F210U-BY230 [ETC]
Fanless Embedded PC for Cloud Terminal and Digital Signage Applications;型号: | F210U-BY230 |
厂家: | ETC |
描述: | Fanless Embedded PC for Cloud Terminal and Digital Signage Applications PC |
文件: | 总2页 (文件大小:337K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Fanless Embedded PC
for Cloud Terminal and Digital Signage Applications
Giada F210U
Features
• Intel® Atom™ x5-Z8350 Processor (Cherry Trail)
• Supports Windows, Linux and Android
• Dual independent display support
• Onboard memory and eMMC
• Fanless design for silent operation
Specifications
F210U-BY460
F210U-BY230
CPU
Intel® AtomTM X5-Z8350 Processor
Intel® AtomTM X5-Z8350 Processor
Frequency
L3 Cache
1.44 GHz (up to 1.92 GHz)
1.44 GHz (up to 1.92 GHz)
2 MB
2 MB
Processor
System
Process Technology
14 nm
14 nm
Cores / Threats
4 / 4
4 / 4
Scenario Design Power
(SDP)
2 W
AMI EFI 64 Mb
2 W
AMI EFI 64 Mb
BIOS
Type
Memory
DDR3L-1600MHz Onboard
4 GB
DDR3L-1600MHz Onboard
2 GB
Capacity
GPU
Integrated Intel® HD Graphics 400
DirectX11, OpenGL4.0 and OpenCL 1.2
1 x VGA
Integrated Intel® HD Graphics 400
DirectX11, OpenGL4.0 and OpenCL 1.2
1 x VGA
Graphic Engine
Graphics
VGA
1 x HDMI
Max. 1920 x 1080 @60Hz
1 x HDMI
Max. 1920 x 1080 @60Hz
HDMI
Audio
Controller
Controller
1 x MIC-IN, 1 x AUDIO OUT
1 x MIC-IN, 1 x AUDIO OUT
Realtek 8111F, Gigabit Ethernet
Realtek 8111F, Gigabit Ethernet
Networking
WIFI/BT
Onboard WIFI+BT
1 x COM
Onboard WIFI+BT
1 x COM
Serial Ports
USB Interface
Watchdog Timer
IR
I/O Interface
1 x USB 3.0, 3 x USB 2.0
Patented JAHC unattended Technology
Yes
1 x USB 3.0, 3 x USB 2.0
Patented JAHC unattended Technology
Yes
Other
Expansion
Storage
Mini PCIe
2xMini-Pcle(3G/SSD)
2xMini-Pcle(3G/SSD)
eMMC
64 GB
32 GB
TF Card
1x TF card reader
1x TF card reader
Microsoft Windows
Android
Windows® 8.1 64-bit, Windows® 10 64-bit
Windows® 8.1 64-bit, Windows® 10 64-bit
Android 5.1
Ubuntu 14.04
DC-IN
Android 5.1
Ubuntu 14.04
DC-IN
OS Support
Linux
Power Type
Power Adapter
Construction
Mounting
Power
Requirement
12V 2A
12V 2A
Metal
Metal
VESA Mounting Kit (Optional)
116.6 x 107.2 x 30 mm
Black
VESA Mounting Kit (Optional)
116.6 x 107.2 x 30 mm
Black
Mechanical
Dimensions(W x H x D)
Color
F210U-BY460
F210U-BY230
Operating Temperature
Storage Temperature
Relative Humidity
EMC
0~40 ℃ at 0.7m/s air flow
-20~60 ℃
Environment
Regulation
95%@40℃ (non-condensing)
CE/FCC Class B, CCC
CE/FCC LVD, CCC
Safety
Others
RoHS, REACH, WEEE, EN62311, EN300328, CE EMC, EMS, CE LVD
Order Information
Intel
Operating
Temperature
Part Number
RAM
eMMC
Wi-Fi
Mini-PCIe
COM
IR
JAHC
CPU
Z8350
Z8350
WiFi+BT
Wi-Fi+BT
1 x full/half-length w/SIM
1 x full/half-length w/SIM
1
1
Yes
Yes
Yes
Yes
0 ~ 40 ℃
0 ~ 40 ℃
F210U-BY460
F210U-BY230
4 GB
2 GB
64 GB
32 GB
Packing List
Part Number
Description
Part Number
Description
-
-
-
-
1 x F210
1 x User Manual
-
-
-
-
1 x DVD
1 x Power Adapter
1 x Wi-Fi antenna
Optional
1 x AC power cable
1 x VESA Mounting Kit (NUC-JC530)
The product appearance, specifications and features are subject to change. Giada reserves the right of final interpretation for the content hereinabove.
相关型号:
F211AF104J050C
SMR Series Metallized Polyphenylene Sulfide Film, 150C, 5.0 â 27.5 mm Lead Spacing, 50 â 400 VDC
KEMET
F211AF104J063C
SMR Series Metallized Polyphenylene Sulfide Film, 150C, 5.0 â 27.5 mm Lead Spacing, 50 â 400 VDC
KEMET
F211AF104J100C
SMR Series Metallized Polyphenylene Sulfide Film, 150C, 5.0 â 27.5 mm Lead Spacing, 50 â 400 VDC
KEMET
F211AF104J250C
SMR Series Metallized Polyphenylene Sulfide Film, 150C, 5.0 â 27.5 mm Lead Spacing, 50 â 400 VDC
KEMET
F211AF104J400C
SMR Series Metallized Polyphenylene Sulfide Film, 150C, 5.0 â 27.5 mm Lead Spacing, 50 â 400 VDC
KEMET
F211AF104K050C
SMR Series Metallized Polyphenylene Sulfide Film, 150C, 5.0 â 27.5 mm Lead Spacing, 50 â 400 VDC
KEMET
©2020 ICPDF网 联系我们和版权申明