AS1117T-2.5 [ETC]
Analog IC ; 模拟IC\n
| 型号： | AS1117T-2.5 |
| 厂家： | 
ETC |
| 描述： | Analog IC
|
| 文件： | 总9页 (文件大小：143K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
AS1117
800mA Low Dropout Regulator
SCSI-II Active Terminator
FEATURES
APPLICATIONS
• Guaranteed 800mA Output
• SCSI-II Active Terminator
• Portable/ Palm Top / Notebook Computers
• Battery Chargers
• Three Terminal Adjustable Or Fixed 1.5V, 2.5V, 3V, 3.3V & 5V
• Very Low Quiescent Current
• Low Dropout Voltage Of 1.2 Volts At Full Load
• Extremely Tight Load And Line Regulation
• Very Low Temperature Coefficient
• Disk Drives
• Portable Consumer Equipment
• Portable Instrumentation
• SMPS Post-Regulator
• Logic-Controlled Electronic Shutdown
• Internal Overcurrent Limiting & Thermal Overload Protection
• Surface Mount Package SOT-223, TO-252, TO-220, SOT-89, TO-263, & SO-8
PRODUCT DESCRIPTION
The AS1117 is a low power positive-voltage regulator designed to meet 800mA output current and comply with SCSI-II specifications
with a fixed output voltage of 2.85V. This device is an excellent choice for use in battery-powered applications, as active terminators
for the SCSI bus, and portable computers. The AS1117 features very low quiescent current and very low dropout voltage of 1.2V at a
full load and lower as output current decreases. AS1117 is available as an adjustable or fixed 1.5V, 2.5V, 3.0V, 3.3V, and 5.0V output
voltages.
The AS1117 is offered in a 3-pin surface mount package SOT-223, TO-252, TO-220 and TO-263. The output capacitor of 10µF or
larger is needed for output stability of AS1117 as required by most of the other regulator circuits.
ORDERING INFORMATION
TO-220
3-PIN
TO-263
3-PIN
SOT-223
3-PIN
PLASTIC
SOIC 8 PIN
AS1117S
TO-252
DPAK
Oper. Temp.
Range
AS1117U
AS1117T
AS1117T-X
AS1117M3
AS1117R
-40°C to +85°C
AS1117U-X
AS1117M3-X
AS1117S-X
AS1117R-X
-40°C to +85°C
X= Output Voltage (X = 1.5V, 2.5V, 3.0V, 3.3V, 5.0, or Blank for Adjustable)
PIN CONNECTIONS
8-Pin Surface Mount (S)
TO-220-3 (U)
SOT-223 (M3)
TO-263-3 (T)
TO-252 (R)
1
2
3
4
8
7
6
5
GND
N/C
VIN
VIN
VIN
N/C
AS1117
AS1117
AS1117
1
2
3
AS1117
AS1117
1
2
3
VOUT
VOUT
2
1
3
1
2
3
ADJ/GND
VOUT VIN
ADJ/GND
VOUT
VIN
Top View
Top View
ADJ/GND
VOUT
VIN
Front View
Top View
ADJ/GND
VOUT
VIN
Front View
Rev. 10/6/00
AS1117
ABSOLUTE MAXIMUM RATINGS
Power Dissipation..........................................Internally Limited
Lead Temp. (Soldering, 5 Seconds) ................................ 260°C
Storage Temperature Range ............................-65° to +150°C
Operating Junction Temperature Range
Input Supply Voltage ......................................-20V to +20V
ESD Rating ............................................................2KV Min
AS1117.................................................. -40C° to +125°C
ELECTRICAL CHARACTERISTICS at
, Ta=25°C, CL =3.3µf, unless otherwise specified. Limits in
VIN = VOUT +1
Boldface apply over the full operating temperature range.
AS1117
Typ
Min
Max
Parameter
Conditions
Units
1.5V Version
Output Voltage
IOUT = 10mA, VIN = 4.85V
0≤IOUT≤800mA, 4.25≤VIN≤10V
1.500
1.485
1.470
1.515
1.530
V
2.5V Version
Output Voltage
IOUT = 10mA, VIN = 4.85V
0≤IOUT≤800mA, 4.25≤VIN≤10V
2.500
2.475
2.450
2.525
2.550
V
3.0V Version
IOUT = 10mA, VIN = 4.85V
3.000
3.300
2.970
3.030
V
V
Output Voltage
2.940
3.060
0≤IOUT≤800mA, 4.75≤VIN≤10V
3.3V Version
Output Voltage
IOUT = 10mA, VIN = 5.0V
0≤IOUT≤800mA, 4.75≤VIN≤10V
3.267
3.234
3.333
3.366
5.0V Version
IOUT = 10mA, VIN = 7.0V
5.000
1.250
4.950
5.050
V
Output Voltage
4.900
5.100
0≤IOUT≤800mA, 6.50≤VIN≤12V
All Output Options
Reference Voltage
IOUT = 10mA, (VIN – VOUT) = 2V
10≤ IOUT≤800mA, 1.4≤(VIN -VIN) ≤10V
(Note 1)
1.238
1.225
1.262
1.270
0.05
V
%
Output Voltage
Temperature Stability
Line Regulation
1.00
1.00
1.00
1.00
1.00
1.00
1.00
1.05
1.10
5.00
1000
0.01
60
7.00
7.00
mV
mV
V
4.50V ≤VIN≤12V, VOUT = 3.00, IOUT = 0
4.80V ≤VIN≤12V, VOUT = 3.30, IOUT = 0
6.50V ≤VIN≤15V, VOUT = 5.00, IOUT = 0
0≤IOUT≤800mA, VIN = 4.50V, VOUT = 3.00
0≤IOUT≤800mA, VIN = 4.80V, VOUT = 3.30
0≤IOUT≤800mA, VIN = 6.50V, VOUT = 5.00
IL = 100mA
10.00
12.00
12.00
15.00
Load Regulation
1.10
Dropout Voltage
( Note 2)
IL = 500mA
1.15
IL = 800mA
1.20
10.00
mA
mA
%/W
dB
4.25V ≤VIN≤6.5V
Quiescent Current
Current Limit
Thermal Regulation
Ripple Rejection
(VIN-VOUT) = 5V
25°C,30mS Pulse
1200
0.1
75
fRIPPLE = 120Hz, (Vin-VOUT) = 3V,
V
RIPPLE = 1Vp-p
125°C, 1000Hrs
0.03
0.003
15
%
%
°C/W°
Long Term Stability
RMS Output Noise
Thermal Resistance
% of Vout, 10Hz≤f≤10kHz
Junction to case, at tab
Note 1: Output temperature coefficient is defined as the worst case voltage change divided by the total temperature range
Note 2: Dropout voltage is defined as the input to output differential at which the output voltage drops 100mV below its nominal value measured at 1V differential at very low values of
programmed output voltage, the minimum input supply voltage of 2V ( 2.3V over temperature) must be taken into account.
Note 3: Thermal regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied. excluding load or line regulation effect.
Rev. 10/6/00
AS1117
Maximum Junction Temperature range:
APPLICATION NOTES EXTERNAL
CAPACITOR
TJ = Tambient (max) + PD* thermal resistance (Junction-to-
ambient)
To ensure the stability of the AS1117 an output capacitor of
at least 10µF (tantalum)or 50µF (aluminum) is required. The
value may change based on the application requirements on
the output load or temperature range. The capacitor
equivalent series resistance (ESR) will effect the AS1117
stability. The value of ESR can vary from the type of
capacitor used in the applications. The recommended value
for ESR is 0.5Ω. The output capacitance could increase in
size to above the minimum value. The larger value of output
capacitance as high as 100µF can improve the load transient
response.
Maximum Junction temperature must not exceed the 125°C.
50 X 50 mm
35 X 17 mm
SOLDERING METHODS
The AS1117 SOT-223 package is designed to be compatible
with infrared reflow or vapor-phase reflow soldering
techniques. During soldering the non-active or mildly active
fluxes may be used. The AS1117 die is attached to the
heatsink lead which exits opposite the input, output, and
ground pins.
16 X 10 mm
Hand soldering and wave soldering should be avoided since
these methods can cause damage to the device with excessive
Fig. 1. Substrate Layout for SOT-223
thermal gradients on the package.
The SOT-223
recommended soldering method are as follows: vapor phase
reflow and infrared reflow with the component preheated to
within 65°C of the soldering temperature range.
THERMAL CHARACTERISTICS
The thermal resistance of AS1117 is 15°C/W from junction
to tab and 31 °C/W from tab to ambient for a total of 46
°C/W from junction to ambient. The AS1117 features the
internal thermal limiting to protect the device during
overload conditions. Special care needs to be taken during
continuos load conditions the maximum junction temperature
does not exceed 125 °C.
Taking the FR-4 printed circuit board and 1/16 thick with 1
ounce copper foil as an experiment (fig.1 & fig.2), the PCB
material is effective at transmitting heat with the tab attached
to the pad area and a ground plane layer on the backside of
the substrate. Refer to table 1 for the results of the
experiment.
The thermal interaction from other components in the
application can effect the thermal resistance of the AS1117.
The actual thermal resistance can be determined with
experimentation. AS1117 power dissipation is calculated as
follows:
PD = (VIN - VOUT)(IOUT
)
Rev. 10/6/00
AS1117
Table 1.
TOTAL PC BOARD AREA
TOPDIDE COPPER AREA
BACKSIDE COPPER AREA
THERMAL RESISTANCE
JUNCTION TO AMBIENT
2500mm
2500mm
2500mm
2500mm
2500mm
1600mm
2500mm
2500mm
1600mm
900mm
2500mm
1250mm
950mm
2500mm
1800mm
600mm
1250mm
915mm
600mm
240mm
240mm
2500mm
46°C/W°
47°C/W°
49°C/W°
51°C/W°
53°C/W°
55°C/W°
58°C/W°
59°C/W°
67°C/W°
72°C/W°
85°C/W°
2500mm
2500mm
0
0
1600mm
0
0
0
900mm
0
900mm
VIN
AS1117
OUT
IN
V
IN
AS1117
V
OUT
OUT
IN
C1
C
2
C
1
ADJ
vREF
ADJ
R1
R1
IADJ
50uA
LOAD
R
2
VOUT= VREF(1+R2/R1) +IADJ R2
Typical Adjustable Regulator
800mA Current output
Rev. 10/6/00
AS1117
PACKAGE DRAWING
TO-263-3L (T)
±
±
(4.470 ±
0.127)
0.051)
0.005
0.176
0.050
0.055 (1.397)
0.405 ±
0.005
±
0.002 (1.270
±
(10.287 0.127)
0.356 ± 0.005
±
(9.042 0.127)
0.600 +- 0.025
±
(15.24
0.635)
±
0.010
0.100
±
(2.540 0.254)
0° 8°
0.103 BSC
(2.616)
0.050 (1.270)
+
0.032 +- 0.001
+ 0.003
0.015
-
(0.813 +- 0.025)
-
(0.381 0.074)
Rev. 10/6/00
AS1117
PACKAGE DRAWING
SOT-223-3L (M3)
0.124
0.116
0.146 0.295
0.130 0.264
0.041
0.033
0.0905 NOM
0.181 NOM
0.146
0.130
°
16 C
°
10 C
0.264
0.248
0.0040
0.0008
0.014
0.010
°
16 C
10 C Max
°
°
16 C
0.033
0.025
10
°
C
Rev. 10/6/00
AS1117
PACKAGE DRAWING
TO-220-3L (U)
0.180 ± 0.005
(4.572 ± 0.127)
0.151D ± 0.002
(3.835 D ± 0.051)
0.408 ± 0.013
(10.36 ± 0.33)
0.050 ± 0.002
(1.270 ± 0.051)
0.110 ± 0.010
(2.794 ± 0.254)
0.250 ± 0.010
(6.350 ± 0.254)
Tapered 1o
2 Sides
0.340 ± 0.010
(8.636 ± 0.254)
SEATING PLANE
1.020 ± 0.015
(25.910 ± 0.381)
0.150 MIN
(3.81 MIN)
7o Typ.
0.540 ± 0.015
(13.720 ± 0.381)
0.410
(10.41)
0.050 TYP
(1.27 TYP)
0.200 ± 0.010
(5.080 ± 0.254)
0.015 ± 0.010/-0.015
(2.667± 0.254/-0.381)
0.100 ± 0.010
(2.540 ± 0.254)
0.015 ± 0.010/-0.002
(0.381± 0.254/-0.051)
0.032 ± 0.005
(0.813 ± 0.127)
Rev. 10/6/00
AS1117
PACKAGE DRAWING
8-PIN SOIC (S)
4.0 (0.158)
3.8 (0.150)
5.2 (0.205)
4.6 (0.181)
6.2 (0.244)
5.8 (0.228)
Pin 1
1.27 (0.50)
BSC
1.75 (0.069)
1.35 (0.053)
0.78 (0.031)
0.61 (0.024)
0.77 (0.030)
0.64 (0.025)
°
(4 PLCS)
°
45
5.0 (0.197)
4.8 (0.188)
0.37 (0.015)
BSC
7
°
3 -6
°
0.56 (0.022)
0.49 (0.019)
0.22 (0.009)
0.19 (0.007)
°
7
(4 PLCS)
0.45 (0.018)
0.35 (0.014)
0.20 (0.008)
0.10 (0.004)
Rev. 10/6/00
AS1117
PACKAGE DRAWING
TO-252-3L (R)
-B-
-A-
L2
E
A
A1
C1
b2
A
4
2
SEATING
PLANE
D
L
L13
H
3
1
L
-C-
b
c
b1
A
3 PLCS
8
e
.010
M
A
M
C
e1
D1
NOTES
1. Refer To Applicable Symbol List.
2. Dimensions And Tolerancing Per Ansi Y14.5m - 1982.
3. Lead Dimension Uncontrolled in L 3
.
4. Tab Contour Optional Within Dim. b 2 & L2 And E1 & D1
5. D1 & E1 Establishes A Minimum Mounting Surface for Terminal 4.
6. L is the Termal Length for Soldering.
E1
TERM 4
7. Controlling Dimension: Inch
8. 2 Mils Suggested For Postive Contact At Mounting.
S
Y
M
B
O
L
BACK VIEW A-A
N
O
T
INCHES
MM
MIN
MAX
0.094
0.045
0.035
0.045
0.215
0.023
0.023
0.245
-
MIN
MAX
2.3876
1.143
0.889
1.143
5.461
0.5842
0.5842
6.223
-
E
A
A1
b
0.086
0.035
0.025
0.300
0.205
0.018
0.018
0.235
0.170
0.250
0.170
2.184
0.889
0.635
7.620
5.207
0.457
0.457
5.969
4.318
6.350
4.318
b1
b2
c
4
c1
D
D1
E
4,5
4,5
0.265
-
6.731
-
E1
e
0.098
0.180
2.489
4.572
e1
H
0.370
0.020
0.025
0.035
0.045
0.410
-
9.398
0.508
0.635
0.889
1.143
10.414
-
L
6
L1
L2
L3
0.040
0.050
0.060
1.016
1.270
1.524
4
3
Rev. 10/6/00
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