CX77129-12 [ETC]
Amplifier. Other ; 功放。其他\n
| 型号： | CX77129-12 |
| 厂家： | 
ETC |
| 描述： | Amplifier. Other
|
| 文件： | 总16页 (文件大小：237K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
CX77129
System Smart™ PA Module for CDMA / AMPS (824–849 MHz)
The CX77129 Power Amplifier Module is a dual-mode Code Division Multiple
Access (CDMA) / Advanced Mobile Phone Service (AMPS) module designed for
mobile units operating in the 824–849 MHz cellular bandwidth. This device
meets stringent IS95 CDMA linearity requirements to and beyond 28 dBm output
power and can be driven to power output levels beyond 31 dBm for high
Distinguishing Features
TM
•
•
•
System Smart design
Three switchable power states
Dual digital input for setting
power states
TM
efficiency FM mode operation. The CX77129 System Smart design presents a
•
•
Power down control
Higher efficiency over large
dynamic range
unique feature that enables exceptionally low average battery current
consumption with two control pins that accept digital signals provided by the
system’s baseband ASIC. This digital control logic defines an RF power range of
operation for the PA. The decoding logic within the PA uses this information to
optimize efficiency within this power range while meeting the specification for
Adjacent Channel Power Ratio (ACPR).
•
8-pin LCC package
(6 x 6 x 1.5 mm)
Applications
•
•
•
Digital cellular (CDMA)
Analog cellular (AMPS)
Wireless Local Loop (WLL)
The two control pins (referred to as VCONT1 and VCONT2) allow the PA to be
switched into one of four states.
•
State/Power-range 3—high power mode, linear up to POUT = 28 dBm, total
PA current is typically 560 mA (VCONT1 = High, VCONT2 = High)
• State/Power-range 2—medium power mode, linear up to POUT = 13 dBm,
total PA current is typically 130 mA (VCONT1 = Low, VCONT2 = High)
•
State/Power-range 1—low power mode, linear up to POUT = –5 dBm, total
PA current is typically 46 mA (VCONT1 = Low, VCONT2 = Low)
• State/Power-range 0—power-down mode, leakage current less than 5 µA
(VCONT1 = Low, VCONT2 = Low, VREF = 0.0 V)
The current in States 1 and 2 is much lower than that achieved in a conventional
Power Amplifier.
Functional Block Diagram
V
CC
V
CONT1
V
CONT2
V
REF
(4)
(5, 8)
(1)
(3)
Bias Circuits and Decoding Logic
Inter
Stage
Match
RFIN
(2)
Input
Match
Output
Match
RFOUT
(6)
DA
PA
MMIC
MODULE
GND
(7)
GND2
(9)
Data Sheet
101384A
© 2001, 2002 Conexant Systems, Inc., All Rights Reserved.
May 14, 2002
Electrical Specifications
77129
System Smart™ PA Module for CDMA / AMPS (824–849 MHz)
Electrical Specifications
The following tables list the electrical characteristics of the CX77129 System Smart™ Power
Amplifier. Table 1 lists the absolute maximum ratings while Table 2 shows the recommended
operating conditions to achieve the performance characteristics listed in Table 4. Table 3 presents a
truth table for the power ranges.
Table 1. Absolute Maximum Ratings(1)
Parameter
Symbol
Minimum
Nominal
Maximum
Unit
Input Power
PR3 (High Power)
PR2 (Medium Power)
PR1 (Low Power)
PIN
PIN
PIN
—
—
—
—
—
—
6.0
–5.0
–10.0
dBm
dBm
dBm
Supply Voltage
VCC
VREF
TC
—
—
3.4
3.0
25
6.0
—
Volts
Volts
°C
Reference Voltage
Case Operating Temperature
Storage Temperature
–30
–55
+110
+125
TTSTG
—
°C
NOTE(S):
(1)
No damage assumes only one parameter set at limit at a time with all other parameters set at or below
nominal value.
Table 2. Recommended Operating Conditions
Parameter
Supply Voltage
Symbol
Minimum
Nominal
Maximum
Unit
VCC
3.2
2.95
824.0
–30
2.0
3.4
3.0
4.2
3.05
849.0
+85
4.2
Volts
Volts
MHz
°C
Reference Voltage
VREF
FO
Operating Frequency
Operating Temperature
Control Voltage (HIGH)
Control Voltage (LOW)
836.5
+25
—
TC
VCONT1, VCONT2
VCONT1, VCONT2
Volts
Volts
0.0
—
0.2
Table 3. Power Range Truth Table
VCONT1(1)
VCONT2(1)
Power Mode
VREF
Range
PR3 (High Power)
PR2 (Medium Power)
PR1 (Low Power)
Shut Down
3.0 V
3.0 V
3.0 V
0.0 V
HIGH
LOW
LOW
LOW
HIGH
HIGH
LOW
LOW
13 dBm ~ 28 dBm
–5 dBm ~ 13 dBm
≤ –5 dBm
—
NOTE(S):
(1)
High (2.0 V ~ 3.0 V) Low (0.0 V ~ 0.2 V).
2. To change between High Power and Medium Power mode, switch VCONT1 and VCONT2 accordingly. Please
reverse this procedure to power-down the module.
2
Conexant
101384A
May 14, 2002
CX77129
Electrical Specifications
System Smart™ PA Module for CDMA / AMPS (824–849 MHz)
Table 4. Electrical Specifications for CDMA/AMPS Nominal Conditions(1)
Characteristic
Condition
Symbol
Minimum
Typical
Maximum
Unit
Output Power
Range 3
PR3 selected
PR2 selected
PR1 selected
PO3
PO2
PO1
—
—
—
—
—
—
28.0
13.0
–5.0
dBm
dBm
dBm
Range 2
Range 1
Quiescent current
Gain—Digital
PR1 selected
Iq1
—
30.0
45.0
mA
PR3 selected
PO = 28.0 dBm
PO = 13.0 dBm
PO = –5.0 dBm
GP3
GP2
GP1
28.7
24.0
17.0
31.0
28.0
20.0
33.5
30.0
22.5
dB
dB
dB
PR2 selected
PR1 selected
Gain—Analog
Total Supply Current
PR3 selected
PO = 31.0 dBm
Gp
29.0
31.0
33.5
dB
PO = 28.0 dBm
PO = 13.0 dBm
PO = –5.0 dBm
ICC3
ICC2
ICC1
—
—
—
560.0
133.0
46.0
620
150
55
mA
mA
mA
PR2 selected
PR1 selected
Total Supply Current in
Power Down mode
—
IPD
—
3.0
5.0
µA
Power-Added Efficiency
Digital
PR3 selected
PR2 selected
PO3 = 28.0 dBm
PO2 = 13.0 dBm
PAE3
PAE2
31.0
3.0
33.0
4.5
—
—
%
%
Power Added Efficiency
Analog
PO = 31.0 dBm
PAEa
40.0
45.0
—
%
Adjacent Channel
Power(2)
Any PR selected, up to
each range maximum
output power
ACP
ACP
—
—
–49.0
–61.5
–47.0(3)
–58.5
dBc
dBc
885 kHz offset
1980 kHz offset
Harmonic Suppression
Second
Any PR selected, up to
each range maximum
output power
2FO
3FO
—
—
—
—
–37.5
–39.0
dBc
dBc
Third
Noise Power in RX Band
Any PR selected, up to
each range maximum
output power, 45 MHz
above Tx frequency
RxBN
—
–133.0
–132.0
dBm/Hz
Noise Figure
—
NF
—
6.5
—
dB
Input Voltage Standing
Wave Ratio
PR3 selected
PR2 selected
PR1 selected
PO = 28.0 dBm
PO = 13.0 dBm
PO = –5.0 dBm
VSWR3
VSWR2
VSWR1
—
—
—
1.5:1
1.6:1
1.6:1
1.8:1
1.9:1
1.9:1
—
—
—
Stability (spurious
output)
5:1 VSWR all phases,
and any PR selected
—
—
—
–60.0
dBc
101384A
May 14, 2002
Conexant
3
Electrical Specifications
77129
System Smart™ PA Module for CDMA / AMPS (824–849 MHz)
Table 4. Electrical Specifications for CDMA/AMPS Nominal Conditions(1)
Characteristic
Condition
Symbol
Minimum
Typical
Maximum
Unit
Switching speed between
states
From any PR to any
other PR
τ-PR
—
—
5.0
µsec
Ruggedness–No damage
PO ≤ 28 dBm
Ru
10:1
—
—
VSWR
NOTE(S):
(1)
VCC = 3.4 V, VREF = 3.0 V, Freq. = 836.5 MHz, TC = 25 °C
ACP is specified per IS95 as the ratio of the total in-band power (1.23 MHz BW) to adjacent power in a 30 kHz BW
ACPR maximum for low power mode (PR1 selected) = 45.6 dBc.
(2)
(3)
4
Conexant
101384A
May 14, 2002
CX77129
Electrical Specifications
System Smart™ PA Module for CDMA / AMPS (824–849 MHz)
Table 5. Electrical Specifications for CDMA/AMPS Recommended Operating Conditions(1)
Characteristic
Condition
Symbol
Minimum
Maximum
Unit
Gain—Digital
PR3 selected
PO = 28.0 dBm
PO = 13.0 dBm
PO = –5.0 dBm
GP3
GP2
GP1
26.0
23.5
16.8
34.8
31.8
24.8
dB
dB
dB
PR2 selected
PR1 selected
Gain—Analog
PO = 31.0 dBm
Gp
26.0
35.8
dB
Power-Added Efficiency Digital
PR3 selected
PR2 selected
PO3 = 28.0 dBm
PO2 = 13.0 dBm
PAE3
PAE2
30.0
2.4
—
—
%
%
Power Added Efficiency Analog
Adjacent Channel Power(2)
885 kHz offset
PO = 31.0 dBm
PAEa
39.0
—
%
Any PR selected, up to
each range maximum
output power
1980 kHz offset
ACP
ACP
—
—
–44.0
–57.0
dBc
dBc
Harmonic Suppression
Any PR selected, up to
each range maximum
output power
Second
Third
2FO
3FO
—
—
–35.0
–35.0
dBc
dBc
Input Voltage Standing Wave Ratio
PR3 selected
PR2 selected
PR1 selected
PO = 28.0 dBm
PO = 13.0 dBm
PO = –5.0 dBm
VSWR3
VSWR2
VSWR1
—
—
—
2.0:1
2.0:1
2.0:1
—
—
—
Switching speed between states
From any PR to any
other PR
τ-PR
—
5.0
µsec
NOTE(S):
(1)
Maximum overall conditions listed in Table 2.
ACP is specified per IS95 as the ratio of the total in-band power (1.23 MHz BW) to adjacent power in a 30 kHz BW
(2)
101384A
May 14, 2002
Conexant
5
Characterization Data
77129
System Smart™ PA Module for CDMA / AMPS (824–849 MHz)
Characterization Data
The following graphs illustrate the characteristics of a typical CX77129 System Smart™ Power
Amplifier under nominal operating conditions (VCC = 3.4 V, VREF = 3.0 V, room temperature) tested
in an evaluation board described in the following section.
Figure 1. Total Battery Current vs. Output Power (Digital Mode)
600
500
PR3
400
300
200
PR2
100
PR1
0
-20
-15
-10
-5
0
5
10
15
20
25
30
PO U T (dBm)
Figure 2. Total Battery Current in Low to Medium Power Range (Digital Mode)
150
125
100
75
PR2
50
PR1
25
0
-20
-15
-10
-5
0
5
10
PO U T (dBm)
6
Conexant
101384A
May 14, 2002
CX77129
Characterization Data
System Smart™ PA Module for CDMA / AMPS (824–849 MHz)
Figure 3. Gain vs. Output Power (Digital Mode)
32
30
28
PR3
PR2
26
24
22
20
18
16
14
12
10
PR1
-20
-15
-10
-5
0
5
10
15
20
25
30
PO U T (dBm)
Figure 4. Power Added Efficiency vs. Output Power (Digital Mode)
50
40
30
20
PR3
10
PR1
PR2
0
-20
-15
-10
-5
0
5
10
15
20
25
30
PO U T (dBm)
101384A
May 14, 2002
Conexant
7
Characterization Data
77129
System Smart™ PA Module for CDMA / AMPS (824–849 MHz)
Figure 5. Adjacent Channel Power vs. Output Power (Digital Mode)
ACP1u
ACP1l
0
-10
-20
-30
-40
-50
PR3
PR1
PR2
-60
-70
-80
-90
-20
-15
-10
-5
0
5
10
15
20
25
30
PO U T (dBm)
Figure 6. Harmonic Suppression vs. Output Power (Digital Mode)
2Fo
3Fo
0
-10
-20
-30
PR3
-40
PR1
PR2
-50
-60
-70
-80
-20
-15
-10
-5
0
5
10
15
20
25
30
PO U T (dBm)
8
Conexant
101384A
May 14, 2002
CX77129
Characterization Data
System Smart™ PA Module for CDMA / AMPS (824–849 MHz)
Figure 7. Gain vs. Output Power (Analog Mode)
32
30
28
26
24
22
20
18
16
14
12
10
0
2
4
6
8
10 12 14 16 18 20 22 24 26 28 30 32
POU T (dBm)
Figure 8. Power Added Efficiency vs. Output Power (Analog Mode)
50
45
40
35
30
25
20
15
10
5
0
0
2
4
6
8
10 12 14 16 18 20 22 24 26 28 30 32
PO U T (dB)
101384A
May 14, 2002
Conexant
9
Characterization Data
77129
System Smart™ PA Module for CDMA / AMPS (824–849 MHz)
Figure 9. Harmonic Suppression vs. Output Power
2Fo
3Fo
0
-10
-20
-30
-40
-50
-60
-70
0
2
4
6
8
10
12
14
16
18
20
22
24
26
28
30
32
Po ut (dBm)
10
Conexant
101384A
May 14, 2002
CX77129
Evaluation Board Description
System Smart™ PA Module for CDMA / AMPS (824–849 MHz)
Evaluation Board Description
The evaluation board is a platform for testing and interfacing design circuitry. To accommodate the
interface testing of the CX77129, the evaluation board schematic and diagrams are included for
preliminary analysis and design. Figure 10 shows the basic schematic of the board for the 824 MHz
to 849 MHz range. Figure 11 illustrates the board layout.
Figure 10. Evaluation Board Schematic
VCC1
VCC2
C2
C6
C4
C5
VCONT2
8
1
2
3
7
6
5
CX77129
RF OUT
VCONT1
RF IN
VREF
4
C1
C3
101384_004
Figure 11. Evaluation Board Assembly Diagram
C5
U1
C2
C6
C4
C1
C3
Prototype Test-Board
Component Description
Location
C1
Value
4.7 µF
C2
4.7 µF
C3
10,000 pF
1,000 pF
150 pF
330 pF
C4
C5
C6
101384_003
101384A
May 14, 2002
Conexant
11
Typical System Design Implementation
77129
System Smart™ PA Module for CDMA / AMPS (824–849 MHz)
Typical System Design Implementation
Figure 12 shows the CX77129 interface to baseband logic and transmit chain in a typical handset.
Since CX77129 uses two CMOS logic level power control pins, two pull-up resistors are required.
Another CMOS logic pin (PA_ON) can be used to enable / disable the CX77129. A NPN bipolar
transistor and P-Channel P-FET are used to supply VREF to the CX77129. In order to provide a
consistent voltage with adequate current from the Low Drop-Out voltage regulator, a low
on-resistance P-FET is required.
Figure 12. Interconnect Schematic
VDD
LDO Regulator
PA_ON
PA_R0
PA_R1
Baseband
Signal
Processor
and
VCONT1
VCONT2
VREF
CX77129
VDD
PA_ON
Control Logic
SAW
Filter
RFIN
RFOUT
CDMA
I/Q DACs
UpConverter/
Driver
GND
VCC1, VCC2
+
VBATTERY
–
101059_005
The following steps are used to power up the CX77129 module.
1. Connect Vcc to a 3.4 V DC power supply, then turn on the supply.
2. Connect Vref to a 3.0 V DC power supply, then turn on the supply.
3. For High Power mode (up to 28dBm), apply HIGH to VCONT1 and VCONT2.
4. For Medium Power, Low Power, and Shutdown modes, refer to Table 3.
5. Apply RF signal.
12
Conexant
101384A
May 14, 2002
CX77129
Package Dimensions & Pin Descriptions
System Smart™ PA Module for CDMA / AMPS (824–849 MHz)
Package Dimensions & Pin Descriptions
Figure 13 shows the bottom view of the CX77129 package outline with the solder pads clearly
visible. Table 6 lists the CX77129 signal descriptions.
Figure 13. CX77129 Package Drawing
1.41
TYP
3.20
1.40
1.50
VCONT2
1
8
7
6
5
GND
VCC1
RF IN
R0.20
0.90
GROUND
PAD
RF OUT
3.06
2
3
6.00
0.76
PAD
DETAIL
4
VCC2
VREF
VCONT1
SIDE VIEW
TOP VIEW
Note: Solder mask pattern pad layout as
seen from top looking through package.
All dimensions in millimeters.
101384_002
Table 6. Signal Description
Pin
Name
VCC1
Description
1
2
3
Supply for High-Power Amplifier. Must be decoupled close to package
RF IN
VREF
50 Ω RF Input—DC decoupled internally inside module
Power Range logic (Analog voltage, NOT CMOS COMPATIBLE). See Table 3 for logic
states
4
5
6
7
8
VCONT1
VCONT2
RF OUT
GND
Power Range logic (Digital Voltage, CMOS COMPATIBLE). See Table 3 for logic states
Supply for High-Power Amplifier. Must be decoupled close to package
50 Ω RF Output—DC decoupled internally inside module
GND for Logic Circuits
VCONT2
GND2
Power Range logic (Digital Voltage, CMOS COMPATIBLE). See Table 3 for logic states
9
Backside of package must be solder-connected directly to a ground plane by multiple
VIA’s
(Pkg
Base)
101384A
May 14, 2002
Conexant
13
Packaging and Handling Information
77129
System Smart™ PA Module for CDMA / AMPS (824–849 MHz)
Packaging and Handling Information
Because of its sensitivity to moisture absorption, this device package is baked and vacuum packed
prior to shipment. Instructions on the shipping container label must be followed regarding exposure
to moisture after the container seal is broken, otherwise, problems related to moisture absorption
may occur when the part is subjected to high temperature during solder assembly.
The CX77129 is capable of withstanding an MSL 3/225 °C solder reflow. Care must be taken when
attaching this product, whether it is done manually or in a production solder reflow environment. If
the part is attached in a reflow oven, the temperature ramp rate should not exceed 5 °C per second;
maximum temperature should not exceed 225 °C. If the part is manually attached, precaution
should be taken to insure that the part is not subjected to temperatures exceeding 225 °C for more
than 10 seconds. For details on both attachment techniques, precautions, and handling procedures
recommended by Conexant, please refer to Application Note: PCB Design and SMT
Assembly/Rework, Document Number 101752. Additional information on standard SMT reflow profiles
can also be found in the JEDEC Standard J–STD–020A.
Production quantities of this product are shipped in the standard tape-and-reel format. For
packaging details, refer to Application Note: Tape and Reel, Document Number 101568.
Figure 1. Typical Case Markings
CONEXANT
CX77129-NN
Manufacturing Part Number-Revision Number
Mark Pin 1
Identifier
EXXXXX.XX MEX
YYWW
Lot Number Country Code
YY = Manufacture Year
WW = Week Package Sealed
101384_006
14
Conexant
101384A
May 14, 2002
Ordering Information
Manufacturing
Part Number
Product
Revision
Model Number
Package
Operating Temperature
CX77129
CX77129–12
12
—
—
Revision History
Revision
Level
Date
Description
A
—
May 15, 2002
Initial Release
References
Application Note: PCB Design and SMT Assembly/Rework, Document Number 101752.
Application Note: Tape and Reel, Document Number 101568
Standard SMT Reflow Profiles: JEDEC Standard J–STD–020A.
© 2001, 2002 Conexant Systems, Inc.
All Rights Reserved.
Information in this document is provided in connection with Conexant Systems, Inc. (“Conexant”) products. These materials are
provided by Conexant as a service to its customers and may be used for informational purposes only. Conexant assumes no
responsibility for errors or omissions in these materials. Conexant may make changes to specifications and product descriptions at
any time, without notice. Conexant makes no commitment to update the information and shall have no responsibility whatsoever for
conflicts or incompatibilities arising from future changes to its specifications and product descriptions.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as
provided in Conexant’s Terms and Conditions of Sale for such products, Conexant assumes no liability whatsoever.
THESE MATERIALS ARE PROVIDED “AS IS” WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESS OR IMPLIED, RELATING
TO SALE AND/OR USE OF CONEXANT PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A
PARTICULAR PURPOSE, CONSEQUENTIAL OR INCIDENTAL DAMAGES, MERCHANTABILITY, OR INFRINGEMENT OF ANY
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ACCURACY OR COMPLETENESS OF THE INFORMATION, TEXT, GRAPHICS OR OTHER ITEMS CONTAINED WITHIN THESE
MATERIALS. CONEXANT SHALL NOT BE LIABLE FOR ANY SPECIAL, INDIRECT, INCIDENTAL, OR CONSEQUENTIAL
DAMAGES, INCLUDING WITHOUT LIMITATION, LOST REVENUES OR LOST PROFITS, WHICH MAY RESULT FROM THE USE
OF THESE MATERIALS.
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