FAN2513S33 [ETC]
Positive Fixed Voltage Regulator ; 正固定电压稳压器\n型号: | FAN2513S33 |
厂家: | ETC |
描述: | Positive Fixed Voltage Regulator
|
文件: | 总10页 (文件大小:282K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
www.fairchildsemi.com
FAN2512, FAN2513
150 mA CMOS LDO Regulators with Fast Start Enable
wide variety of external capacitors, and the compact SOT23-5
surface-mount package. In addition, the FAN2512/13 family
offer the fast power-cycle time required in CDMA handset
applications. These products offer significant improvements
over older BiCMOS designs and are pin-compatible with
many popular devices. The output is thermally protected
Features
• Ultra Low Power Consumption
• Enable optimized for CDMA time slices
• 150 mV dropout voltage at 150 mA
• 25 µA ground current at 150 mA
• Enable/Shutdown Control
against overload.
• SOT23-5 package
• Thermal limiting
• 300 mA peak current
The FAN2512 and FAN2513 devices are distinguished by
the assignment of pin 4:
FAN2512: pin 4 – ADJ, allowing the user to adjust the
output voltage over a wide range using an external voltage
divider.
Applications
• Cellular Phones and accessories
• PDAs
• Portable cameras and video recorders
FAN2512-XX: pin 4 – BYP, to which a bypass capacitor
• Laptop, notebook and palmtop computers
may be connected for optimal noise performance. Output
voltage is fixed, indicated by the suffix XX.
Description
The FAN2512/13 family of micropower low-dropout voltage
regulators utilize CMOS technology to offer a new level of
cost-effective performance in GSM, TDMA, and CDMA
FAN2513-XX: pin 4 – ERR, a flag which indicates that the
output voltage has dropped below the specified minimum
due to a fault condition.
cellular handsets, Laptop and Notebook portable computers,
The standard fixed output voltages available are 2.5V, 2.6V,
and other portable devices. Features include extremely low
2.7V, 2.8V, 2.85V, 3.0V, and 3.3V. Custom output voltage are
power consumption and low shutdown current, low dropout
also available: please contact your local Fairchild Sales
voltage, exceptional loop stability able to accommodate a
Office for information.
Block Diagrams
EN
EN
V
IN
V
IN
BYP
Bandgap
Bandgap
p
p
Error
Error
Amplifier
Amplifier
V
ADJ
OUT
V
OUT
Thermal
Sense
Thermal
Sense
GND
GND
FAN2512
FAN2512-XX
EN
V
IN
ERR
Bandgap
p
Error
Amplifier
V
OUT
Thermal
Sense
GND
FAN2513-XX
REV. 1.1.3 5/23/01
PRODUCT SPECIFICATION
FAN2512/FAN2513
Pin Assignments
VIN
GND
EN
1
2
3
5
4
VOUT
ADJ/BYP/ERR
Pin No.
FAN2512
VIN
FAN2512-XX
VIN
FAN2513-XX
1.
2.
3.
4.
5.
VIN
GND
EN
GND
EN
GND
EN
ADJ
BYP
ERR
VOUT
VOUT
VOUT
Pin Descriptions
Pin Name Pin No.
Type
Pin Function Description
ADJ
4
Input
FAN2512 Adjust. Ratio of potential divider from VOUT to ADJ
determines output voltage.
BYP
ERR
4
4
Passive
FAN2512-XX Bypass. Connect 470 pF capacitor for noise reduction.
Open drain
FAN2513-XX Error. Error flag output.
0: Output voltage < 95% of nominal.
1: Output voltage > 95% of nominal.
EN
3
Digital Input
Enable.
0: Shutdown VOUT
.
1: Enable VOUT
.
VIN
1
5
2
Power in
Power out
Power
Voltage Input. Supply voltage input.
Voltage Output. Regulated output voltage.
Ground.
VOUT
GND
Functional Description
Designed utilizing CMOS process technology, the
Protection circuitry is provided onboard for overload condi-
tions. In conditions where the device reaches temperatures
exceeding the specified maximums, an onboard circuit shuts
down the output, where it remains suspended until it has
cooled before re-enabling. The user is also free to shut down
the device using the Enable control pin at any time.
FAN2512/13 family of products are carefully optimized for
use in compact battery-powered devices, offering a unique
combination of low power consumption, extremely low
dropout voltages, high tolerance for a variety of output
capacitors, and the ability to disable the output to less than
1µA under user control. In the circuit, a difference amplifier
controls the current through a series-pass P-Channel
MOSFET, comparing the load voltage at the output with an
onboard low-drift bandgap reference. The series resistance
of the pass P-Channel MOSFET is approximately 1Ω, result-
ing in an unusually low dropout voltage under load when
compared to older bipolar pass-transistor designs.
Careful design of the output regulator amplifier assures loop
stability over a wide range of ESR values in the external
output capacitor. A wide range of values and types can be
accommodated, allowing the user to select a capacitor
meeting his space, cost, and performance requirements,
and enjoy reliable operation over temperature, load, and
tolerance variations.
2
REV. 1.1.3 5/23/01
FAN2512/FAN2513
PRODUCT SPECIFICATION
An Enable pin, available on all devices, allows the user to
shut down the regulator output to conserve power, reducing
supply current to less than 1µA. The output can then be
re-Enabled within 500µSec, fulfilling the fast power-cycling
needs of CDMA applications. Depending on the model
selected, other control and status functions are available at
pin 4 to enhance the operation of the device. The adjustable-
voltage versions utilize pin 4 to connect to an external
voltage divider which feeds back to the regulator error
amplifier, thereby setting the voltage as desired. Two other
functions are available in the fixed-voltage versions: in
noise-sensitive applications, an external Bypass capacitor
connection is provided that allows the user to achieve opti-
mal noise performance at the output, while the Error output
functions as a diagnostic flag to indicate that the output
voltage has dropped more than 5% below the nominal fixed
voltage.
more. Tantalum or aluminum electrolytic, or multilayer
ceramic types can all be used. A nominal value of at least
1µF is recommended.
Bypass Capacitor (FAN2512 Only)
In the fixed-voltage configuration, connecting a capacitor
between the bypass pin and ground can significantly reduce
noise on the output. Values ranging from 470pF to 10nF can
be used, depending on the sensitivity to output noise in the
application.
At the high-impedance Bypass pin, care must be taken in the
circuit layout to minimize noise pickup, and capacitors must
be selected to minimize current loading (leakage). Noise
pickup from external sources can be considerable. Leakage
currents into the Bypass pin will directly affect regulator
accuracy and should be kept as low as possible; thus, high-
quality ceramic and film types are recommended for their
low leakage characteristics. Cost-sensitive applications not
concerned with noise can omit this capacitor.
Applications Information
External Capacitors – Selection
Control Functions
Enable Pin
Applying a voltage of 0.4V or less at the Enable pin will dis-
able the output, reducing the quiescent output current to less
than 1µA, while a voltage of 2.0V or greater will enable the
device. If this shutdown function is not needed, the pin can
simply be connected to the VIN pin. Allowing this pin to float
will cause erratic operation.
The FAN2512/13 allows the user to utilize a wide variety of
capacitors compared to other LDO products. An innovative
design approach offers significantly reduced sensitivity to
ESR (Effective Series Resistance), which degrades regulator
loop stability in older designs. While the improvements fea-
tured in the FAN2512/13 family greatly simplify the design
task, capacitor quality still must be considered if the designer
is to achieve optimal circuit performance. In general,
ceramic capacitors offer superior ESR performance, at a
lower cost and a smaller case size than tantalums. Those with
X7R or Y5Vdielectric offer the best temperature coefficient
characteristics. The combination of tolerance and variation
over temperature in some capacitor types can result in signif-
icant variations, resulting in unstable performance over rated
conditions.
Error Flag (FAN2513 Only)
To indicate conditions such as input voltage dropout
(low VIN), overheating, or overloading (excessive output
current), the ERR pin indicates a fault condition. It is an
open-drain output which is HIGH when the voltage at VOUT
is greater than 95% of the nominal rated output voltage and
LOW when VOUT is less than 95% or the rated output volt-
age, as specified in the error trip level characteristics.
Input Capacitor
An input capacitor of 2.2µF (nominal value) or greater,
connected between the Input pin and Ground, located in
close proximity to the device, will improve transient
response and noise rejection. Higher values will offer supe-
rior input ripple rejection and transient response. An input
capacitor is recommended when the input source, either a
battery or a regulated AC voltage, is located far from the
device. Any good quality ceramic, tantalum, or metal film
capacitor will give acceptable performance, however tanta-
lum capacitors with a surge current rating appropriate to the
application must be selected to avoid catastrophic failure.
A logic pullup resistor of 100KΩ is recommended at this
output. The pin can be left disconnected if unused.
Thermal Protection
The FAN2512/13 is designed to supply high peak output
currents of up to 1A for brief periods, however this output
load will cause the device temperature to increase and
exceed maximum ratings due to power dissipation. During
output overload conditions, when the die temperature
exceeds the shutdown limit temperature of 190°C, onboard
thermal protection will disable the output until the tempera-
ture drops below this limit, at which point the output is then
re-enabled. During a thermal shutdown situation the user
may assert the power-down function at the Enable pin,
Output Capacitor
An output capacitor is required to maintain regulator loop
stability. Unlike many other LDO regulators, the FAN2512/13
family of products are nearly insensitive to output capacitor
ESR. Stable operation will be achieved with a wide variety
of capacitors with ESR values ranging from 10mΩ to 10Ω or
reducing power consumption to the minimum level IGND
.
REV. 1.1.3 5/23/01
3
PRODUCT SPECIFICATION
FAN2512/FAN2513
device to enter a thermal cycling loop, in which the circuit
enters a shutdown condition, cools, re-enables, and then
again overheats and shuts down repeatedly due to an
unmanaged fault condition.
Thermal Characteristics
The FAN2512/13 is designed to supply 150mA at the speci-
fied output voltage with an operating die (junction) tempera-
ture of up to 125°C. Once the power dissipation and thermal
resistance is known, the maximum junction temperature of
the device can be calculated. While the power dissipation is
calculated from known electrical parameters, the thermal
resistance is a result of the thermal characteristics of the
compact SOT23-5 surface-mount package and the surround-
ing PC Board copper to which it is mounted.
Operation of Adjustable Version
The adjustable version of the FAN2512/13 includes an input
pin ADJ which allows the user to select an output voltage
ranging from 1.32V to near VIN, using an external resistor
divider. The voltage VADJ presented to the ADJ pin is fed to
the onboard error amplifier which adjusts the output voltage
until VADJ is equal to the onboard bandgap reference voltage
of 1.32V(typ). The equation is:
The power dissipation is equal to the product of the input-to-
output voltage differential and the output current plus the
ground current multiplied by the input voltage, or:
Rupper
VOUT = 1.32V × 1 + ---------------
PD = (VIN – VOUT)IOUT + VINIGND
Rlower
The total value of the resistor chain should not exceed
250KΩ total to keep the error amplifier biased during
no-load conditions. Programming output voltages very near
VIN need to allow for the magnitude and variation of the
dropout voltage VDO over load, supply, and temperature
variations. Note that the low-leakage FET input to the
CMOS Error Amplifier induces no bias current error to the
calculation.
The ground pin current IGND can be found in the charts
provided in the Electrical Characteristics section.
The relationship describing the thermal behavior of the
package is:
T
J(max) – T
A
-------------------------------
PD(max)
=
θJA
where TJ(max) is the maximum allowable junction tempera-
ture of the die, which is 125°C, and TA is the ambient operat-
ing temperature. θJA is dependent on the surrounding PC
board layout and can be empirically obtained. While the θJC
(junction-to-case) of the SOT23-5 package is specified at
130°C /W, the θJA of the minimum PWB footprint will be at
least 235°C /W. This can be improved upon by providing a
heat sink of surrounding copper ground on the PWB.
Depending on the size of the copper area, the resulting θJA
can range from approximately 180°C /W for one square inch
to nearly 130°C /W for 4 square inches. The addition of
backside copper with through-holes, stiffeners, and other
enhancements can also aid in reducing this value. The heat
contributed by the dissipation of other devices located
nearby must be included in design considerations.
General PWB Layout Considerations
To achieve the full performance of the device, careful circuit
layout and grounding technique must be observed. Establish-
ing a small local ground, to which the GND pin, the output
and bypass capacitors are connected, is recommended, while
the input capacitor should be grounded to the main ground
plane. The quiet local ground is then routed back to the main
ground plane using feedthrough vias. In general, the high-
frequency compensation components (input, bypass, and
output capacitors) should be located as close to the device as
possible. The proximity of the output capacitor is especially
important to achieve optimal noise compensation from the
onboard error amplifier, especially during high load condi-
tions. A large copper area in the local ground will provide the
heat sinking discussed above when high power dissipation
significantly increases the temperature of the device.
Once the limiting parameters in these two relationships have
been determined, the design can be modified to ensure that
the device remains within specified operating conditions. If
overload conditions are not considered, it is possible for the
Component-side copper provides significantly better thermal
performance for this surface-mount device, compared to that
obtained when using only copper planes on the underside.
4
REV. 1.1.3 5/23/01
FAN2512/FAN2513
PRODUCT SPECIFICATION
Absolute Maximum Ratings (beyond which the device may be damaged)1
Parameter
Min
Typ
Max
Unit
V
Power Supply Voltages
VIN (Measured to GND)
Enable Input (EN)
Applied voltage (Measured to GND)2
ERR Output
0
7
7
7
0
V
Applied voltage (Measured to GND)2
0
V
Power
Dissipation3
Internally limited
Temperature
Junction
-65
150
260
150
°C
°C
°C
kV
Lead Soldering (5 seconds)
Storage
Electrostatic Discharge4
-65
4
Notes:
1. Functional operation under any of these conditions is NOT implied. Performance and reliability are guaranteed only
if Operating Conditions are not exceeded.
2. Applied voltage must be current limited to specified range.
3. Based upon thermally limited junction temperature:
T
J(max) – TA
ΘJA
PD = -------------------------------
4. Human Body Model is 4kV minimum using Mil Std. 883E, method 3015.7. Machine Model is 400V minimum using JEDEC
method A115-A.
Operating Conditions
Parameter
VIN
Min
2.7
Vref
0
Nom
Max
6.5
Units
V
Input Voltage Range
Output Voltage Range, Adjustable
Enable Input Voltage
ERR Flag Voltage
VO
VIN–VDO
VIN
V
VEN
V
VERR
TJ
VIN
V
Junction Temperature
Thermal resistance
-40
+125
°C
θJA
220
130
°C/W
°C/W
θJC
Thermal resistance
REV. 1.1.3 5/23/01
5
PRODUCT SPECIFICATION
FAN2512/FAN2513
Electrical Characteristics (Notes 1, 2)
Symbol
Regulator
VDO
Parameter
Conditions
Min.
Typ.
Max.
Units
Drop Out Voltage
IOUT = 100 µA
2.5
50
4
75
mV
mV
mV
mV
%
IOUT = 50 mA
IOUT = 100 mA
IOUT = 150 mA
100
150
140
180
2
∆VO
Output Voltage Accuracy
-2
1.24
-6
VDO
ReferenceVoltageAccuracy,AdjustableMode
Output Voltage Accuracy, Adjustable Mode
Ground Pin Current
1.32
1.40
6
V
3
∆VO
%
IGND
IOUT = 150 mA
50
µA
Protection
Current Limit
Thermally Protected
150
IGSD
TSH
ETL
Shut-Down Current
EN = 0V
1
µA
°C
%
Thermal Protection Shutdown Temperature
ERR Trip Level
FAN2513 only
90
95
99
0.4
Enable Input
VIL
VIH
IIH
II
Logic Low Voltage
1.2
1.4
V
V
Logic High Voltage
Input Current High
Input Current Low
2.0
1
1
µA
µA
Switching Characteristics (Notes 1, 2)
Parameter
Enable Input4
Conditions
Min.
Typ.
Max.
Unit
Response time
500
3
µsec
Error Flag (FAN2513-XX)
Response time
msec
Performance Characteristics (Notes 1, 2)
Symbol
∆VOUT/∆VIN
∆VOUT/VOUT
eN
Parameter
Conditions
Min. Typ. Max. Units
Line regulation
Load regulation
Output noise
VIN = (VOUT + 1) to 7V
IOUT = 0.1 to 150mA
10Hz–1KHz
0.3
1.0
<7
% /V
%
2.0
µV/
Hz
C
OUT = 10µF,
CBYP = 0.01µF
>10KHz,
<0.01
43
C
C
OUT = 10µF,
BYP = 0.01µF
PSRR
Power Supply Rejection
120 Hz,
COUT = 10µF,
CBYP = 0.01µF
dB
Notes:
1. Unless otherwise stated, T = 25°C, V = V
+ 1V, I
= 100µA, V > 2.0 V.
A
IN
OUT
OUT IH
2. Bold values indicate -40 ≤ T ≤ 125°C.
J
3. The adjustable version, has a bandgap voltage range of 1.24V to 1.40V with a nominal value of 1.32V.
4. When using repeated cycling.
6
REV. 1.1.3 5/23/01
FAN2512/FAN2513
PRODUCT SPECIFICATION
Typical Performance Characteristics
Power Supply
Rejection Ratio
Power Supply
Rejection Ratio
Power Supply
Rejection Ratio
100
80
60
40
20
0
100
80
60
40
20
0
100
80
60
40
20
0
IOUT = 10mA
OUT = 1.0µF Cer.
IOUT = 100µA
OUT = 1.0µF Cer.
IOUT = 100mA
OUT = 1.0µF Cer.
C
C
C
VIN = 4.0V
VIN = 4.0V
OUT = 3.0V
V
OUT = 3.0V
V
VIN = 4.0V
OUT = 3.0V
V
1k 10k
1M
1k 10k
1M
10 100
100k
10M
10 100
100k
10M
1k 10k
1M
10M
10 100
100k
Frequency (Hz)
Frequency (Hz)
Frequency (Hz)
Power Supply
Rejection Ratio
Power Supply
Rejection Ratio
Power Supply
Rejection Ratio
100
80
60
40
20
0
100
100
IOUT = 10mA
COUT = 10µF Cer.
CBYP = 0.01µF
IOUT = 150mA
OUT = 1.0µF Cer.
IOUT = 100µA
OUT = 10µF Cer.
CBYP = 0.01µF
C
C
80
60
40
20
0
80
60
40
20
0
VIN = 4.0V
OUT = 3.0V
VIN = 4.0V
VOUT = 3.0V
V
VIN = 4.0V
V
OUT = 3.0V
1k 10k
1M
10M
10 100
100k
1k 10k
1M
10M
10 100
100k
1k 10k
1M
10M
10 100
100k
Frequency (Hz)
Frequency (Hz)
Frequency (Hz)
Power Supply
Rejection Ratio
Power Supply
Rejection Ratio
Power Supply
Rejection Ratio vs. Voltage Drop
100
80
60
40
20
0
100
80
60
40
20
0
70
IOUT = 100mA
COUT = 10µF Cer.
CBYP = 0.01µF
IOUT = 150mA
COUT = 10µF Cer.
CBYP = 0.01µF
60
IOUT = 100µA
10mA
50
40
30
20
10
0
VIN = 4.0V
VIN = 4.0V
OUT = 3.0V
V
OUT = 3.0V
V
COUT = 1.0µF Cer.
100mA
150mA
3.0
3.6
Voltage (V)
4.1
1k 10k
1M
1k 10k
1M
10M
10 100
100k
10M
10 100
100k
Frequency (Hz)
Frequency (Hz)
Power Supply
Rejection Ratio vs. Voltage Drop
Noise Performance
Ground Pin Current
10
1
70
30.00
28.00
60
VIN = 4V
VIN = 4V
IOUT = 10mA
50
40
V
OUT = 3V
V
OUT = 3V
0.1
26.00
24.00
22.00
20.00
100µA
100mA
30
20
10
0
0.01
0.001
0.0001
COUT = 10µF Cer.
COUT = 1.0µF
CBYP = 0.01µF
L = 10µA
150mA
I
3.0
3.6
Voltage (V)
4.1
1k
10k
1M
10 100
100k
10
1
Load Current (mA)
100
0.1
Frequency (Hz)
REV. 1.1.3 5/23/01
7
PRODUCT SPECIFICATION
FAN2512/FAN2513
Typical Performance Characteristics (continued)
Ground Pin Current
Ground Pin Current
Ground Pin Current
35.00
30.00
35.00
30.00
75
50
25
0
VIN = 4V
VOUT = 3V
IL = 100µA
25.00
20.00
15.00
25.00
20.00
15.00
10.00
5.00
0.00
10.00
5.00
0.00
VOUT = 3V
VOUT = 3V
I
OUT = 100µA
I
OUT = 150mA
4.0
5.0
7.0
125
125
4.0
5.0
7.0
0
40
Temperature (°C)
125
3.0
6.0
3.0
6.0
-40
80
Input Voltage (V)
Input Voltage (V)
Dropout Characteristics
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
Ground Pin Current
Dropout Voltage
75
50
25
0
150.00
120.00
VOUT = 3V
VIN = 4V
OUT = 3V
L = 150mA
V
I
ROUT = 30KΩ
ROUT = 20Ω
90.00
60.00
30.00
0.00
0
40
25 50
2.0
100 125 150
3.0
5.0
-40
80
0.1
75
0.0
1.0
4.0
Temperature (°C)
Input Voltage (V)
Output Current (mA)
Output Voltage
vs. Temperature
Dropout Voltage
Dropout Voltage
3.05
3
8
6
4
2
0
200
150
100
50
2.95
2.9
VIN = 4V
IL = 100µA
IL = 150mA
Typical 3V device
L = 100µA
I
2.85
0
-40
0
40
125
0
40
0
40
125
-40
80
-40
80
80
Temperature (°C)
Temperature (°C)
Temperature (°C)
Functional Characteristics
Enable Pin Delay
Shutdown Delay
Enable
Disable
VOUT
VOUT
Time (20µs/div)
Time (20µs/div)
8
REV. 1.1.3 5/23/01
FAN2512/FAN2513
PRODUCT SPECIFICATION
Mechanical Dimensions
5-Lead SOT-23-5 (S) Package
Notes:
Inches
Millimeters
Symbol
Notes
1. Package outline exclusive of mold flash & metal burr.
2. Package outline exclusive of solder plating.
3. EIAJ Ref Number SC-74A.
Min.
Max.
Min.
Max.
A
A1
B
c
.035
.000
.008
.003
.106
.059
.057
.006
.020
.010
.122
.071
.90
.00
1.45
.15
.20
.50
.08
.25
D
E
e
2.70
1.50
3.10
1.80
.037 BSC
.075 BSC
.95 BSC
1.90 BSC
e1
H
L
.087
.126
.024
10°
2.20
3.20
.60
.004
.10
0°
0°
10°
α
e
B
L
E
H
e1
c
D
A
A1
REV. 1.1.3 5/23/01
9
PRODUCT SPECIFICATION
FAN2512/FAN2513
Ordering Information
Product Number
FAN2512S
VOUT
Adj.
2.5
Pin 4 Function
Adjust
Package Marking
AJA
AJE
AJG
AJJ
FAN2512S25
FAN2512S26
FAN2512S27
FAN2512S28
FAN2512S285
FAN2512S30
FAN2512S33
FAN2513S25
FAN2513S26
FAN2513S27
FAN2513S28
FAN2513S285
FAN2513S30
FAN2513S33
Bypass
2.6
Bypass
2.7
Bypass
2.8
Bypass
AJM
AJN
AJW
AJ3
2.85
3.0
Bypass
Bypass
3.3
Bypass
2.5
Error output
Error output
Error output
Error output
Error output
Error output
Error output
AKE
AKG
AKJ
AKM
AKN
AKW
AK3
2.6
2.7
2.8
2.85
3.0
3.3
Tape and Reel Information
Quantity
Reel Size
7"
Width
8mm
3000
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ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME
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LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES
OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR
CORPORATION. As used herein:
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the body,
or (b) support or sustain life, and (c) whose failure to
perform when properly used in accordance with
instructions for use provided in the labeling, can be
reasonably expected to result in a significant injury of the
user.
2. A critical component in any component of a life support
device or system whose failure to perform can be
reasonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
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5/23/01 0.0m 005
Stock#DS30002512
2000 Fairchild Semiconductor Corporation
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