FR1111C [ETC]
F_1111C Series Ultra Compact AllnGaP SMT LED; F_1111C系列超小型的AllnGaP SMT LED
| 型号： | FR1111C |
| 厂家： | 
ETC |
| 描述： | F_1111C Series Ultra Compact AllnGaP SMT LED |
| 文件： | 总2页 (文件大小：162K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Pr o d u ct Gu id e
F_1111C Series Ultra Compact AlInGaP SMT LED
ꢀꢀFea tu r es
ꢀꢀAp p lica tio n s
• Meets industry standards for 1608 (0603) footprint
• Provides bright, wide and uniform spatial distribution
• Excellent for cellular telephone key pads,
• Mobile devices (cellular telephones, PDAs, pagers)
• Industrial / Medical instrumentation
• LCD backlighting and pager display applications
ꢀꢀOu tlin e Dim en sio n s
Epoxy
PCB
PCB Warpage direction
Unit: mm
Tolerances + 0.1
ꢀꢀElectr o -Op tica l Ch a r a cter istics
(Ta=25°C)
Forward
Part No.
Luminous
Intensity I
Emitted Lens
Color
Wavelength
Reverse Viewing
Material
Spectral Line
Half Width
F
Voltage V
Color
Current I Angle
V
R
Peak
λp
TYP.
Dominant
λd
λ
(2 θ 1/2)
∆
R
MAX.
V
F
I
TYP.
MAX.
IF
TYP.
MIN.
TYP.
TYP.
IF
FR1111C
FA1111C
FY1111C
AlInGaP
AlInGaP
AlInGaP
Red
25 50 20 635 626
25 65 20 609 605
25 65 20 592 590
15
15
15
20
20
20
1.9 2.4
1.9 2.4
1.9 2.4
20 100
20 100
20 100
5
5
5
Milky
Orange
Yellow
140°
Deg.
White
Units
mcd
mA
nm
mA
V
mA µA
V
ꢀ Ab so lu te Ma xim u m Ra tin gs
(Ta=25°C)
Red
Orange
Yellow
Units
Item
Symbol
FR
81
30
100
5
FA
81
30
100
5
FY
81
30
100
5
mW
mA
mA
V
Pd
Power Dissipation
Forward Current
F
I
Peak Forward Current
Reverse Voltage
Operating Temperature
Storage Temperature
Derating*
FM
I
R
V
°C
-40 to +85
-40 to +100
Topr
Tstg
°C
mA/°C
0.43 (DC) 1.0 (Pulse)
F
∆I
FM
* Ta=25°C, I applies for the pulse width ≤ 1msec. and duty cycle ≤1/20.
ꢀ Ta p in g Sp ecifica tio n s
4+0.1
ꢀ Op er a tio n Cu r r en t Der a tin g Ch a r t (DC)
φ 1.5+0.1
(1)
(0.2)
0
Center Hole
Quantity on tape:
Quantity on tape:
4000 pieces
4000 pieces
per reel
per reel
2+0.05
(φ 0.5)
Center Hole
(0.9)
2+0.5
φ
21+0.8
4+0.1
Direction to pull
FR, FA, FY
φ
13+0.2
9+0.3
+
180
0
11.4+1
φ
3
ꢀ Pr eca u tio n s
Please follow these handling precautions to prevent damage to the chip and
ensure its reliability.
1. Soldering conditions:
• Soldering iron: Temperature at tip of iron: 280°C max. (30W max.)
Soldering time: 3 sec. max.
• Dip soldering: Preheating: 120°C ~ 150°C max. (resin surface temp.)
60-120 sec. max. Bath temperature: 260°C max. Dipping Time: 5 sec. max.
• Reflow Soldering:
°C
Operation Heating
240
ꢀ Sp a tia l Distr ib u tio n
Temperature
Cooling:
150
120
rise: 5°C/sec.
—5°C/sec.
Pre-heating
0
60 to 120 sec.
5 sec. max
2. Cleaning:
• If cleaning is required, use the following solutions for less than 1 minute,
at less than 40°C.
• Appropriate chemicals: Ethyl alcohol and isopropyl alcohol.
• Effect of ultrasonic cleaning on the LED resin body differs depending on such
factors as the oscillator output, size of PCB and LED mounting method. The
use of ultrasonic cleaning should be enforced at proper output after confirming
there is no problem.
Product specifications subject to change without notice. PGF_1111C-0301
Sta n ley Electr ic Sa les o f Am er ica , In c.
2660 Ba rra nc a Pa rkwa y, Irvine , CA 92606 • Te l: 800-LED-LCD1 (533-5231) • Fa x: 949-222-0555
We b site : www.sta nle y-e le c tric .c om
相关型号：
©2020 ICPDF网 联系我们和版权申明