
The host system can detect whether a program or
erase operation is complete by observing the RY/BY#
pin, or by reading the DQ7 (Data# Polling) and DQ6
(toggle) status bits. After a program or erase cycle has
been completed, the device is ready to read array data
or accept another command.
The sector erase architecture allows memory sectors
to be erased and reprogrammed without affecting the
data contents of other sectors. The device is fully
erased when shipped from the factory.
The standard device offers access times of 100, 120,
and 150 ns, allowing high speed microprocessors to
operate without wait states. To eliminate bus contention
the device has separate chip enable (CE#), write
enable (WE#) and output enable (OE#) controls.
Hardware data protection measures include a low
VCC detector that automatically inhibits write opera-
tions during power transitions. The hardware sector
protection feature disables both program and erase
operations in any combination of the sectors of
memory. This can be achieved in-system or via pro-
gramming equipment.
The device requires only a single 1.8 volt power
supply for both read and write functions. Internally
generated and regulated voltages are provided for the
program and erase operations.
The device is entirely command set compatible with the
JEDEC single-power-supply Flash standard. Com-
mands are written to the command register using
standard microprocessor write timings. Register con-
tents serve as input to an internal state-machine that
controls the erase and programming circuitry. Write
cycles also internally latch addresses and data needed
for the programming and erase operations. Reading
data out of the device is similar to reading from other
Flash or EPROM devices.
The Erase Suspend feature enables the user to put
erase on hold for any period of time to read data from,
or program data to, any sector that is not selected for
erasure. True background erase can thus be achieved.
The hardware RESET# pin terminates any operation
in progress and resets the internal state machine to
reading array data. The RESET# pin may be tied to the
system reset circuitry. A system reset would thus also
reset the device, enabling the system microprocessor
to read the boot-up firmware from the Flash memory.
Device programming occurs by executing the program
command sequence. This initiates the Embedded
Program algorithm—an internal algorithm that auto-
matically times the program pulse widths and verifies
proper cell margin. The Unlock Bypass mode facili-
tates faster programming times by requiring only two
write cycles to program data instead of four.
The device offers two power-saving features. When
addresses have been stable for a specified amount of
time, the device enters the automatic sleep mode.
The system can also place the device into the standby
mode. Power consumption is greatly reduced in both
these modes.
Device erasure occurs by executing the erase
command sequence. This initiates the Embedded
Erase algorithm—an internal algorithm that automati-
cally preprograms the array (if it is not already
programmed) before executing the erase operation.
AMD’s Flash technology combines years of Flash
memory manufacturing experience to produce the
highest levels of quality, reliability and cost effectiveness.
The device electrically erases all bits within a sector
simultaneously via Fowler-Nordheim tunneling. The
data is programmed using hot electron injection.
2
Am29SL800C
TABLE OF CONTENTS
Product Selector Guide . . . . . . . . . . . . . . . . . . . . .4
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . .5
Special Handling Instructions for FBGA Packages .................. 6
Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . .7
Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Ordering Information . . . . . . . . . . . . . . . . . . . . . . .8
Device Bus Operations . . . . . . . . . . . . . . . . . . . . . .9
Table 1. Am29SL800C Device Bus Operations ................................9
Word/Byte Configuration .......................................................... 9
Requirements for Reading Array Data ..................................... 9
Writing Commands/Command Sequences .............................. 9
Program and Erase Operation Status .................................... 10
Standby Mode ........................................................................ 10
Automatic Sleep Mode ........................................................... 10
RESET#: Hardware Reset Pin ............................................... 10
DQ5: Exceeded Timing Limits ................................................ 22
DQ3: Sector Erase Timer ....................................................... 22
Table 6. Write Operation Status ..................................................... 23
Absolute Maximum Ratings . . . . . . . . . . . . . . . . 24
Figure 7. Maximum Negative Overshoot Waveform ...................... 24
Figure 8. Maximum Positive Overshoot Waveform........................ 24
Operating Ranges. . . . . . . . . . . . . . . . . . . . . . . . . 24
DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 25
Figure 9. I
Current vs. Time (Showing Active and Automatic
CC1
Sleep Currents).............................................................................. 26
Figure 10. Typical I vs. Frequency ........................................... 26
CC1
Test Conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Figure 11. Test Setup..................................................................... 27
Table 7. Test Specifications ........................................................... 27
Key to Switching Waveforms .................................................. 27
Figure 12. Input Waveforms and Measurement Levels ................. 27
AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 28
Output Disable Mode .............................................................. 11
Table 2. Am29SL800CT Top Boot Block Sector Address Table .....11
Table 3. Am29SL800CB Bottom Boot Block Sector Address Table 12
Autoselect Mode ..................................................................... 13
Table 4. Am29SL800C Autoselect Codes (High Voltage Method) ..13
Sector Protection/Unprotection ............................................... 13
Temporary Sector Unprotect .................................................. 13
Figure 1. In-System Sector Protect/Unprotect Algorithms .............. 14
Figure 2. Temporary Sector Unprotect Operation........................... 15
Hardware Data Protection ...................................................... 15
Read Operations .................................................................... 28
Figure 13. Read Operations Timings ............................................. 28
Figure 14. RESET# Timings .......................................................... 29
Word/Byte Configuration (BYTE#) ........................................ 30
Figure 15. BYTE# Timings for Read Operations............................ 30
Figure 16. BYTE# Timings for Write Operations............................ 30
Erase/Program Operations ..................................................... 31
Figure 17. Program Operation Timings.......................................... 32
Figure 18. Chip/Sector Erase Operation Timings .......................... 33
Figure 19. Data# Polling Timings (During Embedded Algorithms). 34
Figure 20. Toggle Bit Timings (During Embedded Algorithms)...... 34
Figure 21. DQ2 vs. DQ6................................................................. 35
Temporary Sector Unprotect .................................................. 35
Figure 22. Temporary Sector Unprotect Timing Diagram .............. 35
Figure 23. Sector Protect/Unprotect Timing Diagram .................... 36
Alternate CE# Controlled Erase/Program Operations ............ 37
Figure 24. Alternate CE# Controlled Write Operation Timings ...... 38
Erase and Programming Performance . . . . . . . 39
Latchup Characteristics. . . . . . . . . . . . . . . . . . . . 39
TSOP Pin Capacitance . . . . . . . . . . . . . . . . . . . . . 39
Data Retention. . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . 40
TS 048—48-Pin Standard TSOP ............................................ 40
TSR048—48-Pin Reverse TSOP ........................................... 41
FBB048—48-Ball Fine-Pitch Ball Grid Array (FBGA)
Low V Write Inhibit .............................................................. 15
CC
Write Pulse “Glitch” Protection ............................................... 15
Logical Inhibit .......................................................................... 15
Power-Up Write Inhibit ............................................................ 15
Command Definitions . . . . . . . . . . . . . . . . . . . . . 15
Reading Array Data ................................................................ 15
Reset Command ..................................................................... 15
Autoselect Command Sequence ............................................ 16
Word/Byte Program Command Sequence ............................. 16
Unlock Bypass Command Sequence ..................................... 16
Figure 3. Program Operation .......................................................... 17
Chip Erase Command Sequence ........................................... 17
Sector Erase Command Sequence ........................................ 17
Erase Suspend/Erase Resume Commands ........................... 18
Figure 4. Erase Operation............................................................... 18
Command Definitions ............................................................. 19
Table 5. Am29SL800C Command Definitions ................................19
Write Operation Status . . . . . . . . . . . . . . . . . . . . 20
DQ7: Data# Polling ................................................................. 20
Figure 5. Data# Polling Algorithm ................................................... 20
RY/BY#: Ready/Busy# ........................................................... 21
DQ6: Toggle Bit I .................................................................... 21
DQ2: Toggle Bit II ................................................................... 21
Reading Toggle Bits DQ6/DQ2 .............................................. 21
Figure 6. Toggle Bit Algorithm......................................................... 22
6 x 9 mm package .................................................................. 42
Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . 43
Revision A (August 1998) ....................................................... 43
Revision B (January 1999) ..................................................... 43
Revision B+1 (March 5, 1999) ................................................ 43
Revision C (December 6, 1999) ............................................. 43
Revision D (February 21, 2000) .............................................. 43
Revision D+1 (May 8, 2000) ................................................... 43
Revision D+2 (November 14, 2000) ....................................... 43
Am29SL800C
3
PRODUCT SELECTOR GUIDE
Family Part Number
Am29SL800C
Speed Options
-100
100
100
35
-120
120
120
50
-150
150
150
65
Max access time, ns (t
)
ACC
Max CE# access time, ns (t
)
CE
Max OE# access time, ns (t
)
OE
Note: See “AC Characteristics” for full specifications.
BLOCK DIAGRAM
DQ0–DQ15 (A-1)
RY/BY#
V
CC
Sector Switches
V
SS
Erase Voltage
Generator
Input/Output
Buffers
RESET#
State
Control
WE#
BYTE#
Command
Register
PGM Voltage
Generator
Data
Latch
Chip Enable
Output Enable
Logic
STB
CE#
OE#
Y-Decoder
Y-Gating
STB
V
Detector
Timer
CC
Cell Matrix
X-Decoder
A0–A18
4
Am29SL800C
CONNECTION DIAGRAMS
A15
A14
A13
A12
A11
A10
A9
A8
NC
NC
1
2
3
4
5
6
7
8
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
A16
BYTE#
VSS
DQ15/A-1
DQ7
DQ14
DQ6
DQ13
DQ5
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
DQ12
DQ4
VCC
WE#
RESET#
NC
Standard TSOP
DQ11
DQ3
DQ10
DQ2
DQ9
DQ1
DQ8
DQ0
OE#
VSS
CE#
A0
NC
RY/BY#
A18
A17
A7
A6
A5
A4
A3
A2
A1
1
2
3
4
5
6
7
8
A15
A14
A13
A12
A11
A10
A9
A8
NC
NC
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
A16
BYTE#
VSS
DQ15/A-1
DQ7
DQ14
DQ6
DQ13
DQ5
DQ12
DQ4
VCC
DQ11
DQ3
DQ10
DQ2
DQ9
DQ1
DQ8
DQ0
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
WE#
RESET#
NC
Reverse TSOP
NC
RY/BY#
A18
A17
A7
A6
A5
A4
A3
A2
A1
OE#
VSS
CE#
A0
Am29SL800C
5
CONNECTION DIAGRAMS (Continued)
48-Ball FBGA
(Top View, Balls Facing Down)
A6
B6
C6
D6
E6
F6
G6
H6
A13
A12
A14
A15
A16
BYTE# DQ15/A-1 VSS
A5
A9
B5
A8
C5
D5
E5
F5
G5
H5
A10
A11
DQ7
DQ14
DQ13
DQ6
A4
B4
C4
D4
E4
F4
G4
H4
WE# RESET#
NC
NC
DQ5
DQ12
VCC
DQ4
A3
B3
C3
D3
E3
F3
G3
H3
RY/BY#
NC
A18
NC
DQ2
DQ10
DQ11
DQ3
A2
A7
B2
C2
A6
D2
A5
E2
F2
G2
H2
A17
DQ0
DQ8
DQ9
DQ1
A1
A3
B1
A4
C1
A2
D1
A1
E1
A0
F1
G1
H1
CE#
OE#
VSS
Flash memory devices in FBGA packages may be
damaged if exposed to ultrasonic cleaning methods.
The package and/or data integrity may be compro-
mised if the package body is exposed to temperatures
above 150°C for prolonged periods of time.
Special Handling Instructions for FBGA
Packages
Special handling is required for Flash Memory products
in FBGA packages.
6
Am29SL800C
PIN CONFIGURATION
LOGIC SYMBOL
A0–A18
= 19 addresses
19
DQ0–DQ14 = 15 data inputs/outputs
A0–A18
16 or 8
DQ15/A-1
=
DQ15 (data input/output, word mode),
A-1 (LSB address input, byte mode)
DQ0–DQ15
(A-1)
BYTE#
CE#
=
=
=
=
=
=
=
=
=
Selects 8-bit or 16-bit mode
Chip enable
CE#
OE#
OE#
Output enable
WE#
WE#
Write enable
RESET#
BYTE#
RESET#
RY/BY#
VCC
Hardware reset pin, active low
Ready/Busy# output
1.8–2.2 V single power supply
Device ground
RY/BY#
VSS
NC
Pin not connected internally
Am29SL800C
7
ORDERING INFORMATION
Standard Products
AMD standard products are available in several packages and operating ranges. The order number (Valid Combi-
nation) is formed by a combination of the elements below.
Am29SL800C
T
-100
E
C
TEMPERATURE RANGE
C
=
Commercial (0°C to +70°C)
I
=
Industrial (–40°C to +85°C)
PACKAGE TYPE
E
=
=
=
48-Pin Thin Small Outline Package (TSOP)
Standard Pinout (TS 048)
F
48-Pin Thin Small Outline Package (TSOP)
Reverse Pinout (TSR048)
WB
48-Ball Fine-Pitch Ball Grid Array (FBGA)
0.80 mm pitch, 6 x 9 mm package (FBB048)
SPEED OPTION
See Product Selector Guide and Valid Combinations
BOOT CODE SECTOR ARCHITECTURE
T
B
=
=
Top Sector
Bottom Sector
DEVICE NUMBER/DESCRIPTION
Am29SL800C
8 Megabit (1 M x 8-Bit/512 K x 16-Bit) CMOS Flash Memory
1.8 Volt-only Read, Program, and Erase
Valid Combinations for TSOP Packages
AM29SL800CT-100,
Valid Combinations for FBGA Packages
Order Number Package Marking
AM29SL800CT-100,
AM29SL800CB-100
A800CT10V,
A800CB10V
AM29SL800CT-120,
AM29SL800CB-120
AM29SL800CB-100
EC, EI, FC, FI
AM29SL800CT-120,
AM29SL800CB-120
WBC, A800CT12V,
C, I
AM29SL800CT-150,
AM29SL800CB-150
WBI
A800CB12V
AM29SL800CT-150,
AM29SL800CB-150
A800CT15V,
A800CB15V
Valid Combinations
Valid Combinations list configurations planned to be sup-
ported in volume for this device. Consult the local AMD sales
office to confirm availability of specific valid combinations and
to check on newly released combinations.
8
Am29SL800C
DEVICE BUS OPERATIONS
This section describes the requirements and use of the
device bus operations, which are initiated through the
internal command register. The command register
itself does not occupy any addressable memory loca-
tion. The register is composed of latches that store the
commands, along with the address and data informa-
tion needed to execute the command. The contents of
the register serve as inputs to the internal state
machine. The state machine outputs dictate the func-
tion of the device. Table 1 lists the device bus
operations, the inputs and control levels they require,
and the resulting output. The following subsections
describe each of these operations in further detail.
Table 1. Am29SL800C Device Bus Operations
DQ8–DQ15
BYTE#
= V
Addresses
(Note 1)
DQ0– BYTE#
Operation
CE# OE# WE# RESET#
DQ7
= V
IH
IL
Read
L
L
H
H
A
D
D
DQ8–DQ14 = High-Z,
DQ15 = A-1
IN
OUT
OUT
Write
L
H
L
H
A
D
D
IN
IN
IN
V
0.2 V
±
V
0.2 V
±
CC
CC
Standby
X
X
X
High-Z High-Z
High-Z
Output Disable
Reset
L
H
X
H
X
H
L
X
X
High-Z High-Z
High-Z High-Z
High-Z
High-Z
X
Sector Address,
A6 = L, A1 = H,
A0 = L
Sector Protect (Note 2)
L
H
L
V
D
X
X
X
ID
IN
Sector Address,
A6 = H, A1 = H,
A0 = L
Sector Unprotect (Note 2)
L
H
X
L
V
V
D
D
X
ID
IN
IN
Temporary Sector Unprotect
X
X
A
D
High-Z
ID
IN
IN
Legend:
L = Logic Low = V , H = Logic High = V , V = 10 ± 1.0 V, X = Don’t Care, A = Address In, D = Data In, D = Data Out
IL
IH
ID
IN
IN
OUT
Notes:
1. Addresses are A18:A0 in word mode (BYTE# = V ), A18:A-1 in byte mode (BYTE# = V ).
IH
IL
2. The sector protect and sector unprotect functions may also be implemented via programming equipment. See the “Sector
Protection/Unprotection” section.
The internal state machine is set for reading array data
Word/Byte Configuration
upon device power-up, or after a hardware reset. This
The BYTE# pin controls whether the device data I/O
ensures that no spurious alteration of the memory
pins DQ15–DQ0 operate in the byte or word configura-
content occurs during the power transition. No
tion. If the BYTE# pin is set at logic ‘1’, the device is in
command is necessary in this mode to obtain array
word configuration, DQ15–DQ0 are active and con-
data. Standard microprocessor read cycles that assert
trolled by CE# and OE#.
valid addresses on the device address inputs produce
If the BYTE# pin is set at logic ‘0’, the device is in byte
configuration, and only data I/O pins DQ0–DQ7 are
active and controlled by CE# and OE#. The data I/O
pins DQ8–DQ14 are tri-stated, and the DQ15 pin is
used as an input for the LSB (A-1) address function.
valid data on the device data outputs. The device
remains enabled for read access until the command
register contents are altered.
See “Reading Array Data” for more information. Refer
to the AC Read Operations table for timing specifica-
tions and to Figure 13 for the timing diagram. ICC1 in the
DC Characteristics table represents the active current
specification for reading array data.
Requirements for Reading Array Data
To read array data from the outputs, the system must
drive the CE# and OE# pins to VIL. CE# is the power
control and selects the device. OE# is the output
control and gates array data to the output pins. WE#
should remain at VIH. The BYTE# pin determines
whether the device outputs array data in words or
bytes.
Writing Commands/Command Sequences
To write a command or command sequence (which
includes programming data to the device and erasing
sectors of memory), the system must drive WE# and
CE# to VIL, and OE# to VIH.
Am29SL800C
9
For program operations, the BYTE# pin determines
whether the device accepts program data in bytes or
words. Refer to “Word/Byte Configuration” for more
information.
The device also enters the standby mode when the
RESET# pin is driven low. Refer to the next section,
RESET#: Hardware Reset Pin.
If the device is deselected during erasure or program-
ming, the device draws active current until the
operation is completed.
The device features an Unlock Bypass mode to facili-
tate faster programming. Once the device enters the
Unlock Bypass mode, only two write cycles are
required to program a word or byte, instead of four. The
“Word/Byte Program Command Sequence” section
has details on programming data to the device using
both standard and Unlock Bypass command
sequences.
ICC3 in the DC Characteristics table represents the
standby current specification.
Automatic Sleep Mode
The automatic sleep mode minimizes Flash device
energy consumption. The device automatically enables
this mode when addresses remain stable for tACC + 50
ns. The automatic sleep mode is independent of the
CE#, WE#, and OE# control signals. Standard address
access timings provide new data when addresses are
changed. While in sleep mode, output data is latched
and always available to the system. ICC4 in the DC
Characteristics table represents the automatic sleep
mode current specification.
An erase operation can erase one sector, multiple sec-
tors, or the entire device. Tables 2 and 3 indicate the
address space that each sector occupies. A “sector
address” consists of the address bits required to
uniquely select a sector. The “Command Definitions”
section has details on erasing a sector or the entire
chip, or suspending/resuming the erase operation.
After the system writes the autoselect command
sequence, the device enters the autoselect mode. The
system can then read autoselect codes from the
internal register (which is separate from the memory
array) on DQ7–DQ0. Standard read cycle timings apply
in this mode. Refer to the Autoselect Mode and Autose-
lect Command Sequence sections for more
information.
RESET#: Hardware Reset Pin
The RESET# pin provides a hardware method of reset-
ting the device to reading array data. When the
RESET# pin is driven low for at least a period of tRP, the
device immediately terminates any operation in
progress, tristates all output pins, and ignores all
read/write commands for the duration of the RESET#
pulse. The device also resets the internal state
machine to reading array data. The operation that was
interrupted should be reinitiated once the device is
ready to accept another command sequence, to
ensure data integrity.
ICC2 in the DC Characteristics table represents the
active current specification for the write mode. The “AC
Characteristics” section contains timing specification
tables and timing diagrams for write operations.
Program and Erase Operation Status
Current is reduced for the duration of the RESET#
pulse. When RESET# is held at VSS±0.2 V, the device
draws CMOS standby current (ICC4). If RESET# is held
at VIL but not within VSS±0.2 V, the standby current will
be greater.
During an erase or program operation, the system may
check the status of the operation by reading the status
bits on DQ7–DQ0. Standard read cycle timings and ICC
read specifications apply. Refer to “Write Operation
Status” for more information, and to “AC Characteris-
tics” for timing diagrams.
The RESET# pin may be tied to the system reset cir-
cuitry. A system reset would thus also reset the Flash
memory, enabling the system to read the boot-up firm-
ware from the Flash memory.
Standby Mode
When the system is not reading or writing to the device,
it can place the device in the standby mode. In this
mode, current consumption is greatly reduced, and the
outputs are placed in the high impedance state, inde-
pendent of the OE# input.
If RESET# is asserted during a program or erase oper-
ation, the RY/BY# pin remains a “0” (busy) until the
internal reset operation is complete, which requires a
time of tREADY (during Embedded Algorithms). The
system can thus monitor RY/BY# to determine whether
the reset operation is complete. If RESET# is asserted
when a program or erase operation is not executing
(RY/BY# pin is “1”), the reset operation is completed
within a time of tREADY (not during Embedded Algo-
rithms). The system can read data tRH after the
RESET# pin returns to VIH.
The device enters the CMOS standby mode when the
CE# and RESET# pins are both held at VCC ± 0.2 V.
(Note that this is a more restricted voltage range than
VIH.) If CE# and RESET# are held at VIH, but not within
V
CC ± 0.2 V, the device will be in the standby mode, but
the standby current will be greater. The device requires
standard access time (tCE) for read access when the
device is in either of these standby modes, before it is
ready to read data.
Refer to the AC Characteristics tables for RESET#
parameters and to Figure 14 for the timing diagram.
10
Am29SL800C
Output Disable Mode
When the OE# input is at VIH, output from the device is
disabled. The output pins are placed in the high imped-
ance state.
Table 2. Am29SL800CT Top Boot Block Sector Address Table
Address Range (in hexadecimal)
Sector Size
(Kbytes/
(x8)
(x16)
Sector
SA0
A18
0
A17
0
A16
0
A15
0
A14
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
0
A13
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
0
A12
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
0
Kwords)
Address Range
Address Range
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
32/16
8/4
00000h–0FFFFh
10000h–1FFFFh
20000h–2FFFFh
30000h–3FFFFh
40000h–4FFFFh
50000h–5FFFFh
60000h–6FFFFh
70000h–7FFFFh
80000h–8FFFFh
90000h–9FFFFh
A0000h–AFFFFh
B0000h–BFFFFh
C0000h–CFFFFh
D0000h–DFFFFh
E0000h–EFFFFh
F0000h–F7FFFh
F8000h–F9FFFh
FA000h–FBFFFh
FC000h–FFFFFh
00000h–07FFFh
08000h–0FFFFh
10000h–17FFFh
18000h–1FFFFh
20000h–27FFFh
28000h–2FFFFh
30000h–37FFFh
38000h–3FFFFh
40000h–47FFFh
48000h–4FFFFh
50000h–57FFFh
58000h–5FFFFh
60000h–67FFFh
68000h–6FFFFh
70000h–77FFFh
78000h–7BFFFh
7C000h–7CFFFh
7D000h–7DFFFh
7E000h–7FFFFh
SA1
0
0
0
1
SA2
0
0
1
0
SA3
0
0
1
1
SA4
0
1
0
0
SA5
0
1
0
1
SA6
0
1
1
0
SA7
0
1
1
1
SA8
1
0
0
0
SA9
1
0
0
1
SA10
SA11
SA12
SA13
SA14
SA15
SA16
SA17
SA18
1
0
1
0
1
0
1
1
1
1
0
0
1
1
0
1
1
1
1
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
1
8/4
1
1
1
1
1
1
X
16/8
Am29SL800C
11
Table 3. Am29SL800CB Bottom Boot Block Sector Address Table
Address Range (in hexadecimal)
Sector Size
(Kbytes/
(x8)
(x16)
Sector
SA0
A18
0
A17
0
A16
0
A15
0
A14
0
A13
0
A12
X
0
Kwords)
Address Range
Address Range
16/8
8/4
00000h–03FFFh
04000h–05FFFh
06000h–07FFFh
08000h–0FFFFh
10000h–1FFFFh
20000h–2FFFFh
30000h–3FFFFh
40000h–4FFFFh
50000h–5FFFFh
60000h–6FFFFh
70000h–7FFFFh
80000h–8FFFFh
90000h–9FFFFh
A0000h–AFFFFh
B0000h–BFFFFh
C0000h–CFFFFh
D0000h–DFFFFh
E0000h–EFFFFh
F0000h–FFFFFh
00000h–01FFFh
02000h–02FFFh
03000h–03FFFh
04000h–07FFFh
08000h–0FFFFh
10000h–17FFFh
18000h–1FFFFh
20000h–27FFFh
28000h–2FFFFh
30000h–37FFFh
38000h–3FFFFh
40000h–47FFFh
48000h–4FFFFh
50000h–57FFFh
58000h–5FFFFh
60000h–67FFFh
68000h–6FFFFh
70000h–77FFFh
78000h–7FFFFh
SA1
0
0
0
0
0
1
SA2
0
0
0
0
0
1
1
8/4
SA3
0
0
0
0
1
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
32/16
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
64/32
SA4
0
0
0
1
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
SA5
0
0
1
0
SA6
0
0
1
1
SA7
0
1
0
0
SA8
0
1
0
1
SA9
0
1
1
0
SA10
SA11
SA12
SA13
SA14
SA15
SA16
SA17
SA18
0
1
1
1
1
0
0
0
1
0
0
1
1
0
1
0
1
0
1
1
1
1
0
0
1
1
0
1
1
1
1
0
1
1
1
1
Note for Tables 2 and 3: Address range is A18:A-1 in byte mode and A18:A0 in word mode. See “Word/Byte Configuration”
section for more information.
12
Am29SL800C
tion, when verifying sector protection, the sector
address must appear on the appropriate highest order
address bits (see Tables 2 and 3). Table 4 shows the
remaining address bits that are don’t care. When all
necessary bits have been set as required, the program-
ming equipment may then read the corresponding
identifier code on DQ7–DQ0.
Autoselect Mode
The autoselect mode provides manufacturer and
device identification, and sector protection verification,
through identifier codes output on DQ7–DQ0. This
mode is primarily intended for programming equipment
to automatically match a device to be programmed with
its corresponding programming algorithm. However,
the autoselect codes can also be accessed in-system
through the command register.
To access the autoselect codes in-system, the host
system can issue the autoselect command via the
command register, as shown in Table 5. This method
does not require VID. See “Command Definitions” for
details on using the autoselect mode.
When using programming equipment, the autoselect
mode requires VID on address pin A9. Address pins
A6, A1, and A0 must be as shown in Table 4. In addi-
Table 4. Am29SL800C Autoselect Codes (High Voltage Method)
A18 A11
to to
Mode CE# OE# WE# A12 A10 A9
A8
to
A7
A5
to
A2
DQ8
to
A0 DQ15
DQ7
to
DQ0
Description
A6
A1
Manufacturer ID: AMD
L
L
L
L
H
H
X
X
V
X
L
X
L
L
X
01h
ID
Device ID:
Am29SL800C
(Top Boot Block)
Word
Byte
Word
Byte
22h
EAh
X
X
V
X
L
L
X
L
L
H
ID
L
L
L
L
L
L
H
H
H
X
22h
X
EAh
6Bh
6Bh
Device ID:
Am29SL800C
(Bottom Boot Block)
X
X
X
V
V
X
X
X
X
H
L
ID
01h
(protected)
X
X
Sector Protection Verification
L
L
H
SA
L
H
ID
00h
(unprotected)
L = Logic Low = V , H = Logic High = V , SA = Sector Address, X = Don’t care.
IL
IH
an AMD representative to request the document con-
taining further details.
Sector Protection/Unprotection
The hardware sector protection feature disables both
program and erase operations in any sector. The hard-
ware sector unprotection feature re-enables both
program and erase operations in previously protected
sectors. Sector protection/unprotection can be imple-
mented via two methods.
The device is shipped with all sectors unprotected.
AMD offers the option of programming and protecting
sectors at its factory prior to shipping the device
through AMD’s ExpressFlash™ Service. Contact an
AMD representative for details.
The primary method requires VID on the RESET# pin
only, and can be implemented either in-system or via
programming equipment. Figure 1 shows the algo-
rithms and Figure 23 shows the timing diagram. This
method uses standard microprocessor bus cycle
timing. For sector unprotect, all unprotected sectors
must first be protected prior to the first sector unprotect
write cycle.
It is possible to determine whether a sector is protected
or unprotected. See “Autoselect Mode” for details.
Temporary Sector Unprotect
This feature allows temporary unprotection of previ-
ously protected sectors to change data in-system. The
Sector Unprotect mode is activated by setting the
RESET# pin to VID. During this mode, formerly pro-
tected sectors can be programmed or erased by
selecting the sector addresses. Once VID is removed
from the RESET# pin, all the previously protected
sectors are protected again. Figure 2 shows the algo-
rithm, and Figure 22 shows the timing diagrams, for this
feature.
The alternate method intended only for programming
equipment requires VID on address pin A9 and OE#.
This method is compatible with programmer routines
written for earlier 3.0 volt-only AMD flash devices. Pub-
lication number 21622 contains further details. Contact
Am29SL800C
13
START
START
Protect all sectors:
The indicated portion
of the sector protect
algorithm must be
performed for all
PLSCNT = 1
PLSCNT = 1
RESET# = VID
RESET# = VID
unprotected sectors
prior to issuing the
first sector
Wait 1 µs
Wait 1 µs
unprotect address
No
First Write
No
First Write
Cycle = 60h?
Temporary Sector
Unprotect Mode
Temporary Sector
Unprotect Mode
Cycle = 60h?
Yes
Yes
Set up sector
address
No
All sectors
protected?
Sector Protect:
Write 60h to sector
address with
A6 = 0, A1 = 1,
A0 = 0
Yes
Set up first sector
address
Sector Unprotect:
Wait 150 µs
Write 60h to sector
address with
A6 = 1, A1 = 1,
A0 = 0
Verify Sector
Protect: Write 40h
to sector address
with A6 = 0,
Reset
PLSCNT = 1
Increment
PLSCNT
Wait 15 ms
A1 = 1, A0 = 0
Verify Sector
Unprotect: Write
40h to sector
address with
A6 = 1, A1 = 1,
A0 = 0
Read from
sector address
with A6 = 0,
A1 = 1, A0 = 0
Increment
PLSCNT
No
No
PLSCNT
= 25?
Read from
sector address
with A6 = 1,
Data = 01h?
Yes
A1 = 1, A0 = 0
No
Yes
Set up
next sector
address
Yes
No
PLSCNT
= 1000?
Protect another
sector?
Data = 00h?
Yes
Device failed
No
Yes
Remove VID
from RESET#
No
Last sector
verified?
Device failed
Write reset
command
Yes
Remove VID
Sector Unprotect
Algorithm
from RESET#
Sector Protect
Algorithm
Sector Protect
complete
Write reset
command
Sector Unprotect
complete
Figure 1. In-System Sector Protect/Unprotect Algorithms
Am29SL800C
14
command definitions). In addition, the following hard-
ware data protection measures prevent accidental
erasure or programming, which might otherwise be
caused by spurious system level signals during VCC
power-up and power-down transitions, or from system
noise.
START
RESET# = V
(Note 1)
ID
Low V
Write Inhibit
CC
When VCC is less than VLKO, the device does not
accept any write cycles. This protects data during VCC
power-up and power-down. The command register and
all internal program/erase circuits are disabled, and the
device resets. Subsequent writes are ignored until VCC
is greater than VLKO. The system must provide the
proper signals to the control pins to prevent uninten-
Perform Erase or
Program Operations
RESET# = V
IH
tional writes when VCC is greater than VLKO
.
Temporary Sector
Unprotect Completed
(Note 2)
Write Pulse “Glitch” Protection
Noise pulses of less than 5 ns (typical) on OE#, CE# or
WE# do not initiate a write cycle.
Logical Inhibit
Notes:
Write cycles are inhibited by holding any one of OE# =
VIL, CE# = VIH or WE# = VIH. To initiate a write cycle,
CE# and WE# must be a logical zero while OE# is a
logical one.
1. All protected sectors unprotected.
2. All previously protected sectors are protected once
again.
Power-Up Write Inhibit
Figure 2. Temporary Sector Unprotect Operation
If WE# = CE# = VIL and OE# = VIH during power up, the
device does not accept commands on the rising edge
of WE#. The internal state machine is automatically
reset to reading array data on power-up.
Hardware Data Protection
The command sequence requirement of unlock cycles
for programming or erasing provides data protection
against inadvertent writes (refer to Table 5 for
COMMAND DEFINITIONS
Writing specific address and data commands or
sequences into the command register initiates device
operations. Table 5 defines the valid register command
sequences. Writing incorrect address and data
values or writing them in the improper sequence
resets the device to reading array data.
timings, except that if it reads at an address within
erase-suspended sectors, the device outputs status
data. After completing a programming operation in the
Erase Suspend mode, the system may once again
read array data with the same exception. See “Erase
Suspend/Erase Resume Commands” for more infor-
mation on this mode.
All addresses are latched on the falling edge of WE# or
CE#, whichever happens later. All data is latched on
the rising edge of WE# or CE#, whichever happens
first. Refer to the appropriate timing diagrams in the
“AC Characteristics” section.
The system must issue the reset command to re-
enable the device for reading array data if DQ5 goes
high, or while in the autoselect mode. See the “Reset
Command” section, next.
See also “Requirements for Reading Array Data” in the
“Device Bus Operations” section for more information.
The Read Operations table provides the read parame-
ters, and Figure 13 shows the timing diagram.
Reading Array Data
The device is automatically set to reading array data
after device power-up. No commands are required to
retrieve data. The device is also ready to read array
data after completing an Embedded Program or
Embedded Erase algorithm.
Reset Command
Writing the reset command to the device resets the
device to reading array data. Address bits are don’t
care for this command.
After the device accepts an Erase Suspend command,
the device enters the Erase Suspend mode. The
system can read array data using the standard read
Am29SL800C
15
The reset command may be written between the
sequence cycles in an erase command sequence
before erasing begins. This resets the device to reading
array data. Once erasure begins, however, the device
ignores reset commands until the operation is
complete.
system is not required to provide further controls or tim-
ings. The device automatically generates the program
pulses and verifies the programmed cell margin. Table
5 shows the address and data requirements for the
byte program command sequence.
When the Embedded Program algorithm is complete,
the device then returns to reading array data and
addresses are no longer latched. The system can
determine the status of the program operation by using
DQ7, DQ6, or RY/BY#. See “Write Operation Status”
for information on these status bits.
The reset command may be written between the
sequence cycles in a program command sequence
before programming begins. This resets the device to
reading array data (also applies to programming in
Erase Suspend mode). Once programming begins,
however, the device ignores reset commands until the
operation is complete.
Any commands written to the device during the
Embedded Program Algorithm are ignored. Note that a
hardware reset immediately terminates the program-
ming operation. The Byte Program command
sequence should be reinitiated once the device has
reset to reading array data, to ensure data integrity.
The reset command may be written between the
sequence cycles in an autoselect command sequence.
Once in the autoselect mode, the reset command must
be written to return to reading array data (also applies
to autoselect during Erase Suspend).
Programming is allowed in any sequence and across
sector boundaries. A bit cannot be programmed
from a “0” back to a “1”. Attempting to do so may halt
the operation and set DQ5 to “1”, or cause the Data#
Polling algorithm to indicate the operation was suc-
cessful. However, a succeeding read will show that the
data is still “0”. Only erase operations can convert a “0”
to a “1”.
If DQ5 goes high during a program or erase operation,
writing the reset command returns the device to
reading array data (also applies during Erase
Suspend).
Autoselect Command Sequence
The autoselect command sequence allows the host
system to access the manufacturer and devices codes,
and determine whether or not a sector is protected.
Table 5 shows the address and data requirements. This
method is an alternative to that shown in Table 4, which
is intended for PROM programmers and requires VID
on address bit A9.
Unlock Bypass Command Sequence
The unlock bypass feature allows the system to
program bytes or words to the device faster than using
the standard program command sequence. The unlock
bypass command sequence is initiated by first writing
two unlock cycles. This is followed by a third write cycle
containing the unlock bypass command, 20h. The
device then enters the unlock bypass mode. A two-
cycle unlock bypass program command sequence is all
that is required to program in this mode. The first cycle
in this sequence contains the unlock bypass program
command, A0h; the second cycle contains the program
address and data. Additional data is programmed in
the same manner. This mode dispenses with the initial
two unlock cycles required in the standard program
command sequence, resulting in faster total program-
ming time. Table 5 shows the requirements for the
command sequence.
The autoselect command sequence is initiated by
writing two unlock cycles, followed by the autoselect
command. The device then enters the autoselect
mode, and the system may read at any address any
number of times, without initiating another command
sequence. A read cycle at address XX00h retrieves the
manufacturer code. A read cycle at address 01h in
word mode (or 02h in byte mode) returns the device
code. A read cycle containing a sector address (SA)
and the address 02h in word mode (or 04h in byte
mode) returns 01h if that sector is protected, or 00h if it
is unprotected. Refer to Tables 2 and 3 for valid sector
addresses.
During the unlock bypass mode, only the Unlock
Bypass Program and Unlock Bypass Reset commands
are valid. To exit the unlock bypass mode, the system
must issue the two-cycle unlock bypass reset
command sequence. The first cycle must contain the
data 90h; the second cycle the data 00h. Addresses
are don’t cares. The device then returns to reading
array data.
The system must write the reset command to exit the
autoselect mode and return to reading array data.
Word/Byte Program Command Sequence
The system may program the device by word or byte,
depending on the state of the BYTE# pin. Program-
ming is a four-bus-cycle operation. The program
command sequence is initiated by writing two unlock
write cycles, followed by the program set-up command.
The program address and data are written next, which
in turn initiate the Embedded Program algorithm. The
Figure 3 illustrates the algorithm for the program oper-
ation. See the Erase/Program Operations table in “AC
Characteristics” for parameters, and to Figure 17 for
timing diagrams.
16
Am29SL800C
The system can determine the status of the erase oper-
ation by using DQ7, DQ6, DQ2, or RY/BY#. See “Write
Operation Status” for information on these status bits.
When the Embedded Erase algorithm is complete, the
device returns to reading array data and addresses are
no longer latched.
START
Write Program
Command Sequence
Figure 4 illustrates the algorithm for the erase opera-
tion. See the Erase/Program Operations tables in “AC
Characteristics” for parameters, and to Figure 18 for
timing diagrams.
Data Poll
from System
Sector Erase Command Sequence
Embedded
Program
algorithm
in progress
Sector erase is a six bus cycle operation. The sector
erase command sequence is initiated by writing two
unlock cycles, followed by a set-up command. Two
additional unlock write cycles are then followed by the
address of the sector to be erased, and the sector
erase command. Table 5 shows the address and data
requirements for the sector erase command sequence.
Verify Data?
Yes
No
The device does not require the system to preprogram
the memory prior to erase. The Embedded Erase algo-
rithm automatically programs and verifies the sector for
an all zero data pattern prior to electrical erase. The
system is not required to provide any controls or
timings during these operations.
No
Increment Address
Last Address?
Yes
Programming
Completed
After the command sequence is written, a sector erase
time-out of 50 µs begins. During the time-out period,
additional sector addresses and sector erase com-
mands may be written. Loading the sector erase buffer
may be done in any sequence, and the number of
sectors may be from one sector to all sectors. The time
between these additional cycles must be less than 50
µs, otherwise the last address and command might not
be accepted, and erasure may begin. It is recom-
mended that processor interrupts be disabled during
this time to ensure all commands are accepted. The
interrupts can be re-enabled after the last Sector Erase
command is written. If the time between additional
sector erase commands can be assumed to be less
than 50 µs, the system need not monitor DQ3. Any
command other than Sector Erase or Erase
Suspend during the time-out period resets the
device to reading array data. The system must
rewrite the command sequence and any additional
sector addresses and commands.
Note: See Table 5 for program command sequence.
Figure 3. Program Operation
Chip Erase Command Sequence
Chip erase is a six bus cycle operation. The chip erase
command sequence is initiated by writing two unlock
cycles, followed by a set-up command. Two additional
unlock write cycles are then followed by the chip erase
command, which in turn invokes the Embedded Erase
algorithm. The device does not require the system to
preprogram prior to erase. The Embedded Erase algo-
rithm automatically preprograms and verifies the entire
memory for an all zero data pattern prior to electrical
erase. The system is not required to provide any con-
trols or timings during these operations. Table 5 shows
the address and data requirements for the chip erase
command sequence.
The system can monitor DQ3 to determine if the sector
erase timer has timed out. (See the “DQ3: Sector Erase
Timer” section.) The time-out begins from the rising
edge of the final WE# pulse in the command sequence.
Once the sector erase operation has begun, only the
Erase Suspend command is valid. All other commands
are ignored. Note that a hardware reset during the
sector erase operation immediately terminates the
operation. The Sector Erase command sequence
should be reinitiated once the device has returned to
reading array data, to ensure data integrity.
Any commands written to the chip during the
Embedded Erase algorithm are ignored. Note that a
hardware reset during the chip erase operation imme-
diately terminates the operation. The Chip Erase
command sequence should be reinitiated once the
device has returned to reading array data, to ensure
data integrity.
Am29SL800C
17
When the Embedded Erase algorithm is complete, the
device returns to reading array data and addresses are
no longer latched. The system can determine the
status of the erase operation by using DQ7, DQ6, DQ2,
or RY/BY#. (Refer to “Write Operation Status” for infor-
mation on these status bits.)
ation. See “Write Operation Status” for more
information.
The system may also write the autoselect command
sequence when the device is in the Erase Suspend
mode. The device allows reading autoselect codes
even at addresses within erasing sectors, since the
codes are not stored in the memory array. When the
device exits the autoselect mode, the device reverts to
the Erase Suspend mode, and is ready for another
valid operation. See “Autoselect Command Sequence”
for more information.
Figure 4 illustrates the algorithm for the erase opera-
tion. Refer to the Erase/Program Operations tables in
the “AC Characteristics” section for parameters, and to
Figure 18 for timing diagrams.
Erase Suspend/Erase Resume Commands
The system must write the Erase Resume command
(address bits are “don’t care”) to exit the erase suspend
mode and continue the sector erase operation. Further
writes of the Resume command are ignored. Another
Erase Suspend command can be written after the
device has resumed erasing.
The Erase Suspend command allows the system to
interrupt a sector erase operation and then read data
from, or program data to, any sector not selected for
erasure. This command is valid only during the sector
erase operation, including the 50 µs time-out period
during the sector erase command sequence. The
Erase Suspend command is ignored if written during
the chip erase operation or Embedded Program algo-
rithm. Writing the Erase Suspend command during the
Sector Erase time-out immediately terminates the
time-out period and suspends the erase operation.
Addresses are “don’t-cares” when writing the Erase
Suspend command.
START
Write Erase
Command Sequence
When the Erase Suspend command is written during a
sector erase operation, the device requires a maximum
of 20 µs to suspend the erase operation. However,
when the Erase Suspend command is written during
the sector erase time-out, the device immediately ter-
minates the time-out period and suspends the erase
operation.
Data Poll
from System
Embedded
Erase
algorithm
in progress
After the erase operation has been suspended, the
system can read array data from or program data to
any sector not selected for erasure. (The device “erase
suspends” all sectors selected for erasure.) Normal
read and write timings and command definitions apply.
Reading at any address within erase-suspended
sectors produces status data on DQ7–DQ0. The
system can use DQ7, or DQ6 and DQ2 together, to
determine if a sector is actively erasing or is erase-sus-
pended. See “Write Operation Status” for information
on these status bits.
No
Data = FFh?
Yes
Erasure Completed
Notes:
1. See Table 5 for erase command sequence.
After an erase-suspended program operation is com-
plete, the system can once again read array data within
non-suspended sectors. The system can determine
the status of the program operation using the DQ7 or
DQ6 status bits, just as in the standard program oper-
2. See “DQ3: Sector Erase Timer” for more information.
Figure 4. Erase Operation
18
Am29SL800C
Command Definitions
Table 5. Am29SL800C Command Definitions
Bus Cycles (Notes 2-5)
Command
Sequence
(Note 1)
First
Second
Third
Addr
Fourth
Fifth
Sixth
Addr Data Addr Data
Data Addr Data Addr Data Addr Data
Read (Note 6)
Reset (Note 7)
1
1
RA
XXX
555
RD
F0
Word
2AA
555
2AA
555
2AA
555
555
AAA
555
Manufacturer ID
4
4
4
AA
AA
AA
55
55
55
90
90
90
X00
01
Byte
Word
Byte
Word
Byte
AAA
555
X01 22EA
X02
EA
X01 226B
Device ID,
Top Boot Block
AAA
555
AAA
555
Device ID,
Bottom Boot Block
AAA
AAA
X02
6B
XX00
XX01
00
(SA)
X02
Word
Byte
555
2AA
555
555
Sector Protect Verify
(Note 9)
4
AA
55
90
(SA)
X04
AAA
AAA
01
Word
Byte
Word
Byte
555
AAA
555
2AA
555
2AA
555
PA
555
AAA
555
Program
Unlock Bypass
4
3
AA
AA
55
55
A0
20
PA
PD
AAA
XXX
XXX
555
AAA
Unlock Bypass Program (Note 10)
Unlock Bypass Reset (Note 11)
2
2
A0
90
PD
00
XXX
2AA
555
2AA
555
Word
555
AAA
555
555
AAA
555
2AA
555
2AA
555
555
Chip Erase
Byte
6
6
AA
AA
55
55
80
80
AA
AA
55
55
10
30
AAA
555
AAA
Word
Sector Erase
Byte
SA
AAA
XXX
XXX
AAA
AAA
Erase Suspend (Note 12)
Erase Resume (Note 13)
1
1
B0
30
Legend:
X = Don’t care
PD = Data to be programmed at location PA. Data latches on the
rising edge of WE# or CE# pulse, whichever happens first.
RA = Address of the memory location to be read.
SA = Address of the sector to be verified (in autoselect mode) or
erased. Address bits A18–A12 uniquely select any sector.
RD = Data read from location RA during read operation.
PA = Address of the memory location to be programmed.
Addresses latch on the falling edge of the WE# or CE# pulse,
whichever happens later.
Notes:
1. See Table 1 for description of bus operations.
9. The data is 00h for an unprotected sector and 01h for a
protected sector. See “Autoselect Command Sequence” for
more information.
2. All values are in hexadecimal.
3. Except when reading array or autoselect data, all bus
cycles are write operations.
10. The Unlock Bypass command is required prior to the
Unlock Bypass Program command.
4. Data bits DQ15–DQ8 are don’t cares for unlock and
11. The Unlock Bypass Reset command is required to return
to reading array data when the device is in the unlock
bypass mode.
command cycles.
5. Address bits A18–A11 are don’t cares for unlock and
command cycles, unless SA or PA required.
12. The system may read and program in non-erasing
sectors, or enter the autoselect mode, when in the Erase
Suspend mode. The Erase Suspend command is valid
only during a sector erase operation.
6. No unlock or command cycles required when reading
array data, unless SA or PA required.
7. The Reset command is required to return to reading array
data when device is in the autoselect mode, or if DQ5
goes high (while the device is providing status data).
13. The Erase Resume command is valid only during the Erase
Suspend mode.
8. The fourth cycle of the autoselect command sequence is
a read cycle.
Am29SL800C
19
WRITE OPERATION STATUS
The device provides several bits to determine the
status of a write operation: DQ2, DQ3, DQ5, DQ6,
DQ7, and RY/BY#. Table 6 and the following subsec-
tions describe the functions of these bits. DQ7,
RY/BY#, and DQ6 each offer a method for determining
whether a program or erase operation is complete or in
progress. These three bits are discussed first.
Table 6 shows the outputs for Data# Polling on DQ7.
Figure 5 shows the Data# Polling algorithm.
START
DQ7: Data# Polling
Read DQ7–DQ0
Addr = VA
The Data# Polling bit, DQ7, indicates to the host
system whether an Embedded Algorithm is in progress
or completed, or whether the device is in Erase Sus-
pend. Data# Polling is valid after the rising edge of the
final WE# pulse in the program or erase command
sequence.
Yes
DQ7 = Data?
During the Embedded Program algorithm, the device
outputs on DQ7 the complement of the datum pro-
grammed to DQ7. This DQ7 status also applies to
programming during Erase Suspend. When the
Embedded Program algorithm is complete, the device
outputs the datum programmed to DQ7. The system
must provide the program address to read valid status
information on DQ7. If a program address falls within a
protected sector, Data# Polling on DQ7 is active for
approximately 1 µs, then the device returns to reading
array data.
No
No
DQ5 = 1?
Yes
Read DQ7–DQ0
Addr = VA
During the Embedded Erase algorithm, Data# Polling
produces a “0” on DQ7. When the Embedded Erase
algorithm is complete, or if the device enters the Erase
Suspend mode, Data# Polling produces a “1” on DQ7.
This is analogous to the complement/true datum output
described for the Embedded Program algorithm: the
erase function changes all the bits in a sector to “1”;
prior to this, the device outputs the “complement,” or
“0.” The system must provide an address within any of
the sectors selected for erasure to read valid status
information on DQ7.
Yes
DQ7 = Data?
No
PASS
FAIL
After an erase command sequence is written, if all
sectors selected for erasing are protected, Data#
Polling on DQ7 is active for approximately 100 µs, then
the device returns to reading array data. If not all
selected sectors are protected, the Embedded Erase
algorithm erases the unprotected sectors, and ignores
the selected sectors that are protected.
Notes:
1. VA = Valid address for programming. During a sector
erase operation, a valid address is an address within any
sector selected for erasure. During chip erase, a valid
address is any non-protected sector address.
2. DQ7 should be rechecked even if DQ5 = “1” because
DQ7 may change simultaneously with DQ5.
When the system detects DQ7 has changed from the
complement to true data, it can read valid data at DQ7–
DQ0 on the following read cycles. This is because DQ7
may change asynchronously with DQ0–DQ6 while
Output Enable (OE#) is asserted low. Figure 19, Data#
Polling Timings (During Embedded Algorithms), in the
“AC Characteristics” section illustrates this.
Figure 5. Data# Polling Algorithm
20
Am29SL800C
Table 6 shows the outputs for Toggle Bit I on DQ6.
Figure 6 shows the toggle bit algorithm. Figure 20 in the
“AC Characteristics” section shows the toggle bit timing
diagrams. Figure 21 shows the differences between
DQ2 and DQ6 in graphical form. See also the subsec-
tion on DQ2: Toggle Bit II.
RY/BY#: Ready/Busy#
The RY/BY# is a dedicated, open-drain output pin that
indicates whether an Embedded Algorithm is in
progress or complete. The RY/BY# status is valid after
the rising edge of the final WE# pulse in the command
sequence. Since RY/BY# is an open-drain output,
several RY/BY# pins can be tied together in parallel
DQ2: Toggle Bit II
with a pull-up resistor to VCC
.
The “Toggle Bit II” on DQ2, when used with DQ6, indi-
cates whether a particular sector is actively erasing
(that is, the Embedded Erase algorithm is in progress),
or whether that sector is erase-suspended. Toggle Bit
II is valid after the rising edge of the final WE# pulse in
the command sequence. The device toggles DQ2 with
each OE# or CE# read cycle.
If the output is low (Busy), the device is actively erasing
or programming. (This includes programming in the
Erase Suspend mode.) If the output is high (Ready),
the device is ready to read array data (including during
the Erase Suspend mode), or is in the standby mode.
Table 6 shows the outputs for RY/BY#. Figures 14, 17
and 18 shows RY/BY# for reset, program, and erase
operations, respectively.
DQ2 toggles when the system reads at addresses
within those sectors that have been selected for era-
sure. But DQ2 cannot distinguish whether the sector is
actively erasing or is erase-suspended. DQ6, by com-
parison, indicates whether the device is actively
erasing, or is in Erase Suspend, but cannot distinguish
which sectors are selected for erasure. Thus, both
status bits are required for sector and mode informa-
tion. Refer to Table 6 to compare outputs for DQ2 and
DQ6.
DQ6: Toggle Bit I
Toggle Bit I on DQ6 indicates whether an Embedded
Program or Erase algorithm is in progress or complete,
or whether the device has entered the Erase Suspend
mode. Toggle Bit I may be read at any address, and is
valid after the rising edge of the final WE# pulse in the
command sequence (prior to the program or erase
operation), and during the sector erase time-out.
Figure 6 shows the toggle bit algorithm in flowchart
form, and the section “DQ2: Toggle Bit II” explains the
algorithm. See also the DQ6: Toggle Bit I subsection.
Figure 20 shows the toggle bit timing diagram. Figure
21 shows the differences between DQ2 and DQ6 in
graphical form.
During an Embedded Program or Erase algorithm
operation, successive read cycles to any address
cause DQ6 to toggle (The system may use either OE#
or CE# to control the read cycles). When the operation
is complete, DQ6 stops toggling.
After an erase command sequence is written, if all
sectors selected for erasing are protected, DQ6 toggles
for approximately 100 µs, then returns to reading array
data. If not all selected sectors are protected, the
Embedded Erase algorithm erases the unprotected
sectors, and ignores the selected sectors that are
protected.
Reading Toggle Bits DQ6/DQ2
Refer to Figure 6 for the following discussion. When-
ever the system initially begins reading toggle bit
status, it must read DQ7–DQ0 at least twice in a row to
determine whether a toggle bit is toggling. Typically, the
system would note and store the value of the toggle bit
after the first read. After the second read, the system
would compare the new value of the toggle bit with the
first. If the toggle bit is not toggling, the device has com-
pleted the program or erase operation. The system can
read array data on DQ7–DQ0 on the following read
cycle.
The system can use DQ6 and DQ2 together to deter-
mine whether a sector is actively erasing or is erase-
suspended. When the device is actively erasing (that is,
the Embedded Erase algorithm is in progress), DQ6
toggles. When the device enters the Erase Suspend
mode, DQ6 stops toggling. However, the system must
also use DQ2 to determine which sectors are erasing
or erase-suspended. Alternatively, the system can use
DQ7 (see the subsection on DQ7: Data# Polling).
However, if after the initial two read cycles, the system
determines that the toggle bit is still toggling, the
system also should note whether the value of DQ5 is
high (see the section on DQ5). If it is, the system
should then determine again whether the toggle bit is
toggling, since the toggle bit may have stopped tog-
gling just as DQ5 went high. If the toggle bit is no longer
toggling, the device has successfully completed the
program or erase operation. If it is still toggling, the
device did not completed the operation successfully,
and the system must write the reset command to return
to reading array data.
If a program address falls within a protected sector,
DQ6 toggles for approximately 1 µs after the program
command sequence is written, then returns to reading
array data.
DQ6 also toggles during the erase-suspend-program
mode, and stops toggling once the Embedded
Program algorithm is complete.
Am29SL800C
21
The remaining scenario is that the system initially
determines that the toggle bit is toggling and DQ5 has
not gone high. The system may continue to monitor the
toggle bit and DQ5 through successive read cycles,
determining the status as described in the previous
paragraph. Alternatively, it may choose to perform
other system tasks. In this case, the system must start
at the beginning of the algorithm when it returns to
determine the status of the operation (top of Figure 6).
DQ5: Exceeded Timing Limits
DQ5 indicates whether the program or erase time has
exceeded a specified internal pulse count limit. Under
these conditions DQ5 produces a “1.” This is a failure
condition that indicates the program or erase cycle was
not successfully completed.
The DQ5 failure condition may appear if the system
tries to program a “1” to a location that is previously pro-
grammed to “0.” Only an erase operation can change
a “0” back to a “1.” Under this condition, the device
halts the operation, and when the operation has
exceeded the timing limits, DQ5 produces a “1.”
START
Under both these conditions, the system must issue the
reset command to return the device to reading array
data.
Read DQ7–DQ0
(Note 1)
DQ3: Sector Erase Timer
After writing a sector erase command sequence, the
system may read DQ3 to determine whether or not an
erase operation has begun. (The sector erase timer
does not apply to the chip erase command.) If addi-
tional sectors are selected for erasure, the entire time-
out also applies after each additional sector erase com-
mand. When the time-out is complete, DQ3 switches
from “0” to “1.” If the time between additional sector
erase commands from the system can be assumed to
be less than 50 µs, the system need not monitor DQ3.
See also the “Sector Erase Command Sequence”
section.
Read DQ7–DQ0
No
Toggle Bit
= Toggle?
Yes
No
DQ5 = 1?
Yes
After the sector erase command sequence is written,
the system should read the status on DQ7 (Data#
Polling) or DQ6 (Toggle Bit I) to ensure the device has
accepted the command sequence, and then read DQ3.
If DQ3 is “1”, the internally controlled erase cycle has
begun; all further commands (other than Erase Sus-
pend) are ignored until the erase operation is complete.
If DQ3 is “0”, the device will accept additional sector
erase commands. To ensure the command has been
accepted, the system software should check the status
of DQ3 prior to and following each subsequent sector
erase command. If DQ3 is high on the second status
check, the last command might not have been
accepted. Table 6 shows the outputs for DQ3.
(Notes
1, 2)
Read DQ7–DQ0
Twice
Toggle Bit
= Toggle?
No
Yes
Program/Erase
Operation Not
Complete, Write
Reset Command
Program/Erase
Operation Complete
Notes:
1. Read toggle bit twice to determine whether or not it is
toggling. See text.
2. Recheck toggle bit because it may stop toggling as DQ5
changes to “1” . See text.
Figure 6. Toggle Bit Algorithm
22
Am29SL800C
Table 6. Write Operation Status
DQ7
DQ5
DQ2
Operation
(Note 2)
DQ6
(Note 1)
DQ3
N/A
1
(Note 2)
RY/BY#
Embedded Program Algorithm
Embedded Erase Algorithm
DQ7#
0
Toggle
Toggle
0
0
No toggle
Toggle
0
0
Standard
Mode
Reading within Erase
Suspended Sector
1
No toggle
0
N/A
Toggle
1
Erase
Suspend Reading within Non-Erase
Data
Data
Data
0
Data
N/A
Data
N/A
1
0
Mode
Suspended Sector
Erase-Suspend-Program
DQ7#
Toggle
Notes:
1. DQ5 switches to ‘1’ when an Embedded Program or Embedded Erase operation has exceeded the maximum timing limits.
See “DQ5: Exceeded Timing Limits”for more information.
2. DQ7 and DQ2 require a valid address when reading status information. Refer to the appropriate subsection for further details.
Am29SL800C
23
ABSOLUTE MAXIMUM RATINGS
Storage Temperature
Plastic Packages . . . . . . . . . . . . . . . –65°C to +150°C
20 ns
20 ns
Ambient Temperature
with Power Applied. . . . . . . . . . . . . . –65°C to +125°C
0.0 V
Voltage with Respect to Ground
–0.5 V
–2.0 V
VCC (Note 1) . . . . . . . . . . . . . . . .–0.5 V to +2.5 V
A9, OE#,
and RESET# (Note 2) . . . . . . . .–0.5 V to +11.0 V
20 ns
All other pins (Note 1) . . . . . –0.5 V to VCC+0.5 V
Output Short Circuit Current (Note 3) . . . . . . 100 mA
Figure 7. Maximum Negative
Overshoot Waveform
Notes:
1. Minimum DC voltage on input or I/O pins is –0.5 V. During
voltage transitions, input or I/O pins may overshoot V to
SS
–2.0 V for periods of up to 20 ns. See Figure 7. Maximum
DC voltage on input or I/O pins is V +0.5 V. During
CC
voltage transitions, input or I/O pins may overshoot to V
+2.0 V for periods up to 20 ns. See Figure 8.
CC
20 ns
V
CC
2. Minimum DC input voltage on pins A9, OE#, and RESET#
is –0.5 V. During voltage transitions, A9, OE#, and
+2.0 V
V
+0.5 V
CC
RESET# may overshoot V to –2.0 V for periods of up to
SS
20 ns. See . Maximum DC input voltage on pin A9 is +11.0
V which may overshoot to 12.5 V for periods up to 20 ns.
2.0 V
3. No more than one output may be shorted to ground at a
time. Duration of the short circuit should not be greater
than one second.
20 ns
20 ns
Figure 8. Maximum Positive
Overshoot Waveform
Stresses above those listed under “Absolute Maximum
Ratings” may cause permanent damage to the device. This is
a stress rating only; functional operation of the device at
these or any other conditions above those indicated in the
operational sections of this data sheet is not implied.
Exposure of the device to absolute maximum rating
conditions for extended periods may affect device reliability.
OPERATING RANGES
Commercial (C) Devices
Ambient Temperature (TA) . . . . . . . . . . . 0°C to +70°C
Industrial (I) Devices
Ambient Temperature (TA) . . . . . . . . . –40°C to +85°C
VCC Supply Voltages
VCC, all speed options . . . . . . . . . . . .+1.8 V to +2.2 V
Operating ranges define those limits between which the func-
tionality of the device is guaranteed.
24
Am29SL800C
DC CHARACTERISTICS
CMOS Compatible
Parameter
Description
Test Conditions
= V to V
Min
Typ
Max
±1.0
35
Unit
µA
V
V
,
CC
IN
SS
I
Input Load Current
LI
= V
CC
CC max
I
A9 Input Load Current
Output Leakage Current
V
= V
; A9 = 11.0 V
µA
LIT
CC
CC max
V
V
= V to V
,
CC
OUT
SS
I
±1.0
µA
LO
= V
CC
CC max
5 MHz
1 MHz
5 MHz
1 MHz
5
1
5
1
10
3
CE# = V OE#
Byte Mode
V
IL,
=
=
IH,
IH,
V
Active Read Current
CC
I
I
mA
mA
CC1
(Notes 1, 2)
10
3
CE# = V OE#
V
IL,
Word Mode
V
Active Write Current
CC
CE# = V OE#
V
20
25
CC2
IL,
=
IH
(Notes 2, 3, 5)
I
I
V
V
Standby Current (Note 2)
Reset Current (Note 2)
CE#, RESET# = V ± 0.2 V
1
1
5
5
µA
µA
CC3
CC
CC
CC
RESET# = V ± 0.2 V
CC4
SS
Automatic Sleep Mode
(Notes 2, 3)
V
V
= V ± 0.2 V;
CC
IH
IL
I
1
5
µA
CC5
= V ± 0.2 V
SS
V
Input Low Voltage
Input High Voltage
–0.5
0.2 x V
V
V
IL
CC
V
V
0.8 x V
V
+ 0.3
IH
CC
CC
Voltage for Autoselect and
Temporary Sector Unprotect
V
= 2.0 V
9.0
11.0
V
ID
CC
V
V
I
I
I
I
= 2.0 mA, V = V
0.25
0.1
V
V
V
V
OL1
OL2
OH1
OH2
OL
OL
OH
OH
CC
CC min
CC min
Output Low Voltage
Output High Voltage
= 100 µA, V = V
CC
V
V
= –2.0 mA, V = V
0.7 x V
CC
CC
CC min
CC min
= –100 µA, V = V
V
–0.1
CC
CC
Low V Lock-Out Voltage
(Note 4)
CC
V
1.2
1.5
V
LKO
Notes:
1. The I current listed is typically less than 1 mA/MHz, with OE# at V . Typical V is 2.0 V.
CC
IH
CC
2. The maximum I specifications are tested with V = V max.
CC
CC
CC
3. I active while Embedded Erase or Embedded Program is in progress.
CC
4. Automatic sleep mode enables the low power mode when addresses remain stable for t
5. Not 100% tested.
+ 50 ns.
ACC
Am29SL800C
25
DC CHARACTERISTICS (Continued)
Zero Power Flash
20
15
10
5
0
0
500
1000
1500
2000
2500
3000
3500
4000
Time in ns
Note: Addresses are switching at 1 MHz
Figure 9. ICC1 Current vs. Time (Showing Active and Automatic Sleep Currents)
10
8
6
2.2 V
4
1.8 V
2
0
1
2
3
4
5
Frequency in MHz
Note: T = 25 °C
Figure 10. Typical ICC1 vs. Frequency
26
Am29SL800C
TEST CONDITIONS
Table 7. Test Specifications
-120,
Test Condition
-100
-150
Unit
Output Load
1 TTL gate
Device
Under
Test
Output Load Capacitance, C
(including jig capacitance)
L
30
100
pF
C
L
Input Rise and Fall Times
Input Pulse Levels
5
0.0–2.0
ns
V
Input timing measurement
reference levels
1.0
1.0
V
V
Output timing measurement
reference levels
Figure 11. Test Setup
Key to Switching Waveforms
WAVEFORM
INPUTS
OUTPUTS
Steady
Changing from H to L
Changing from L to H
Don’t Care, Any Change Permitted
Does Not Apply
Changing, State Unknown
Center Line is High Impedance State (High Z)
2.0 V
0.0 V
1.0 V
1.0 V
Input
Measurement Level
Output
Figure 12. Input Waveforms and Measurement Levels
Am29SL800C
27
AC CHARACTERISTICS
Read Operations
Parameter
Speed Options
JEDEC
Std
Description
Test Setup
-100
-120
-150
Unit
t
t
Read Cycle Time (Note 1)
Min
100
100
120
150
150
ns
AVAV
RC
CE# = V
OE# = V
IL
IL
t
t
Address to Output Delay
Max
120
ns
AVQV
ACC
t
t
Chip Enable to Output Delay
OE# = V
Max
Max
Max
Max
Min
100
35
120
50
16
16
0
150
65
ns
ns
ns
ns
ns
ELQV
GLQV
EHQZ
GHQZ
CE
IL
t
t
t
Output Enable to Output Delay
OE
t
t
Chip Enable to Output High Z (Note 1)
Output Enable to Output High Z (Note 1)
DF
DF
t
Read
Output Enable
t
OEH
Toggle and
Data# Polling
Hold Time (Note 1)
Min
Min
30
0
ns
ns
Output Hold Time From Addresses, CE# or
OE#, Whichever Occurs First (Note 1)
t
t
OH
AXQX
Notes:
1. Not 100% tested.
2. See Figure 11 and Table 7 for test specifications.
tRC
Addresses Stable
tACC
Addresses
CE#
tDF
tOE
OE#
tOEH
WE#
tCE
tOH
HIGH Z
HIGH Z
Output Valid
Outputs
RESET#
RY/BY#
0 V
Figure 13. Read Operations Timings
28
Am29SL800C
AC CHARACTERISTICS
Hardware Reset (RESET#)
Parameter
JEDEC
Std
Description
Test Setup
Max
All Speed Options
Unit
RESET# Pin Low (During Embedded
Algorithms) to Read or Write (see Note)
t
20
µs
READY
RESET# Pin Low (NOT During Embedded
Algorithms) to Read or Write (see Note)
t
Max
500
ns
READY
t
t
RESET# Pulse Width
Min
Min
Min
Min
500
200
20
ns
ns
µs
ns
RP
RESET# High Time Before Read (see Note)
RESET# Low to Standby Mode
RY/BY# Recovery Time
RH
t
RPD
t
0
RB
Note: Not 100% tested.
RY/BY#
CE#, OE#
RESET#
tRH
tRP
tReady
Reset Timings NOT during Embedded Algorithms
Reset Timings during Embedded Algorithms
tReady
RY/BY#
tRB
CE#, OE#
RESET#
tRP
Figure 14. RESET# Timings
Am29SL800C
29
AC CHARACTERISTICS
Word/Byte Configuration (BYTE#)
Parameter
Speed Options
JEDEC
Std
Description
CE# to BYTE# Switching Low or High
BYTE# Switching Low to Output HIGH Z
BYTE# Switching High to Output Active
-100
-120
10
-150
Unit
ns
t
t
t
t
Max
Max
Min
ELFL/ ELFH
50
60
60
ns
FLQZ
FHQV
100
120
150
ns
CE#
OE#
BYTE#
t
ELFL
Data Output
(DQ0–DQ14)
Data Output
(DQ0–DQ7)
BYTE#
DQ0–DQ14
DQ15/A-1
Switching
from word
to byte
Address
Input
DQ15
Output
mode
t
FLQZ
t
ELFH
BYTE#
BYTE#
Switching
from byte
to word
Data Output
(DQ0–DQ7)
Data Output
(DQ0–DQ14)
DQ0–DQ14
DQ15/A-1
mode
Address
Input
DQ15
Output
t
FHQV
Figure 15. BYTE# Timings for Read Operations
CE#
The falling edge of the last WE# signal
WE#
BYTE#
t
SET
(t
)
AS
t
(t
)
HOLD AH
Note: Refer to the Erase/Program Operations table for t and t specifications.
AS
AH
Figure 16. BYTE# Timings for Write Operations
Am29SL800C
30
AC CHARACTERISTICS
Erase/Program Operations
Parameter
Speed Options
JEDEC
Std
Description
Write Cycle Time (Note 1)
-100
-120
120
0
-150
Unit
ns
t
t
Min
Min
Min
Min
Min
Min
100
150
AVAV
WC
t
t
Address Setup Time
Address Hold Time
Data Setup Time
ns
AVWL
WLAX
AS
AH
DS
DH
t
t
50
50
60
60
0
70
70
ns
t
t
t
ns
DVWH
WHDX
t
Data Hold Time
ns
t
Output Enable Setup Time
0
ns
OES
Read Recovery Time Before Write
(OE# High to WE# Low)
t
t
Min
0
ns
GHWL
GHWL
t
t
t
CE# Setup Time
Min
Min
Min
Min
Typ
Typ
Typ
Min
Min
Min
0
0
ns
ns
ns
ns
ELWL
WHEH
WLWH
WHWL
CS
CH
WP
t
t
CE# Hold Time
t
Write Pulse Width
Write Pulse Width High
50
60
30
10
12
2
70
t
t
WPH
Byte
t
t
Programming Operation (Notes 1, 2)
µs
WHWH1
WHWH2
WHWH1
Word
t
t
Sector Erase Operation (Notes 1, 2)
sec
µs
WHWH2
t
V
Setup Time
50
0
VCS
CC
t
Recovery Time from RY/BY#
ns
RB
t
Program/Erase Valid to RY/BY# Delay
200
ns
BUSY
Notes:
1. Not 100% tested.
2. See the “Erase and Programming Performance” section for more information.
Am29SL800C
31
AC CHARACTERISTICS
Program Command Sequence (last two cycles)
Read Status Data (last two cycles)
tAS
PA
tWC
Addresses
555h
PA
PA
tAH
CE#
OE#
tCH
tWHWH1
tWP
WE#
Data
tWPH
tCS
tDS
tDH
PD
DOUT
A0h
Status
tBUSY
tRB
RY/BY#
VCC
tVCS
Notes:
1. PA = program address, PD = program data, D
is the true data at the program address.
OUT
2. Illustration shows device in word mode.
Figure 17. Program Operation Timings
32
Am29SL800C
AC CHARACTERISTICS
Erase Command Sequence (last two cycles)
Read Status Data
VA
tAS
SA
tWC
VA
Addresses
CE#
2AAh
555h for chip erase
tAH
tCH
OE#
tWP
WE#
tWPH
tWHWH2
tCS
tDS
tDH
In
Data
Complete
55h
30h
Progress
10 for Chip Erase
tBUSY
tRB
RY/BY#
VCC
tVCS
Notes:
1. SA = sector address (for Sector Erase), VA = Valid Address for reading status data (see “Write Operation Status”).
2. Illustration shows device in word mode.
Figure 18. Chip/Sector Erase Operation Timings
Am29SL800C
33
AC CHARACTERISTICS
tRC
VA
Addresses
VA
VA
tACC
tCE
CE#
tCH
tOE
OE#
WE#
tOEH
tDF
tOH
High Z
High Z
DQ7
Valid Data
Complement
Complement
True
DQ0–DQ6
Valid Data
Status Data
True
Status Data
tBUSY
RY/BY#
Note: VA = Valid address. Illustration shows first status cycle after command sequence, last status read cycle, and array data read cycle.
Figure 19. Data# Polling Timings (During Embedded Algorithms)
tRC
Addresses
CE#
VA
tACC
tCE
VA
VA
VA
tCH
tOE
OE#
WE#
tOEH
tDF
tOH
High Z
DQ6/DQ2
RY/BY#
Valid Status
(first read)
Valid Status
Valid Status
Valid Data
(second read)
(stops toggling)
tBUSY
Note: VA = Valid address; not required for DQ6. Illustration shows first two status cycle after command sequence, last status read
cycle, and array data read cycle.
Figure 20. Toggle Bit Timings (During Embedded Algorithms)
34
Am29SL800C
AC CHARACTERISTICS
Enter
Embedded
Erasing
Erase
Suspend
Enter Erase
Suspend Program
Erase
Resume
Erase
Erase Suspend
Read
Erase
Suspend
Program
Erase
Complete
WE#
Erase
Erase Suspend
Read
DQ6
DQ2
Note: The system may use CE# or OE# to toggle DQ2 and DQ6. DQ2 toggles only when read at an address within an
erase-suspended sector.
Figure 21. DQ2 vs. DQ6
Temporary Sector Unprotect
Parameter
JEDEC
Std
Description
Rise and Fall Time
ID
All Speed Options
Unit
t
V
Min
Min
500
ns
VIDR
RESET# Setup Time for Temporary Sector
Unprotect
t
4
µs
RSP
10 V
RESET#
0 or 1.8 V
0 or 1.8 V
tVIDR
tVIDR
Program or Erase Command Sequence
CE#
WE#
tRSP
RY/BY#
Figure 22. Temporary Sector Unprotect Timing Diagram
Am29SL800C
35
AC CHARACTERISTICS
VID
VIH
RESET#
SA, A6,
A1, A0
Valid*
Sector Protect/Unprotect
60h 60h
Valid*
Valid*
Status
Verify
40h
Data
Sector Protect: 150 µs
Sector Unprotect: 15 ms
1 µs
CE#
WE#
OE#
* For sector protect, A6 = 0, A1 = 1, A0 = 0. For sector unprotect, A6 = 1, A1 = 1, A0 = 0.
Figure 23. Sector Protect/Unprotect Timing Diagram
36
Am29SL800C
AC CHARACTERISTICS
Alternate CE# Controlled Erase/Program Operations
Parameter
Speed Options
JEDEC
Std
Description
-100
-120
120
0
-150
Unit
ns
t
t
t
Write Cycle Time (Note 1)
Address Setup Time
Address Hold Time
Data Setup Time
Min
Min
Min
Min
Min
Min
100
150
AVAV
AVEL
ELAX
WC
t
ns
AS
AH
DS
DH
t
t
50
50
60
60
0
70
70
ns
t
t
t
ns
DVEH
EHDX
t
Data Hold Time
ns
t
Output Enable Setup Time
0
ns
OES
Read Recovery Time Before Write
(OE# High to WE# Low)
t
t
t
Min
0
ns
GHEL
WLEL
GHEL
t
t
WE# Setup Time
WE# Hold Time
Min
Min
Min
Min
Typ
Typ
Typ
0
0
ns
ns
ns
ns
WS
t
EHWH
WH
t
t
CE# Pulse Width
CE# Pulse Width High
50
60
30
10
12
2
70
ELEH
EHEL
CP
t
t
CPH
Byte
Programming Operation
(Notes 1, 2)
t
t
µs
WHWH1
WHWH1
Word
t
t
Sector Erase Operation (Notes 1, 2)
sec
WHWH2
WHWH2
Notes:
1. Not 100% tested.
2. See the “Erase and Programming Performance” section for more information.
Am29SL800C
37
AC CHARACTERISTICS
555 for program
PA for program
2AA for erase
SA for sector erase
555 for chip erase
Data# Polling
Addresses
PA
tWC
tWH
tAS
tAH
WE#
OE#
tGHEL
tWHWH1 or 2
tCP
CE#
Data
tWS
tCPH
tDS
tBUSY
tDH
DQ7#
DOUT
tRH
A0 for program
55 for erase
PD for program
30 for sector erase
10 for chip erase
RESET#
RY/BY#
Notes:
1. PA = program address, PD = program data, DQ7# = complement of the data written, D
2. Figure indicates the last two bus cycles of command sequence.
3. Word mode address used as an example.
= data written
OUT
Figure 24. Alternate CE# Controlled Write Operation Timings
38
Am29SL800C
ERASE AND PROGRAMMING PERFORMANCE
Parameter
Typ (Note 1)
Max (Note 2)
Unit
s
Comments
Sector Erase Time
Chip Erase Time
2
15
Excludes 00h programming
prior to erasure (Note 4)
38
10
12
10
7
s
Byte Programming Time
Word Programming Time
300
360
80
µs
µs
s
Excludes system level
overhead (Note 5)
Byte Mode
Word Mode
Chip Programming Time
(Note 3)
60
s
Notes:
1. Typical program and erase times assume the following conditions: 25°C, 2.0 V V , 1,000,000 cycles. Additionally,
CC
programming typicals assume checkerboard pattern.
2. Under worst case conditions of 90°C, V = 1.8 V, 1,000,000 cycles.
CC
3. The typical chip programming time is considerably less than the maximum chip programming time listed, since most bytes
program faster than the maximum program times listed.
4. In the pre-programming step of the Embedded Erase algorithm, all bytes are programmed to 00h before erasure.
5. System-level overhead is the time required to execute the two- or four-bus-cycle sequence for the program command. See
Table 5 for further information on command definitions.
6. The device has a minimum guaranteed erase and program cycle endurance of 1,000,000 cycles.
LATCHUP CHARACTERISTICS
Description
Min
Max
Input voltage with respect to V on all pins except I/O pins
(including A9, OE#, and RESET#)
SS
–1.0 V
11.0 V
Input voltage with respect to V on all I/O pins
–0.5 V
V
+ 0.5 V
CC
SS
V
Current
–100 mA
+100 mA
CC
Includes all pins except V . Test conditions: V = 1.8 V, one pin at a time.
CC
CC
TSOP PIN CAPACITANCE
Parameter
Symbol
Parameter Description
Input Capacitance
Test Setup
Typ
6
Max
7.5
12
Unit
pF
C
V
= 0
IN
IN
C
Output Capacitance
Control Pin Capacitance
V
= 0
8.5
7.5
pF
OUT
OUT
C
V
= 0
IN
9
pF
IN2
Notes:
1. Sampled, not 100% tested.
2. Test conditions T = 25°C, f = 1.0 MHz.
A
DATA RETENTION
Parameter
Test Conditions
150°C
Min
10
Unit
Years
Years
Minimum Pattern Data Retention Time
125°C
20
Am29SL800C
39
PHYSICAL DIMENSIONS*
TS 048—48-Pin Standard TSOP
Dwg rev AA; 10/99
* For reference only. BSC is an ANSI standard for Basic Space Centering
40
Am29SL800C
PHYSICAL DIMENSIONS
TSR048—48-Pin Reverse TSOP
Dwg rev AA; 10/99
* For reference only. BSC is an ANSI standard for Basic Space Centering.
Am29SL800C
41
PHYSICAL DIMENSIONS
FBB048—48-Ball Fine-Pitch Ball Grid Array (FBGA)
6 x 9 mm package
Dwg rev AF; 10/99
42
Am29SL800C
REVISION SUMMARY
Revision A (August 1998)
Revision D (February 21, 2000)
Initial release.
Removed “preliminary” designation from data sheet.
Data sheet parameters are now stable; only speed,
package, and temperature range combinations are
expected to change in future revisions.
Revision B (January 1999)
Distinctive Characteristics
Added dash to part numbers.
Corrected power consumption specifications to match
those in DC Characteristics table.
Device Bus Operations table
Connection Diagrams
Changed standby voltage specification to VCC ± 0.2 V.
FBGA diagram now shows top view.
Standby Mode, RESET#: Hardware Reset Pin
Ordering Information
Changed standby voltage specification to VCC ± 0.2 V.
Added FBGA markings to valid combinations table.
DC Characteristics table
Changed test conditions for ICC3, ICC4, ICC5 to VCC
0.2 V.
±
Revision B+1 (March 5, 1999)
Physical Dimensions
Revision D+1 (May 8, 2000)
Ordering Information
FBB048: Corrected ball grid layout in drawing.
Revision C (December 6, 1999)
Optional processing: Deleted the burn-in option
AC Characteristics—Figure 17. Program
Operations Timing and Figure 18. Chip/Sector
Erase Operations
AC Characteristics—Read Operations
Changed tDF to 16 ns for all speeds.
Deleted tGHWL and changed OE# waveform to start at
high.
Revision D+2 (November 14, 2000)
Added table of contents. Deleted burn-in option from
Ordering Information section.
Physical Dimensions
Replaced figures with more detailed illustrations.
Trademarks
Copyright © 2000 Advanced Micro Devices, Inc. All rights reserved.
AMD, the AMD logo, and combinations thereof are registered trademarks of Advanced Micro Devices, Inc.
ExpressFlash is a trademark of Advanced Micro Devices, Inc.
Product names used in this publication are for identification purposes only and may be trademarks of their respective companies.
Am29SL800C
43
相关型号:
AM29SL800CB-120WBD
512KX16 FLASH 1.8V PROM, 120ns, PBGA48, 6 X 9 MM, 0.80 MM PITCH, FBGA-48
SPANSION
AM29SL800CB-120WBF
512KX16 FLASH 1.8V PROM, 120ns, PBGA48, 6 X 9 MM, 0.80 MM PITCH, FBGA-48
SPANSION
©2020 ICPDF网 联系我们和版权申明