C2472 [ETC]

RDFC Controllers for Offline Applications; RDFC控制器,用于离线应用
C2472
型号: C2472
厂家: ETC    ETC
描述:

RDFC Controllers for Offline Applications
RDFC控制器,用于离线应用

控制器
文件: 总18页 (文件大小:466K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
C2472, C2473 and C2474 Datasheet  
RDFC Controllers for Offline Applications  
ADVANTAGES  
Low system component count  
High average efficiency  
Low standby power consumption  
EMI compliance without extra components  
High isolation & surge voltage withstand  
High power density in very small size  
C2474PW1  
PDIP-8  
C2472PX2  
SOT23-6  
FEATURES  
C2473PX1  
SOP-8  
Highly integrated CMOS controller IC  
Low cost package options  
Drive suitable for low cost bipolar power transistors  
Resonant switching for high efficiency and low EMI  
Frequency optimised for power circuit parasitics  
Protection against overload, over-temperature and under-voltage  
APPLICATIONS  
External AC/DC charger/adaptor (single voltage input) e.g. cordless phones, portable electric tools.  
Embedded PSU (single voltage input) e.g. set-top boxes, DVD players, audio products, domestic appliances.  
OVERVIEW  
The C2472, C2473 and C2474 controllers use CamSemi’s Resonant Discontinuous Forward Converter  
(RDFC) topology to create a high efficiency, low cost alternative to line-frequency transformer PSUs. By  
operating in resonant mode, EMI is greatly reduced, enabling the replacement of linear PSUs in demanding  
applications such as audio products and cordless phone chargers. The C2472, C2473 and C2474 controllers  
also offer overload protection which is usually associated with more expensive switch mode solutions.  
AUX  
VDD  
Vdd  
Vdd  
regulator  
Base  
drive  
Switch  
saturation  
sensing  
COL  
CS  
Resonance  
sensing  
RDFC  
Control  
BAS  
Current  
sensing  
GND  
Figure 1: Block Diagram of the C2472, C2473 and C2474 Controller ICs  
Product data  
© Cambridge Semiconductor Ltd 2007  
Page 1 of 18  
DS-1423-0709C  
26-Sep-2007  
C2472, C2473 and C2474 Datasheet  
RDFC Controllers for Offline Applications  
PIN DEFINITIONS  
Figure 2: C2472, C2473 and C2474 Pin Assignment  
(drawings are not to scale)  
VDD Pin  
The VDD pin supplies power to the controller and is maintained at the correct voltage (nominally 3.3 V) by an  
internal shunt regulator.  
COL Pin  
The COL pin is used to sense the collector voltage of the primary switching transistor, via a c oupling  
capacitor, to control the timing and current levels of the signals produced on the BAS pin.  
CS Pin  
The CS pin senses the primary switch current via the current sensing resistor. The voltage sensed on this  
pin is used to control the operating modes to manage standby and overload protection. Operating  
characteristics are programmed via two external resistors.  
AUX Pin  
The AUX pin provides the supply current for the internal base driver block. In most applications, the AUX pin  
is connected to the external supply rail via an NPN transistor and a current-limiting resistor to set the  
maximum base current; however, in low power applications the AUX pin can be connected to the VDD pin  
via the limiting resistor, with some compromise on the standby power consumption.  
BAS Pin  
The BAS pin switches the external bipolar primary switch transistor on and off. The current supplied to the  
switch transistor is controlled to minimize the switching losses and thereby help optimize overall system  
efficiency.  
GND Pin  
GND pins provide the ground reference. Where the device has multiple GND pins, all must be connected to  
a common, low impedance path.  
Product data  
© Cambridge Semiconductor Ltd 2007  
Page 2 of 18  
DS-1423-0709C  
26-Sep-2007  
C2472, C2473 and C2474 Datasheet  
RDFC Controllers for Offline Applications  
TYPICAL APPLICATION CIRCUIT  
The C2472, C2473 and C2474 controllers are intended primarily for single input voltage AC/DC applications,  
such as replacement of line frequency linear transformer power supplies. These versatile controllers support  
a wide range of applications at low cost. A typical circuit configuration is shown in Figure 3.  
Figure 3: Typical RDFC Application Schematic  
Typical 12 W Charger Performance  
Input  
115 V ac  
12 V, 1 A dc  
> 80%  
Output  
Efficiency  
No-load power input  
< 150 mW  
Typical Maximum Application Rated Power  
Power Switch  
115 Vac  
230 Vac  
(Q1) Gain  
Standard  
High  
20 W  
40 W  
40 W  
60 W  
Product data  
© Cambridge Semiconductor Ltd 2007  
Page 3 of 18  
DS-1423-0709C  
26-Sep-2007  
C2472, C2473 and C2474 Datasheet  
RDFC Controllers for Offline Applications  
PRINCIPLE OF OPERATION  
Power-Up/Power-Down Sequences  
The C2472, C2473 and C2474 controllers are powered via their VDD pins. When mains voltage is first  
applied, a small amount of current (IDDSLEEP) is drawn from the rectified mains input via high value start up  
resistors (Rht1 and Rht2 in Figure 3). When the voltage on the VDD pin (VDD) reaches a level VOVDTHR the  
controller wakes up, demands more supply current (IDDWAKE) and enters the Start-up state (see Figure 4).  
The controller stays in Start-up for a short time during which internal circuit blocks are enabled and then  
changes to Active operation. In both Start-up and Active states, the controller uses an internal shunt  
regulator to regulate the VDD rail voltage; the regulator is disabled in Sleep. A higher regulation voltage is  
applied during Start-up (VDDREG(S)) than during Active operation (VDDREG(R)) to help provide sufficient VDD  
before the Auxiliary supply from the transformer rises to maintain VDD.  
If the VDD pin voltage drops below VUVDTHR the controller goes back to Sleep, reducing the supply current  
demand. The system will restart when input power is restored. To achieve a smooth power up sequence the  
VDD reservoir capacitor needs to be large enough to sustain the supply above VUVDTHR over the Start-up  
period.  
Figure 4: VDD Pin Waveform (VDD) During Initial Power-up and Power-down  
State  
Description  
Sleep  
From initial application of power or from Active state if VDD falls below VUVDTHR, the  
controller changes to Sleep state. Non-essential controller circuits are powered down  
and the external switching transistor (Q1) is held off. Exit from Sleep state occurs when  
VDD rises above VOVDTHR and the controller moves to the Start-up state.  
Start-up  
Active  
When the Start-up state is entered, internal controller circuits are activated and power  
conversion begins (Standby mode – see Table 2). In Start-up the on-chip shunt  
regulator stabilises VDD to an intermediate value, VDDREG(S). After a preset time, the  
controller changes from Start-up to Active operation.  
Converter operation continues, the shunt regulator controls VDD to the lower VDDREG(R)  
If VDD falls below VUVDTHR the controller ceases converter operation and reverts to  
Sleep state.  
.
Table 1: Summary of RDFC Controller States  
Product data  
© Cambridge Semiconductor Ltd 2007  
Page 4 of 18  
DS-1423-0709C  
26-Sep-2007  
C2472, C2473 and C2474 Datasheet  
RDFC Controllers for Offline Applications  
Start-up and Active State Power Conversion Modes  
In the Start-up and Active states the C2472, C2473 and C2474 ICs have several modes for controlling power  
conversion that are designed to achieve maximum efficiency and to limit power (current) across a wide range  
of loads. Refer to Table 2 for a summary of each mode.  
Mode  
Typical Load  
Range  
Description  
Standby  
IOUT ≥ 0% to  
~20% of rated  
current  
Standby mode reduces power consumption at low loads. It achieves this by  
progressively reducing the on-time then by increasing the off-time as the load  
decreases. As load increases, the converter duty is increased until the controller  
returns to Normal mode. Typically, mains ripple causes change of operating mode  
during each mains half-cycle, with the converter moving to lower-power modes  
between peaks of the mains voltage.  
Normal  
IOUT > ~20% to  
100% of rated  
current  
Normal mode is used for steady state power delivery. During Normal mode the power  
device switches in a fully resonant minimum-voltage-switching waveform, with the off-  
time determined by the transformer resonance (TRES) and the on-time being equal to  
75% of the off time. A low level of primary switch current, sensed via the CS pin  
voltage, causes the controller to change to Standby mode and a high level to Overload  
mode.  
Overload IOUT >~100%  
rated current  
Overload mode is activated at high output loads. In this mode the on-time of the  
primary switch is terminated early (before 75% of TRES) when the primary current  
exceeds a preset maximum, thereby protecting the primary switch and limiting the  
output current. This results in reduction of the output voltage. Heavy overload (sensed  
by the on-period of the primary switch reducing below a preset time) causes Foldback  
mode to be entered.  
Foldback VOUT < ~70%  
rated output  
Foldback mode is entered from the Overload mode. In this mode the controller reduces  
the on/off duty cycle to protect the power supply and any connected load by both  
shortening the on-period and increasing the off-period of the primary switch. Converter  
cycles continue to maintain auxiliary power to the controller. The controller exits the  
Foldback mode and enters the Power Burst mode after a fixed number of power  
conversion cycles.  
Power  
Burst  
VOUT < ~70%  
rated output  
Power Burst mode is entered periodically from Foldback mode in order to restart the  
power supply output. In Power Burst mode, the controller operates at maximum  
delivered power for a set number of power converter cycles. At the end of the burst, if  
the load is not excessive, the converter goes to Normal mode; otherwise it reverts to  
Foldback mode.  
Table 2: Summary of Active Operating Modes  
When the controller goes from Sleep to Start-up state, its power conversion mode is set to Standby. Typically  
the converter output voltage is low at this time so the primary switch current is high during the first few  
converter cycles. This causes the operating mode to change quickly to Normal or Overload mode.  
Product data  
© Cambridge Semiconductor Ltd 2007  
Page 5 of 18  
DS-1423-0709C  
26-Sep-2007  
C2472, C2473 and C2474 Datasheet  
RDFC Controllers for Offline Applications  
RDFC Power Supply I-V Characteristic  
Figure 5 illustrates a typical RDFC power supply characteristic with the various Active state modes of  
operation identified. INOM and VNOM are the nominal output voltage and current drawn by the load at the rated  
power of the application circuit.  
Figure 5: Typical RDFC Power Supply Characteristic Indicating Different Active Modes of Operation  
The exact thresholds for transition between modes depend on specific application characteristics, controller  
internal clock frequency (FCLK) and CS pin thresholds (VOCPH and VOCPL). These parameters and their effects  
are explained later.  
Product data  
© Cambridge Semiconductor Ltd 2007  
Page 6 of 18  
DS-1423-0709C  
26-Sep-2007  
C2472, C2473 and C2474 Datasheet  
RDFC Controllers for Offline Applications  
Switching Waveforms  
The collector voltage (VCE) and current (IC) waveforms of the primary switching transistor (Q1 in Figure 3) are  
shown in Figure 6. TRES is the duration of the transformer resonance during the off period. Note that in  
Overload mode, the primary switch Q1 is turned off when the current exceeds the protection level OCPH  
(sensed by the CS pin voltage).  
Figure 6: Typical Switch (Q1) Collector Voltage (VCE) and Current (IC) Waveforms  
Product data  
© Cambridge Semiconductor Ltd 2007  
Page 7 of 18  
DS-1423-0709C  
26-Sep-2007  
C2472, C2473 and C2474 Datasheet  
RDFC Controllers for Offline Applications  
Resonance Control  
The natural resonance of the transformer and associated components is deduced from the current flowing  
into and out of the COL pin via the collector coupling capacitor.  
The voltage sensed on the COL pin is used to control saturation of the primary switch transistor (Q1 in  
Figure 3) during the on-period (see “Optimised Base Drive”). During the off-period, timing of the resonance is  
detected via the current in and out of the pin, which has a low impedance path to GND during this time. Rate  
of change of voltage at the transformer primary causes current into or out of the COL pin, which is processed  
to measure the resonance period TRES and to find the optimum turn-on time for the following conversion  
cycle. The resonant period is also used to determine the maximum on-time of the primary switch transistor,  
so that  
TON = 0.75 x TRES  
The maximum duty cycle (DNORMAL) is therefore nominally 43%. On-time of the switch is controlled to manage  
power delivery and is reduced in both low-load and overload conditions. The minimum on-time in overload is  
determined by the internal CS blanking, specified as TCSBLANK  
.
At turn-on of the primary switching transistor, its collector voltage can fall very rapidly, with correspondingly  
large current out of or in to the COL pin via the coupling capacitor (Ccol). An on-chip clamp transistor,  
controlled by an internal signal called ACTICLAMP, provides a low resistance path to GND. This transistor is  
turned on shortly before turn-on of the primary switch and remains on until time TACT after turn-on of the  
primary switch. It is then turned off during the remainder of the primary switch on-period. In some  
applications, the current through the coupling capacitor may develop sufficient voltage across the clamp  
transistor to cause conduction of the ESD protection diodes. This is permissible up to a limit ICOL which is  
specified in ABSOLUTE MAXIMUM RATINGS. If, due to application design, the capacitor current could  
exceed this level, external protection diodes and a resistor must be provided (Dcol1, Dcol2 and Rcol in  
Figure 3).  
Product data  
© Cambridge Semiconductor Ltd 2007  
Page 8 of 18  
DS-1423-0709C  
26-Sep-2007  
C2472, C2473 and C2474 Datasheet  
RDFC Controllers for Offline Applications  
Optimised Base Drive  
To minimize losses in the primary switching transistor (Q1) its base current is carefully controlled. To  
minimize turn-on losses, the base current is initially forced to a maximum value IBASMAX for a time TFON (the  
force-on or “FON” pulse). For the remainder of the on-time the base current is reduced to a lower value such  
that the on-state collector voltage is maintained at a preset target voltage, thereby minimizing turn-off time  
and consequent losses. During this period, TPBD, the so called “proportional base drive” (PBD) current is  
referred to as IBASPBD  
.
Aux Supply  
Bypass transistor  
Raux  
AUX  
Qon  
Qoff  
PBD  
BAS  
Q1  
FON  
TPBD  
GND  
0V  
Figure 7: Primary Switch (Q1) Base Drive  
The BAS pin (see Figure 7) is driven by two transistors, Qon and Qoff. Qon provides IBASMAX during TFON and  
IBASPBD during the remainder of the on-period. Transistor Qoff provides a low-resistance (RBASCLAMP) path to  
GND during the off-period to ensure rapid turn-off of the primary switch, Q1. IBASPBD is set by the PBD system  
within the controller but IBASMAX is determined by the external resistor Raux and the Aux Supply voltage.  
IBASMAX  
IBAS  
VCE  
TFON  
TPBD  
Figure 8: Base Driver Current Waveforms  
Product data  
© Cambridge Semiconductor Ltd 2007  
Page 9 of 18  
DS-1423-0709C  
26-Sep-2007  
C2472, C2473 and C2474 Datasheet  
RDFC Controllers for Offline Applications  
IBASPBD is controlled by monitoring the voltage at the COL pin during TPBD; base current is increased  
progressively as VCOL rises above threshold VCREF(see Figure 9). The desired on-state VCE of the switching  
transistor is set by capacitors Cp and Ccol (see Figure 3), the COL pin capacitance (CINCOL) and VCREF  
.
IBASPBD  
VCO L  
VCREF  
Figure 9: IBASPBD characteristic  
Power Control  
Load conditions are sensed on a cycle-by-cycle basis via the CS pin. When low levels of output power  
demand are detected, the controller progressively reduces the switching duty cycle to reduce power  
consumption and to improve output voltage regulation. Power demand causes increase in duty up to the  
maximum, or until Overload is detected.  
The voltage at the CS pin is compared to two thresholds, one nominally at GND voltage (VOCPL) to generate  
an internal signal OCPL and the other at a negative threshold (VOCPH) to generate an internal signal OCPH.  
The controller samples OCPL a short time (TOCPL) after turn-on of the primary switch. A negative voltage at  
the CS pin indicates power demand so the controller increases the switching duty up to the maximum;  
conversely a positive voltage causes a decrease in duty.  
Excessive primary switch current, detected via OCPH, terminates the on-period of the primary switch to limit  
power delivery (Overload mode). High levels of overload (when the converter output voltage held is low by  
the load) causes OCPH to trigger soon after turn-on of the primary switch. This condition is detected by the  
controller sampling OCPH at time TFBTHR after turn-on. If OCPH triggers within this time, the controller  
changes to Foldback mode. To prevent mis-triggering, OCPH is blanked for a short period TCSBLANK after  
turn-on.  
Product data  
© Cambridge Semiconductor Ltd 2007  
Page 10 of 18  
DS-1423-0709C  
26-Sep-2007  
C2472, C2473 and C2474 Datasheet  
RDFC Controllers for Offline Applications  
The effective thresholds for current through the primary switch for both power reduction (OCPL) and  
overload (OCPH) are programmed by the current-sense resistors connected to the CS pin as shown in  
Figure 10.  
ICSBIAS  
OCPH  
OCPH  
threshold (-ve)  
Current  
sense  
comparators  
GND  
OCPL  
CS  
GND  
R2  
Primary  
switch  
Rcs  
current  
Figure 10: Current Sense Diagram  
The internal current source (ICSBIAS) develops an offset voltage across the series resistor (R2 in Figure 10) so  
setting OCPL current threshold. Switch current in excess of overload (OCPH) is detected using a fixed  
threshold voltage but the contribution from the offset voltage across R2 has to be taken into account.  
IOCPL threshold current = (VOCPL + ICSBIAS.R2)/Rcs  
IOCPH threshold current = (VOCPH + ICSBIAS.R2)/Rcs  
VOCPH IOCPL VOCPL IOCPH  
R2   
IOCPH ICSBIAS IOCPL ICSBIAS  
VOCPH VOCPL  
Rcs   
IOCPH IOCPL  
Note: IOCPL, IOCPH, VOCPH ICSBIAS are all positive magnitude in these formulae  
Product data  
© Cambridge Semiconductor Ltd 2007  
Page 11 of 18  
DS-1423-0709C  
26-Sep-2007  
C2472, C2473 and C2474 Datasheet  
RDFC Controllers for Offline Applications  
Protection Features  
Collector De-saturation (Over Voltage) Protection (COVP)  
To protect the primary switch from excessive power dissipation, the on-state voltage of the primary switching  
transistor is limited by the controller. The controller will go to Foldback mode if the COL pin voltage is greater  
than VCOVP at the end of the on-time for four consecutive cycles.  
Over-temperature Protection (OTP)  
Temperature sensing is integrated with the controller. If the temperature of the die rises above the shutdown  
temperature, TSH, the BAS output is inhibited. It restarts once the temperature has fallen more than T SH (HYST)  
below TSH. In typical applications “hiccup” operation will occur. While BAS is inhibited, the device is active  
and draws IDDWAKE. This causes VDD to fall since auxiliary power is not provided by the transformer. Once VDD  
reaches VUVDTHR, the controller enters the Sleep state and IDD falls to IDDSLEEP allowing VDD to rise again (via  
the resistors Vht1 and Vht2). When VDD reaches VOVDTHR reset occurs and the controller re-starts. If the die  
temperature is below TSH, BAS operation continues but if it is still above TSH, BAS operation ceases after a  
short period and the hiccup cycle repeats.  
Primary Switch Over-current Protection (OCP)  
To protect the primary switch, the base drive is turned off if the primary switch current rises too high, sensed  
via the CS input voltage falling below a preset negative threshold VOCPH. See also Power Control on page  
10.  
Output Overload/Short-circuit Protection  
If the application circuit is overloaded beyond a certain limit the controller goes into Foldback mode with  
reduced duty cycle, protecting the primary switch by reducing its power dissipation. Transition to Foldback  
mode is triggered by the CS pin voltage crossing the VOCPH threshold within a time TFBTHR of the start of the  
FON pulse. This typically happens when the load holds the output voltage low. See also Power Control on  
page 10.  
Under Voltage Protection  
The controller is prevented from operating if the VDD supply is inadequate (VDD < VUVDTHR). Once the  
controller has stopped operation it will not restart until the VDD supply voltage rises above VOVDTHR  
.
Product data  
© Cambridge Semiconductor Ltd 2007  
Page 12 of 18  
DS-1423-0709C  
26-Sep-2007  
C2472, C2473 and C2474 Datasheet  
RDFC Controllers for Offline Applications  
ABSOLUTE MAXIMUM RATINGS  
CAUTION: Permanent damage may result if a device is subjected to operating conditions at or in excess of  
absolute maximum ratings.  
Parameter  
Symbol Condition  
Min  
Max  
4.6  
Units  
V
Supply voltage  
Input voltage AUX  
Input voltage BAS  
Input voltage CS  
Input voltage COL  
Pin current VDD  
Pin current AUX  
VDD  
VAUX  
VBAS  
VCS  
-0.5  
-0.5  
VDD + 0.5  
VDD + 0.5  
VDD + 0.5  
VDD + 0.5  
30  
V
V
-0.5  
V
VCOL  
IDD  
-0.5  
V
-100  
-100  
-100  
-100  
-100  
-100  
mA  
mA  
mA  
mA  
mA  
mA  
IAUX  
100  
1001  
All other conditions  
Pin current BAS  
Pin current CS  
IBAS  
While Qoff is on (Figure 7), base Tj < 125 °C  
220  
duty < 30%  
Tj < 100 °C  
400  
ICS  
100  
During PBD: ESD diode limit, input is high  
impedance  
-100  
100  
mA  
Pin current COL  
ICOL  
During turn-on transient (ACTICLAMP active)  
During resonance off period  
-250  
-125  
250  
250  
mA  
mA  
Junction  
temperature  
TJ  
TSTOR  
TL  
-25  
-40  
125  
150  
260  
oC  
oC  
oC  
Storage  
temperature  
Lead temperature  
(soldering, 10 s)  
Human body model, JESD22-A114  
2
kV  
V
ESD withstand  
Charged device model, ANSI-ESD-STM5.3.1  
500  
1 IBAS can be higher if controller is active and not in PBD or FON, up to VBAS = VDD  
Product data  
© Cambridge Semiconductor Ltd 2007  
Page 13 of 18  
DS-1423-0709C  
26-Sep-2007  
C2472, C2473 and C2474 Datasheet  
RDFC Controllers for Offline Applications  
NORMAL OPERATING CONDITIONS  
Parameter  
Symbol  
Condition  
Min  
Typ  
Max  
Units  
Supply voltage  
VDD  
VDD pin, limited by internal regulator  
3.1  
3.3  
3.5  
V
Junction  
temperature  
Over temperature protection operates  
at higher temperatures  
TJ  
-25  
25  
100  
ºC  
FCLK  
FCLKTC  
FMAX  
9.7  
-35  
12.1  
14.5  
5
MHz  
kHzC-1  
MHz  
MHz  
µs  
Tj = 25 C, VDD=VDDREG(R)  
Internal digital clock  
frequency  
Temperature coefficient  
FCLK / 61  
FCLK / 490  
35 / FCLK  
280 / FCLK  
Switching frequency,  
Normal mode  
Determined by TRES (FCLK in MHz)  
FMIN  
TRESMIN  
TRESMAX  
IDD  
Transformer  
resonance time  
Natural resonance of transformer and  
associated capacitances. FCLK in MHz.  
µs  
Supply current  
Limit externally  
30  
mA  
ELECTRICAL CHARACTERISTICS  
Unless otherwise stated:  
1. Min and Max electrical characteristics apply over normal operating conditions.  
2. Typical electrical characteristics apply at TJ = TJTYP and VDD = VDDTYP  
3. Functionality and performance is not defined when a device is subjected to conditions outside the  
range of normal operating conditions and device reliability may be compromised.  
4. For parameters dependent on FCLK, the value of FCLK,in MHz should be used in calculations.  
VDD Pin  
Parameter  
Symbol  
Condition  
Min  
Typ  
3.3  
4
Max  
Units  
V
VDDREG(R) Active state, 2.5 mA < IDD < 30 mA  
VDDREG(S) Start-up state, 2.5 mA < IDD < 30 mA  
IDDSLEEP Sleep state, VDD < VUVDTHR  
3.1  
3.5  
Regulation voltage  
Quiescent current  
V
8
µA  
Start-up & Active states, Normal mode  
IDDWAKE (VDDREG(R) – 300 mV) < VDD and  
VDD < (VDDREG(R) - 100 mV)  
Residual supply current  
0.5  
2.5  
mA  
OVD threshold, Sleep  
UVD threshold  
VOVDTHR Sleep state  
VUVDTHR Start-up and Active states  
IDD < 30 mA  
3.5  
2.7  
4.6  
3.2  
V
V
VDDREG(R) - VUVDTHR  
150  
mV  
AUX Pin  
Parameter  
Symbol  
Condition  
Min  
Typ  
Max  
100  
Units  
mA  
V
Input current  
IAUXMAX  
IAUX = 10 mA  
IAUX = 80mA  
0.84  
1.2  
1.22  
1.64  
BAS = 800 mV  
0 C < TJ < 100 C  
AUX pin voltage  
VAUXFON  
V
Product data  
© Cambridge Semiconductor Ltd 2007  
Page 14 of 18  
DS-1423-0709C  
26-Sep-2007  
C2472, C2473 and C2474 Datasheet  
RDFC Controllers for Offline Applications  
CS Pin  
Parameter  
Symbol  
Condition  
Min  
Typ  
Max  
Units  
OCPH comparator  
threshold  
VOCPH  
-260  
-235  
mV  
0 C < TJ < 100 C  
OCPL comparator  
threshold  
VOCPL  
-5  
5
mV  
OCPH comparator  
response time  
Step CS input from  
VCS > -200 mV to VCS < -300 mV  
TOCP  
0.1  
µs  
40  
67.5  
59.5  
µA  
µA  
0 C < TJ < 100 C  
Tj = 25C  
ICSBIAS  
Bias current  
41.5  
19 / FCLK  
- 0.06  
OCPL sampling time  
Blanking period  
TOCPL  
TCSBLANK  
TFBTHR  
FCLK in MHz  
FCLK in MHz  
FCLK in MHz  
µs  
µs  
µs  
4 / FCLK  
- 0.06  
Foldback threshold  
time  
26 / FCLK  
- 0.06  
BAS Pin  
Parameter  
Symbol  
Condition  
Min  
Typ  
Max  
Units  
Base drive current  
IBASMAX  
Limit by external resistor  
100  
mA  
Base clamp turn-off  
resistance  
RBASCLAMP  
DNORMAL  
VBAS = 400 mV  
Normal mode  
8.5  
%
ns  
Duty cycle  
43  
Standby mode  
0 C < TJ < 100 C  
100  
400  
230  
705  
Force-on period  
TFON  
(depends on FCLK  
)
Normal, Foldback & Power Burst  
modes. 0 C < TJ < 100 C  
ns  
µs  
µs  
Minimum on-period  
Maximum off-period  
TONMIN  
Standby (FCLK in MHz)  
Standby (FCLK in MHz)  
20 / FCLK  
1920 / FCLK  
+ TRES  
TOFFMAX  
Burst length, number of converter  
cycles  
NBURST  
TBURSTCYCMIN  
NFOLD  
22144  
39 / FCLK  
18326  
cycles  
µs  
Power Burst mode  
Foldback mode  
Minimum converter cycle period in  
Power Burst mode2 (FCLK in MHz)  
Foldback duration between bursts,  
number of converter cycles  
Converter period in Foldback mode3  
(FCLK in MHz)  
cycles  
900 / FCLK  
TRES  
+
TFOLDCYCMIN  
TOFFEXTMIN  
µs  
Extended off time (FCLK in MHz)  
896 / FCLK  
µs  
2 Minimum converter period = TRES + TONMIN  
3 Minimum converter period = TRES + TOFFEXT + TONMIN  
Product data  
© Cambridge Semiconductor Ltd 2007  
Page 15 of 18  
DS-1423-0709C  
26-Sep-2007  
C2472, C2473 and C2474 Datasheet  
RDFC Controllers for Offline Applications  
COL Pin  
Parameter  
Symbol  
Condition  
Min  
Typ  
Max  
Units  
Rising edge  
comparator  
threshold  
ICRISE  
0.4  
mA  
Falling edge  
comparator  
threshold  
ICFALL  
VCOVP  
VCREF  
-0.4  
mA  
V
Collector over-  
voltage comparator  
threshold  
0.7VDD  
0.76  
0.9VDD  
1.1  
Intercept of characteristic  
10 mA < IBAS < 80mA  
(see Figure 11)  
PBD threshold  
voltage  
V
PBD  
transconductance  
200  
28  
mAV-1  
Input leakage  
current  
-650  
25  
650  
31  
nA  
pF  
µs  
TJ < 100 C  
Input capacitance  
CINCOL  
VCOL = 1 V  
3 / FCLK  
0.06  
Standby mode (FCLK in MHz)  
ACTICLAMP  
duration after FON  
TACT  
Normal, Foldback and Power Burst  
modes (FCLK in MHz)  
4 / FCLK  
0.06  
µs  
IBAS (mA)  
100  
80  
60  
40  
20  
VCOL (V)  
1.0  
2.0  
VCREF  
Figure 11: COL/BAS Transconductance (typical, at 25 °C)  
Product data  
© Cambridge Semiconductor Ltd 2007  
Page 16 of 18  
DS-1423-0709C  
26-Sep-2007  
C2472, C2473 and C2474 Datasheet  
RDFC Controllers for Offline Applications  
THERMAL CIRCUIT PROTECTION  
Parameter  
Symbol  
Condition  
Min  
Typ  
Max  
Units  
Thermal shutdown  
temperature  
TSH  
At junction  
105  
115  
125  
oC  
Thermal shutdown  
hysteresis  
TSH (HYST)  
At junction  
35  
oC  
PACKAGE THERMAL RESISTANCE CHARACTERISTICS  
Conditions:  
1. Controller IC mounted on typical PCB (1.6 mm thick, 35 µm copper, CEM1);  
2. θJP measured to pin terminal of device at the surface of the PCB.  
Junction-to-pin  
θJP (Typical)  
Junction-to-ambient  
θJA (Typical)  
Package  
Units  
SOT23-6  
SOP-8  
60  
70  
35  
170  
140  
105  
°C / W  
°C / W  
°C / W  
PDIP-8  
PACKAGE AND ORDERING INFORMATION  
Package Marking  
The PDIP-8 (C2474PW1) and SOP-8 (C2473PX1) packages are marked with the full product type number.  
The SOT23-6 package (C2472PX2) is marked with a short code FA as illustrated in Figure 12.  
C2472PX2 product  
short code FA  
Lot dependent  
code XX (varies)  
F A X X  
Figure 12: C2472PX2 SOT23-6 Package Marking  
Ordering  
Type  
Package  
Packing Form  
7” Tape & Reel  
13” Tape & Reel  
7” Tape & Reel  
13” Tape & Reel  
Tube  
Order  
C2472PX2-TR7  
C2472PX2-TR13  
C2473PX1-TR7  
C2473PX1-TR13  
C2474PW1-T1  
C2472PX2  
SOT23-6  
C2473PX1  
C2474PW1  
SOP-8  
PDIP-8  
For further package and ordering information please contact CamSemi.  
Product data  
© Cambridge Semiconductor Ltd 2007  
Page 17 of 18  
DS-1423-0709C  
26-Sep-2007  
C2472, C2473 and C2474 Datasheet  
RDFC Controllers for Offline Applications  
DATASHEET STATUS  
The status of this Datasheet is shown in the footer. Always refer to the most current version.  
Datasheet Status  
Product  
Status  
Definition  
Product preview  
In development  
In qualification  
In production  
The Datasheet contains target specifications relating to design and  
development of the described IC product. Application circuits are illustrative  
only. Specifications are subject to change without notice.  
Preliminary  
The Datasheet contains preliminary specifications relating to functionality and  
performance of the described IC product. Application circuits are illustrative  
only. Specifications are subject to change without notice.  
Product data  
The Datasheet contains specifications relating to functionality and  
performance of the described IC product. Application circuits are illustrative  
only. Specifications are subject to change without notice.  
CONTACT DETAILS  
Cambridge Semiconductor Ltd  
St Andrew’s House  
St Andrew’s Road  
Cambridge  
CB4 1DL  
United Kingdom  
Phone: +44 (0)1223 446450  
Fax:  
+44 (0)1223 446451  
Email: sales.enquiries@camsemi.com  
Web: www.camsemi.com  
DISCLAIMER  
The product information provided herein is believed to be accurate and is provided on an “as is” basis. Cambridge Semiconductor Ltd  
(CamSemi) assumes no responsibility or liability for the direct or indirect consequences of use of the information in respect of any  
infringement of patents or other rights of third parties. Cambridge Semiconductor Ltd does not grant any licence under its patent or  
intellectual property rights or the rights of other parties.  
Any application circuits described herein are for illustrative purposes only. In respect of any application of the product described herein  
Cambridge Semiconductor Ltd expressly disclaims all warranties of any kind, whether express or implied, including, but not limited to,  
the implied warranties of merchantability, fitness for a particular purpose and non-infringement. No advice or information, whether oral or  
written, obtained from Cambridge Semiconductor Ltd shall create any warranty of any kind. Cambridge Semiconductor Ltd shall not be  
liable for any direct, indirect, incidental, special, consequential or exemplary damages, howsoever caused including but not limited to,  
damages for loss of profits, goodwill, use, data or other intangible losses.  
The products and circuits described herein are subject to the usage conditions and end application exclusions as outlined in Cambridge  
Semiconductor Ltd Terms and Conditions of Sale which can be found at www.camsemi.com/legal .  
Cambridge Semiconductor Ltd reserves the right to change specifications without notice. To obtain the most current product information  
available visit www.camsemi.com or contact us at the address shown above.  
Product data  
© Cambridge Semiconductor Ltd 2007  
Page 18 of 18  
DS-1423-0709C  
26-Sep-2007  

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