BU-63147D3-122L [ETC]

Telecommunication IC ; 电信IC\n
BU-63147D3-122L
型号: BU-63147D3-122L
厂家: ETC    ETC
描述:

Telecommunication IC
电信IC\n

驱动器 电信
文件: 总8页 (文件大小:68K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
BU-63147 and BU-63149  
MIL-STD-1553 DATA BUS  
+5V TRANSCEIVER  
FEATURES  
DESCRIPTION  
The BU-63147/49 transceiver is a com- The transmitter section accepts  
plete dual transmitter and receiver pair bi-phase TTL signal data at its  
+5V Power Supply  
Low Power  
TX DATA IN  
conforming fully to MIL-STD-1553A TX DATA IN and  
inputs  
and 1553B. Features include: mono- and produces phase-modulated  
lithic design, +5V power supply voltage, bipolar data at the TX DATA OUT and  
Conforms Fully To MIL-STD-1553A  
AND 1553B  
TX DATA OUT  
outputs.  
The  
Harris or Smiths type decoder inter-  
face, completely independent dual transmitter’s output voltage level is  
redundant operation, and small size typically about 11Vpp. An external  
(36 pin DIP). The receiver section of input, INHIBIT, takes priority over the  
the BU-63147/49 series accepts transmitter inputs and disables the  
phase-modulated bipolar data from a transmitter when activated with a logic  
MIL-STD-1553 Data Bus and pro- “1”.  
Dual Transceiver  
Available with MIL-STD-1760  
Compliant Transmitter Voltage  
duces TTL Signal data at its output.  
Available with McAir Compatible  
Waveform  
The small size, +5V power supply volt-  
RX DATA OUT and  
age,  
and  
compliance  
with  
RX DATA OUT  
These outputs represent positive and MIL-STD-1553 simplify engineering  
negative variations of the input data design, making it an excellent choice  
signals beyond an internally fixed for interfacing with any MIL-STD-1553  
threshold level. An external STROBE system.  
36-Pin DIP  
HARRIS or SMITHS I/O  
Compatibility  
input enables or disables the receiver’s  
outputs.  
+5 V  
RECEIVER STROBE  
1553  
DATA  
BUS  
BI PHASE  
TTL DATA  
PHASE MODULATED  
BIPOLAR DATA  
RECEIVER SECTION  
COMPARATOR  
RX DATA IN  
FILTER  
RX DATA OUT  
SHORT OR  
LONG STUB  
COUPLING  
ISOLATION  
TRANSFORMER  
DECODER  
RX DATA OUT  
RX DATA IN  
FILTER  
COMPARATOR  
TRANSMITTER SECTION  
TX Data Out  
TX Data Out  
SHAPING  
NETWORK  
TX DATA IN  
ENCODER  
SHAPING  
NETWORK  
TX DATA IN  
TX INHIBIT  
CASE/GND  
FIGURE 1. BU-63147/49 BLOCK DIAGRAM (one channel shown)  
© 2000 Data Device Corporation  
TABLE 1. BU-63147/49 SPECIFICATIONS  
TABLE 1. BU-63147/49 SPECIFICATIONS  
PARAMETER MIN TYP MAX  
PARAMETER  
MIN TYP  
MAX  
UNITS  
UNITS  
POWER DISSIPATION (Note 10)  
Total Hybrid  
ABSOLUTE MAXIMUM RATING  
Supply Voltage  
! +5 V (Vcc)  
Receiver  
BU-63147/9XX-XX0  
• Idle (Both Channels)  
• 25% Transmitter Duty Cycle  
(One Channel)  
-0.3  
5.0  
7.0  
20  
V
0.55  
0.78  
W
W
! Input Voltage  
Vp-p  
differential  
• 50% Transmitter Duty Cycle  
(One Channel)  
• 100% Transmitter Duty Cycle  
(One Channel)  
BU-63147/9X3-XX2  
• Idle (Both Channels)  
• 25% Transmitter Duty Cycle  
(One Channel)  
• 50% Transmitter Duty Cycle  
(One Channel)  
• 100% Transmitter Duty Cycle  
(One Channel)  
Hottest Die  
BU-63147/9XX-XX0  
• Idle (Both Channels)  
• 25% Transmitter Duty Cycle  
(One Channel)  
• 50% Transmitter Duty Cycle  
(One Channel)  
1.00  
1.44  
W
W
Logic  
! Voltage Input Range  
-0.3  
2.5  
Vcc+10%  
V
RECEIVER  
Differential Input Resistance  
(Notes 1-6)  
Differential Input Capacitance  
(Notes 1-6)  
Threshold Level (Note 7)  
Common Mode Voltage (Note 8)  
kohm  
pF  
0.55  
0.84  
W
W
5
0.20  
6
0.860  
10  
Vp-p  
Vpeak  
1.13  
1.70  
W
W
TRANSMITTER  
Differential Output Voltage  
! Direct Coupled Across 35 ,  
Measured on Bus  
! Transformer Coupled Across  
70 , Measured on Stub:  
• BU-63147XX-XX0  
• BU-63147X3-XX2 (Note 9)  
Output Noise, Differential (Direct  
Coupled)  
Output Offset Voltage, Transformer  
Coupled Across 70 ohms  
Rise/Fall Time  
7
9
Vp-p  
0.28  
0.51  
W
W
18  
20  
20  
22  
27  
27  
10  
Vp-p  
Vp-p  
mVp-p,  
diff  
mVp-p,  
diff  
0.75  
1.22  
W
W
• 100% Transmitter Duty Cycle  
(One Channel)  
BU-63147/9X3-XX2  
• Idle (Both Channels)  
• 25% Transmitter Duty Cycle  
(One Channel)  
-250 150  
250  
0.28  
0.58  
W
W
100 150  
200 250  
300  
300  
ns  
ns  
• BU-63147X3  
• BU-63147X4  
• 50% Transmitter Duty Cycle  
(One Channel)  
• 100% Transmitter Duty Cycle  
(One Channel)  
0.88  
1.48  
W
W
LOGIC  
V
IH  
2.0  
20  
V
V
V
IL  
0.8  
I
IH  
100  
µA  
THERMAL  
T
T
R
• Thermal Resistance, Junction-to-  
Case, Hottest Die (θJC)  
• Operating Junction Temperature  
• Storage Temperature  
• Lead Temperature  
25  
°C/W  
x Data In, x Inhibit x Strobe  
I
IL  
-100  
2.4  
3.4  
-20  
µA  
-55  
-65  
150  
150  
+300  
°C  
°C  
°C  
T
T
R
x Data In, x Inhibit x Strobe  
(Vcc=4.75V,I =max)  
V
V
I
OH  
OL  
OH  
V
V
(Vcc=4.75V, I =max)  
(soldering, 10 sec.)  
OL  
0.4  
PHYSICAL CHARACTERISTICS  
Size  
OL  
mA  
mA  
I
OH  
-3.4  
36-Pin DIP  
POWER SUPPLY REQUIREMENTS  
Voltages/Tolerances  
in.  
(mm)  
1.895 x 0.775 x 0.210  
(48.1 x 19.7 x 5.3)  
! +5V  
4.75 5.0  
5.5  
V
36-Lead Flatpack  
Weight  
Current Drain (Total Hybrid)  
BU-63147/9XX-XX0  
in.  
(mm)  
1.905 x 0.785 x 0.165  
(48.4 x 19.9 x 4.2)  
• Idle (Both Channels)  
• 25% Transmitter Duty Cycle  
(One Channel)  
• 50% Transmitter Duty Cycle  
(One Channel)  
100  
205  
mA  
mA  
oz  
(g)  
0.6  
(17)  
310  
520  
mA  
mA  
Notes:  
• 100% Transmitter Duty Cycle  
(One Channel)  
Notes 1 through 6 are applicable to the Receiver Differential Resistance and  
Differential Capacitance specifications:  
BU-63147/9X3-XX2  
• Idle (Both Channels)  
• 25% Transmitter Duty Cycle  
(One Channel)  
100  
216  
mA  
mA  
(1) Specifications include both transmitter and receiver (assumed tied together  
externally).  
• 50% Transmitter Duty Cycle  
(One Channel)  
• 100% Transmitter Duty Cycle  
(One Channel)  
332  
565  
mA  
mA  
(2) Impedance parameters are specified directly between pins TX/RX A(B) and  
TX/RX A(B) hybrid.  
(3) It is assumed that all power and ground inputs to the hybrid are connected and  
that the hybrid case is connected to ground for the impedance measurement.  
2
TABLE 2. TRANSMIT OPERATING MODE  
Notes (continued)  
(4) The specifications are applicable for both unpowered and powered conditions.  
(5) The specifications assume a 2 volt rms balanced, differential, sinusoidal input.  
The applicable frequency range is 75 kHz to 1 MHz.  
TX Data In  
TX Data In  
TX INHIBUIT  
DRIVER OUTPUT  
OFF (NOTE)  
OFF  
X
0
X
0
H
X
(6) Minimum resistance and maximum capacitance parameters are guaranteed  
over the operating range, but are not tested.  
TX DATA OUT ON,  
TX DATA OUT OFF  
0
1
L
(7) The Threshold Level, as referred to in this specification, is meant to be the  
maximum peak-to-peak voltage (measured on the data bus) that can be  
applied to the receiver's input without causing the output to change from the  
OFF state.  
TX DATA OUT ON,  
TX DATA OUT OFF  
1
1
0
1
L
X
OFF  
NOTE:  
DRIVER OUTPUT terminals are in the high impedance mode  
during OFF time, independent of INHIBIT status.  
(8) Assumes a common mode voltage within the frequency range of dc to 2 MHz,  
applied to pins of the isolation transformer on the stub side (either direct or  
transformer coupled), and referenced to transceiver ground. Transformer must  
be a DDC recommended transformer or other transformer that provides an  
equivalent minimum CMRR.  
RECEIVER OPERATING MODE  
(9) MIL-STD-1760 requires minimum output voltage of 20 Vp-p on the stub con-  
nection. The -XX2 option is not available for the BU-63147X4 version.  
(10) Power dissipation specifications assume a transformer coupled configura-  
tion, with external dissipation (while transmitting) of 0.14 watts for the active  
isolation transformer, 0.08 watts for the active coupling transformer, 0.45 watts  
for each of the two bus isolation resistors, and 0.15 watts for each of the two  
bus termination resistors.  
The receiver section accepts data from a MIL-STD-1553 Data  
Bus when coupled to the Data Bus as shown in FIGURE 3. This  
data is converted to bi-phase TTL and furnished to  
RX DATA OUT and RX DATA OUT  
.
When STROBE is high data passes throught the receiver to  
RX DATA OUT and RX DATA OUT. Applying a low to STROBE  
disables the receiver output terminals.  
As illustrated in FIGURE 2, the receiver in the BU-65147 pro-  
vides compatibility to the Harris decoder, while the BU-63149  
provides compatibility to the Smiths decoder.  
INTRODUCTION  
The BU-63147/49 is a dual redundant transmitter and receiver  
packaged in a 36-pin DDIP. It is directly compatible to Harris  
15530 encoder/decoder and has internal (factory preset) thresh-  
old levels. The dual transceiver only requires +5V power and  
conforms to MIL-STD-1553A and 1553B. For McAir compatabili-  
ty, versions are available with rise/fall times of 200 to 300 nsec.  
WAVEFORMS  
FIGURE 2 illustrates the BU-63147 with Harris type decoder  
interface and the BU-63149 with Smiths type decoder interface.  
Note that DATA and DATA inputs must be complementary wave-  
forms with a 50% duty cycle.  
FIGURE 3 illustrates the connection between a BU-63147/49  
transceiver and a MIL-STD-1553 Data Bus. After transformer  
isolating the transceiver, it can be either direct coupled (short  
stub) or transformer coupled (long stub) to the Data Bus.  
TX Data In  
X X X  
X X X  
X X X  
X X X  
ENCODER  
OUTPUT  
(NOTE 2)  
TX Data In  
LINE-TO-LINE  
OUTPUT  
TRANSMIT OPERATING MODE  
LINE-TO-LINE  
INPUT  
The transmitter section accepts encoded TTL data and converts  
it to phase-modulated bipolar form using a waveshaping network  
and driver circuits. The driver outputs TX DATA OUT and  
TX DATA OUT are transformer coupled to the Data Bus.  
RX Data Out  
RX Data Out  
BU-63147  
BU-63149  
RX Data Out  
RX Data Out  
The transmitter output terminals can be put into a high imped-  
ance state by setting INHIBIT high, or setting TX DATA IN and  
TX DATA IN to the same logic level. The operating modes are  
shown in TABLE 2.  
Notes:  
(1) TX Data In and RX Data Out are TTL signals.  
(2) TX Data In inputs must be at opposite logic levels during transmission, and at  
the same logic level when not transmitting.  
(3) LINE-TO-LINE output voltage is measured between TX Data Out and TX Data Out.  
(4) LINE-TO-LINE input voltage is measured on the Data Bus.  
The transceivers are able to operate in a “wraparound” mode.  
This allows output data to be monitored by the receiver section  
and returned to the decoder where it is checked for errors.  
FIGURE 2. WAVEFORMS FOR HARRIS/SMITHS  
TYPE ENCODER/DECODERS  
3
SHORT STUB  
(DIRECT COUPLED)  
Z (70 to 85)  
0
(1:2.5)  
1 FT MAX  
55Ω  
4
1
2
3
TX  
55Ω  
8
TX  
RX  
RX  
BU-63147/49  
11.2 VPP  
28 VPP  
OR  
LONG STUB  
(TRANSFORMER  
COUPLED)  
(1:1.4)  
(1:1.79)  
20 FT MAX  
0.75 Z  
1
2
3
5
7
8
4
1
3
0
TX  
0.75 Z  
0
TX  
RX  
RX  
BU-63147/49  
20 V PP  
Z (70 to 85)  
0
Notes:  
One half of dual transceivers shown.  
FIGURE 3. INTERFACE TO 1553 BUS  
PULSE TRANSFORMERS  
formers in a variety of mechanical configurations with the  
required turns ratios of 1:2.5 direct coupled, or 1:1.79 trans-  
former coupled. Table 3 provides a listing of many of these. For  
further information, contact BTTC at 631-244-7393 or at  
www.bttc-beta.com.  
Interfacing the BU-63147/49 to a MIL-STD-1553 bus requires a  
pair of pulse transformers. Beta Transformer Technology  
Corporation (BTTC), a subsidiary of DDC, manufactures trans-  
NOTES:  
1. For the BU-63147/49X4-XX0 versions, which include McAIR compatible transceivers, only the B-3818 or B-3819 transformers  
(shown in bold in the table) may be used.  
2. For the BU-63147/49X3-XXX versions with 1553B (and possibly 1760) transceivers, any of the other transformers listed may be used.  
3. There are no BU-63147/49X4-XX2 versions.  
4
TABLE 3. RECOMMENDED BTTC TRANSFORMERS FOR USE WITH BU-63147/49 TRANSCEIVERS  
TRANSFORMER CONFIGURATION  
BTTC PART NO.  
Single epoxy transformer, through-hole, 0.625 X 0.625, 0.250" max height  
B-3226  
Single epoxy transformer, through-hole, 0.625 X 0.625, 0.220" max height.  
(May be used with BU-63147/49X4-XX0 version.)  
B-3818  
Single epoxy transformer, flat pack, 0.625" X 0.625", 0.275" max height  
Single epoxy transformer, surface mount, 0.625" X 0.625", 0.275" max height  
B-3231  
B-3227  
Single epoxy transformer, surface mount, hi-temp solder, 0.625" X 0.625", 0.220" max height.  
(May be used with BU-63147/49X4-XX0 version.)  
B-3819  
Single epoxy transformer, flat pack, 0.625" X 0.625", 0.150" max height  
Single epoxy transformer, surface mount, 0.625" X 0.625", 0.150" max height  
LPB-5014  
LPB-5015  
TST-9007  
TST-9017  
TST-9027  
B-3300  
Dual epoxy transformer, twin stacked, 0.625" X 0.625", 0.280" max height  
Dual epoxy transformer, twin stacked, surface mount, 0.625" X 0.625", 0.280" max height  
Dual epoxy transformer, twin stacked, flat pack, 0.625" X 0.625", 0.280" max height  
Dual epoxy transformer, side by side, through-hole, 0.930" X 0.630", 0.155 max height  
Dual epoxy transformer, side by side, flat pack, 0.930" X 0.630", 0.155 max height  
Dual epoxy transformer, side by side, surface mount, 0.930" X 0.630", 0.155 max height  
Single metal transformer, hermetically sealed, flat pack, 0.630" X 0.630", 0.175" max height  
Single metal transformer, hermetically sealed, surface mount, 0.630" X 0.630", 0.175" max height  
B-3261  
B-3310  
HLP-6014  
HLP-6015  
TABLE 4. BU-63147/49 PIN LISTING  
PIN  
1
FUNCTION  
PIN  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
29  
30  
31  
32  
33  
34  
35  
36  
FUNCTION  
TX Data Out A  
TX Data Out A  
GND A  
NC  
2
RX Data In B  
RX Data In B  
GND B  
3
4
NC  
5
RX Data Out A  
RX Strobe A  
GND A  
NC  
6
+5 VDC B  
TX Inhibit B  
TX Data In B  
TX Data In B  
NC  
7
8
RX Data Out A  
GND (case)  
TX Data Out B  
TX Data Out B  
GND B  
9
10  
11  
12  
13  
14  
15  
16  
17  
18  
RX Data In A  
RX Data In A  
GND A  
NC  
RX Data Out B  
RX Strobe B  
GND B  
NC  
+5 VDC A  
TX Inhibit A  
TX Data In A  
TX Data In A  
RX Data Out B  
NC  
5
DOT  
IDENTIFIES  
PIN 1  
0.09± 0.01  
(2.3±0.25)  
0.1± 0.01  
(2.5±0.3)  
18  
19  
1
0.775± 0.005  
(19.7±0.13)  
BOTTOM VIEW  
36  
0.086 TYP (2.2)  
RADIUS  
1.895 ±0.005  
(48.13 ±0.13)  
0.21 MAX  
(5.3)  
0.015 MAX  
(0.39)  
SIDE VIEW  
0.100± 0.002  
TOLERANCE  
NON-CUMULATIVE  
CENTER TO CENTER  
AT SEATING PLANE  
0.055 TYP (1.4)  
RADIUS  
SEATING  
PLANE  
0.25 MIN  
(6.4)  
0.018± 0.002 DIA  
(0.46±0.06)  
FIGURE 4. BU-63147D3/D4 and BU-63149D3/D4 MECHANICAL OUTLINE, DIP  
0.250 MIN  
(6.35)  
0.785 MAX  
(20.0)  
1
36  
1.905 MAX  
(48.4)  
TOP VIEW  
0.015 TYP  
(0.381)  
0.100 TYP  
(2.54)  
19  
18  
17 EQUAL SPACES  
@0.100=1.700 TOLERANCE  
NON-CUMULATIVE  
(2.54 = 43.18)  
0.165 MAX  
0.010± 0.002  
(0.254±0.051)  
(4.2)  
SIDE VIEW  
FIGURE 5. BU-63147F3/F4 and BU-63149F3/F4 MECHANICAL OUTLINE, FLATPACK  
6
ORDERING INFORMATION  
BU-63147D3-120X  
Supplemental Process Requirements:  
S = Pre-Cap Source Inspection  
L = Pull Test  
Q = Pull Text and Pre-Cap Inspection  
K = One Lot Date Code  
W = One Lot Date Code and PreCap Date Code  
Y = One Lot Date Code and 100% Pull Test  
Z = One Lot Date Code, PreCap Source, and 100% Pull Test  
Blank = None of the above  
Test Criteria:  
0 = Standard Testing  
2 = MIL-STD-1760 Amplitude Compliant  
(Note: The -XX2 option is not available for the BU-63147/49X4 version.)  
Process Requirements:  
0 = Standard DDC Processing, no Burn-In  
1 = MIL-PRF-38534 Compliant  
2 = B*  
3 = MIL-PRF-38534 Compliant with PIND Testing  
4 = MIL-PRF-38534 Compliant with Solder Dip  
5 = MIL-PRF-38534 Compliant with PIND Testing and Solder Dip  
6 = B* with PIND Testing  
7 = B* with Solder Dip  
8 = B* with PIND Testing and Solder Dip  
9 = Standard DDC Processing with Solder Dip, no Burn-In  
Temperature Grade/Data Requirements:  
1 = -55°C to +125°C  
2 = -40°C to +85°C  
3 = 0°C to +70°C  
4 = -55°C to +125°C with Variables Test Data  
5 = -40°C to +85°C with Variables Test Data  
6 = Custom Part (Reserved)  
7 = Custom Part (Reserved)  
8 = 0°C to +70°C with Variables Test Data  
Rise/Fall Times Option:  
3 = Rise/Fall times = 100 to 300 ns  
4 = Rise/Fall times = 200 to 300 ns  
Package Type:  
D = DIP Package  
F = Flat Pack  
Base Product Type:  
BU-63147 = 5V Dual Transceiver, HARRIS Compatible  
BU-63149 = 5V Dual Transceiver, SMITHS Compatible  
*Standard DDC Processing with burn-in and full temperature test, see table below.  
STANDARD DDC PROCESSING  
MIL-STD-883  
TEST  
METHOD(S)  
CONDITION(S)  
INSPECTION  
SEAL  
2009, 2010, 2017, and 2032  
1014  
1010  
A and C  
TEMPERATURE CYCLE  
CONSTANT ACCELERATION  
BURN-IN  
C
A
2001  
1015, Table 1  
7
The information in this data sheet is believed to be accurate; however, no responsibility is  
assumed by Data Device Corporation for its use, and no license or rights are  
granted by implication or otherwise in connection therewith.  
Specifications are subject to change without notice.  
105 Wilbur Place, Bohemia, New York 11716-2482  
For Technical Support - 1-800-DDC-5757 ext. 7382 or 7234  
Headquarters - Tel: (631) 567-5600, Fax: (631) 567-7358  
West Coast - Tel: (714) 895-9777, Fax: (714) 895-4988  
Southeast - Tel: (703) 450-7900, Fax: (703) 450-6610  
United Kingdom - Tel: +44-(0)1635-811140, Fax: +44-(0)1635-32264  
Ireland - Tel: +353-21-341065, Fax: +353-21-341568  
France - Tel: +33-(0)1-41-16-3424, Fax: +33-(0)1-41-16-3425  
Germany - Tel: +49-(0)8141-349-087, Fax: +49-(0)8141-349-089  
Sweden - Tel: +46-(0)8-54490044, Fax +46-(0)8-7550570  
Japan - Tel: +81-(0)3-3814-7688, Fax: +81-(0)3-3814-7689  
World Wide Web - http://www.ddc-web.com  
U
®
DATA DEVICE CORPORATION  
REGISTERED TO ISO 9001  
FILE NO. A5976  
A 04/00-500  
PRINTED IN THE U.S.A.  
8

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