FOA1100/2100 [ETC]

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FOA1100/2100
型号: FOA1100/2100
厂家: ETC    ETC
描述:

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P R O D U C T B R I E F  
S e m i co n d u c t o r S o l u t i o n s f o r  
H i g h S p e e d Co m m u n i ca t i o n  
a n d F i b e r O p t i c A p p l i ca t i o n s  
The FOA21002A2 is the industry's first STM64/OC-192  
Laser Diode Driver for SDH/SONET systems in Silicon Ger-  
manium technology. This new device is a key component  
for leading-edge high speed optical communication sys-  
tems for regional, metropolitan and backbone transport  
data networks at the highest speeds of up to 10.7 Gbit/s  
over one single fiber. It is a member of the complete  
10 Gbit/s chipset in the Silicon Germanium technology  
with the industry’s lowest power consumption.  
Features  
Typical Applications  
Suitable for driving both  
FOA21002A2  
50 matched Electro-  
Nominal data rate up to  
Fiber optics telecom and  
Absorption Modulators  
10.7 Gbit/s  
datacom applications  
(EAM) as well as direct modu-  
Suitable for driving electro-  
SONET/SDH OC-192/STM-64  
lation of 50 or 25 matched  
absorption modulators (EAM)  
with and without FEC  
laser diodes. (for single or dif-  
Suitable for direct modula-  
tion of 50 or 25 matched  
laser diodes  
Driver for EAM, laser diode  
ferential transmission lines)  
modules, transmission lines  
Adjustable output current  
swing up to 60 mA  
Test and Measurement  
equipment:  
Adjustable output current  
swing up to 60 mA  
(3 V across 50 )  
Clock driver, buffer  
Pulse shape adjustment:  
Eye symmetry, duty cycle,  
output voltage undershoot  
(3 V across 50 )  
Pulse shape adjustment:  
duty cycle, output voltage  
undershoot  
Fully differential design  
Low power consumption  
Main Advantages  
Fully differential design  
Data rate up to 10.7 Gbit/s  
Supply voltage of -5.2 V  
Industry's lowest power  
consumption of typical 1.5 W  
(for full voltage swing of 3 V)  
and +1.8 V  
Small chip size of  
1.415 x 1.045 mm (bare die)  
Packing  
Type  
LDD  
Sales Code  
Package  
FOA21002A  
Bare die  
F O A 2 1 0 0 2 A 2  
F O A 2 1 0 0 2 A 1 L a s e r D i o d e D r i v e r  
L D D 9 .9 5 - 1 0 .7 G b i t / s , - 5 . 2 V  
N e v e r s t o p t h i n k i n g .  
P R O D U C T B R I E F  
FOA21002A2  
Block Diagram  
VCC  
VCCQH  
VCCQL  
FOA21002A2  
60  
60 Ω  
50  
50 Ω  
QH  
QL  
IH  
IL  
IOS1H  
IOS1L  
VEE  
IMOD  
ISS1 EF23 EF12 EF22  
IOS2H IOS2L  
Application Example  
+1.8 V  
40  
L*  
L*  
VCC  
VCCQH VCCQL  
50  
IMOD  
45  
FOA21002A2  
IH  
IL  
QH  
DataIN+  
DataIN-  
50  
Laser  
Module  
QL  
IOS1H  
IOS1L  
Open  
Open  
VEE  
600  
ISS1  
160  
EF23  
EF12  
EF22  
-5.2 V  
Open Open  
10 Gbit/s  
Chipset Overview  
1)  
Data  
MUX+CMU  
Laser Driver  
Laser  
Processing  
FOA41001B1  
FOA21002A1  
Framer/  
Mapper  
FOAxxxx  
One Chip  
Transceiver  
FOA6100xB1  
1)  
DEMUX+CDR  
CDR  
TIA  
PIN  
FOA51001B1  
FOA31002B1  
FOA11002A2  
Optional Serial CDR  
How to reach us:  
Attention please!  
Warnings  
The information herein is given to describe certain compo-  
nents and shall not be considered as warranted character-  
istics.  
Due to technical requirements components may contain dan-  
gerous substances. For information on the types in question  
please contact your nearest Infineon Technologies Office.  
http://www.infineon.com  
Published by  
Infineon Technologies AG,  
St.-Martin-Strasse 53,  
81541 München  
Terms of delivery and rights to technical change reserved.  
Infineon Technologies Components may only be used in  
life-support devices or systems with the express written  
approval of Infineon Technologies, if a failure of such com-  
ponents can reasonably be expected to cause the failure of  
that life-support device or system, or to affect the safety or  
effectiveness of that device or system. Life support devices  
or systems are intended to be implanted in the human  
body, or to support and/or maintain and sustain and/or  
protect human life. If they fail, it is reasonable to assume  
that the health of the user or other persons may be  
endangered.  
We hereby disclaim any and all warranties, including but  
not limited to warranties of non-infringement, regarding  
circuits, descriptions and charts stated herein.  
© Infineon Technologies AG 2002. All Rights Reserved.  
Infineon Technologies is an approved CECC manufacturer.  
Information  
For further information on technology, delivery terms and  
conditions and prices please contact your nearest  
Infineon Technologies Office in Germany or our  
Infineon Technologies Representatives worldwide.  
Ordering No. B168-H7713-G1-X-7600  
Printed in Germany  
Published by Infineon Technologies AG  
PS 1201.5  
NB  

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