AP-MSD32GCH4P-1TM [ETC]
Industrial Micro SD 3.0;
| 型号： | AP-MSD32GCH4P-1TM |
| 厂家： | 
ETC |
| 描述： | Industrial Micro SD 3.0 |
| 文件： | 总21页 (文件大小：514K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
RoHS Recast Compliant
Industrial Micro SD 3.0
Specifications
March 5th, 2013
Version 1.1
Apacer Technology Inc.
4th Fl., 75 Hsin Tai Wu Rd., Sec.1, Xizhi, New Taipei City, Taiwan 221
Tel: +886-2-2698-2888
www.apacer.com
Fax: +886-2-2689-2889
Industrial Micro SD 3.0
AP-MSDxxxCX4P-1TM
FEATURES:
ꢀ
ꢀ
Operating frequency: up to 100 MHz
ꢀ
Fully compatible with SD Card Association
specifications
Intelligent endurance design
Built-in advanced ECC algorithm
Wear-leveling
-
-
Part 1, Physical Layer Specification, Version
3.1 Final
-
-
-
-
Part 3, Security Specification, Version 3.0
Final
Flash bad-block management
Built in write protect
ꢀ
ꢀ
Capacity range
ꢀ
Temperature ranges
-
4, 8, 16, 32 GB
-
-
Operating temperature: -25 ~ +85°C
Storage temperature: -40°C ~ +85°C
Performance*
-
-
Sustained Read: Up to 19 MB/sec
Sustained Write: Up to 12 MB/sec
ꢀ
ꢀ
Operating voltage: 2.7V ~ 3.6V
Power consumption*
Operating: 47 mA
Standby: 150 uA
ꢀ
ꢀ
ꢀ
ꢀ
SD-protocol compatible
Supports SD SPI mode
Backward compatible with 2.0
NAND Flash Type: MLC
-
-
ꢀ
ꢀ
Physical dimension : 15mm(L) x
11mm(W) x 1mm(H)
RoHS Recast Compliant (2011/65/EU)
*Vary from capacities. Performance values presented here are typical and may vary depending on settings and platforms.
1
© 2013 Apacer Technology, Inc.
Rev. 1.1
Industrial Micro SD 3.0
AP-MSDxxxCX4P-1TM
TABLE OF CONTENTS
1. General Description ....................................................................................................... 3
1.1 PRODUCT FUNCTION BLOCK ..................................................................................................................3
1.2 FUNCTIONAL DESCRIPTION .....................................................................................................................3
1.2.1 Flash Management .......................................................................................................................4
1.2.2 Powerful ECC Algorithms .............................................................................................................4
1.2.3 Power Management......................................................................................................................4
2. Electrical characteristics............................................................................................. 5
2.1 CARD
2.2 PIN SSIGNMENT...................................................................................................................................5
2.3 CAPACITY PECIFICATION......................................................................................................................6
ARCHITECTURE............................................................................................................................5
A
S
2.4 PERFORMANCE......................................................................................................................................6
2.5 ELECTRICAL ..........................................................................................................................................6
3. Physical Characteristics............................................................................................... 7
3.1 PHYSICAL
3.2 ENVIRONMENTAL
D
IMENSION ............................................................................................................................7
PECIFICATIONS..........................................................................................................9
S
4. AC Characteristics ........................................................................................................11
4.1MICRO SD INTERFACE
4.2 MICRO SD INTERFACE
T
T
IMING (DEFAULT) .............................................................................................11
ODE)..............................................................................12
IMING (HIGH SPEED M
4.3 SD INTERFACE TIMING (SDR12, SDR25 AND SDR50 MODES) INPUT ...................................................13
4.3.1 SDR50 Input Timing ...................................................................................................................13
4.3.2 Output .........................................................................................................................................14
4.3.3 SD Interface Timing (DDR50 Mode)...........................................................................................14
4.3.4 Bus Timings – Parameters Values (DDR50 Mode)....................................................................15
5. Product Ordering Information...................................................................................16
5.1 PRODUCT
5.2 VALID
CODE DESIGNATIONS ...........................................................................................................16
OMBINATIONS .........................................................................................................................17
C
2
© 2013 Apacer Technology, Inc.
Rev. 1.1
Industrial Micro SD 3.0
AP-MSDxxxCX4P-1TM
1. General Description
As the demand of reliable and high-performance data storage in a small form factor increases, Apacer’s
Micro SD card 3.0 is designed specifically for multiple applications by offering high endurance, reliability,
and agility, where extreme flexibility, endurance, data integrity, and exceptionally transmission are
required.
The Micro SD 3.0 card fully complies with SD Card Association standard. The Command List is
compatible with [Part 1 Physical Layer Specification Ver3.1 Final] definitions, while the Card Capacity of
Non-secure Area, Secure Area supports [Part 3 Security Specification Ver3.0 Final] Specifications. The
card allows selection of either SD or SPI mode for compatibility in data communication. To provide higher
transfer rate, the card can extend to 100MHz clock frequency.
The card also comes with endurance features for data error detection and correction, write protection, and
password protection.
1.1 Product Function Block
The Micro SD contains a card controller and a memory core for the SD standard interface.
1.2 Functional description
The Micro SD device contains a high level, intelligent flash management that provides many capabilities
including:
ꢁ
ꢁ
ꢁ
ꢁ
High performance flash memory control
ECC algorithms
Wear leveling
Power management
3
© 2013 Apacer Technology, Inc.
Rev. 1.1
Industrial Micro SD 3.0
AP-MSDxxxCX4P-1TM
1.2.1 Flash Management
The SD controller contains logic/physical flash block mapping and bad block management system. It will
manage all flash block including user data space and spare block.
The Micro SD also contains a sophisticated defect and error management system. It does a read after
write under margin conditions to verify that the data is written correctly (except in the case of write pre-
erased sectors). In case that a bit is found to be defective, the SD will replace this bad bit with a spare bit
within the sector header. If necessary, the Micro SD will even replace the entire sector with a spare sector.
This is completely transparent to the master (host device) and does not consume any user data space.
1.2.2 Powerful ECC Algorithms
The powerful ECC algorithms will enhance flash block use rate and whole device life. The SD controller
supports up to 68bits ECC circuits to protect data transfer.
1.2.3 Power Management
A power saving feature of the Micro SD is automatic entrance and exit from sleep mode. Upon completion
of an operation, the SD will enter the sleep mode to conserve power if no further commands are received
within X seconds, where X is programmable by software. The master does not have to take any action for
this to occur. The SD is in sleep mode except when the host is accessing it, thus conserving power.
Any command issued by the master to the Micro SD will cause it to exit sleep mode and response to the
master.
4
© 2013 Apacer Technology, Inc.
Rev. 1.1
Industrial Micro SD 3.0
AP-MSDxxxCX4P-1TM
2. Electrical characteristics
2.1 Card Architecture
2.2 Pin Assignment
SD Mode
SPI Mode
Description
Pin
Name
DAT2
CD/DAT3 2
CMD
Description
Data line[bit 2]
Name
Reserved
CS
1
2
3
4
5
6
7
8
Card Detect/Data line [bit 3]
Command/Response
Supply voltage
Chip select
Data in
DI
VDD
VDD
Supply voltage
Clock
CLK
Clock
SCLK
VSS
VSS
Supply voltage ground
Data line[bit 0]
Supply voltage ground
Data out
DAT0
DAT1
DO
Data line[bit 1]
Reserved
5
© 2013 Apacer Technology, Inc.
Rev. 1.1
Industrial Micro SD 3.0
AP-MSDxxxCX4P-1TM
2.3 Capacity Specification
The following table shows the specific capacity for the SD 3.0 card.
Capacity
4 GB
Total Bytes
3,972,005,888
7,960,788,992
15,997,075,456
32,078,036,992
8 GB
16 GB
32 GB
Note: total bytes are viewed under Windows operating system and were measured by SD format too.
2.4 Performance
Performances of the SD 3.0 card are shown in the table below.
Capacity
4 GB
19
8 GB
19
16 GB
19
32 GB
19
Modes
Read (MB/s)
Write (MB/s)
12
12
12
12
Note: results may vary depending on settings and platforms.
2.5 Electrical
Operating Voltages
Symbol
Parameter
Min.
2.7
Max.
Unit
VDD
Power Supply Voltage
3.6
V
Power consumption
Capacity
4 GB
40
8 GB
42
16 GB
45
32 GB
Modes
Operating (mA)
47
Standby (uA
)
100
100
100
150
Note: results may vary depending on settings and platforms.
6
© 2013 Apacer Technology, Inc.
Rev. 1.1
Industrial Micro SD 3.0
AP-MSDxxxCX4P-1TM
3. Physical Characteristics
3.1 Physical Dimension
7
© 2013 Apacer Technology, Inc.
Rev. 1.1
Industrial Micro SD 3.0
AP-MSDxxxCX4P-1TM
8
© 2013 Apacer Technology, Inc.
Rev. 1.1
Industrial Micro SD 3.0
AP-MSDxxxCX4P-1TM
3.2 Environmental Specifications
Climatic Testing
Test Condition
(Gold Series)
DUT
State
Test Item
Temperature
Duration
Durability Testing
Test Item
Descriptions
9
© 2013 Apacer Technology, Inc.
Rev. 1.1
Industrial Micro SD 3.0
AP-MSDxxxCX4P-1TM
10
© 2013 Apacer Technology, Inc.
Rev. 1.1
Industrial Micro SD 3.0
AP-MSDxxxCX4P-1TM
4. AC Characteristics
4.1 Micro SD Interface Timing (Default)
SYMBOL
PARAMETER
MIN
MAX
UNIT
Note
Clock CLK (All values are referred to min(VIH) and max(VIL)
Ccard≤10 pF
fPP
fOD
tWL
Clock frequency Data Transfer Mode
Clock frequency Identification Mode
Clock low time
0
25
400
-
MHz
kHz
ns
(1 card)
Ccard≤10 pF
0(1)/100
(1 card)
Ccard≤10 pF
10
10
-
(1 card)
Ccard≤10 pF
tWH
tTLH
tTHL
tISU
tIH
Clock high time
-
ns
(1 card)
Ccard≤10 pF
Clock rise time
10
10
-
ns
(1 card)
Ccard≤10 pF
Clock fall time
-
ns
(1 card)
Ccard≤10 pF
Input setup time
5
ns
(1 card)
Ccard≤10 pF
Input hold time
5
-
ns
(1 card)
11
© 2013 Apacer Technology, Inc.
Rev. 1.1
Industrial Micro SD 3.0
AP-MSDxxxCX4P-1TM
CL≤40 pF
tODLY
Output delay time
0
14
ns
ns
(1 card)
CL≤40 pF
Output Delay time during Identification
Mode
tODLY
0
50
(1 card)
(1)0Hz means to stop the clock. The given minimum frequency range is for cases that requires the clock to be continued.
4.2 Micro SD Interface Timing (High Speed Mode)
SYMBOL
PARAMETER
MIN
MAX
UNIT
Note
Ccard≤10 pF
(1 card)
fPP
Clock frequency data transfer mode
0
50
MHz
Ccard≤10 pF
(1 card)
Ccard≤10 pF
(1 card)
Ccard≤10 pF
(1 card)
Ccard≤10 pF
(1 card)
Ccard≤10 pF
(1 card)
Ccard≤10 pF
(1 card)
CL≤40 pF
(1 card)
CL≤15 pF
(1 card)
tWL
tWH
tTLH
tTHL
tISU
tIH
Clock low time
Clock high time
7
7
-
-
-
ns
ns
ns
ns
ns
ns
ns
ns
pF
Clock rise time
3
Clock fall time
-
3
Input setup time
6
2
-
Input hold time
-
tODLY
tOH
Output delay time
Output hold time
14
50
40
2.5
CL≤15 pF
(1 card)
System capacitance of each line*
CL
*In order to satisfy severe timing, host shall run on only one card
12
© 2013 Apacer Technology, Inc.
Rev. 1.1
Industrial Micro SD 3.0
AP-MSDxxxCX4P-1TM
4.3 SD Interface Timing (SDR12, SDR25 and SDR50 Modes) Input
Symbol
Min
Max
Unit
Remark
208MHz (Max.), Between rising
edge, VCT= 0.975V
tCLK
4.80
-
ns
tCR, tCF < 2.00ns (max.) at 100MHz,
CCARD=10pF
tCR, tCF
-
0.2* tCLK
70
ns
%
Clock Duty
30
4.3.1 SDR50 Input Timing
13
© 2013 Apacer Technology, Inc.
Rev. 1.1
Industrial Micro SD 3.0
AP-MSDxxxCX4P-1TM
Symbol
Min
3.00
0.80
Max
-
Unit
ns
ns
SDR50 Mode
CCARD =10pF, VCT= 0.975V
CCARD =5pF, VCT= 0.975V
tIs
tIH
-
4.3.2 Output
Symbol
Min
Max
Unit
Remark
tCLK>=10.0ns, CL=30pF, using driver Type B,
for SDR50
tODLY
-
7.5
ns
tCLK>=20.0ns, CL=40pF, using driver Type B,
for SDR25 and SDR12,
Hold time at the tODLY (min.), CL=15pF
tODLY
TOH
-
14
-
ns
ns
1.5
4.3.3 SD Interface Timing (DDR50 Mode)
Symbol
tCLK
Min
20
Max
-
Unit
ns
Remark
50MHz (Max.), Between rising edge
tCR, tCF < 4.00ns (max.) at 50MHz,
CCARD=10pF
tCR, tCF
-
0.2* tCLK
55
ns
%
Clock Duty
45
14
© 2013 Apacer Technology, Inc.
Rev. 1.1
Industrial Micro SD 3.0
AP-MSDxxxCX4P-1TM
4.3.4 Bus Timings – Parameters Values (DDR50 Mode)
Symbol
Parameters Min Max Unit
Input CMD (referenced to CLK rising edge)
Remark
Input set-up time
Ccard≤10 pF
(1 card)
Ccard≤10 pF
(1 card)
tISU
tIH
6
-
-
ns
ns
Input hold time
0.8
Output CMD (referenced to CLK rising edge)
Output Delay time during
Data Transfer Mode
Output Hold time
CL≤30 pF
(1 card)
CL≥15 pF
(1 card)
tODLY
TOH
-
13.7
-
ns
ns
1.5
Inputs DAT (referenced to CLK rising and falling edges)
Input set-up time
Ccard≤10 pF
(1 card)
Ccard≤10 pF
(1 card)
tISU2x
tIH2x
3
-
-
ns
ns
Input hold time
0.8
Outputs DAT (referenced to CLK rising and falling edges)
Output Delay time during
Data Transfer Mode
Output Hold time
CL≤25 pF
(1 card)
tODLY2x
TOH2x
-
7.0
-
ns
ns
CL≥15 pF
(1 card)
1.5
15
© 2013 Apacer Technology, Inc.
Rev. 1.1
Industrial Micro SD 3.0
AP-MSDxxxCX4P-1TM
5. Product Ordering Information
5.1 Product Code Designations
A P – MSD x x x C X 4 X – 1 TM
Flash Type:
CTL Solution
4: SDHC
Configuration
S one chip
D two chip
H four chip
Temperature:
C: Commercial Temperature
I: Extended Temperature
Capacities:
04G:
08G
4GB
8GB
16G
32G
16GB
32GB
Model Name
Apacer Product Code
16
© 2013 Apacer Technology, Inc.
Rev. 1.1
Industrial Micro SD 3.0
AP-MSDxxxCX4P-1TM
5.2 Valid Combinations
5.2.1 Commercial Temperature
Capacity
4GB
AP/N
AP-MSD04GCS4P-1TM
AP-MSD08GCS4P-1TM
AP-MSD16GCD4P-1TM
AP-MSD32GCH4P-1TM
8GB
16GB
32GB
Note: Please consult with Apacer sales representatives for availabilities.
17
© 2013 Apacer Technology, Inc.
Rev. 1.1
Industrial Micro SD 3.0
AP-MSDxxxCX4P-1TM
Revision History
Description
Revision
1.0
Date
Official release
Revised operating temperature
03/01/2013
03/05/2013
1.1
18
© 2013 Apacer Technology, Inc.
Rev. 1.1
Industrial Micro SD 3.0
AP-MSDxxxCX4P-1TM
Global Presence
Apacer Technology Inc.
4th Fl., 75 Hsin Tai Wu Rd., Sec.1
Hsichih, New Taipei City
Taiwan 221
Taiwan (Headquarters)
R.O.C.
Tel: +886-2-2698-2888
Fax: +886-2-2698-2889
amtsales@apacer.com
Apacer Memory America, Inc.
386 Fairview Way, Suite102,
Milpitas, CA 95035
Tel: 1-408-518-8699
Fax: 1-408-935-9611
sa@apacerus.com
U.S.A.
Japan
Europe
China
India
Apacer Technology Corp.
5F, Matsura Bldg., Shiba, Minato-Ku
Tokyo, 105-0014, Japan
Tel: 81-3-5419-2668
Fax: 81-3-5419-0018
jpservices@apacer.com
Apacer Technology B.V.
Science Park Eindhoven 5051 5692 EB Son,
The Netherlands
Tel: 31-40-267-0000
Fax: 31-40-267-0000#6199
sales@apacer.nl
Apacer Electronic (Shanghai) Co., Ltd
1301, No.251,Xiaomuqiao Road, Shanghai,
200032, China
Tel: 86-21-5529-0222
Fax: 86-21-5206-6939
sales@apacer.com.cn
Apacer Technologies Pvt Ltd,
# 535, 1st Floor, 8th cross, JP Nagar 3rd Phase,
Bangalore – 560078, India
Tel: 91-80-4152-9061
sales_india@apacer.com
19
© 2013 Apacer Technology, Inc.
Rev. 1.1
Mouser Electronics
Authorized Distributor
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