AW24MUFL-SM [ETC]
HARDWARE DESIGN GUIDE FOR ARTAFLEX WIRELESS MODULES;
| 型号： | AW24MUFL-SM |
| 厂家： | 
ETC |
| 描述： | HARDWARE DESIGN GUIDE FOR ARTAFLEX WIRELESS MODULES |
| 文件： | 总23页 (文件大小：376K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
HARDWARE DESIGN GUIDE
FOR
ARTAFLEX WIRELESS MODULES
For Models:
AWP24S
AWS24S
AWP24U
AWAC24U
AWA24S
AW24MCHL-SM
AW24MCHL-H2
AW24MUFL-SM
Document:
AN-121-0001
Written By:
Kashif Ahmed
Date:
Sept 18,2009
Artaflex Inc.
215 Konrad Crescent
Markham, Ontario, Canada
L3R8T9
File: AN-121-0001-R2
Page 1 of 23
(905) 479-0148
http://www.artaflexmodules.com
Contents
1.0 Introduction ....................................................................................................................... 3
2.0 Main Features ................................................................................................................... 3
3.0 Module Types.................................................................................................................... 4
4.0 Mechanical Dimensions..................................................................................................... 5
5.0 Design Guidelines
5.1 PCB Design................................................................................................................ 5
5.2 Module Placement Strategy...................................................................................... 15
5.3 External Antenna Applications.................................................................................. 20
6.0 SMT Assembly Guidelines for AW24MCHL-SM.............................................................. 21
Artaflex Inc.
215 Konrad Crescent
Markham, Ontario, Canada
L3R8T9
File: AN-121-0001-R2
Page 2 of 23
(905) 479-0148
http://www.artaflexmodules.com
1. Introduction
This document provides information on designing Artaflex wireless modules into
products that require 2.4 GHz ISM band wireless data transmission. A brief description
is provided for all the modules to aid in assisting the designer on selecting the right
model for the design. For more detailed information, please refer to engineering
datasheets or contact Artaflex technical sales/support.
To ensure optimal RF performance, suggested design guidelines are provided for
placement on PCB. Information on mating connectors on host board, solder reflow
temperature profiles for assembly and reworking information are also provided.
manufacturing are also provided.
Artaflex wireless modules operate in the 2.4 GHZ ISM band. The Falcon series
modules are based on Cypress Semiconductor CyFi chipset and offer seamless
compliance to the CyFi protocol. The modules are low power with transmitting data
rates up to 1Mb/s and operating range from 50 meters for embedded antenna devices
to 1 kilometer for devices equipped with a power amplifier. All modules are
FCC/EU/ETS/Industry Canada agency certified.
2. Main Features
• Low operating current
• Transmit power from 4dBm up to +21 dBm
• Receive sensitivity up to –97 dBm
• Sleep current <1-10 µA
• Operating range from 10m to 1km or more depending on model and conditions
• DSSS data rates up to 250 kbps, GFSK data rate of 1 Mbps
• Auto Transaction Sequencer (ATS) - no micro controller intervention
• Framing, Length, CRC16, and Auto ACK
• Fast startup and fast channel changes
• Separate 16-byte transmit and receive FIFOs
• AutoRate™ - dynamic data rate reception
• Receive Signal Strength Indication (RSSI)
• 4-MHz SPI microcontroller interface
• No proprietary software required
• Serial Peripheral Interface (SPI) control while in sleep mode
• Operating voltage from 2.4 to 3.6 volts
• Operating temperature from 0 to 70°C
• Size: as small as 15mm(L) x 13.5(W) x 1.8mm(H)
Artaflex Inc.
215 Konrad Crescent
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L3R8T9
File: AN-121-0001-R2
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• Weight: 5 - 27 grams
• FCC Modular Approval Grant to meet FCC Part 15, EN 300 328-1, EN 301 489-1,
EN 301 489-7 and Industry Canada RSS-210 standards
3. Module Types
There are many packaging options available.
The following is a list of available modules with a brief description.
1) AWP24S has an integrated PCB print antenna. It is a first generation module.
2) AWS24S has a co-axial U.FL connector for attaching an external antenna. It is a
first generation module.
3) AWP24U is a USB dongle version allowing it to plug into computers.
4) AWA24S has a power amplifier for longest operating range
5) AWAC24U is a USB dongle with a power amplifier that offers longest range and
a computer interface
6) AW24MCHL-H2 has a chip antenna and header connector. It is a second
generation module that offers high performance in the smallest available
package.
7) AW24MCHL-HR is the same as AW24MCHL-H2 but has a right angle connector
allowing the module to be mounted perpendicular to host PCB.
8) AW24MCHL-SM is a surface mount version that has the lowest profile since
there is no header connector.
9) AW24MUFL has a header connector and has a U.FL connector for connecting
an external antenna.
Artaflex Inc.
215 Konrad Crescent
Markham, Ontario, Canada
L3R8T9
File: AN-121-0001-R2
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4. Mechanical Dimensions
a. AWP24S - Integrated PCB Antenna Module
Size:
38.1 mm x 25.4 mm (1.5” x 1.0”)
AWP24S Connector Pin Information
Pin Name Type
Default
GND
VCC
-
Description
1
GND
VCC
IRQ
Power
Power
I/O
Ground
2
Main Supply 2.4 to 3.6 volts
3
Interrupt output (configurable active high or low), or GPIO
Module Reset. Internal on Chip 10k-ohm pull-down resistor. Active HIGH
SPI data input, or SDAT
4
RST
Input
I/O
Input
Input
Pull Up
Input
Hi Z
GND
NC
5
MOSI
SS
6
Input
Input
I/O
SPI Interface enable, Active LOW
SPI Clock
7
SCK
8
MISO
GND
PACTL
TXPA
RXPA
SPI data output pin or GPIO in 3-pin SPI mode.
9
Power
I/O
Ground
10
11
12
No Connect – Leave Open Circuit[8]
No Connect – Leave Open Circuit[8]
No Connect – Leave Open Circuit[8]
I/O
NC
I/O
NC
Artaflex Inc.
215 Konrad Crescent
Markham, Ontario, Canada
L3R8T9
File: AN-121-0001-R2
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b. AWS24S - Co-axial External Antenna Module
Size:
38.1 mm x 25.4 mm (1.5” x 1.0”)
AWS24S Connector Pin Information
Pin Name Type
Default
GND
VCC
-
Description
1
2
3
4
5
6
7
8
9
GND
VCC
IRQ
Power
Power
I/O
Ground
Main Supply 2.4 to 3.6 volts
Interrupt output (configurable active high or low), or GPIO
Module Reset. Internal on Chip 10k-ohm pull-down resistor. Active HIGH
SPI data input, or SDAT
RST
Input
I/O
Input
Input
Pull Up
Input
Hi Z
MOSI
SS
Input
Input
I/O
SPI Interface enable, Active LOW
SPI Clock
SCK
MISO
GND
SPI data output pin or GPIO in 3-pin SPI mode.
Ground
Power
GND
Artaflex Inc.
215 Konrad Crescent
Markham, Ontario, Canada
L3R8T9
File: AN-121-0001-R2
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10
11
12
PACTL
TXPA
RXPA
I/O
I/O
I/O
NC
NC
NC
No Connect – Leave Open Circuit[8]
No Connect – Leave Open Circuit[8]
No Connect – Leave Open Circuit[8]
c. AWA24S - Power Amplifier Module
Size:
25.4 mm x 20.32 mm
AWA24S Connector Pin Information
Pin Name Type
Default
GND
VCC
-
Description
1
GND
Power
Power
I/O
Ground
2
VCC
Main Supply 2.4 to 3.6 volts
3
IRQ
Interrupt output (configurable active high or low), or GPIO
Module Reset. Internal on Chip 10k-ohm pull-down resistor. Active HIGH
SPI data input, or SDAT
4
RST
Input
I/O
Input
Input
Pull Up
Input
Hi Z
5
MOSI
SS
6
Input
Input
I/O
SPI Interface enable, Active LOW
7
SCK
SPI Clock
8
MISO
GND
*PACTL
TXPA
RXPA
SPI data output pin or GPIO in 3-pin SPI mode.
Ground
9
Power
Power
Input
Input
GND
VCC
Input
Input
10
11
12
Power Control – max power at 3.3V - Shut down “0V”
Active High to set Module into a Transmit mode (RXPA = Low)
Active High to set the Module into a Receive mode (TXPA = Low)
Artaflex Inc.
215 Konrad Crescent
Markham, Ontario, Canada
L3R8T9
File: AN-121-0001-R2
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d. AWP24U - Wireless USB Dongle
Size:
45.7 mm x 20.3 mm
Artaflex Inc.
215 Konrad Crescent
Markham, Ontario, Canada
L3R8T9
File: AN-121-0001-R2
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e. AWAC24U – Wireless USB Dongle with PA
No Drawing Available. Mechanical Specifications Pending Release.
Artaflex Inc.
215 Konrad Crescent
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L3R8T9
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f. AW24MCHL-H2 - Micro Module with Chip Antenna
Size:
16 mm x 13.5 mm
g. AW24MCHL-HR - Micro Module with Chip Antenna and RA Connector
Artaflex Inc.
215 Konrad Crescent
Markham, Ontario, Canada
L3R8T9
File: AN-121-0001-R2
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AW24MCHL-H2 / HR Connector Pin Information
Header
Pin No
Name Type Default
Description
1
2
GND
VCC
Power
Power
GND
VCC
Ground
Main Supply 2.4 to 3.6 volts
Interrupt output (configurable active high or
low), or GPIO
3
4
IRQ
RST
I/O
-
Module Reset. Internal on Chip 10k-ohm pull-
down resistor. Active HIGH
Input
Input
5
6
MOSI
SS
I/O
Input
Input
I/O
Input
Pull Up
Input
SPI data input, or SDAT
SPI Interface enable, Active LOW
SPI Clock
7
SCK
MISO
GND
L/D
8
Hi Z
SPI data output pin or GPIO in 3-pin SPI mode.
Ground
9
Power
Power
GND
GND
10
Connect to GND.
Artaflex Inc.
215 Konrad Crescent
Markham, Ontario, Canada
L3R8T9
File: AN-121-0001-R2
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11
12
TXPA
RXPA
I/O
I/O
O
O
Can be used as GPIO
Can be used as GPIO
h. AW24MUFL-H2 - Micro Module with UFL connector
Size:
16 mm x 13.5 mm
Artaflex Inc.
215 Konrad Crescent
Markham, Ontario, Canada
L3R8T9
File: AN-121-0001-R2
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AW24MUFL-H2 Connector Pin Information
Header
Name Type Default
Pin No
Description
1
2
GND
VCC
Power
Power
GND
VCC
Ground
Main Supply 2.4 to 3.6 volts
Interrupt output (configurable active high or
low), or GPIO
3
4
IRQ
RST
I/O
-
Module Reset. Internal on Chip 10k-ohm pull-
down resistor. Active HIGH
Input
Input
5
6
MOSI
SS
I/O
Input
Input
I/O
Input
Pull Up
Input
Hi Z
GND
GND
O
SPI data input, or SDAT
SPI Interface enable, Active LOW
SPI Clock
7
SCK
8
MISO
GND
L/D
SPI data output pin or GPIO in 3-pin SPI mode.
Ground
9
Power
Power
I/O
10
11
12
Connect to GND.
TXPA
RXPA
Can be used as GPIO
Can be used as GPIO
I/O
O
Artaflex Inc.
215 Konrad Crescent
Markham, Ontario, Canada
L3R8T9
File: AN-121-0001-R2
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i. AW24MCHL-SM - Micro Module with Surface Mount Connections
Size:
15 mm x 13.5 mm
AW24MCHL-SM Connector Pin out Information
SMT
Pin No
Name Type Default
Description
12
11
GND
VCC
Power
Power
GND
VCC
Ground
Main Supply 2.4 to 3.6 volts
Interrupt output (configurable active high or
low), or GPIO
5
9
IRQ
RST
I/O
-
Module Reset. Internal on Chip 10k-ohm pull-
down resistor. Active HIGH
Input
Input
3
4
MOSI
SS
I/O
Input
Input
I/O
Input
Pull Up
Input
SPI data input, or SDAT
SPI Interface enable, Active LOW
SPI Clock
2
SCK
MISO
GND
L/D
6
Hi Z
SPI data output pin or GPIO in 3-pin SPI mode.
Ground
13
10
Power
Power
GND
GND
Connect to GND.
Buffered 0.75, 1.5, 3, 6, or 12 MHz clock, PACTL, or
GPIO.
Tri-states in sleep mode (configure as GPIO drive LOW).
7
XOUT
I/O
I/O
O
O
Control signal for external PA, T/R switch, or
GPIO.
No Connect – Leave Open Circuit[8]
8
PACTL
1,14,15,16
Artaflex Inc.
215 Konrad Crescent
Markham, Ontario, Canada
L3R8T9
File: AN-121-0001-R2
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5.0
Design Guidelines
5.1 PCB Design
All Falcon wireless modules except the surface mount version require a mating
receptacle connector on the host PCB. The following are recommended
connectors manufactured by FCI that will mate to the modules. Equivalents
from other manufacturers can also be used.
These are available as surface mount versions or through-hole:
FCI part number 55508-112TRLF (12 pin dual row 2mm vertical SM receptacle)
http://portal.fciconnect.com/portal/page/portal/FcicntPublic/ComergentConnect?appname=catDi
splayStyle$domProductQueryName=55508-112TRLF*$OP=search
FCI part number 63453-112LF (12 pin dual row 2mm vertical through hole
receptacle)
http://portal.fciconnect.com/portal/page/portal/FcicntPublic/ComergentConnect?appname=catDi
splayStyle$domProductQueryName=63453-112lf*$OP=search
Artaflex Inc.
215 Konrad Crescent
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L3R8T9
File: AN-121-0001-R2
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For Artaflex wireless module AW24MCHL-SM, there is no mating connector required
since it is mounted directly onto the host PCB. See below for recommended land
pattern.
Artaflex Inc.
215 Konrad Crescent
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L3R8T9
File: AN-121-0001-R2
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5.2 Module Placement Strategy
Artaflex wireless modules are RF devices that require proper placement on
PCB to ensure optimal performance. The antenna on the PCB has an omni-
directional radiation pattern. To maximize antenna efficiency, an adequate
grounding plane must be provided under the module. However, the areas
underneath and surrounding the antenna area must be free of copper. The
position of the module on the host board and overall design of the product
enclosure contribute to antenna performance. Poor design effects radiation
patterns and can result in reflection, diffraction, and/or scattering of the
transmitted signal thus limiting the range. Measured radiation patterns of these
modules are available from Artaflex and can be used to benchmark design
performance. In summary:
i. Never place the ground plane or route copper traces directly underneath the
antenna portion of the module.
ii. Never place the antenna close to metallic objects.
iii. Keep wiring, components and objects away from antenna.
iv. Do not place the antenna in a metallic or metalized plastic enclosure.
v. Enclosure walls should be 1cm or more away from the antenna in all
directions.
vi. If possible, mount antenna overhanging the edge of the host board. Add an
uninterrupted ground plane on host board, directly underneath the module, up
to the PCB edge. Adding a ground plane will allow traces to be run on the on
the bottom side of the host board if required. See diagram following.
vii. If antenna cannot be mounted in overhanging position, then provisions must
be made to keep area clear of copper as recommended in diagram.
viii. For designs that require external antenna and U.FL connector, use
recommended antenna. The rules for placement on edge are not required.
However, a ground plane is necessary underneath the module.
Artaflex Inc.
215 Konrad Crescent
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L3R8T9
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If required, please contact Artaflex for assistance for PCB layout and RF design.
Artaflex Inc.
215 Konrad Crescent
Markham, Ontario, Canada
L3R8T9
File: AN-121-0001-R2
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Artaflex Inc.
215 Konrad Crescent
Markham, Ontario, Canada
L3R8T9
File: AN-121-0001-R2
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http://www.artaflexmodules.com
5.3 External Antenna Applications
Artaflex recommends using Centurion antenna WRR2400-IP04-B for modules
that require an external antenna. This antenna has been qualified and approved
for use by regulatory agencies in the US, Canada and European Union under the
Modular Approval certification. It is compatible with the RF impedance and
frequency range of all Artaflex models that have an external antenna with U.FL
connector. The use of any antenna that does not meet the same parameters as
the antenna recommended voids the Modular Approval grant.
Follow the recommended rules for optimal performance:
i.
ii.
Place antenna vertically for longest range and best communication
Allow 75-130 mm clearance from antenna to any metallic objects
iii.
Artaflex Inc.
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L3R8T9
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6. SMT Assembly Guidelines for AW24MCHL-SM
j. Solder Reflow Profiles
Package Reflow Parameters
J-STD-020
Convention 220 +/- Reflow Profile
Average ramp-up rate (183ْC to peak)
Preheat temperature 125ْC (+/- 25ْC)
Temperature maintained above 183ْC
Time within 5ْC of actual peak temperature
Peak temperature range
3ْC/second max
120 seconds max
60~150 seconds
10~20 seconds
220 +5/-0ْC
Ramp-down rate
Time 25ْC to peak temperature
6ْC/second max
6 minutes max
Package Reflow Parameters
J-STD-020
Convention 235 +5/-0ْC Reflow Profile
Average ramp-up rate (183ْC to peak)
Preheat temperature 125ْC (+/- 25ْC)
Temperature maintained above 183ْC
Time within 5ْC of actual peak temperature
Peak temperature range
3ْC/second max
120 seconds max
60 ~150 seconds
10 ~ 20 seconds
235 +5/-0ْC
Ramp-down rate
Time 25ْC to peak temperature
6ْC/second max
6 minutes max
Package Reflow Parameters
NEMI Recommended
Convection or IR 260ْC Reflow Profile
Ramp-up rate (217ْC to peak)
Preheat temperature 125ْC (+/- 25ْC)
Time 50ْC to peak temperature
Temperature maintained above 217ْC
Time within 5ْC of actual peak temperature
Peak temperature range
3ْC/second max
60 to 120 seconds max
3.5 minutes, 6 minutes max
60 to 150 seconds
10 ~ 20 seconds
260ْC -5/+0ْC
Ramp-down rate
6ْC/second max
Artaflex Inc.
215 Konrad Crescent
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L3R8T9
File: AN-121-0001-R2
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k. Pb-Free Soldering Paste
Use of “No Clean” soldering paste is strongly recommended, as it does not
require cleaning after the soldering process.
Note: The quality of the solder joints on the castellations (‘half vias’) where they
contact the host board should meet the appropriate IPC specification. See IPC-
A-610-D Acceptability of Electronic Assemblies, section 8.2.4 Castellated
Terminations
.
l. Cleaning
In general, cleaning the populated modules is strongly discouraged. Residuals
under the module cannot be easily removed with any cleaning process.
Cleaning with water can lead to capillary effects where water is absorbed into
the gap between the host board and the module. The combination of soldering
flux residuals and encapsulated water could lead to short circuits between
neighboring pads. Water could also damage any stickers or labels.
Cleaning with alcohol or a similar organic solvent will likely flood soldering flux
residuals into the two housings, which is not accessible for post-washing
inspection. The solvent could also damage any stickers or labels.
Ultrasonic cleaning could damage the module permanently.
The best approach is to consider using a “no clean” soldering paste and
eliminate the post-soldering cleaning step.
m. Optical Inspection
After soldering the Module to the host board, consider optical inspection to
check the following:
Proper alignment and centering of the module over the pads.
Proper solder joints on all pads.
Excessive solder or contacts to neighboring pads, or vias.
Artaflex Inc.
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L3R8T9
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n. Repeating Reflow Soldering
Only a single reflow soldering process is encouraged for host boards.
o. Wave Soldering
If a wave soldering process is required on the host boards due to the presence
of leaded components, only a single wave soldering process should be used.
p. Hand Soldering
Hand soldering is possible. Use a soldering iron temperature setting equivalent
to 350°C, follow IPC recommendations/reference document IPC-7711.
q. Rework
The SMT Module can be unsoldered from the host board. Use of a hot air re-
work tool and hot plate for pre-heating from underneath is recommended. Avoid
overheating
.
Warning!
Never attempt a rework on the module itself, e.g. replacing individual
components. Such actions will void warranty coverage.
The information contained herein is subject to change without notice and may be found to contain errors of omission or changes in parameters. For
feedback or technical support regarding Artaflex CyFi Radio Modem products please contact Artaflex at www.artaflex.com.
Artaflex Inc. assumes no responsibility for the use of any circuitry other than circuitry embodied in an Artaflex product.
Nor does it convey or imply any license under patent or other rights. Artaflex products are not warranted nor intended to be used for medical, life support,
life saving, critical control or safety applications, unless pursuant to an express written agreement with Artaflex Inc. Furthermore, Artaflex does not
authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in
significant injury to the user. The inclusion of Artaflex products in life-support systems application implies that the manufacturer assumes all risk of such
use and in doing so indemnifies Artaflex Inc. against all charges.
CyFi and AutoRate are trademarks™ of Cypress Semiconductor.
All products and company names mentioned in this document are the trademarks of their respective holders.
Artaflex Inc.
215 Konrad Crescent
Markham, Ontario, Canada
L3R8T9
File: AN-121-0001-R2
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(905) 479-0148
http://www.artaflexmodules.com
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