BLM8G0710S-60PBY [ETC]
RF FET LDMOS 65V 36.2DB SOT12112;
| 型号： | BLM8G0710S-60PBY |
| 厂家： | 
ETC |
| 描述： | RF FET LDMOS 65V 36.2DB SOT12112 |
| 文件： | 总21页 (文件大小：1739K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
BLM8G0710S-60PB;
BLM8G0710S-60PBG
LDMOS 2-stage power MMIC
Rev. 3 — 13 September 2018
Product data sheet
1. Product profile
1.1 General description
The BLM8G0710S-60PB(G) is a dual section, 2-stage power MMIC using Ampleon’s state
of the art GEN8 LDMOS technology. This multiband device is perfectly suited as general
purpose driver or small cell final in the frequency range from 700 MHz to 1000 MHz.
Available in gull wing or straight lead outline.
Table 1.
Performance
Typical RF performance at Tcase = 25 °C.
Test signal: 3GPP test model 1; 64 DPCH; PAR = 9.9 dB at 0.01% probability on CCDF; per section
unless otherwise specified in a class-AB production circuit.
Test signal
f
VDS
(V)
28
PL(AV)
(W)
6
Gp
ηD
ACPR5M
(dBc)
40
(MHz)
957.5
(dB)
34.7
(%)
26
single carrier W-CDMA
1.2 Features and benefits
Designed for broadband operation (frequency 700 MHz to 1000 MHz)
High section-to-section isolation enabling multiple combinations
Integrated temperature compensated bias
Biasing of individual stages is externally accessible
Integrated ESD protection
Excellent thermal stability
High power gain
On-chip matching for ease of use
For RoHS compliance see the product details on the Ampleon website
1.3 Applications
RF power MMIC for W-CDMA base stations in the 700 MHz to 1000 MHz frequency
range. Possible circuit topologies are the following as also depicted in Section 8.1:
Dual section or single ended
Doherty
Quadrature combined
Push-pull
BLM8G0710S-60PB(G)
LDMOS 2-stage power MMIC
2. Pinning information
2.1 Pinning
pin 1 index
VDS(A1)
VGS(A2)
VGS(A1)
RF_IN_A
n.c.
1
2
3
4
5
6
7
RF_OUT_ VDS(A2)
16
n.c.
n.c.
n.c.
n.c.
n.c.
8
9
10
11
12
13
14
RF_IN_B
VGS(B1)
RF_OUT_ VDS(B2)
15
VGS(B2)
VDS(B1)
amp00601
Transparent top view
The exposed backside of the package is the ground terminal of the device.
Fig 1. Pin configuration
2.2 Pin description
Table 2.
Symbol
VDS(A1)
VGS(A2)
VGS(A1)
RF_IN_A
n.c.
Pin description
Pin
Description
1
drain-source voltage of section A, driver stage (A1)
gate-source voltage of section A, final stage (A2)
gate-source voltage of section A, driver stage (A1)
RF input section A
2
3
4
5
not connected
n.c.
6
not connected
n.c.
7
not connected
n.c.
8
not connected
n.c.
9
not connected
n.c.
10
11
12
13
14
not connected
RF_IN_B
VGS(B1)
VGS(B2)
VDS(B1)
RF input section B
gate-source voltage of section B, driver stage (B1)
gate-source voltage of section B, final stage (B2)
drain-source voltage of section B, driver stage (B1)
BLM8G0710S-60PB_S-60PBG
All information provided in this document is subject to legal disclaimers.
© Ampleon Netherlands B.V. 2018. All rights reserved.
Product data sheet
Rev. 3 — 13 September 2018
2 of 21
BLM8G0710S-60PB(G)
LDMOS 2-stage power MMIC
Table 2.
Pin description …continued
Symbol
Pin
15
Description
RF output section B / drain-source voltage of section B, final stage (B2)
RF output section A / drain-source voltage of section A, final stage (A2)
RF_OUT_B/VDS(B2)
RF_OUT_A/VDS(A2)
GND
16
flange RF ground
3. Ordering information
Table 3.
Ordering information
Type number
Package
Name Description
Version
BLM8G0710S-60PB
-
plastic, heatsink small outline package;
SOT1211-3
16 leads (flat)
BLM8G0710S-60PBG -
plastic, heatsink small outline package; 16 leads
SOT1212-3
4. Block diagram
V
DS(A1)
RF_IN_A
RF_OUT_A / V
DS(A2)
V
V
TEMPERATURE
COMPENSATED BIAS
GS(A1)
GS(A2)
V
TEMPERATURE
COMPENSATED BIAS
GS(B1)
V
GS(B2)
RF_IN_B
RF_OUT_B / V
DS(B2)
V
DS(B1)
aaa-009323
Fig 2. Block diagram
5. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
VDS
Parameter
Conditions
Min
Max
65
Unit
V
drain-source voltage
gate-source voltage
storage temperature
junction temperature
case temperature
-
VGS
0.5 +13
V
Tstg
65
+150 C
[1]
Tj
-
-
225
150
C
C
Tcase
[1] Continuous use at maximum temperature will affect the reliability. For details refer to the online MTF
calculator.
BLM8G0710S-60PB_S-60PBG
All information provided in this document is subject to legal disclaimers.
© Ampleon Netherlands B.V. 2018. All rights reserved.
Product data sheet
Rev. 3 — 13 September 2018
3 of 21
BLM8G0710S-60PB(G)
LDMOS 2-stage power MMIC
6. Thermal characteristics
Table 5.
Thermal characteristics
Measured for total device.
Symbol Parameter
Conditions
Value Unit
[1]
Rth(j-c)
thermal resistance from junction to case
final stage; Tcase = 90 C; PL = 5 W
driver stage; Tcase = 90 C; PL = 5 W
0.9
3.7
K/W
K/W
[1]
[1] When operated with a CW signal.
7. Characteristics
Table 6.
DC characteristics
Tcase = 25 °C; per section unless otherwise specified.
Symbol Parameter
Conditions
Min
Typ
Max
Unit
Final stage
V(BR)DSS drain-source breakdown voltage
VGS = 0 V; ID = 482 A
VDS = 28 V; ID = 240 mA
VDS = 28 V; ID = 240 mA
40 C Tcase +85 C
65
1.5
1.7
-
-
-
V
V
V
%
VGSq
gate-source quiescent voltage
2
2.7
3.6
-
[1]
[1]
2.65
1
IDq/T
quiescent drain current variation
with temperature
IDSS
IDSX
IGSS
drain leakage current
drain cut-off current
gate leakage current
VGS = 0 V; VDS = 28 V
VGS = 5.65 V; VDS = 10 V
VGS = 1.0 V; VDS = 0 V
-
-
-
-
1.4
-
A
A
8.3
-
140
nA
Driver stage
V(BR)DSS drain-source breakdown voltage
VGS = 0 V; ID = 120.6 A
VDS = 28 V; ID = 60 mA
VDS = 28 V; ID = 60 mA
40 C Tcase +85 C
65
1.5
1.7
-
-
-
V
V
V
%
VGSq
gate-source quiescent voltage
2
2.7
3.6
-
[2]
[2]
2.65
1
IDq/T
quiescent drain current variation
with temperature
IDSS
IDSX
IGSS
drain leakage current
drain cut-off current
gate leakage current
VGS = 0 V; VDS = 28 V
VGS = 5.65 V; VDS = 10 V
VGS = 1.0 V; VDS = 0 V
-
-
-
-
1.4
-
A
A
2.1
-
140
nA
[1] In production circuit with 1.3 k gate feed resistor.
[2] In production circuit with 1.2 k gate feed resistor.
Table 7.
RF Characteristics
Typical RF performance at Tcase = 25 °C; VDS = 28 V; IDq1 = 60 mA (driver stage); IDq2 = 240 mA (final stage); PL(AV) = 6 W;
unless otherwise specified, measured in an Ampleon wideband straight lead production circuit.
Symbol Parameter
Conditions
Min
Typ
Max
Unit
Test signal: single carrier W-CDMA [1]
Gp
power gain
f = 730.5 MHz
f = 957.5 MHz
f = 730.5 MHz
f = 957.5 MHz
-
35.6
34.7
23.4
26
-
dB
dB
%
33.2
-
36.2
D
drain efficiency
-
-
21
%
BLM8G0710S-60PB_S-60PBG
All information provided in this document is subject to legal disclaimers.
© Ampleon Netherlands B.V. 2018. All rights reserved.
Product data sheet
Rev. 3 — 13 September 2018
4 of 21
BLM8G0710S-60PB(G)
LDMOS 2-stage power MMIC
Table 7.
RF Characteristics …continued
Typical RF performance at Tcase = 25 °C; VDS = 28 V; IDq1 = 60 mA (driver stage); IDq2 = 240 mA (final stage); PL(AV) = 6 W;
unless otherwise specified, measured in an Ampleon wideband straight lead production circuit.
Symbol Parameter
RLin input return loss
Conditions
Min
Typ
17
39.5
40
8
Max
10
-
Unit
dB
f = 957.5 MHz
-
ACPR5M adjacent channel power ratio f = 730.5 MHz
-
dBc
(5 MHz)
f = 957.5 MHz
-
34.5 dBc
PARO
output peak-to-average ratio
f = 730.5 MHz
f = 957.5 MHz
-
-
-
dB
dB
6.7
8
Test signal: CW [2]
s21
s212
phase response difference
between sections
10
-
-
+10
deg
insertion power gain difference between sections
0.5
+0.5 dB
[1] 3GPP test model 1; 64 DPCH; PAR = 9.9 dB at 0.01% probability on CCDF.
[2] f = 957.5 MHz.
8. Application information
Table 8.
Typical performance
Test signal: 1-tone pulsed CW; RF performance at Tcase = 25 °C; VDS = 28 V; IDq = 600 mA unless otherwise specified,
measured in an Ampleon wideband f = 700 MHz to 1000 MHz class AB application circuit.
Symbol Parameter
PL(1dB) output power at 1 dB gain compression f = 800 MHz
D
Conditions
Min Typ
Max Unit
-
-
-
-
-
-
-
74
-
-
-
-
-
-
-
W
drain efficiency
power gain
at PL(1dB); f = 800 MHz
58.4
36.5
154
0.3
%
Gp
PL(AV) = 11.2 W; f = 800 MHz
2-tone CW; PL(AV) = 40 W; f = 881.5 MHz
PL(AV) = 11.2 W; f = 700 MHz to 1000 MHz
f = 800 MHz
dB
Bvideo
Gflat
video bandwidth
gain flatness
MHz
dB
G/T
s122
gain variation with temperature
isolation
0.03
24.5
dB/C
dB
between sections A and B; PL(AV) = 8 W;
f = 800 MHz
K
Rollett stability factor
T = 40 C; f = 0.1 GHz to 3 GHz
-
>1.2
-
BLM8G0710S-60PB_S-60PBG
All information provided in this document is subject to legal disclaimers.
© Ampleon Netherlands B.V. 2018. All rights reserved.
Product data sheet
Rev. 3 — 13 September 2018
5 of 21
BLM8G0710S-60PB(G)
LDMOS 2-stage power MMIC
40 mm
10 μF
Ferrite
120 pF
1.2 kΩ
1.3 kΩ
10 μF
10 μF
10 μF
3.9 pF
4.7 pF
4.3 pF
4.3 pF
100 Ω
40 mm
3.9 pF
10 μF
10 μF
1.3 kΩ
1.2 kΩ
10 μF
120 pF
Ferrite
10 μF
amp00006
Printed-Circuit Board (PCB): Rogers 4350; thickness = 0.508 mm.
Fig 3. Component layout for class-AB application circuit
BLM8G0710S-60PB_S-60PBG
All information provided in this document is subject to legal disclaimers.
© Ampleon Netherlands B.V. 2018. All rights reserved.
Product data sheet
Rev. 3 — 13 September 2018
6 of 21
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VDS
28 V
BLM8G0710S-60PB
Single ended class AB compact board
schematics 700 MHz - 1000 MHz
VGS
10 F
50 V
Ferrite
120 pF
0805
10 F
50 V
VDS
28 V
VDS(A1)
1
2
3
4
BLM8G0710S-60PB PathA
10 F
6.3 V
VGS(A2)
VGS(A1)
RF_IN_A
n.c.
1.3 kȍ
1.2 kȍ
10 F
6.3 V
Final
clamped
RF sense FET
Driver
clamped
RF sense FET
5
6
7
16
n.c.
n.c.
RF in
3.9 pF
0805
4.3 pF
0805
RF out
100 ȍ
Driver
RF power FET
Final
RF power FET
Driver
RF power FET
Final
RF power FET
4.7 pF
0805
4.3 pF
0805
3.9 pF
0805
n.c.
n.c.
8
9
15
n.c.
10
11
Driver
clamped
RF sense FET
Final
clamped
RF sense FET
RF_IN_B
VGS(B1)
VGS(B2)
VDS(B1)
10 F
6.3 V
1.2 kȍ
12
13
14
1.3 kȍ
10 F
6.3 V
BLM8G0710S-60PB PathB
10 F
50 V
120 pF
0805
10 F
50 V
Ferrite
amp00007
Fig 4. Electrical schematic
BLM8G0710S-60PB(G)
LDMOS 2-stage power MMIC
8.1 Possible circuit topologies
-3 dB / Φ-0°
In A
Out A
Out
In
-3 dB / Φ-0°
In B
Out B
amp00514
Fig 5. Dual section or single ended
Splitter
Combiner
In
-3 dB / Φ-0°
λ/4
λ/4
-3 dB / Φ-90°
Out
amp00603
Fig 6. Doherty
3 dB Coupler
3 dB Coupler
In
-3 dB / Φ-0°
-3 dB / Φ-90°
Out
amp00515
Fig 7. Quadrature combined
BLM8G0710S-60PB_S-60PBG
All information provided in this document is subject to legal disclaimers.
© Ampleon Netherlands B.V. 2018. All rights reserved.
Product data sheet
Rev. 3 — 13 September 2018
8 of 21
BLM8G0710S-60PB(G)
LDMOS 2-stage power MMIC
Splitter
λ/2
Combiner
In
-3 dB / Φ-0°
λ/2
-3 dB / Φ-180°
Out
amp00516
Fig 8. Push-pull
8.2 Ruggedness in class-AB operation
The BLM8G0710S-60PB and BLM8G0710S-60PBG are capable of withstanding a load
mismatch corresponding to VSWR = 30 : 1 through all phases under the following
conditions: VDS = 32 V; IDq1 = 60 mA; IDq2 = 192 mA; Pi = 13 dBm, Pi is measured at CW
and corresponding to PL(3dB) under ZS = 50 ; f = 840 MHz.
8.3 Impedance information
Table 9.
Typical impedance tuned for maximum output power
Measured load-pull data per section; test signal: pulsed CW; Tcase = 25 °C; VDS = 28 V; IDq1 = 60 mA; IDq2 = 240 mA;
tp = 100 μs; δ = 10 %; ZS = 50 Ω. Typical values unless otherwise specified.
tuned for maximum output power
tuned for maximum power added efficiency
f
ZL
Gp(max) PL
ηadd
AM-PM
conversion
ZL
Gp(max) PL
ηadd
AM-PM
conversion
(MHz)
(Ω)
(dB)
(dBm) (%)
(deg)
(Ω)
(dB)
(dBm) (%)
(deg)
BLM8G0710S-60PB
700
720
740
760
780
800
820
840
860
880
900
920
940
960
980
3.0 + j2.1
3.0 + j1.7
3.0 + j1.7
3.0 + j1.3
3.3 + j1.3
3.2 + j0.9
3.3 + j1.0
3.4 + j0.5
3.5 + j0.5
3.4 + j0.4
3.4 + j0.3
3.4 + j0.4
3.5 + j0.0
3.5 j0.1
3.5 j0.1
36.1
35.9
35.8
35.4
35.3
35.2
35.0
34.8
34.7
34.8
34.7
34.7
34.5
34.2
34.2
47.2
47.3
47.4
47.4
47.5
47.5
47.5
47.5
47.5
47.4
47.4
47.4
47.3
47.3
47.3
55.1
53.4
54.8
53.5
55.0
53.8
54.9
53.2
53.8
53.2
53.4
54.4
52.9
52.7
53.9
2.4
2.5
3.0
3.0
2.4
3.1
2.4
2.3
2.1
1.8
2.1
1.4
1.1
1.3
0.4
4.2 + j5.2
4.4 + j5.0
4.2 + j4.5
4.1 + j4.8
4.0 + j4.4
3.9 + j4.2
4.1 + j3.8
3.8 + j4.0
3.8 + j3.8
4.0 + j3.5
3.7 + j3.6
3.8 + j3.7
3.5 + j3.2
3.5 + j3.1
3.4 + j2.8
37.6
37.8
37.5
37.2
37.0
37.0
36.7
36.8
36.7
36.7
36.8
36.8
36.6
36.4
36.2
45.3
45.4
45.7
45.4
45.7
45.8
46.0
45.7
45.7
45.9
45.7
45.5
45.7
45.7
45.8
65.7
64.6
64.7
64.3
63.7
64.0
63.6
63.4
63.1
63.1
63.0
63.0
62.3
62.0
62.2
1.5
1.0
0.2
0.9
1.3
1.0
0.1
1.3
1.2
0.3
0.9
0.5
0.5
0.3
1.0
BLM8G0710S−60PBG
BLM8G0710S-60PB_S-60PBG
All information provided in this document is subject to legal disclaimers.
© Ampleon Netherlands B.V. 2018. All rights reserved.
Product data sheet
Rev. 3 — 13 September 2018
9 of 21
BLM8G0710S-60PB(G)
LDMOS 2-stage power MMIC
Table 9.
Typical impedance tuned for maximum output power …continued
Measured load-pull data per section; test signal: pulsed CW; Tcase = 25 °C; VDS = 28 V; IDq1 = 60 mA; IDq2 = 240 mA;
tp = 100 μs; δ = 10 %; ZS = 50 Ω. Typical values unless otherwise specified.
tuned for maximum output power
tuned for maximum power added efficiency
f
ZL
Gp(max) PL
ηadd
AM-PM
conversion
ZL
Gp(max) PL
ηadd
AM-PM
conversion
(MHz)
700
720
740
760
780
800
820
840
860
880
900
920
940
960
(Ω)
(dB)
36.3
36.4
35.9
35.6
35.5
35.4
35.8
35.5
34.5
34.7
34.8
35
(dBm) (%)
(deg)
0.3
(Ω)
(dB)
37.7
37.7
37.3
37.0
37.0
37.0
37.3
36.6
35.9
36.4
36.5
36.6
36.4
36.1
(dBm) (%)
(deg)
3.2
2.2
2.0
2.2
2.9
3.2
1.8
1.3
2.5
3.2
2.7
1.9
1.2
2.2
3.0 + j0.6
3.0 + j0.6
2.9 + j0.3
3.0 + j0.2
3.3 j0.1
3.3 j0.5
3.3 j0.5
3.3 j0.5
3.5 j0.9
3.4 j1.0
3.4 j1.2
3.4 j1.1
3.5 j1.4
3.5 j1.6
47.5
47.5
47.6
47.7
47.7
47.7
47.7
47.6
47.7
47.6
47.6
47.6
47.5
47.5
55.1
55.6
54.6
56.0
55.9
54.4
55.2
55.4
54.9
54.2
54.2
55.4
54.7
54.9
4.5 + j3.6
4.4 + j3.1
4.1 + j3.4
4.4 + j2.8
4.3 + j2.9
3.9 + j2.6
4.1 + j2.3
4.1 + j2.1
3.8 + j2.0
3.6 + j2.0
3.7 + j1.8
3.7 + j1.8
3.8 + j1.6
3.5 + j1.3
45.8
46.1
45.8
46.1
46.0
46.1
46.2
46.3
46.3
46.1
46.1
45.9
46.0
46.0
66.1
65.7
65.4
65.1
64.7
64.4
64.0
63.7
63.7
63.1
63.3
63.2
62.8
62.8
0.6
1.9
0.6
0.9
0.8
1.3
1.3
0.6
0.1
0.0
0.4
0.3
0.4
34.7
34.4
8.4 Graphs
amp00008
amp00009
40
30
20
10
0
0
38
0
G
RL
G
RL
in
(dB)
p
in
p
(1)
(dB)
(dB)
(dB)
-10
-20
-30
-40
36
34
32
30
-6
(2)
(1)
(2)
-12
-18
-24
200
400
600
800
1000
1200
700
750
800
850
900
950
f (MHz)
1000
f (MHz)
Tcase = 25 C; VDS = 28 V; IDq1 = 60 mA; IDq2 = 240 mA;
Tcase = 25 C; VDS = 28 V; IDq1 = 60 mA; IDq2 = 240 mA;
PL = 2 W. Per section.
PL = 2 W. Per section.
(1) magnitude of Gp
(2) magnitude of RLin
(1) magnitude of Gp
(2) magnitude of RLin
Fig 9. Wideband power gain and input return loss as
function of frequency; typical values
Fig 10. In-band power gain and input return loss as
function of frequency; typical values
BLM8G0710S-60PB_S-60PBG
All information provided in this document is subject to legal disclaimers.
© Ampleon Netherlands B.V. 2018. All rights reserved.
Product data sheet
Rev. 3 — 13 September 2018
10 of 21
BLM8G0710S-60PB(G)
LDMOS 2-stage power MMIC
amp00010
amp00011
40
38
36
34
32
80
60
40
20
0
8
(1)
G
η
φ
/φ
(deg)
p
D
s21 s21(norm)
(2)
(3)
(4)
(dB)
(%)
4
0
G
p
((11))
((22))
((33))
((44))
-4
η
D
-8
25
30
35
40
45
(dBm)
50
25
30
35
40
45
50
P
L
P
(dBm)
L
Tcase = 25 C; VDS = 28 V; IDq1 = 60 mA; IDq2 = 240 mA.
Normalized at PL = 22 dBm; Tcase = 25 C; VDS = 28 V;
Per section.
IDq1 = 60 mA; IDq2 = 240 mA. Per section.
(1) f = 700 MHz
(2) f = 800 MHz
(3) f = 900 MHz
(4) f = 1000 MHz
(1) f = 700 MHz
(2) f = 800 MHz
(3) f = 900 MHz
(4) f = 1000 MHz
Fig 11. Power gain and drain efficiency as function of
output power; typical values
Fig 12. Normalized phase response as a function of
output power; typical values
amp00012
-10
IMD
(dBcc))
(1)
(2)
IMD3
IMD5
-30
(1)
(2)
IMD7
(1)
(2)
-50
-70
-90
2
3
1
10
10
10
tone spacing (MHz)
Tcase = 25 C; VDS = 28 V; IDq1 = 60 mA; IDq2 = 240 mA; f = 881.5 MHz; 2-tone CW, PL = 20 W. Per section.
(1) IMD low
(2) IMD high
Fig 13. Intermodulation distortion as a function of tone spacing; typical values
BLM8G0710S-60PB_S-60PBG
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Product data sheet
Rev. 3 — 13 September 2018
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BLM8G0710S-60PB(G)
LDMOS 2-stage power MMIC
amp00013
amp00014
-20
ACPR
(dBc)
50
40
30
20
10
0
60
2
η
|s |
12
D
(%)
(dB)
-30
48
36
24
12
0
-40
-50
-60
-70
ACPRR
5M
η
D
ACPPRR
10M
30
32.5
35
37.5
40
42.5
(dBm)
45
500
600
700
800
900 1000 1100 1200
f (MHz)
P
L
Tcase = 25 C; VDS = 28 V; IDq1 = 60 mA; IDq2 = 240 mA:
f = 900 MHz; 1-carrier W-CDMA; test model 1;
Tcase = 25 C; VDS = 28 V; IDq1 = 40 mA; IDq2 = 260 mA,
measured on evaluation board.
PAR = 9.9 dB at 0.01% probability on CCDF. Per section
Fig 14. Adjacent channel power ratio and drain
efficiency as function of output power;
typical values
Fig 15. Section A to B isolation as a function of
frequency; typical values
BLM8G0710S-60PB_S-60PBG
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BLM8G0710S-60PB(G)
LDMOS 2-stage power MMIC
9. Package outline
SOT1211-3
(18.01)
(2.15)
(15.44)
7.45
(0.75)
E
0.10 (4)
A
15
16
0.05 A
L
R1.38
16.00
P
2.00 0.1
Z
R0.16 max.
0.10
1
14
metal protrusion 4x
(ground) in corners (2)
1.57 (5)
0.22 0.05
1.50
B
1.00 (12x)
0.25 B
0.35 (14x) (3)
L
+
-
0.08
0.03
20.75(1)
0.05 B
L
3.92
R1.00
R0.32
B
20.57
(0.20) molding compound around
the perimeter of the heatsink
R0.60(4x)
pin 17 (6)
0.25 B
5.50 (3)
L
Min. 15.5
Min. 18.5
1
Tolerances unless otherwise stated:
Angle:
Revision:
Revision date:
Package outline drawing:
SOT1211-3
7/26/2018
B
1°
Dimension:
B
0.05
units in mm.
Third angle projection
Sheet 1 of 2
Fig 16. Package outline SOT1211-3 (sheet 1 of 2)
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BLM8G0710S-60PB(G)
LDMOS 2-stage power MMIC
SOT1211-3
Drawing Notes
Description
Items
(1)
Dimensions are excluding mold protrusion. Areas located adjacent to the leads have a maximum mold protrusion of 0.25
mm (per side) and 0.62 mm max. in length. In between the 14 leads the protrusion is 0.25 mm. max. At all other areas the
mold protrusion is maximum 0.15 mm per side. See also detail B.
(2)
(3)
(4)
(5)
(6)
(7)
The metal protrusion (tie bars) in the corner will not stick out of the molding compound protrusions (detail A).
The lead dambar (metal) protrusions are not included. Add 0.14 mm max to the total lead dimension at the dambar location.
The lead coplanarity over all leads is 0.1 mm maximum.
Dimension is measured 0.5 mm from the edge of the top package body.
The hatched area indicates the exposed metal heatsink.
The leads and exposed heatsink are plated with matte Tin (Sn).
location of metal protrusion (2)
DETAIL
A
SCALE 25:1
B
A
lead dambar
location
DETAIL
B
SCALE 50:1
1
Tolerances unless otherwise stated:
Angle:
Revision:
Revision date:
Package outline drawing:
SOT1211-3
7/26/2018
B
1°
Dimension:
B
0.05
units in mm.
Third angle projection
Sheet 2 of 2
Fig 17. Package outline SOT1211-3 (sheet 2 of 2)
BLM8G0710S-60PB_S-60PBG
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Product data sheet
Rev. 3 — 13 September 2018
14 of 21
BLM8G0710S-60PB(G)
LDMOS 2-stage power MMIC
SOT1212-3
(18.01)
(15.44)
7.45
(2.15)
(0.75)
A
0.05 A
L
16
15
R1.38
16
P2 0.1Z
R0.16 max.
14
1
metal protrusion 4x
C
1.5
(ground) in corners (2)
1
(12x)
0.25 B
L
0.35 (14x) (3)
20.75 (1)
0.05 B
L
DETAIL
C
+
-
.08
.03
3.92
SCALE 25:1
R1
H
R0.32
20.57
B
0.10
(0.20) compound rim all around the
perimeter of the heatsink
+
-
4°
3°
3.0°
+0.06
0.00
(6)
-
0.02
Gage plane
pin 17 (4)
0.35 (7)
Seating plane
R0.60 (4x)
0.25 B
5.5 (3)
L
Min. 15.5
Min. 18.5
1
Tolerances unless otherwise stated:
Angle:
Revision:
Revision date:
Package outline drawing:
SOT1212-3
7/26/2018
B
1°
Dimension:
B
0.05
units in mm.
Third angle projection
Sheet 1 of 2
Fig 18. Package outline SOT1212-3 (sheet 1 of 2)
BLM8G0710S-60PB_S-60PBG
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Product data sheet
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BLM8G0710S-60PB(G)
LDMOS 2-stage power MMIC
SOT1212-3
Drawing Notes
Description
Items
(1)
Dimensions are excluding mold protrusion. Areas located adjacent to the leads have a maximum mold protrusion of 0.25
mm (per side) and 0.62 mm max. in length. In between the 14 leads the protrusion is 0.25 mm max. At all other areas the
mold protrusion is maximum 0.15 mm per side. See also detail B.
(2)
(3)
(4)
(5)
The metal protrusion (tie bars) in the corner will not stick out of the molding compound protrusions (detail A).
The lead dambar (metal) protrusions are not included. Add 0.14 mm max to the total lead dimension at the dambar location.
The hatched area indicated the exposed heatsink.
The leads and exposed heatsink are plated with matte Tin (Sn).
Dimension is measured with respect to the bottom of the heatsink Datum H. Positive value means that the bottom of the
heatsink is higher than the bottom of the lead.
(6)
(7)
Gage plane (foot length) to be measured from the seating plane.
location of metal protrusion (2)
B
DETAIL
A
SCALE 25:1
A
lead dambar
location
DETAIL
B
SCALE 50:1
1
Tolerances unless otherwise stated:
Angle:
Revision:
Revision date:
Package outline drawing:
SOT1212-3
7/26/2018
B
1°
Dimension:
B
0.05
units in mm.
Third angle projection
Sheet 2 of 2
Fig 19. Package outline SOT1212-3 (sheet 2 of 2)
BLM8G0710S-60PB_S-60PBG
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Product data sheet
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BLM8G0710S-60PB(G)
LDMOS 2-stage power MMIC
10. Handling information
CAUTION
This device is sensitive to ElectroStatic Discharge (ESD). Observe precautions for handling
electrostatic sensitive devices.
Such precautions are described in the ANSI/ESD S20.20, IEC/ST 61340-5, JESD625-A or
equivalent standards.
Table 10. ESD sensitivity
ESD model
Class
C1 [1]
1B [2]
Charged Device Model (CDM); According to ANSI/ESDA/JEDEC standard JS-002
Human Body Model (HBM); According to ANSI/ESDA/JEDEC standard JS-001
[1] CDM classification C1 is granted to any part that passes after exposure to an ESD pulse of 250 V.
[2] HBM classification 1B is granted to any part that passes after exposure to an ESD pulse of 500 V.
11. Abbreviations
Table 11. Abbreviations
Acronym
AM
Description
Amplitude Modulation
3GPP
CCDF
CW
3rd Generation Partnership Project
Complementary Cumulative Distribution Function
Continuous Wave
DPCH
ESD
Dedicated Physical CHannel
ElectroStatic Discharge
GEN8
LDMOS
MMIC
MTF
Eighth Generation
Laterally Diffused Metal Oxide Semiconductor
Monolithic Microwave Integrated Circuit
Median Time to Failure
PAR
Peak-to-Average Ratio
PM
Phase Modulation
RoHS
VSWR
W-CDMA
Restriction of Hazardous Substances
Voltage Standing Wave Ratio
Wideband Code Division Multiple Access
BLM8G0710S-60PB_S-60PBG
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Product data sheet
Rev. 3 — 13 September 2018
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BLM8G0710S-60PB(G)
LDMOS 2-stage power MMIC
12. Revision history
Table 12. Revision history
Document ID
Release date Data sheet status
Product data sheet
Change notice
Supersedes
BLM8G0710S-60PB_S-60PBG v.3 20180913
-
BLM8G0710S-60PB_
S-60PBG v.2
Modifications
• Figure 1 on page 2: figure updated
• Table 3 on page 3: package outline versions changed to SOT1211-3 and
SOT1212-3
• Figure 3 on page 6: figure updated
• Figure 5 on page 8: figure updated
• Figure 6 on page 8: figure updated
• Figure 7 on page 8: figure updated
• Figure 8 on page 9: figure updated
• Table 9 on page 9: typo corrected
• Section 9 on page 13: package outline versions changed from SOT1211-2 and
SOT1212-2 to SOT1211-3 and SOT1212-3
• Table 10 on page 17: added table
BLM8G0710S-60PB_S-60PBG v.2 20160322
Product data sheet
-
-
BLM8G0710S-60PB_
S-60PBG v.1
BLM8G0710S-60PB_S-60PBG v.1 20160225
Product data sheet
-
BLM8G0710S-60PB_S-60PBG
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Rev. 3 — 13 September 2018
18 of 21
BLM8G0710S-60PB(G)
LDMOS 2-stage power MMIC
13. Legal information
13.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.ampleon.com.
Ampleon product can reasonably be expected to result in personal injury,
13.2 Definitions
death or severe property or environmental damage. Ampleon and its
suppliers accept no liability for inclusion and/or use of Ampleon products in
such equipment or applications and therefore such inclusion and/or use is at
the customer’s own risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. Ampleon does not give any representations or
warranties as to the accuracy or completeness of information included herein
and shall have no liability for the consequences of use of such information.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. Ampleon makes no representation
or warranty that such applications will be suitable for the specified use without
further testing or modification.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local Ampleon sales office. In
case of any inconsistency or conflict with the short data sheet, the full data
sheet shall prevail.
Customers are responsible for the design and operation of their applications
and products using Ampleon products, and Ampleon accepts no liability for
any assistance with applications or customer product design. It is customer’s
sole responsibility to determine whether the Ampleon product is suitable and
fit for the customer’s applications and products planned, as well as for the
planned application and use of customer’s third party customer(s). Customers
should provide appropriate design and operating safeguards to minimize the
risks associated with their applications and products.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
Ampleon and its customer, unless Ampleon and customer have explicitly
agreed otherwise in writing. In no event however, shall an agreement be valid
in which the Ampleon product is deemed to offer functions and qualities
beyond those described in the Product data sheet.
Ampleon does not accept any liability related to any default, damage, costs or
problem which is based on any weakness or default in the customer’s
applications or products, or the application or use by customer’s third party
customer(s). Customer is responsible for doing all necessary testing for the
customer’s applications and products using Ampleon products in order to
avoid a default of the applications and the products or of the application or
use by customer’s third party customer(s). Ampleon does not accept any
liability in this respect.
13.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, Ampleon does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. Ampleon takes no responsibility for
the content in this document if provided by an information source outside of
Ampleon.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
In no event shall Ampleon be liable for any indirect, incidental, punitive,
special or consequential damages (including - without limitation - lost profits,
lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Terms and conditions of commercial sale — Ampleon products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.ampleon.com/terms, unless otherwise agreed in a valid written
individual agreement. In case an individual agreement is concluded only the
terms and conditions of the respective agreement shall apply. Ampleon
hereby expressly objects to applying the customer’s general terms and
conditions with regard to the purchase of Ampleon products by customer.
Notwithstanding any damages that customer might incur for any reason
whatsoever, Ampleon’s aggregate and cumulative liability towards customer
for the products described herein shall be limited in accordance with the
Terms and conditions of commercial sale of Ampleon.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Right to make changes — Ampleon reserves the right to make changes to
information published in this document, including without limitation
specifications and product descriptions, at any time and without notice. This
document supersedes and replaces all information supplied prior to the
publication hereof.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Suitability for use — Ampleon products are not designed, authorized or
warranted to be suitable for use in life support, life-critical or safety-critical
systems or equipment, nor in applications where failure or malfunction of an
BLM8G0710S-60PB_S-60PBG
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Product data sheet
Rev. 3 — 13 September 2018
19 of 21
BLM8G0710S-60PB(G)
LDMOS 2-stage power MMIC
Non-automotive qualified products — Unless this data sheet expressly
states that this specific Ampleon product is automotive qualified, the product
is not suitable for automotive use. It is neither qualified nor tested in
accordance with automotive testing or application requirements. Ampleon
accepts no liability for inclusion and/or use of non-automotive qualified
products in automotive equipment or applications.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
13.4 Trademarks
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without Ampleon’s warranty of the product for such
automotive applications, use and specifications, and (b) whenever customer
uses the product for automotive applications beyond Ampleon’s specifications
such use shall be solely at customer’s own risk, and (c) customer fully
indemnifies Ampleon for any liability, damages or failed product claims
resulting from customer design and use of the product for automotive
applications beyond Ampleon’s standard warranty and Ampleon’s product
specifications.
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
Any reference or use of any ‘NXP’ trademark in this document or in or on the
surface of Ampleon products does not result in any claim, liability or
entitlement vis-à-vis the owner of this trademark. Ampleon is no longer part of
the NXP group of companies and any reference to or use of the ‘NXP’
trademarks will be replaced by reference to or use of Ampleon’s own
trademarks.
14. Contact information
For more information, please visit: http://www.ampleon.com
For sales office addresses, please visit: http://www.ampleon.com/sales
BLM8G0710S-60PB_S-60PBG
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Product data sheet
Rev. 3 — 13 September 2018
20 of 21
BLM8G0710S-60PB(G)
LDMOS 2-stage power MMIC
15. Contents
1
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1
1.2
1.3
General description. . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits. . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2
2.1
2.2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 2
3
4
5
6
7
Ordering information. . . . . . . . . . . . . . . . . . . . . 3
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Thermal characteristics. . . . . . . . . . . . . . . . . . . 4
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 4
8
Application information. . . . . . . . . . . . . . . . . . . 5
Possible circuit topologies . . . . . . . . . . . . . . . . 8
Ruggedness in class-AB operation. . . . . . . . . . 9
Impedance information . . . . . . . . . . . . . . . . . . . 9
Graphs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
8.1
8.2
8.3
8.4
9
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 13
Handling information. . . . . . . . . . . . . . . . . . . . 17
Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 17
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 18
10
11
12
13
Legal information. . . . . . . . . . . . . . . . . . . . . . . 19
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 19
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 20
13.1
13.2
13.3
13.4
14
15
Contact information. . . . . . . . . . . . . . . . . . . . . 20
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© Ampleon Netherlands B.V. 2018.
All rights reserved.
For more information, please visit: http://www.ampleon.com
For sales office addresses, please visit: http://www.ampleon.com/sales
Date of release: 13 September 2018
Document identifier: BLM8G0710S-60PB_S-60PBG
相关型号：
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