AT25HP512W2-10SC-1.8 [ETC]

SPI Serial EEPROM ; SPI串行EEPROM\n
AT25HP512W2-10SC-1.8
型号: AT25HP512W2-10SC-1.8
厂家: ETC    ETC
描述:

SPI Serial EEPROM
SPI串行EEPROM\n

内存集成电路 光电二极管 异步传输模式 ATM 可编程只读存储器 电动程控只读存储器 电可擦编程只读存储器 时钟
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Features  
Serial Peripheral Interface (SPI) Compatible  
Supports SPI Modes 0 (0,0) and 3 (1,1)  
128-byte Page Mode Only for Write Operations  
Low-voltage and Standard-voltage Operation  
– 5.0 (VCC = 4.5V to 5.5V)  
– 2.7 (VCC = 2.7V to 5.5V)  
– 1.8 (VCC = 1.8V to 3.6V)  
10 MHz (5V), 5MHz (2.7V) and 2 MHz (1.8V) Clock Rate  
Block Write Protection  
– Protect 1/4, 1/2, or Entire Array  
SPI Serial  
EEPROMs  
256K (32,768 x 8)  
512K (65,536 x 8)  
Write Protect (WP) Pin and Write Disable Instructions for  
both Hardware and Software Data Protection  
High Reliability  
– Endurance: 100K Write Cycles  
– Data Retention: >40 Years  
8-pin PDIP, 8-lead EIAJ SOIC, 16-lead JEDEC SOIC and 8-lead Leadless Array Package  
Description  
The AT25HP256/512 provides 262,144/524,288 bits of serial electrically erasable pro-  
grammable read only memory (EEPROM) organized as 32,768/65,536 words of 8-bits  
each. The device is optimized for use in many industrial and commercial applications  
where high-speed, low-power, and low-voltage operation are essential. The  
AT25HP256/512 is available in a space saving 8-pin PDIP (AT25HP256/512), 8-lead  
AT25HP256  
AT25HP512  
EIAJ SOIC (AT25HP256), 16-lead JEDEC SOIC (AT25HP512) and 8-lead Leadless  
(continued)  
Pin Configurations  
Pin Name  
Function  
CS  
Chip Select  
SCK  
SI  
Serial Data Clock  
Serial Data Input  
Serial Data Output  
Ground  
16-lead SOIC  
SO  
GND  
VCC  
WP  
CS  
SO  
1
2
3
4
5
6
7
8
16  
15  
14  
13  
12  
11  
10  
9
VCC  
HOLD  
NC  
Power Supply  
Write Protect  
NC  
NC  
NC  
NC  
NC  
NC  
NC  
HOLD  
Suspends Serial Input  
WP  
GND  
SCK  
SI  
8-lead Leadless Array  
8-lead SOIC  
8-pin PDIP  
VCC  
HOLD  
SCK  
SI  
8
7
6
5
1
2
3
4
CS  
1
2
8
7
VCC  
CS  
SO  
1
8
7
VCC  
CS  
SO  
2
HOLD  
SCK  
SI  
SO  
HOLD  
SCK  
SI  
WP  
GND  
3
4
6
5
3
6
5
WP  
WP  
GND  
4
GND  
Bottom View  
Rev. 1113D–05/01  
Array (AT25HP256/512) packages. In addition, the entire  
family is available in 5.0V (4.5V to 5.5V), 2.7V (2.7V to  
5.5V), and 1.8V (1.8V to 3.6V) versions.  
BLOCK WRITE protection is enabled by programming the  
status register with top ¼, top ½ or entire array of write pro-  
tection. Separate program enable and program disable  
instructions are provided for additional data protection.  
Hardware data protection is provided via the WP pin to pro-  
tect against inadvertent write attempts to the status  
register. The HOLD pin may be used to suspend any serial  
communication without resetting the serial sequence.  
The AT25HP256/512 is enabled through the Chip Select  
pin (CS) and accessed via a 3-wire interface consisting of  
Serial Data Input (SI), Serial Data Output (SO), and Serial  
Clock (SCK). All programming cycles are completely self-  
timed, and no separate ERASE cycle is required before  
WRITE.  
Absolute Maximum Ratings*  
*NOTICE:  
Stresses beyond those listed under Absolute Maxi-  
mum Ratingsmay cause permanent damage to the  
device. This is a stress rating only and functional  
operation of the device at these or any other condi-  
tions beyond those indicated in the operational sec-  
tions of this specification is not implied. Exposure to  
absolute maximum rating conditions for extended  
periods may affect device reliability.  
Operating Temperature.................................. -40°C to +125°C  
Storage Temperature..................................... -65°C to +150°C  
Voltage on Any Pin  
with Respect to Ground.....................................-1.0V to +7.0V  
Maximum Operating Voltage .......................................... 6.25V  
DC Output Current........................................................ 5.0 mA  
Block Diagram  
32,768/65,536x8  
AT25HP256/512  
2
AT25HP256/512  
Pin Capacitance(1)  
Applicable over recommended operating range from TA = 25°C, f = 1.0 MHz, VCC = +5.0V (unless otherwise noted).  
Symbol  
COUT  
CIN  
Test Conditions  
Max  
8
Units  
pF  
Conditions  
VOUT = 0V  
VIN = 0V  
Output Capacitance (SO)  
Input Capacitance (CS, SCK, SI, WP, HOLD)  
6
pF  
Note:  
1. This parameter is characterized and is not 100% tested.  
DC Characteristics  
Applicable over recommended operating range from: TAI = -40°C to +85°C, VCC = +1.8V to +5.5V,  
TAC = 0°C to +70°C, VCC = +1.8V to +5.5V (unless otherwise noted).  
Symbol  
VCC1  
VCC2  
VCC3  
ICC1  
ICC2  
ISB1  
Parameter  
Test Condition  
Min  
1.8  
2.7  
4.5  
Typ  
Max  
3.6  
Units  
V
Supply Voltage  
Supply Voltage  
5.5  
V
Supply Voltage  
5.5  
V
Supply Current  
VCC = 5.0V at 5 MHz, SO = Open Read  
VCC = 5.0V at 5 MHz, SO = Open Write  
VCC = 1.8V, CS = VCC  
6.0  
4.0  
0.1  
0.2  
2.0  
10.0  
7.0  
mA  
mA  
µA  
µA  
µA  
µA  
µA  
V
Supply Current  
Standby Current  
Standby Current  
Standby Current  
Input Leakage  
2.0  
ISB2  
VCC = 2.7V, CS = VCC  
2.0  
ISB3  
VCC = 5.0V, CS = VCC  
5.0  
IIL  
VIN = 0V to VCC  
-3.0  
-3.0  
3.0  
IOL  
Output Leakage  
Input Low Voltage  
Input High Voltage  
Output Low Voltage  
Output High Voltage  
Output Low Voltage  
Output High Voltage  
VIN = 0V to VCC, TAC = 0°C to 70°C  
3.0  
(1)  
VIL  
-0.6  
VCC x 0.3  
VCC + 0.5  
0.4  
(1)  
VIH  
VCC x 0.7  
V
VOL1  
VOH1  
VOL2  
VOH2  
I
OL = 3.0 mA  
IOH = -1.6 mA  
OL = 0.15 mA  
IOH = -100 µA  
V
4.5V VCC =5.5V  
1.8V VCC =3.6V  
VCC - 0.8  
VCC - 0.2  
V
I
0.2  
V
V
Note:  
1. VIL and VIH max are reference only and are not tested.  
3
AC Characteristics  
Applicable over recommended operating range from TA = -40°C to +85°C, VCC = As Specified,  
CL = 1 TTL Gate and 30 pF (unless otherwise noted).  
Symbol  
Parameter  
Voltage  
Min  
Max  
Units  
4.5 - 5.5  
2.7 - 5.5  
1.8 - 3.6  
0
0
0
10  
5
2
fSCK  
SCK Clock Frequency  
MHz  
4.5 - 5.5  
2.7 - 5.5  
1.8 - 3.6  
2
2
2
tRI  
Input Rise Time  
Input Fall Time  
SCK High Time  
SCK Low Time  
CS High Time  
µs  
µs  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
4.5 - 5.5  
2.7 - 5.5  
1.8 - 3.6  
2
2
2
tFI  
4.5 - 5.5  
2.7 - 5.5  
1.8 - 3.6  
40  
80  
200  
tWH  
tWL  
tCS  
tCSS  
tCSH  
tSU  
tH  
4.5 - 5.5  
2.7 - 5.5  
1.8 - 3.6  
40  
80  
200  
4.5 - 5.5  
2.7 - 5.5  
1.8 - 3.6  
50  
100  
250  
4.5 - 5.5  
2.7 - 5.5  
1.8 - 3.6  
50  
100  
250  
CS Setup Time  
CS Hold Time  
4.5 - 5.5  
2.7 - 5.5  
1.8 - 3.6  
50  
100  
250  
4.5 - 5.5  
2.7 - 5.5  
1.8 - 3.6  
12  
20  
50  
Data In Setup Time  
Data In Hold Time  
Hold Setup Time  
Hold Hold Time  
Output Valid  
4.5 - 5.5  
2.7 - 5.5  
1.8 - 3.6  
10  
20  
50  
4.5 - 5.5  
2.7 - 5.5  
1.8 - 3.6  
25  
50  
100  
tHD  
tCD  
tV  
4.5 - 5.5  
2.7 - 5.5  
1.8 - 3.6  
25  
50  
100  
4.5 - 5.5  
2.7 - 5.5  
1.8 - 3.6  
0
0
0
40  
80  
200  
4.5 - 5.5  
2.7 - 5.5  
1.8 - 3.6  
0
0
0
tHO  
Output Hold Time  
AT25HP256/512  
4
AT25HP256/512  
AC Characteristics (Continued)  
Applicable over recommended operating range from TA = -40°C to +85°C, VCC = As Specified,  
CL = 1 TTL Gate and 30 pF (unless otherwise noted).  
Symbol  
Parameter  
Voltage  
Min  
Max  
Units  
4.5 - 5.5  
2.7 - 5.5  
1.8 - 3.6  
0
0
0
100  
200  
300  
tLZ  
Hold to Output Low Z  
ns  
4.5 - 5.5  
2.7 - 5.5  
1.8 - 3.6  
100  
200  
300  
tHZ  
Hold to Output High Z  
Output Disable Time  
Write Cycle Time  
ns  
ns  
4.5 - 5.5  
2.7 - 5.5  
1.8 - 3.6  
100  
100  
250  
tDIS  
4.5 - 5.5  
2.7 - 5.5  
1.8 - 3.6  
10  
10  
10  
tWC  
ms  
4.5 - 5.5  
2.7 - 5.5  
1.8 - 3.6  
Endurance(1)  
5.0V, 25°C, Page Mode  
100K  
Write Cycles  
Note:  
1. This parameter is characterized and is not 100% tested.  
5
Serial Interface Description  
SPI Serial Interface  
MASTER: The device that generates the serial clock.  
AT25HP256/512  
SLAVE: Because the Serial Clock pin (SCK) is always an  
input, the AT25HP256/512 always operates as a slave.  
TRANSMITTER/RECEIVER: The AT25HP256/512 has  
separate pins designated for data transmission (SO) and  
reception (SI).  
MSB: The Most Significant Bit (MSB) is the first bit  
transmitted and received.  
SERIAL OP-CODE: After the device is selected with CS  
going low, the first byte will be received. This byte contains  
the op-code that defines the operations to be performed.  
INVALID OP-CODE: If an invalid op-code is received, no  
data will be shifted into the AT25HP256/512, and the serial  
output pin (SO) will remain in a high impedance state until  
the falling edge of CS is detected again. This will reinitialize  
the serial communication.  
CHIP SELECT: The AT25HP256/512 is selected when the  
CS pin is low. When the device is not selected, data will not  
be accepted via the SI pin, and the serial output pin (SO)  
will remain in a high impedance state.  
HOLD: The HOLD pin is used in conjunction with the CS  
pin to select the AT25HP256/512. When the device is  
selected and a serial sequence is underway, HOLD can be  
used to pause the serial communication with the master  
device without resetting the serial sequence. To pause, the  
HOLD pin must be brought low while the SCK pin is low. To  
resume serial communication, the HOLD pin is brought  
high while the SCK pin is low (SCK may still toggle during  
HOLD). Inputs to the SI pin will be ignored while the SO pin  
is in the high impedance state.  
WRITE PROTECT: The write protect pin (WP) will allow  
normal read/write operations when held high. When the  
WP pin is brought low and WPEN bit is 1, all write opera-  
tions to the status register are inhibited. WP going low  
while CS is still low will interrupt a write to the status regis-  
ter. If the internal write cycle has already been initiated, WP  
going low will have no effect on any write operation to the  
status register. The WP pin function is blocked when the  
WPEN bit in the status register is 0. This will allow the  
user to install the AT25HP256/512 in a system with the WP  
pin tied to ground and still be able to write to the status reg-  
ister. All WP pin functions are enabled when the WPEN bit  
is set to 1.  
AT25HP256/512  
6
AT25HP256/512  
Functional Description  
The AT25HP256/512 is designed to interface directly with  
the synchronous serial peripheral interface (SPI) of the  
6800 type series of microcontrollers.  
Table 3. Read Status Register Bit Definition  
Bit  
Definition  
Bit 0 = 0 (RDY) indicates the device is READY. Bit 0  
= 1 indicates the write cycle is in progress.  
Bit 0 (RDY)  
The AT25HP256/512 utilizes an 8-bit instruction register.  
The list of instructions and their operation codes are con-  
tained in Table 1. All instructions, addresses, and data are  
transferred with the MSB first and start with a high-to-low  
CS transition.  
Bit 1= 0 indicates the device is not WRITE  
ENABLED. Bit 1 = 1 indicates the device is WRITE  
ENABLED.  
Bit 1 (WEN)  
Bit 2 (BP0)  
Bit 3 (BP1)  
See Table 4.  
See Table 4.  
Table 1. Instruction Set for the AT25HP256/512  
Instruction  
Name  
Instruction  
Format  
Bits 4-6 are 0s when device is not in an internal write cycle.  
Bit 7 (WPEN) See Table 5.  
Operation  
WREN  
WRDI  
RDSR  
WRSR  
READ  
WRITE  
0000 X110  
0000 X100  
0000 X101  
0000 X001  
0000 X011  
0000 X010  
Set Write Enable Latch  
Reset Write Enable Latch  
Read Status Register  
Write Status Register  
Read Data from Memory Array  
Write Data to Memory Array  
Bits 0-7 are 1s during an internal write cycle.  
WRITE STATUS REGISTER (WRSR): The WRSR instruc-  
tion allows the user to select one of four levels of  
protection. The AT25HP256/512 is divided into four array  
segments. Top quarter (1/4), top half (1/2), or all of the  
memory segments can be protected. Any of the data within  
any selected segment will therefore be READ only. The  
block write protection levels and corresponding status reg-  
ister control bits are shown in Table 4.  
WRITE ENABLE (WREN): The device will power up in the  
write disable state when VCC is applied. All programming  
instructions must therefore be preceded by a Write Enable  
instruction.  
The three bits, BP0, BP1, and WPEN are nonvolatile cells  
that have the same properties and functions as the regular  
memory cells (e.g. WREN, tWC, RDSR).  
WRITE DISABLE (WRDI): To protect the device against  
inadvertent writes, the Write Disable instruction disables all  
programming modes. The WRDI instruction is independent  
of the status of the WP pin.  
Table 4. Block Write Protect Bits  
Status Register Bits  
Array Addresses Protected  
AT25HP256/512  
Level  
0
BP1  
BP0  
READ STATUS REGISTER (RDSR): The Read Status  
Register instruction provides access to the status register.  
The READY/BUSY and Write Enable status of the device  
can be determined by the RDSR instruction. Similarly, the  
Block Write Protection bits indicate the extent of protection  
employed. These bits are set by using the WRSR  
instruction.  
0
0
1
1
0
1
0
1
None  
1(1/4)  
2(1/2)  
3(All)  
6000 - 7FFF/C000 - FFFF  
4000 - 7FFF/8000 - FFFF  
0000 - 7FFF/0000 - FFFF  
The WRSR instruction also allows the user to enable or  
disable the write protect (WP) pin through the use of the  
Write Protect Enable (WPEN) bit. Hardware write protec-  
tion is enabled when the WP pin is low and the WPEN bit is  
1. Hardware write protection is disabled when either the  
WP pin is high or the WPEN bit is 0.When the device is  
hardware write protected, writes to the Status Register,  
including the Block Protect bits and the WPEN bit, and the  
block-protected sections in the memory array are disabled.  
Writes are only allowed to sections of the memory which  
are not block-protected.  
Table 2. Status Register Format  
Bit 7  
Bit 6  
Bit 5  
Bit 4  
Bit 3  
Bit 2  
Bit 1  
Bit 0  
WPEN  
X
X
X
BP1  
BP0  
WEN  
RDY  
7
NOTE: When the WPEN bit is hardware write protected, it  
cannot be changed back to 0, as long as the WP pin is  
held low.  
Protection Level. During an internal write cycle, all com-  
mands will be ignored except the RDSR instruction.  
A Write Instruction requires the following sequence. After  
the CS line is pulled low to select the device, the WRITE  
op-code is transmitted via the SI line followed by the byte  
address and the data (D7-D0) to be programmed (Refer to  
Table 6). Programming will start after the CS pin is brought  
high. (The LOW to High transition of the CS pin must occur  
during the SCK low time immediately after clocking in the  
D0 (LSB) data bit.  
Table 5. WPEN Operation  
Protected  
Blocks  
Unprotected  
Blocks  
Status  
Register  
WPEN  
WP  
X
WEN  
0
0
1
1
X
X
0
1
0
1
0
1
Protected  
Protected  
Protected  
Protected  
Protected  
Protected  
Protected  
Writable  
Protected  
Writable  
Protected  
Writable  
Protected  
Writable  
X
Low  
Low  
High  
High  
Protected  
Protected  
Protected  
Writable  
The READY/BUSY status of the device can be determined  
by initiating a READ STATUS REGISTER (RDSR) Instruc-  
tion. If Bit 0 = 1, the WRITE cycle is still in progress. If Bit 0  
= 0, the WRITE cycle has ended. Only the READ STATUS  
REGISTER instruction is enabled during the WRITE pro-  
gramming cycle.  
READ  
SEQUENCE  
(READ): Reading  
the  
The AT25HP256/512 is capable of a 128-byte PAGE  
WRITE operation. After each byte of data is received, the  
seven low order address bits are internally incremented by  
one; the high order bits of the address will remain constant.  
If more than 128-bytes of data are transmitted, the address  
counter will roll over and the previously written data will be  
overwritten. The AT25HP256/512 is automatically returned  
to the write disable state at the completion of a WRITE  
cycle.  
AT25HP256/512 via the SO (Serial Output) pin requires the  
following sequence. After the CS line is pulled low to select  
a device, the READ op-code is transmitted via the SI line  
followed by the byte address to be read (Refer to Table 6).  
Upon completion, any data on the SI line will be ignored.  
The data (D7-D0) at the specified address is then shifted  
out onto the SO line. If only one byte is to be read, the CS  
line should be driven high after the data comes out. The  
READ sequence can be continued since the byte address  
is automatically incremented and data will continue to be  
shifted out. When the highest address is reached, the  
address counter will roll over to the lowest address allowing  
the entire memory to be read in one continuous READ  
cycle.  
NOTE: If the device is not Write enabled (WREN), the  
device will ignore the Write instruction and will return to the  
standby state, when CS is brought high. A new CS falling  
edge is required to re-initiate the serial communication.  
Table 6. Address Key  
WRITE SEQUENCE (WRITE): In order to program the  
AT25HP256/512, two separate instructions must be exe-  
cuted. First, the device must be write enabled via the  
Write Enable (WREN) Instruction. Then a Write (WRITE)  
Instruction may be executed. Also, the address of the  
memory location(s) to be programmed must be outside the  
protected address field location selected by the Block Write  
Address  
AN  
AT25HP256/512  
A14 - A0 / A15 - A0  
A15 / none  
Dont Care Bits  
NOTE: 128-byte PAGE WRITE operation only. Content of  
the page in the array will not be guaranteed if less than 128  
bytes of data is received (byte write is not supported).  
AT25HP256/512  
8
AT25HP256/512  
Timing Diagrams (for SPI Mode 0 (0,0))  
Synchronous Data Timing  
t
CS  
V
V
IH  
CS  
IL  
t
t
CSH  
CSS  
V
IH  
t
WL  
t
WH  
SKC  
SI  
V
IL  
t
SU  
t
H
V
V
IH  
VALID IN  
IL  
t
V
t
t
HO  
DIS  
V
OH  
HI-Z  
HI- Z  
SO  
V
OL  
WREN Timing  
CS  
SCK  
SI  
SO  
WRDI Timing  
CS  
SCK  
SI  
WRDI OP-CODE  
HI-Z  
SO  
9
RDSR Timing  
CS  
0
1
2
3
4
5
6
7
8
9
10 11 12 13 14  
SCK  
SI  
INSTRUCTION  
DATA OUT  
HIGH IMPEDANCE  
7
6
5
4
3
2
1
0
SO  
MSB  
WRSR Timing  
READ Timing  
AT25HP256/512  
10  
AT25HP256/512  
WRITE Timing (AT25HP256)  
CS  
0
1
2
3
4
5
6
7
8
9
10 11 20 21 22 23 24 25 26 27 28 29 30 31  
SCK  
SI  
BYTE ADDRESS  
...  
1ST BYTE DATA IN  
13  
INSTRUCTION  
1
0
15  
14  
7
6
5
3
2
2
4
0
3
1
HIGH IMPEDANCE  
SO  
11  
PAGE WRITE Timing (AT25HP512)  
CS  
0
1
2
3
4
5
6
7
8
9
10 11 20 21 22 23 24 25 26 10431044 1045 1046 1047  
SCK  
SI  
st  
th  
BYTE ADDRESS 1 BYTE DATA IN  
128 BYTE DATA IN  
INSTRUCTION  
13  
12  
1
0
15  
14  
7
6
5
3
2
2
4
0
3
1
HIGH IMPEDANCE  
SO  
HOLD Timing  
CS  
tCD  
tCD  
SCK  
HOLD  
SO  
tHD  
tHD  
tHZ  
tLZ  
AT25HP256/512  
12  
AT25HP256/512  
AT25HP256 Ordering Information  
tWC (max)  
ICC (max)  
ISB (max)  
fMAX  
(ms)  
(µA)  
(µA)  
(kHz)  
Ordering Code  
Package  
Operation Range  
10  
10  
10  
10000  
10000  
4000  
4000  
3000  
3000  
5.0  
5.0  
2.0  
2.0  
2.0  
2.0  
10000  
10000  
5000  
5000  
2000  
2000  
AT25HP256-10CC  
AT25HP256C1-10CC  
AT25HP256-10PC  
AT25HP256W-10SC  
8C  
Commercial  
8C1  
8P3  
8S2  
(0°C to 70°C)  
AT25HP256-10CI  
AT25HP256C1-10CI  
AT25HP256-10PI  
AT25HP256W-10SI  
8C  
Industrial  
8C1  
8P3  
8S2  
(-40°C to 85°C)  
AT25HP256-10CC-2.7  
AT25HP256C1-10CC-2.7  
AT25HP256-10PC-2.7  
AT25HP256W-10SC-2.7  
8C  
Commercial  
8C1  
8P3  
8S2  
(0°C to 70°C)  
AT25HP256-10CI-2.7  
AT25HP256C1-10CI-2.7  
AT25HP256-10PI-2.7  
AT25HP256W-10SI-2.7  
8C  
Industrial  
8C1  
8P3  
8S2  
(-40°C to 85°C)  
AT25HP256-10CC-1.8  
AT25HP256C1-10CC-1.8  
AT25HP256-10PC-1.8  
AT25HP256W-10SC-1.8  
8C  
Commercial  
8C1  
8P3  
8S2  
(0°C to 70°C)  
AT25HP256-10CI-1.8  
AT25HP256C1-10CI-1.8  
AT25HP256-10PI-1.8  
AT25HP256W-10SI-1.8  
8C  
Industrial  
8C1  
8P3  
8S2  
(-40°C to 85°C)  
Package Type  
8C  
8-lead, 0.230" Wide, Leadless Array Package (LAP)  
8-lead, 0.300" Wide, Leadless Array Package (LAP)  
8-pin, 0.300" Wide, Plastic Dual In-line Package (PDIP)  
8-lead, 0.300" Wide, Plastic Gull Wing Small Outline Package (EIAJ SOIC)  
Options  
8C1  
8P3  
8S2  
Blank  
-2.7  
Standard Device (4.5V to 5.5V)  
Low Voltage (2.7V to 5.5V)  
-1.8  
Low Voltage (1.8V to 3.6V)  
13  
AT25HP512 Ordering Information  
tWC (max)  
ICC (max)  
ISB (max)  
fMAX  
(ms)  
(µA)  
(µA)  
(kHz)  
Ordering Code  
Package  
Operation Range  
10  
10  
10  
10000  
10000  
4000  
4000  
3000  
3000  
5.0  
5.0  
2.0  
2.0  
2.0  
2.0  
10000  
10000  
5000  
5000  
2000  
2000  
AT25HP512-10CC  
AT25HP512C1-10CC  
AT25HP512-10PC  
AT25HP512W2-10SC  
8C  
Commercial  
8C1  
8P3  
16S2  
(0°C to 70°C)  
AT25HP512-10CI  
AT25HP512C1-10CI  
AT25HP512-10PI  
AT25HP512W2-10SI  
8C  
Industrial  
8C1  
8P3  
16S2  
(-40°C to 85°C)  
AT25HP512-10CC-2.7  
AT25HP512C1-10CC-2.7  
AT25HP512-10PC-2.7  
AT25HP512W2-10SC-2.7  
8C  
Commercial  
8C1  
8P3  
16S2  
(0°C to 70°C)  
AT25HP512-10CI-2.7  
AT25HP512C1-10CI-2.7  
AT25HP512-10PI-2.7  
AT25HP512W2-10SI-2.7  
8C  
Industrial  
8C1  
8P3  
16S2  
(-40°C to 85°C)  
AT25HP512-10CC-1.8  
AT25HP512C1-10CC-1.8  
AT25HP512-10PC-1.8  
AT25HP512W2-10SC-1.8  
8C  
8C1  
8P3  
16S2  
Commercial  
(0°C to 70°C)  
AT25HP512-10CI-1.8  
AT25HP512C1-10CI-1.8  
AT25HP512-10PI-1.8  
AT25HP512W2-10SI-1.8  
8C  
8C1  
8P3  
16S2  
Industrial  
(-40°C to 85°C)  
Package Type  
8C  
8-lead, 0.230" Wide, Leadless Array Package (LAP)  
8-lead, 0.300" Wide, Leadless Array Package (LAP)  
8-pin, 0.300" Wide, Plastic Dual In-line Package (PDIP)  
16-lead, 0.300" Wide, Plastic Gull Wing Small Outline Package (JEDEC SOIC)  
Options  
8C1  
8P3  
16S2  
Blank  
-2.7  
Standard Device (4.5V to 5.5V)  
Low Voltage (2.7V to 5.5V)  
-1.8  
Low Voltage (1.8V to 3.6V)  
AT25HP256/512  
14  
AT25HP256/512  
Packaging Information  
8C, 8-lead, 0.230" Wide, Leadless Array Package  
(LAP)  
8C1, 8-lead, 0.300" Wide, Leadless Array Package  
(LAP)  
Dimensions in Inches and (Millimeters)  
Dimensions in Inches and (Millimeters)  
SIDE  
SIDE  
TOP VIEW  
VIEW  
TOP VIEW  
VIEW  
5.10 (0.201)  
4.90 (0.193)  
5.03 (0.198)  
4.83 (0.190)  
1.14 (0.045)  
0.94 (0.037)  
1.14 (0.045)  
0.94 (0.037)  
8.10 (0.319)  
7.90 (0.311)  
6.09 (0.240)  
5.89 (0.232)  
0.38 (0.015)  
0.30 (0.012)  
0.38 (0.015)  
0.30 (0.012)  
BOTTOM VIEW  
BOTTOM VIEW  
1
1.32 (0.052)  
1.22 (0.048)  
1.19 (0.047)  
1.09 (0.043)  
1.32 (0.052)  
1.22 (0.048)  
1.12 (0.044)  
1.22 (0.048)  
8
7
6
5
8
7
6
5
1
0.95 (0.037)  
0.85 (0.033)  
0.61 (0.024)  
2
3
4
2
3
4
0.51 (0.020)  
4.76 (0.187)  
4.66 (0.183)  
0.92 (0.036)  
0.82 (0.032)  
0.89 (0.035)  
0.79 (0.031)  
0.34 (0.013)  
0.24 (0.009)  
0.61 (0.024)  
0.51 (0.020)  
8P3, 8-lead, 0.300" Wide, Plastic Dual In-line  
Package (PDIP) Dimensions in Inches and  
(Millimeters) JEDEC STANDARD MS-001 BA  
8S2, 8-lead, 0.200" Wide, Plastic Gull Wing Small  
Outline (EIAJ SOIC)  
Dimensions in Inches and (Millimeters)  
.400 (10.16)  
.355 (9.02)  
.020 (.508)  
.012 (.305)  
PIN  
1
.213 (5.41) .330 (8.38)  
.205 (5.21) .300 (7.62)  
.280 (7.11)  
.240 (6.10)  
PIN 1  
.037 (.940)  
.027 (.690)  
.300 (7.62) REF  
.210 (5.33) MAX  
.050 (1.27) BSC  
.100 (2.54) BSC  
.212 (5.38)  
.203 (5.16)  
.080 (2.03)  
.070 (1.78)  
SEATING  
PLANE  
.015 (.380) MIN  
.150 (3.81)  
.115 (2.92)  
.022 (.559)  
.014 (.356)  
.070 (1.78)  
.045 (1.14)  
.013 (.330)  
.004 (.102)  
.325 (8.26)  
.300 (7.62)  
0
8
REF  
.010 (.254)  
.007 (.178)  
0
REF  
15  
.012 (.305)  
.008 (.203)  
.035 (.889)  
.020 (.508)  
.430 (10.9) MAX  
15  
Packaging Information  
16S2, 16-lead, 0.300" Wide, Plastic Gull Wing Small  
Outline Package (JEDEC SOIC)  
0.020 (0.508)  
0.013 (0.330)  
0.420 (10.7)  
0.393 (9.98)  
0.299 (7.60)  
0.291 (7.39)  
PIN 1  
0.050 (1.27) BSC  
0.394 (10.00)  
0.386 (09.80)  
0.105 (2.67)  
0.092 (2.34)  
0.012 (0.305)  
0.003 (0.076)  
0
8
REF  
0.013 (0.330)  
0.009 (0.229)  
0.035 (0.889)  
0.015 (0.381)  
AT25HP256/512  
16  
Atmel Headquarters  
Atmel Operations  
Corporate Headquarters  
2325 Orchard Parkway  
San Jose, CA 95131  
TEL (408) 441-0311  
FAX (408) 487-2600  
Atmel Colorado Springs  
1150 E. Cheyenne Mtn. Blvd.  
Colorado Springs, CO 80906  
TEL (719) 576-3300  
FAX (719) 540-1759  
Europe  
Atmel Rousset  
Atmel SarL  
Zone Industrielle  
13106 Rousset Cedex  
France  
Route des Arsenaux 41  
Casa Postale 80  
CH-1705 Fribourg  
Switzerland  
TEL (33) 4-4253-6000  
FAX (33) 4-4253-6001  
TEL (41) 26-426-5555  
FAX (41) 26-426-5500  
Atmel Smart Card ICs  
Scottish Enterprise Technology Park  
East Kilbride, Scotland G75 0QR  
TEL (44) 1355-357-000  
Asia  
Atmel Asia, Ltd.  
Room 1219  
FAX (44) 1355-242-743  
Chinachem Golden Plaza  
77 Mody Road Tsimhatsui  
East Kowloon  
Atmel Grenoble  
Avenue de Rochepleine  
BP 123  
Hong Kong  
38521 Saint-Egreve Cedex  
France  
TEL (33) 4-7658-3000  
FAX (33) 4-7658-3480  
TEL (852) 2721-9778  
FAX (852) 2722-1369  
Japan  
Atmel Japan K.K.  
9F, Tonetsu Shinkawa Bldg.  
1-24-8 Shinkawa  
Chuo-ku, Tokyo 104-0033  
Japan  
TEL (81) 3-3523-3551  
FAX (81) 3-3523-7581  
Fax-on-Demand  
North America:  
e-mail  
literature@atmel.com  
1-(800) 292-8635  
Web Site  
http://www.atmel.com  
International:  
1-(408) 441-0732  
BBS  
1-(408) 436-4309  
© Atmel Corporation 2001.  
Atmel Corporation makes no warranty for the use of its products, other than those expressly contained in the Companys standard warranty  
which is detailed in Atmels Terms and Conditions located on the Companys web site. The Company assumes no responsibility for any errors  
which may appear in this document, reserves the right to change devices or specifications detailed herein at any time without notice, and does  
not make any commitment to update the information contained herein. No licenses to patents or other intellectual property of Atmel are granted  
by the Company in connection with the sale of Atmel products, expressly or by implication. Atmels products are not authorized for use as critical  
components in life support devices or systems.  
®
Marks bearing and/or are registered trademarks and trademarks of Atmel Corporation.  
Terms and product names in this document may be trademarks of others.  
Printed on recycled paper.  
1113D05/01/xM  

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