FT230XQ [ETC]
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FT230X USB TO BASIC UART IC
Version 1.2
Document No.: FT_000566 Clearance No.: FTDI# 260
Future Technology
Devices International
Ltd
.
FT230X
(USB to BASIC UART IC)
USB Battery Charger Detection. Allows for USB
peripheral devices to detect the presence of a
higher power source to enable improved
charging.
The FT230X is a USB to serial UART
interface with optimised pin count for
smaller PCB designs and the following
advanced features:
Device supplied pre-programmed with unique
USB serial number.
Single chip USB to asynchronous serial data
transfer interface.
USB Power Configurations; supports bus- powered,
self-powered and bus-powered with power switching
Entire USB protocol handled on the chip. No USB
specific firmware programming required.
Integrated +3.3V level converter for USB I/O.
Fully
integrated
2048
byte
multi-time-
True 3.3V CMOS drive output and TTL input;
operates down to 1V8 with external pull ups.
Tolerant of 5V input
programmable (MTP) memory, storing device
descriptors and CBUS I/O configuration.
Fully integrated clock generation with no external
crystal required plus optional clock output selection
enabling a glue-less interface to external MCU or
FPGA.
Configurable I/O pin output drive strength;
4 mA (min) and 16 mA (max).
Integrated power-on-reset circuit.
Data transfer rates from 300 baud to 3 Mbaud
(RS422, RS485, and RS232) at TTL levels.
Fully integrated AVCC supply filtering - no
external filtering required.
512 byte receive buffer and 512 byte transmit
buffer utilising buffer smoothing technology to
allow for high data throughput.
UART signal inversion option.
+ 5V Single Supply Operation.
Internal 3V3/1V8 LDO regulators
FTDI’s royalty-free Virtual Com Port (VCP) and
Direct (D2XX) drivers eliminate the requirement
for USB driver development in most cases.
Low operating and USB suspend current;
8mA (active-typ) and 70uA (suspend-typ).
Configurable CBUS I/O pins.
UHCI/OHCI/EHCI host controller compatible.
USB 2.0 Full Speed compatible.
Transmit and receive LED drive signals.
UART interface support for 7 or 8 data bits, 1 or 2
stop bits and odd / even / mark / space / no parity
Extended operating temperature range; -40 to
85⁰C.
Synchronous and asynchronous bit bang interface
options with RD# and WR# strobes.
Available in compact Pb-free 16 pin SSOP and 16
pin QFN packages (both RoHS compliant).
Neither the whole nor any part of the information contained in, or the product described in this manual, may be adapted or reproduced in any material or electronic form
without the prior written consent of the copyright holder. This product and its documentation are supplied on an as-is basis and no warranty as to their suitability for any
particular purpose is either made or implied. Future Technology Devices International Ltd will not accept any claim for damages howsoever arising as a result of use or failure
of this product. Your statutory rights are not affected. This product or any variant of it is not intended for use in any medical appliance, device or system in which the failure of
the product might reasonably be expected to result in personal injury. This document provides preliminary information that may be subject to change without notice. No
freedom to use patents or other intellectual property rights is implied by the publication of this document. Future Technology Devices International Ltd, Unit 1, 2 Seaward
Place, Centurion Business Park, Glasgow G41 1HH United Kingdom. Scotland Registered Company Number: SC136640
Copyright © 2013 Future Technology Devices International Limited
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FT230X USB TO BASIC UART IC
Version 1.2
Document No.: FT_000566 Clearance No.: FTDI# 260
1 Typical Applications
USB to RS232/RS422/RS485 Converters
Upgrading Legacy Peripherals to USB
Utilising USB to add system modularity
USB Industrial Control
USB MP3 Player Interface
USB FLASH Card Reader and Writers
Set Top Box PC - USB interface
USB Digital Camera Interface
USB Hardware Modems
Incorporate USB interface to enable PC
transfers for development system
communication
Cellular and Cordless Phone USB data transfer
cables and interfaces
USB Wireless Modems
Interfacing MCU/PLD/FPGA based designs to
add USB connectivity
USB Bar Code Readers
USB dongle implementations for Software/
Hardware Encryption and Wireless Modules
USB Audio and Low Bandwidth Video data
transfer
Detection of dedicated charging port for battery
charging at higher supply currents.
USB Smart Card Readers
USB Instrumentation
1.1 Driver Support
Royalty free VIRTUAL COM PORT
(VCP) DRIVERS for...
Royalty free D2XX Direct Drivers
(USB Drivers + DLL S/W Interface)
Windows 8 32,64-bit
Windows 7 32, 64-bit
Windows Vista and Vista 64-bit
Windows XP and XP 64-bit
Server 2003, XP and Server 2008
Windows XP Embedded
Windows CE 4.2, 5.0 and 6.0
Mac OS-X
Windows 8 32,64-bit
Windows 7 32,64-bit
Windows Vista and Vista 64-bit
Windows XP and XP 64-bit
Server 2003, XP and Server 2008
Windows XP Embedded
Windows CE 4.2, 5.0 and 6.0
Mac OS-X
Linux 3.2 and greater
Android
Linux 2.6 and greater
Android
The drivers listed above are all available to download for free from FTDI website (www.ftdichip.com).
Various 3rd party drivers are also available for other operating systems - see FTDI website
(www.ftdichip.com) for details.
For driver installation, please refer to http://www.ftdichip.com/Documents/InstallGuides.htm
1.2 Part Numbers
Part Number
Package
FT230XQ-xxxx
16 Pin QFN
16 Pin SSOP
FT230XS-xxxx
Note: Packing codes for x is:
- R: Taped and Reel, (SSOP is 3,000pcs per reel, QFN is 5,000pcs per reel).
- U: Tube packing, 100pcs per tube (SSOP only)
- T: Tray packing, 490pcs per tray (QFN only)
For example: FT230XQ-R is 5,000pcs taped and reel packing
Copyright © 2013 Future Technology Devices International Limited
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FT230X USB TO BASIC UART IC
Version 1.2
Document No.: FT_000566 Clearance No.: FTDI# 260
1.3 USB Compliant
The FT230X is fully compliant with the USB 2.0 specification and has been given the USB-IF Test-ID (TID)
40001463 (Rev D).
Copyright © 2013 Future Technology Devices International Limited
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FT230X USB TO BASIC UART IC
Version 1.2
Document No.: FT_000566 Clearance No.: FTDI# 260
2 FT230X Block Diagram
VCC
1V8 Internal
Core Supply
48MHz
3.3 Volt LDO
Regulator
1.8 Volt LDO
Regulator
Baud Rate
Generator
3V3OUT
FIFO RX Buffer
(512 bytes)
TXD
RXD
RTS#
CTS#
USB
USBDP
USBDM
Transceiver
with
Integrated
1.5k pullups
and battery
charge
UART Controller
Serial Interface
Engine
USB
Protocol Engine
UART FIFO
Controller
with
Programmable
Signal Inversion
(SIE)
CBUS0
CBUS1
CBUS2
CBUS3
detection
Internal MTP
Memory
USB DPLL
FIFO TX Buffer
(512 bytes)
3V3OUT
RESET#
Internal
12MHz
Oscillator
X4 Clock
Multiplier
Reset
Generator
48MHz
To USB Transceiver Cell
GND
Figure 2.1 FT230X Block Diagram
For a description of each function please refer to Section 4.
Copyright © 2013 Future Technology Devices International Limited
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FT230X USB TO BASIC UART IC
Version 1.2
Document No.: FT_000566 Clearance No.: FTDI# 260
Table of Contents
1
Typical Applications...................................................................... 2
1.1 Driver Support.................................................................................... 2
1.2 Part Numbers...................................................................................... 2
1.3 USB Compliant.................................................................................... 3
FT230X Block Diagram ................................................................. 4
Device Pin Out and Signal Description.......................................... 7
2
3
3.1 16-LD QFN Package ........................................................................... 7
3.1.1 QFN Package PinOut Description....................................................................................7
3.2 16-LD SSOP Package.......................................................................... 9
3.2.1 SSOP Package PinOut Description..................................................................................9
3.3 CBUS Signal Options ......................................................................... 11
4
5
Function Description................................................................... 13
4.1 Key Features..................................................................................... 13
4.2 Functional Block Descriptions........................................................... 13
Devices Characteristics and Ratings........................................... 16
5.1 Absolute Maximum Ratings............................................................... 16
5.2 ESD and Latch-up Specifications....................................................... 16
5.3 DC Characteristics............................................................................. 17
5.4 MTP Memory Reliability Characteristics ............................................ 21
5.5 Internal Clock Characteristics........................................................... 21
USB Power Configurations.......................................................... 22
6.1 USB Bus Powered Configuration ...................................................... 22
6.2 Self Powered Configuration .............................................................. 23
6.3 USB Bus Powered with Power Switching Configuration .................... 24
Application Examples ................................................................. 25
7.1 USB to RS232 Converter ................................................................... 25
7.2 USB to RS485 Coverter ..................................................................... 26
7.3 USB to RS422 Converter ................................................................... 27
7.4 USB Battery Charging Detection ....................................................... 28
7.5 LED Interface.................................................................................... 31
Internal MTP Memory Configuration........................................... 32
8.1 Default Values .................................................................................. 32
6
7
8
8.2 Methods of Programming the MTP Memory....................................... 33
8.2.1 Programming the MTP memory over USB...................................................................... 33
8.3 Memory Map ..................................................................................... 34
Copyright © 2013 Future Technology Devices International Limited
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FT230X USB TO BASIC UART IC
Version 1.2
Document No.: FT_000566 Clearance No.: FTDI# 260
9
Package Parameters................................................................... 35
9.1 SSOP-16 Package Mechanical Dimensions ........................................ 35
9.2 SSOP-16 Package Markings .............................................................. 36
9.3 QFN-16 Package Mechanical Dimensions.......................................... 37
9.4 QFN-16 Package Markings ................................................................ 38
9.5 Solder Reflow Profile ........................................................................ 39
10 Contact Information................................................................... 40
Appendix A – References........................................................................... 41
Appendix B - List of Figures and Tables..................................................... 42
Appendix C - Revision History.................................................................... 44
Copyright © 2013 Future Technology Devices International Limited
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FT230X USB TO BASIC UART IC
Version 1.2
Document No.: FT_000566 Clearance No.: FTDI# 260
3 Device Pin Out and Signal Description
3.1 16-LD QFN Package
8
15
2
16
4
3V3OUT
TXD
RXD
RTS#
CTS#
7
6
USBDM
USBDP
12
11
5
CBUS0
CBUS1
CBUS2
CBUS3
9
RESET#
14
Figure 3.1 QFN Schematic Symbol
3.1.1 QFN Package PinOut Description
Note : # denotes an active low signal.
Pin No.
Name
Type
Description
**
POWER
Input
10
5 V (or 3V3) supply to IC
VCC
POWER
Input
1
8
VCCIO
1V8 - 3V3 supply for the IO cells
3V3 output at 50mA. May be used to power VCCIO.
**
POWER
Output
When VCC is 3V3; pin 8 is an input pin and should be
connected to pin 10.
3V3OUT
POWER
Input
3, 13
GND
0V Ground input.
Table 3.1 Power and Ground
*Pin 17 is the centre pad under the IC. Connect to GND.
** If VCC is 3V3 then 3V3OUT must also be driven with 3V3 input
Pin No.
Name
USBDM
USBDP
RESET#
Type
INPUT
INPUT
INPUT
Description
7
6
9
USB Data Signal Minus.
USB Data Signal Plus.
Reset input (active low).
Table 3.2 Common Function pins
Copyright © 2013 Future Technology Devices International Limited
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FT230X USB TO BASIC UART IC
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Pin No.
Name
TXD
Type
Output
Input
Description
15
2
Transmit Asynchronous Data Output.
RXD
Receiving Asynchronous Data Input.
16
4
RTS#
CTS#
Output
Input
Request to Send Control Output / Handshake Signal.
Clear To Send Control Input / Handshake Signal.
Configurable CBUS I/O Pin. Function of this pin is configured in the
device MTP memory. The default configuration is TXDEN. See CBUS
Signal Options, Table 3.7.
12
11
5
CBUS0
CBUS1
CBUS2
CBUS3
I/O
I/O
I/O
I/O
Configurable CBUS I/O Pin. Function of this pin is configured in the
device MTP memory. The default configuration is RXLED#. See CBUS
Signal Options, Table 3.7.
Configurable CBUS I/O Pin. Function of this pin is configured in the
device MTP memory. The default configuration is TXLED#. See CBUS
Signal Options, Table 3.7.
Configurable CBUS I/O Pin. Function of this pin is configured in the
device MTP memory. The default configuration is SLEEP#. See CBUS
Signal Options, Table 3.7.
14
Table 3.3 UART Interface and CBUS Group (see note 1)
Notes:
1. When used in Input Mode, the input pins are pulled to VCCIO via internal 75kΩ (approx) resistors.
These pins can be programmed to gently pull low during USB suspend (PWREN# = “1”) by setting an
option in the MTP memory.
Copyright © 2013 Future Technology Devices International Limited
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FT230X USB TO BASIC UART IC
Version 1.2
Document No.: FT_000566 Clearance No.: FTDI# 260
3.2 16-LD SSOP Package
U?
10
1
4
2
6
3V3OUT
TXD
RXD
RTS#
CTS#
9
8
USBDM
USBDP
15
14
7
CBUS0
CBUS1
CBUS2
CBUS3
11
RESET#
16
FT230XS
Figure 3.2 SSOP Schematic Symbol
3.2.1 SSOP Package PinOut Description
Note: # denotes an active low signal.
Pin No.
Name
Type
Description
**
POWER
Input
12
5 V (or 3V3) supply to IC
VCC
POWER
Input
3
VCCIO
1V8 - 3V3 supply for the IO cells
3V3 output at 50mA. May be used to power VCCIO.
**
POWER
Output
10
When VCC is 3V3; pin 10 is an input pin and should be
connected to pin 12.
3V3OUT
POWER
Input
5, 13
GND
0V Ground input.
Table 3.4 Power and Ground
** If VCC is 3V3 then 3V3OUT must also be driven with 3V3 input
Pin No.
Name
USBDM
USBDP
RESET#
Type
INPUT
INPUT
INPUT
Description
9
8
USB Data Signal Minus.
USB Data Signal Plus.
Reset input (active low).
11
Table 3.5 Common Function pins
Pin No.
Name
TXD
Type
Output
Input
Description
1
4
Transmit Asynchronous Data Output.
Receiving Asynchronous Data Input.
RXD
Copyright © 2013 Future Technology Devices International Limited
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FT230X USB TO BASIC UART IC
Version 1.2
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2
6
RTS#
CTS#
Output
Input
Request to Send Control Output / Handshake Signal.
Clear To Send Control Input / Handshake Signal.
Configurable CBUS I/O Pin. Function of this pin is configured in the
device MTP memory. The default configuration is TXDEN. See CBUS
Signal Options, Table 3.7.
15
14
7
CBUS0
CBUS1
CBUS2
CBUS3
I/O
I/O
I/O
I/O
Configurable CBUS I/O Pin. Function of this pin is configured in the
device MTP memory. The default configuration is RXLED#. See CBUS
Signal Options, Table 3.7.
Configurable CBUS I/O Pin. Function of this pin is configured in the
device MTP memory. The default configuration is TXLED#. See CBUS
Signal Options, Table 3.7.
Configurable CBUS I/O Pin. Function of this pin is configured in the
device MTP memory. The default configuration is SLEEP#. See CBUS
Signal Options, Table 3.7.
16
Table 3.6 UART Interface and CBUS Group (see note 1)
Notes:
1. When used in Input Mode, the input pins are pulled to VCCIO via internal 75kΩ (approx) resistors.
These pins can be programmed to gently pull low during USB suspend (PWREN# = “1”) by setting an
option in the MTP memory.
Copyright © 2013 Future Technology Devices International Limited
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FT230X USB TO BASIC UART IC
Version 1.2
Document No.: FT_000566 Clearance No.: FTDI# 260
3.3 CBUS Signal Options
The following options can be configured on the CBUS I/O pins. CBUS signal options are common to both
package versions of the FT230X. These options can be configured in the internal MTP memory using the
software utility FT_PROG or MPROG, which can be downloaded from the FTDI Utilities
(www.ftdichip.com). The default configuration is described in Section 8.
CBUS Signal
Available On CBUS Pin
Description
Option
TRI-STATE
DRIVE 1
DRIVE 0
TXDEN
CBUS0, CBUS1, CBUS2, CBUS3
CBUS0, CBUS1, CBUS2, CBUS3
CBUS0, CBUS1, CBUS2, CBUS3
CBUS0, CBUS1, CBUS2, CBUS3
IO Pad is tri-stated
Output a constant 1
Output a constant 0
Enable transmit data for RS485
Output is low after the device has been configured by
USB, then high during USB suspend mode. This output
can be used to control power to external logic P-Channel
logic level MOSFET switch. Enable the interface pull-down
option when using the PWREN# in this way.
PWREN#
CBUS0, CBUS1, CBUS2, CBUS3
Transmit data LED drive – pulses low when transmitting
data via USB. See Section 7.5 for more details.
TXLED#
RXLED#
CBUS0, CBUS1, CBUS2, CBUS3
CBUS0, CBUS1, CBUS2, CBUS3
CBUS0, CBUS1, CBUS2, CBUS3
Receive data LED drive – pulses low when receiving data
via USB. See Section 7.5 for more details.
LED drive – pulses low when transmitting or receiving
data via USB. See Section 7.5 for more details.
TX&RXLED#
Goes low during USB suspend mode. Typically used to
power down an external TTL to RS232 level converter IC
in USB to RS232 converter designs.
SLEEP#
CBUS0, CBUS1, CBUS2, CBUS3
CLK24MHz
CLK12MHz
CLK6MHz
CBUS0, CBUS1, CBUS2, CBUS3
CBUS0, CBUS1, CBUS2, CBUS3
CBUS0, CBUS1, CBUS2, CBUS3
24 MHz Clock output.*
12 MHz Clock output.*
6 MHz Clock output.*
CBUS bit bang mode option. Allows up to 4 of the CBUS
pins to be used as general purpose I/O. Configured
individually for CBUS0, CBUS1, CBUS2 and CBUS3 in the
internal MTP memory. A separate application note,
AN232R-01, available from FTDI website
GPIO
CBUS0, CBUS1, CBUS2, CBUS3
(www.ftdichip.com) describes in more detail how to use
CBUS bit bang mode.
Battery charge Detect, indicates when the device is
connected to a dedicated battery charger host. Active
high output.
BCD Charger
CBUS0, CBUS1, CBUS2, CBUS3
BCD Charger#
BitBang_WR#
CBUS0, CBUS1, CBUS2, CBUS3
CBUS0, CBUS1, CBUS2, CBUS3
Inverse of BCD Charger
Synchronous and asynchronous bit bang mode WR#
strobe output.
Synchronous and asynchronous bit bang mode RD#
strobe output.
BitBang_RD#
CBUS0, CBUS1, CBUS2, CBUS3
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FT230X USB TO BASIC UART IC
Version 1.2
Document No.: FT_000566 Clearance No.: FTDI# 260
CBUS Signal
Option
Available On CBUS Pin
Description
VBUS Sense
Time Stamp
CBUS0, CBUS1, CBUS2, CBUS3
CBUS0, CBUS1, CBUS2, CBUS3
Input to detect when VBUS is present.
Toggle signal which changes state each time a USB
SOF is received
Prevents the device from entering suspend state
when unplugged.
Keep_Awake#
CBUS0, CBUS1, CBUS2, CBUS3
Table 3.7 CBUS Configuration Control
*When in USB suspend mode the outputs clocks are also suspended.
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FT230X USB TO BASIC UART IC
Version 1.2
Document No.: FT_000566 Clearance No.: FTDI# 260
4 Function Description
The FT230X is a compact USB to a basic serial UART interface device which simplifies USB
implementations in a small optimised package, with minimum UART signals and reduces external
component count by fully integrating an MTP memory, and an integrated clock circuit which requires no
external crystal. It has been designed to operate efficiently with USB host controllers by using as little
bandwidth as possible when compared to the total USB bandwidth available.
4.1 Key Features
Functional Integration. Fully integrated MTP memory, clock generation, AVCC filtering, Power-On-
Reset (POR) and LDO regulators.
Configurable CBUS I/O Pin Options. The fully integrated MTP memory allows configuration of the
Control Bus (CBUS) functionality and drive strength selection. There are 4 configurable CBUS I/O pins.
These configurable options are detailed in section 3.3
The CBUS lines can be configured with any one of these output options by setting bits in the internal MTP
memory. The device is shipped with the most commonly used pin definitions pre-programmed - see
Section 8 for details.
Asynchronous Bit Bang Mode with RD# and WR# Strobes. The FT230X supports FTDI’s previous
chip generation bit-bang mode. In bit-bang mode, the four UART lines can be switched from the regular
interface mode to a 4-bit general purpose I/O port. Data packets can be sent to the device and they will
be sequentially sent to the interface at a rate controlled by an internal timer (equivalent to the baud rate
pre-scalar). In the FT230X device this mode has been enhanced by outputting the internal RD# and WR#
strobes signals which can be used to allow external logic to be clocked by accesses to the bit-bang I/O
bus. This option will be described more fully in a separate application note available from FTDI website
(www.ftdichip.com).
Synchronous Bit Bang Mode. The FT230X supports synchronous bit bang mode. This mode differs from
asynchronous bit bang mode in that the interface pins are only read when the device is written to. This
makes it easier for the controlling program to measure the response to an output stimulus as the data
returned is synchronous to the output data. An application note, AN232R-01, available from FTDI website
(www.ftdichip.com) describes this feature.
Source Power and Power Consumption. The FT230X is capable of operating at a voltage supply
between +3.3V and +5.25V with a nominal operational mode current of 8mA and a nominal USB suspend
mode current of 125µA. This allows greater margin for peripheral designs to meet the USB suspend mode
current limit of 2.5mA. An integrated level converter within the UART interface allows the FT230X to
interface to UART logic running at +1.8V to +3.3V (5V tolerant).
4.2 Functional Block Descriptions
The following paragraphs detail each function within the FT230X. Please refer to the block diagram shown
in Figure 2.1
Internal MTP Memory. The internal MTP memory in the FT230X is used to store USB Vendor ID (VID),
Product ID (PID), device serial number, product description string and various other USB configuration
descriptors. The internal MTP memory is also used to configure the CBUS pin functions. The FT230X is
supplied with the internal MTP memory pre-programmed as described in Section 8. A user area of the
internal MTP memory is available to system designers to allow storing additional data from the user
application over USB. The internal MTP memory descriptors can be programmed in circuit, over USB
without any additional voltage requirement. The descriptors can be programmed using the FTDI utility
software called FT_PROG, which can be downloaded from FTDI Utilities on the FTDI website
(www.ftdichip.com).
+3.3V LDO Regulator. The +3.3V LDO regulator generates the +3.3V reference voltage for driving the
USB transceiver cell output buffers. It requires an external decoupling capacitor to be attached to the
3V3OUT regulator output pin. It also provides +3.3V power to the 1.5kΩ internal pull up resistor on
USBDP. The main function of the LDO is to power the USB Transceiver and the Reset Generator Cells
rather than to power external logic. However, it can be used to supply external circuitry requiring a
+3.3V nominal supply with a maximum current of 50mA.
+1.8V LDO Regulator. The +1.8V LDO regulator generates the +1.8V reference voltage for internal use
driving the IC core functions of the serial interface engine and USB protocol engine.
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FT230X USB TO BASIC UART IC
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USB Transceiver. The USB Transceiver Cell provides the USB 1.1 / USB 2.0 full-speed physical interface
to the USB cable. The output drivers provide +3.3V level slew rate control signalling, whilst a differential
input receiver and two single ended input receivers provide USB data in, Single-Ended-0 (SE0) and USB
reset detection conditions respectfully. This function also incorporates a 1.5kΩ pull up resistor on USBDP.
The block also detects when connected to a USB power supply which will not enumerate the device but
still supply power and may be used for battery charging.
USB DPLL. The USB DPLL cell locks on to the incoming NRZI USB data and generates recovered clock
and data signals for the Serial Interface Engine (SIE) block.
Internal 12MHz Oscillator - The Internal 12MHz Oscillator cell generates a 12MHz reference clock. This
provides an input to the x4 Clock Multiplier function. The 12MHz Oscillator is also used as the reference
clock for the SIE, USB Protocol Engine and UART FIFO controller blocks.
Clock Multiplier / Divider. The Clock Multiplier / Divider takes the 12MHz input from the Internal
Oscillator function and generates the 48MHz, 24MHz, 12MHz and 6MHz reference clock signals. The 48Mz
clock reference is used by the USB DPLL and the Baud Rate Generator blocks.
Serial Interface Engine (SIE). The Serial Interface Engine (SIE) block performs the parallel to serial
and serial to parallel conversion of the USB data. In accordance with the USB 2.0 specification, it
performs bit stuffing/un-stuffing and CRC5/CRC16 generation. It also verifies the CRC on the USB data
stream.
USB Protocol Engine. The USB Protocol Engine manages the data stream from the device USB control
endpoint. It handles the low level USB protocol requests generated by the USB host controller and the
commands for controlling the functional parameters of the UART in accordance with the USB 2.0
specification chapter 9.
FIFO RX Buffer (512 bytes). Data sent from the USB host controller to the UART via the USB data OUT
endpoint is stored in the FIFO RX (receive) buffer. Data is removed from the buffer to the UART transmit
register under control of the UART FIFO controller. (Rx relative to the USB interface).
FIFO TX Buffer (512 bytes). Data from the UART receive register is stored in the TX buffer. The USB
host controller removes data from the FIFO TX Buffer by sending a USB request for data from the device
data IN endpoint. (Tx relative to the USB interface).
UART FIFO Controller. The UART FIFO controller handles the transfer of data between the FIFO RX and
TX buffers and the UART transmit and receive registers.
UART Controller with Programmable Signal Inversion and High Drive. Together with the UART
FIFO Controller the UART Controller handles the transfer of data between the FIFO RX and FIFO TX
buffers and the UART transmit and receive registers. It performs asynchronous 7 or 8 bit parallel to serial
and serial to parallel conversion of the data on the RS232 (or RS422 or RS485) interface.
Control signals supported by UART mode include RTS, CTS. The UART Controller also provides a
transmitter enable control signal pin option (TXDEN) to assist with interfacing to RS485 transceivers.
RTS/CTS and XON / XOFF handshaking options are also supported. Handshaking is handled in hardware to
ensure fast response times. The UART interface also supports the RS232 BREAK setting and detection
conditions.
Additionally, the UART signals can each be individually inverted and have a configurable high drive
strength capability (using FT_PROG). Both these features are configurable in the MTP memory.
Baud Rate Generator - The Baud Rate Generator provides a 16x clock input to the UART Controller
from the 48MHz reference clock. It consists of a 14 bit pre-scalar and 3 register bits which provide fine
tuning of the baud rate (used to divide by a number plus a fraction or “sub-integer”). This determines the
baud rate of the UART, which is programmable from 183 baud to 3 Mbaud.
The FT230X supports all standard baud rates and non-standard baud rates from 183 Baud up to 3
Mbaud. Achievable non-standard baud rates are calculated as follows -
Baud Rate = 3000000 / (n + x)
14
where ‘n’ can be any integer between 2 and 16,384 ( = 2 ) and ‘x’ can be a sub-integer of the value 0,
0.125, 0.25, 0.375, 0.5, 0.625, 0.75, or 0.875. When n = 1, x = 0, i.e. baud rate divisors with values
between 1 and 2 are not possible.
This gives achievable baud rates in the range 183.1 baud to 3,000,000 baud. When a non-standard baud
rate is required simply pass the required baud rate value to the driver as normal, and the FTDI driver will
calculate the required divisor, and set the baud rate. See FTDI application note AN232B-05 on the FTDI
website (www.ftdichip.com) for more details.
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RESET Generator - The integrated Reset Generator Cell provides a reliable power-on reset to the device
internal circuitry at power up. The RESET# input pin allows an external device to reset the FT230X.
RESET# can be tied to VCC or left unconnected if not being used.
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5 Devices Characteristics and Ratings
5.1 Absolute Maximum Ratings
The absolute maximum ratings for the FT230X devices are as follows. These are in accordance with the
Absolute Maximum Rating System (IEC 60134). Exceeding these may cause permanent damage to the
device.
Parameter
Value
Unit
Conditions
Storage Temperature
-65°C to 150°C
168 Hours
Degrees C
Floor Life (Out of Bag) At Factory Ambient
(30°C / 60% Relative Humidity)
(IPC/JEDEC J-
STD-033A MSL
Level 3
Hours
Compliant)*
Ambient Operating Temperature (Power
Applied)
-40°C to 85°C
Degrees C
MTTF FT230XS
MTTF FT230XQ
TBD
Hours
TBD
Hours
VCC Supply Voltage
-0.3 to +5.5
-0.3 to +4.0
-0.5 to +3.63
V
V
V
VCCIO IO Voltage
DC Input Voltage – USBDP and USBDM
DC Input Voltage – High Impedance
-0.3 to +5.8
22
V
Bi-directionals (powered from VCCIO)
DC Output Current – Outputs
mA
Table 5.1 Absolute Maximum Ratings
* If devices are stored out of the packaging beyond this time limit the devices should be baked before
use. The devices should be ramped up to a temperature of +125°C and baked for up to 17 hours.
5.2 ESD and Latch-up Specifications
Description
Specification
Human Body Mode (HBM)
Machine mode (MM)
Charged Device Mode (CDM)
> ± 2kV
> ± 200V
> ± 500V
> ± 200mA
Latch-up
Table 5.2 ESD and Latch-Up Specifications
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5.3 DC Characteristics
DC Characteristics (Ambient Temperature = -40°C to +85°C)
Parameter
Description
Minimum
Typical
Maximum
5.5
Units
V
Conditions
VCC Operating Supply
Voltage
VCC
2.97
5
---
8
Normal Operation
VCCIO Operating
Supply Voltage
VCC2
Icc1
1.62
3.63
V
Operating Supply
Current
6.5
8.3
mA
μA
Normal Operation
USB Suspend
Operating Supply
Current
Icc2
125
VCC must be
greater than 3V3
otherwise 3V3OUT
is an input which
must be driven
with 3.3V
3V3
3.3v regulator output
2.97
3.3
3.63
V
Table 5.3 Operating Voltage and Current
E d
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Parameter
Description
Minimum
Typical
Maximum
Units
Conditions
Ioh = +/-2mA
2.97
VCCIO
VCCIO
V
I/O Drive strength*
= 4mA
I/O Drive strength*
= 8mA
2.97
2.97
2.97
VCCIO
VCCIO
VCCIO
VCCIO
VCCIO
VCCIO
V
V
V
Voh
Output Voltage High
I/O Drive strength*
= 12mA
I/O Drive strength*
= 16mA
Iol = +/-2mA
V
0
0.4
I/O Drive strength*
= 4mA
I/O Drive strength*
= 8mA
V
V
V
V
V
0
0
0
0.4
0.4
0.4
0.8
Vol
Output Voltage Low
I/O Drive strength*
= 12mA
I/O Drive strength*
= 16mA
Input low Switching
Threshold
Vil
LVTTL
Input High Switching
Threshold
Vih
LVTTL
LVTTL
2.0
Vt
Switching Threshold
V
V
1.49
1.15
Schmitt trigger negative
going threshold voltage
Vt-
Schmitt trigger positive
going threshold voltage
Vt+
Rpu
Rpd
Iin
V
1.64
75
Input pull-up resistance
40
40
190
190
10
KΩ
KΩ
μA
μA
Vin = 0
Vin =VCCIO
Vin = 0
Input pull-down
resistance
75
Input Leakage Current
-10
-10
+/-1
+/-1
Tri-state output leakage
current
Ioz
10
Vin = 5.5V or 0
Table 5.4 I/O Pin Characteristics VCCIO = +3.3V (except USB PHY pins)
* The I/O drive strength and slow slew-rate are configurable in the MTP memory.
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Parameter
Description
Minimum
Typical
Maximum
Units
Conditions
Ioh = +/-2mA
2.25
VCCIO
VCCIO
V
I/O Drive strength*
= 4mA
I/O Drive strength*
= 8mA
2.25
2.25
2.25
VCCIO
VCCIO
VCCIO
VCCIO
VCCIO
VCCIO
V
V
V
Voh
Output Voltage High
I/O Drive strength*
= 12mA
I/O Drive strength*
= 16mA
Iol = +/-2mA
V
0
0.4
I/O Drive strength*
= 4mA
I/O Drive strength*
= 8mA
V
V
V
V
V
0
0
0
0.4
0.4
0.4
0.8
Vol
Output Voltage Low
I/O Drive strength*
= 12mA
I/O Drive strength*
= 16mA
Input low Switching
Threshold
Vil
LVTTL
Input High Switching
Threshold
Vih
LVTTL
LVTTL
0.8
Vt
Switching Threshold
V
V
1.1
0.8
Schmitt trigger negative
going threshold voltage
Vt-
Schmitt trigger positive
going threshold voltage
Vt+
Rpu
Rpd
Iin
V
1.2
75
Input pull-up resistance
40
40
190
190
10
KΩ
KΩ
μA
μA
Vin = 0
Vin =VCCIO
Vin = 0
Input pull-down
resistance
75
Input Leakage Current
-10
-10
+/-1
+/-1
Tri-state output leakage
current
Ioz
10
Vin = 5.5V or 0
Table 5.5 I/O Pin Characteristics VCCIO = +2.5V (except USB PHY pins)
* The I/O drive strength and slow slew-rate are configurable in the MTP memory.
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Parameter
Description
Minimum
Typical
Maximum
Units
Conditions
Ioh = +/-2mA
1.62
VCCIO
VCCIO
V
I/O Drive strength*
= 4mA
I/O Drive strength*
= 8mA
1.62
1.62
1.62
VCCIO
VCCIO
VCCIO
VCCIO
VCCIO
VCCIO
V
V
V
Voh
Output Voltage High
I/O Drive strength*
= 12mA
I/O Drive strength*
= 16mA
Iol = +/-2mA
V
0
0.4
I/O Drive strength*
= 4mA
I/O Drive strength*
= 8mA
V
V
V
V
V
0
0
0
0.4
0.4
0.4
0.77
Vol
Output Voltage Low
I/O Drive strength*
= 12mA
I/O Drive strength*
= 16mA
Input low Switching
Threshold
Vil
LVTTL
Input High Switching
Threshold
Vih
LVTTL
LVTTL
1.6
Vt
Switching Threshold
V
V
0.77
Schmitt trigger negative
going threshold voltage
Vt-
0.557
Schmitt trigger positive
going threshold voltage
Vt+
Rpu
Rpd
Iin
V
0.893
75
Input pull-up resistance
40
40
190
190
10
KΩ
KΩ
μA
μA
Vin = 0
Vin =VCCIO
Vin = 0
Input pull-down
resistance
75
Input Leakage Current
-10
-10
+/-1
+/-1
Tri-state output leakage
current
Ioz
10
Vin = 5.5V or 0
Table 5.6 I/O Pin Characteristics VCCIO = +1.8V (except USB PHY pins)
* The I/O drive strength and slow slew-rate are configurable in the MTP memory.
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Parameter
Description
Minimum
Typical
Maximum
Units
Conditions
Voh
Vol
Output Voltage High
Output Voltage Low
VCC-0.2
V
V
0.2
0.8
Input low Switching
Threshold
Vil
V
V
-
-
Input High Switching
Threshold
Vih
2.0
Table 5.7 USB I/O Pin (USBDP, USBDM) Characteristics
5.4 MTP Memory Reliability Characteristics
The internal 2048 Byte MTP memory has the following reliability characteristics:
Parameter
Data Retention
Write Cycle
Value
10
Unit
Years
Cycles
Cycles
2,000
Read Cycle
Unlimited
Table 5.8 MTP Memory Characteristics
5.5 Internal Clock Characteristics
The internal Clock Oscillator has the following characteristics:
Value
Parameter
Unit
Minimum
11.98
Typical
12.00
Maximum
12.02
Frequency of Operation
(see Note 1)
MHz
Clock Period
Duty Cycle
83.19
45
83.33
50
83.47
55
ns
%
Table 5.9 Internal Clock Characteristics
Note 1: Equivalent to +/-1667ppm
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6 USB Power Configurations
The following sections illustrate possible USB power configurations for the FT230X. The illustrations have
omitted pin numbers for ease of understanding since the pins differ between the FT230XS and FT230XQ
package options.
All USB power configurations illustrated apply to both package options for the FT230X device. Please refer
to Section 9 for the package option pin-out and signal descriptions.
6.1 USB Bus Powered Configuration
VCC
Ferrite
Bead
1
VCC
27R
2
USBDM
3
4
27R
USBDP
47pF
47pF
FT230X
5
RESET#
VCCIO
SHIELD
10nF
GND
VCC
3V3OUT
D
N
D
GND
N
G
A
G
100nF
+
4.7uF
100nF
GND
GND
Figure 6.1 Bus Powered Configuration
Figure 6.1 Illustrates the FT230X in a typical USB bus powered design configuration. A USB bus powered
device gets its power from the USB bus. Basic rules for USB bus power devices are as follows –
i) On plug-in to USB, the device should draw no more current than 100mA.
ii) In USB Suspend mode the device should draw no more than 2.5mA.
iii) A bus powered high power USB device (one that draws more than 100mA) should use one of the
CBUS pins configured as PWREN# and use it to keep the current below 100mA on plug-in and
2.5mA on USB suspend.
iv) A device that consumes more than 100mA cannot be plugged into a USB bus powered hub.
v) No device can draw more than 500mA from the USB bus.
The power descriptors in the internal MTP memory of the FT230X should be programmed to match the
current drawn by the device.
A ferrite bead is connected in series with the USB power supply to reduce EMI noise from the FT230X and
associated circuitry being radiated down the USB cable to the USB host. The value of the Ferrite Bead
depends on the total current drawn by the application. A suitable range of Ferrite Beads is available from
Laird Technologies (http://www.lairdtech.com) for example Laird Technologies Part # MI0805K601R-10.
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6.2 Self Powered Configuration
VCC(3.3-5.25V)
1
VCC
27R
27R
2
3
USBDM
USBDP
4
47pF
4k7
47pF
FT230X
5
VBUS_SENSE
SHIELD
VCCIO
RESET#
10k
GND
GND
3V3OUT
D
N
D
N
G
A
G
GND
VCC
100nF
100nF
100nF
+
4.7uF
GND
GND
Figure 6.2 Self Powered Configuration
Figure 6.2 illustrates the FT230X in a typical USB self powered configuration. A USB self powered device
gets its power from its own power supply, VCC, and does not draw current from the USB bus. The basic
rules for USB self powered devices are as follows –
i) A self powered device should not force current down the USB bus when the USB host or hub
controller is powered down.
ii) A self powered device can use as much current as it needs during normal operation and USB
suspend as it has its own power supply.
iii) A self powered device can be used with any USB host, a bus powered USB hub or a self powered
USB hub.
The power descriptor in the internal MTP memory of the FT230X should be programmed to a value of
zero (self powered).
In order to comply with the first requirement above, the USB bus power (pin 1) is used to control the
VBUS_Sense pin of the FT220X device. When the USB host or hub is powered up an internal 1.5kΩ
resistor on USBDP is pulled up to +3.3V, thus identifying the device as a full speed device to the USB
host or hub. When the USB host or hub is powered off, VBUS_Sense pin will be low and the FT220X is
held in a suspend state. In this state the internal 1.5kΩ resistor is not pulled up to any power supply
(hub or host is powered down), so no current flows down USBDP via the 1.5kΩ pull-up resistor. Failure to
do this may cause some USB host or hub controllers to power up erratically.
Figure 6.2 illustrates a self powered design which has a +3.3V to +5.25V supply.
Note:
1. When the FT230X is in reset, the UART interface I/O pins are tri-stated. Input pins have internal
75kΩ pull-up resistors to VCCIO, so they will gently pull high unless driven by some external
logic.
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6.3 USB Bus Powered with Power Switching Configuration
P Channel Power
MOSFET
Switched 5V Power to
External Logic
0.1uF
0.1uF
100k
1k
PWREN#
Ferrite
Bead
1
VCC
27R
27R
2
3
USBDM
USBDP
4
47pF
47pF
FT230X
5
RESET#
VCCIO
SHIELD
10nF
GND
VCC
3V3OUT
CBUS3
D
N
D
N
GND
G
A
G
100nF
+
4.7uF
100nF
GND
GND
Figure 6.3 Bus Powered with Power Switching Configuration
A requirement of USB bus powered applications, is when in USB suspend mode, the application draws a
total current of less than 2.5mA. This requirement includes external logic. Some external logic has the
ability to power itself down into a low current state by monitoring the PWREN# signal. For external logic
that cannot power itself down in this way, the FT230X provides a simple but effective method of turning
off power during the USB suspend mode.
Figure 6.3 shows an example of using a discrete P-Channel MOSFET to control the power to external
logic. A suitable device to do this is an International Rectifier (www.irf.com) IRLML6402, or equivalent. It
is recommended that a “soft start” circuit consisting of a 1kΩ series resistor and a 0.1μF capacitor is used
to limit the current surge when the MOSFET turns on. Without the soft start circuit it is possible that the
transient power surge, caused when the MOSFET switches on, will reset the FT230X or the USB host/hub
controller. The soft start circuit example shown in Figure 6.3 powers up with a slew rate of
approximaely12.5V/ms. Thus supply voltage to external logic transitions from GND to +5V in
approximately 400 microseconds.
As an alternative to the MOSFET, a dedicated power switch IC with inbuilt “soft-start” can be used. A
suitable power switch IC for such an application is the Micrel (www.micrel.com) MIC2025-2BM or
equivalent.
With power switching controlled designs the following should be noted:
i) The external logic to which the power is being switched should have its own reset circuitry to
automatically reset the logic when power is re-applied when moving out of suspend mode.
ii) Set the Pull-down on Suspend option in the internal FT230X MTP memory.
iii) One of the CBUS Pins should be configured as PWREN# in the internal FT230X MTP memory, and
used to switch the power supply to the external circuitry.
iv) For USB high-power bus powered applications (one that consumes greater than 100mA, and up
to 500mA of current from the USB bus), the power consumption of the application must be set in
the Max Power field in the internal FT230X MTP memory. A high-power bus powered application
uses the descriptor in the internal FT230X MTP memory to inform the system of its power
requirements.
v) PWREN# gets its VCC from VCCIO. For designs using 3V3 logic, ensure VCCIO is not powered
down using the external logic. In this case use the +3V3OUT.
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7 Application Examples
The following sections illustrate possible applications of the FT230X. The illustrations have omitted pin
numbers for ease of understanding since the pins differ between the FT230XS and FT230XQ package
options.
7.1 USB to RS232 Converter
VCCIO
VCCIO
TXD
RXD
VCC
TXDATA
RXDATA
RTS
TXD
RXD
Ferrite
Bead
1
VCC
RTS#
CTS#
27R
27R
RTS#
CTS#
2
3
USBDM
USBDP
270R
270R
CTS
4
47pF
47pF
FT230X
5
RESET#
VCCIO
SHIELD
10nF
SLEEP#
CBUS0
CBUS1
CBUS2
SHDN#
TXLED
RXLED
GND
3V3OUT
D
N
D
GND
N
G
A
G
VCC
100nF
+
4.7uF
100nF
VCCIO
GND
GND
10k
10k
10k
10k
GND
DB9M
5
9
4
8
3
7
2
6
1
TXD
RXD
RTS#
CTS#
CTS
TXDATA
RTS
RXDATA
10
SHIELD
Figure 7.1 Application Example showing USB to RS232 Converter
An example of using the FT230X as a USB to RS232 converter is illustrated in Figure 7.1. In this
application, a 3V3 TTL to RS232 Level Converter IC is used on the serial UART interface of the FT230X to
convert the 3V3 levels of the FT230X to RS232 levels. This level shift can be done using line drivers from
a variety of vendors e.g. Zywyn. A useful feature on some of these devices is the SHDN# pin which can
be used to power down the device to a low quiescent current during USB suspend mode.
A suitable level shifting device is the Zywyn ZT3243F which is capable of RS232 communication at up to
1000k baud.
In example shown, the CBUS1 and CBUS2 have been configured as TXLED# and RXLED# and are being
used to drive two LEDs.
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7.2 USB to RS485 Coverter
Vcc
VCCIO
10k
10k
10k
VCC
RS485 LEVEL
CONVERTER
Ferrite
GND
Bead
DB9M
1
2
VCC
3
4
7
6
27R
27R
USBDM
USBDP
TXD
3
4
2
1
47pF
47pF
FT230X
RXD
5
10
SHIELD
RESET#
VCCIO
SHIELD
10nF
ZT3485
5
120R
TXDEN
GND
Link
3V3OUT
PWREN#
D
N
D
N
GND
G
A
G
VCCIO
VCC
100nF
10K
+
4.7uF
100nF
GND
GND
Figure 7.2 Application Example Showing USB to RS485 Converter
An example of using the FT230X as a USB to RS485 converter is shown in Figure 7.2. In this application,
a 3V3-TTL to RS485 level converter IC is used on the serial UART interface of the FT230X to convert the
TTL levels of the FT230X to RS485 levels.
This example uses the Zywyn ZT3485 device. Equivalent devices are available from Maxim and Analogue
Devices. The ZT3485 is a RS485 device in a compact 8 pin SOP package. It has separate enables on both
the transmitter and receiver. With RS485, the transmitter is only enabled when a character is being
transmitted from the UART. The TXDEN signal CBUS pin option on the FT230X is provided for exactly this
purpose and so the transmitter enable is wired to CBUS2 which has been configured as TXDEN. Similarly,
CBUS3 has been configured as PWREN#. This signal is used to control the ZT3485’s receiver enable. The
receiver enable is active low, so it is wired to the PWREN# pin to disable the receiver when in USB
suspend mode. CBUS2 = TXDEN and CBUS3 = PWREN# are the default device configurations of the
FT230X pins.
RS485 is a multi-drop network; so many devices can communicate with each other over a two wire cable
interface. The RS485 cable requires to be terminated at each end of the cable. A link (which provides the
120Ω termination) allows the cable to be terminated if the ZT3485 is physically positioned at either end
of the cable.
In this example the data transmitted by the FT230X is also present on the receive path of the
ZT3485.This is a common feature of RS485 and requires the application software to remove the
transmitted data from the received data stream. With the FT230X it is possible to do this entirely in
hardware by modifying the example shown in Figure 7.2 by logically OR’ing the FT230X TXDEN and the
ZT3485 receiver output and connecting the output of the OR gate to the RXD of the FT230X.
Note that the TXDEN is activated 1 bit period before the start bit. TXDEN is deactivated at the same time
as the stop bit. This is not configurable.
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7.3 USB to RS422 Converter
Vcc
VCC
RS 422 LEVEL
CONVERTER
Ferrite
Bead
RXD
TXD
4
1
VCC
10
9
27R
27R
RTS#
CTS#
2
3
5
USBDM
USBDP
3
4
11
47pF
47pF
2
FT230X
12
5
RESET#
VCCIO
SHIELD
10nF
ZT3491
SLEEP#
PWREN#
D
6
7
GND
VCC
3V3OUT
Vcc
D
N
GND
N
G
A
G
RS 422 LEVEL
CONVERTER
100nF
4
5
10
9
+
4.7uF
100nF
GND
3
2
11
12
GND
Vcc
ZT3491
VCCIO
6
7
10K
GND
RXD
TXDM
TXDP
RXDP
RXDM
RTSM
RTSP
CTSP
CTSM
TXD
RTS
CTS
SHIELD
Figure 7.3 USB to RS422 Converter Configuration
An example of using the FT230X as a USB to RS422 converter is shown in Figure 7.3. In this application,
two TTL to RS422 Level Converter ICs are used on the serial UART interface of the FT230X to convert the
TTL levels of the FT230X to RS422 levels. There are many suitable level converter devices available. This
example uses Zywyn ZT3491 devices which have enables on both the transmitter and receiver. Since the
ZT3491 transmitter enable is active high, it is connected to a CBUS pin in SLEEP# configuration. The
ZT3491 receiver enable is active low and is therefore connected to a CBUS pin PWREN# configuration.
This ensures that when both the ZT3491 transmitters and receivers are enabled then the device is active,
and when the device is in USB suspend mode, the ZT3491 transmitters and receivers are disabled. If a
similar application is used, but the design is USB BUS powered, it may be necessary to use a P-Channel
logic level MOSFET (controlled by PWREN#) in the VCC line of the ZT3491 devices to ensure that the USB
standby current of 2.5mA is met.
The ZT3491 is specified to transmit and receive data at a rate of up to 16 Mbaud. In this example the
maximum data rate is limited to 3 Mbaud by the FT230X.
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7.4 USB Battery Charging Detection
A recent addition to the USB specification (http://www.usb.org/developers/devclass_docs/BCv1.2_011912.zip )
is to allow for additional charging profiles to be used for charging batteries in portable devices. These
charging profiles do not enumerate the USB port of the peripheral. The FT230X device will detect that a
USB compliant dedicated charging port (DCP) is connected. Once detected while in suspend mode, a
battery charge detection signal is provided to allow external logic to switch to charging mode as opposed
to operation mode.
To use the FT230X with battery charging detection the CBUS pins must be reprogrammed to allow for the
BCD Charger output to switch the external charger circuitry on. The CBUS pins are configured in the
internal MTP memory with the free utility FTPROG. If the charging circuitry requires an active low signal
to enable it, the CBUS pin can be programmed to BCD Charger# as an alternative.
When connected to a USB compliant dedicated charging port (DCP, as opposed to a standard USB host)
the device USB signals will be shorted together and the device suspended. The BCD charger signal will
bring the LTC4053 out of suspend and allow battery charging to start. The charge current in the example
below is 1A as defined by the resistance on the PROG pin.
VBUS
3V3OUT
VBUS 3V3OUT
VBUS
3V3OUT
0.1uF
0.1uF
600R/2A
3V3OUT
CN USB
VBUS
1
2
3
4
5
GND
GND
D-
D+
ID
DM
DP
27R
27R
GND
RESET#
10nF
N.F.
BCD
0.1uF
CBUS0
FT230X
0R
SLD GND
GND
GND
GND
VBUS VBUS
VBUS
VBATT
4.7uF
0.1uF
1
2
3
4
5
10
9
8
7
6
CHRG
VCC
FAULT
TIMER
GND
ACPR
GND GND
BAT
SHDN
PROG
NTC
1
+
NCT
-
BCD
NTC
TB3.5mm
LTC4053EDD
0.1uF
1uF
1R
2K2
1K5
GND
GND
GND
GND
GND
GND GND
1A when connected to a dedicated charger port
0A when enumerated
0A when not enumerated and not in sleep
0A when in sleep
EEPROM Setting
VBUS
Battery Options
X-Chip Pin
CBUS0
Function
BCD
Battery Charger Enable
Force Power Enable
X
NTC
JP1
NCT Available
4K32 1%
De-acticate Sleep
1-2 NCT Enabled
2-3 NCT Disabled (Default)
JP1
SIP-3
JUMPER-2mm
GND
Figure 7.4 USB Battery Charging Detection (1 pin)
Alternatively the PWREN# And SLEEP pins may be used to control the LTC4053 such that a battery may
be charged from a standard host (low current) or from a dedicated charging port (high current). In such
a design as shown below the charge current would need to be limited to 0.4A to ensure that the USB host
power limit is not exceeded.
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VBUS
3V3OUT
VBUS 3V3OUT
VBUS 3V3OUT
U1
3V3OUT
0.1uF
0.1uF
600R/2A
CN USB
VBUS
1
2
3
4
5
GND
GND
D-
D+
ID
DM
DP
27R
27R
GND
RESET#
10nF
N.F.
0.1uF
0R
SLEEP#
PWREN#
CBUS5
CBUS6
SLD GND
GND
FT230X
GND
GND
VBUS VBUS
VBUS
VBATT
4.7uF
0.1uF
1
2
3
4
5
10
CHRG
VCC
FAULT
TIMER
GND
ACPR
BAT
SHDN
PROG
NTC
9
8
7
6
GND GND
1
+
NCT
-
SLEEP#
NTC
TB3.5mm
LTC4053EDD
0.1uF
1uF
2K2
16K5 1%
4K32 1%
PWREN#
1R
GND
GND
GND
GND
GND
GND GND
0.4A when connected to a dedicated charger port
0.4A when enumerated
0.1A when not enumerated and not in sleep mode
0A when in sleep mode
EEPROM Setting
VBUS
Battery Options
X-Chip Pin
CBUS5
CBUS6
Function
SLEEP#
PWREN#
Battery Charger Enable
Force Power Enable
De-acticate Sleep
X
X
NTC
JP1
NCT Available
4K32 1%
1-2 NCT Enabled
2-3 NCT Disabled (Default)
X
JP1
SIP-3
JUMPER-2mm
GND
Figure 7.5 USB Battery Charging Detection (2 pin)
In the example above the FT230X SLEEP pin is used to enable/disable the LTC4053, while the PWREN#
signal alters the charging current by altering the resistance on the LTC4053 PROG pin.
A third option shown in the example below uses the SLEEP signal from the FT230X to enable / disable the
battery charger. The BCD# and PWREN# signals are then used to alter the resistance on the PROG pin of
the LTC4053 which controls the charge current drawn from the USB connector.
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VBUS
3V3OUT
VBUS 3V3OUT
VBUS
3V3OUT
0.1uF
0.1uF
600R/2A
3V3OUT
CN USB
VBUS
1
2
3
4
5
GND
GND
D-
D+
ID
DM
DP
27R
27R
GND
RESET#
10nF
18
17
10
BCD#
PWREN#
SLEEP#
CBUS0
CBUS1
CBUS2
N.F.
0.1uF
0R
FT230X
SLD GND
GND
GND
GND
VBUS VBUS
VBUS
VBATT
4.7uF
0.1uF
1
10
9
8
7
6
CHRG
VCC
FAULT
TIMER
GND
ACPR
BAT
SHDN
PROG
NTC
2
3
4
5
GND GND
1
+
NCT
-
SLEEP#
NTC
TB3.5mm
LTC4053EDD
0.1uF
1uF
2K2
16K5 1%
4K32 1%
1K5 - 1%
BCD#
1R
PWREN#
GND
GND
GND
GND
GND
GND GND
1A when connected to a dedicated charger port
0.4A when enumerated
0.1A when not enumerated and not in sleep
0A when in sleep
EEPROM Setting
VBUS
Battery Options
X-Chip Pin
CBUS0
CBUS1
CBUS2
Function
BCD#
PWREN#
SLEEP#
Battery Charger Enable
Force Power Enable
De-acticate Sleep
X
X
NTC
JP1
4K32 1%
NCT Available
1-2 NCT Enabled
2-3
NCT Disabled (Default)
JP1
SIP-3
JUMPER-2mm
GND
Figure 7.6 USB Battery Charging Detection (3 pin)
To calculate the equivalent resistance on the PROG pin select a charge current, then Res = 1500V/Ichg
For more configuration options of the LTC4053 refer to:
AN_175_Battery Charging Over USB
Note: If the FT230X is connected to a standard host port such that the device is enumerated the battery
charge detection signal is inactive as the device will not be in suspend.
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7.5 LED Interface
Any of the CBUS I/O pins can be configured to drive an LED. The FT230X has 3 configuration options for
driving LEDs from the CBUS. These are TXLED#, RXLED#, and TX&RXLED#. Refer to Section 3.3 for
configuration options.
VCCIO
TX
RX
270R
270R
FT230X
TXLED#
RXLED#
[0...3]
CBUS
CBUS
[0...3]
Figure 7.7 Dual LED Configuration
An example of using the FT230X to drive LEDs is shown in Figure 7.7. In this application one of the CBUS
pins is used to indicate transmission of data (TXLED#) and another is used to indicate receiving data
(RXLED#). When data is being transmitted or received the respective pins will drive from tri-state to low
in order to provide indication on the LEDs of data transfer. A digital one-shot is used so that even a small
percentage of data transfer is visible to the end user.
VCCIO
LED
270R
FT230X
TX& RXLED#
[0...3]
CBUS
Figure 7.8 Single LED Configuration
Another example of using the FT230X to drive LEDs is shown in Figure 7.8. In this example one of the
CBUS pins is used to indicate when data is being transmitted or received by the device (TX&RXLED). In
this configuration the FT230X will drive only a single LED.
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8 Internal MTP Memory Configuration
The FT230X includes an internal MTP memory which holds the USB configuration descriptors, other
configuration data for the chip and also user data areas. Following a power-on reset or a USB reset the
FT230X will scan its internal MTP memory and read the USB configuration descriptors stored there.
In many cases, the default values programmed into the MTP memory will be suitable and no re-
programming will be necessary. The defaults can be found in Section 8.1.
The MTP memory in the FT230X can be programmed over USB if the values need to be changed for a
particular application. Further details of this are provided from section 8.2 onwards.
Users who do not have their own USB Vendor ID but who would like to use a unique Product ID in their
design can apply to FTDI for a free block of unique PIDs. See TN_100 – USB Vendor ID/Product ID
Guidelines for more details.
8.1 Default Values
The default factory programmed values of the internal MTP memory are shown in Table 8.1.
Parameter
Value
Notes
USB Vendor ID (VID)
USB Product UD (PID)
Serial Number Enabled?
0403h
6015h
Yes
FTDI default VID (hex)
FTDI default PID (hex)
A unique serial number is generated and
programmed into the MTP memory during device
final test.
Serial Number
See Note
Enabling this option will make the device pull down
on the UART interface lines when in USB suspend
mode (PWREN# is high).
Pull down I/O Pins in USB
Suspend
Disabled
FTDI
Manufacturer Name
Product Description
FT230X BASIC
UART
Max Bus Power Current
Power Source
90mA
Bus Powered
FT230X
Device Type
Returns USB 2.0 device description to the host.
Note: The device is a USB 2.0 Full Speed device
(12Mb/s) as opposed to a USB 2.0 High Speed
device (480Mb/s).
USB Version
0200
Taking RI# low will wake up the USB host controller
from suspend in approximately 20 ms.
Remote Wake Up
Disabled
4mA
DBUS Drive Current
Strength
Options are 4mA, 8mA, 12mA, 16mA
DBUS slew rate
Slow
Options are slow or fast
Normal
Options are normal or Schmitt
DBUS Schmitt Trigger
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Parameter
Value
Notes
Enable
CBUS Drive Current
Strength
4mA
Slow
Options are 4mA, 8mA, 12mA, 16mA
Options are slow or fast
CBUS slew rate
CBUS Schmitt Trigger
Enable
Normal
Options are normal or Schmitt
Makes the device load the VCP driver interface for
the device.
Load VCP Driver
Enabled**
Default configuration of CBUS0 – Transmit data
enable for RS485
CBUS0
CBUS1
CBUS2
TXDEN
RXLED#
TXLED#
Default configuration of CBUS1 – Receive LED drive.
Default configuration of CBUS2 – Transmit LED
drive.
Default configuration of CBUS3 – SLEEP#, goes
active low when the device is in suspend
CBUS3
SLEEP#
Invert TXD
Invert RXD
Invert RTS#
Invert CTS#
Disabled
Disabled
Disabled
Disabled
Signal on this pin becomes TXD# if enable.
Signal on this pin becomes RXD# if enable.
Signal on this pin becomes RTS if enable.
Signal on this pin becomes CTS if enable.
Table 8.1 Default Internal MTP Memory Configuration
**VCP disabled in Rev B silicon in error
8.2 Methods of Programming the MTP Memory
8.2.1 Programming the MTP memory over USB
The MTP memory on all FT-X devices can be programmed over USB. This method is the same as for the
EEPROM on other FTDI devices such as the FT232R. No additional hardware, connections or programming
voltages are required. The device is simply connected to the host computer in the same way that it would
be for normal applications, and the FT_Prog utility is used to set the required options and program the
device.
The FT_Prog utility is provided free-of-charge from the FTDI website, and can be found at the link below.
The user guide is also available at this link.
http://www.ftdichip.com/Support/Utilities.htm#FT_Prog
Additionally, D2XX commands can be used to program the MTP memory from within user applications.
For more information on the commands available, please see the D2XX Programmers Guide below.
http://www.ftdichip.com/Support/Documents/ProgramGuides/D2XX_Programmer's_Guide(FT_000071).p
df
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8.3 Memory Map
The FT-X family MTP memory has various areas which come under three main categories:
User Memory Area
Configuration Memory Area (writable)
Configuration Memory Area (non-writable)
Memory Area Description
Word Address
0x3FF - 0x80
User Memory Area 2
Accessible via USB
Configuration Memory Area
Accessible via USB
0x7E - 0x50
0x4E - 0x40
0x3E - 0x12
0x10 - 0x00
Configuration Memory Area
Cannot be written
User Memory Area 1
Accessible via USB
Configuration Memory Area
Accessible via USB
Figure 8.1: Simplified memory map for the FT-X
User Memory Area
The User Memory Areas are highlighted in Green on the memory map. They can be read and written via
USB on the FT230X. All locations within this range are freely programmable; no areas have special
functions and there is no checksum for the user area.
Note that the application should take into account the specification for the number of write cycles in
Section 5.4 if it will be writing to the MTP memory multiple times.
Configuration Memory Area (writable)
This area stores the configuration data for the device, including the data which is returned to the host in
the configuration descriptors (e.g. the VID, PID and string descriptions) and also values which set the
hardware configuration (the signal assigned to each CBUS pin for example).
These values can have a significant effect on the behaviour of the device. Steps must be taken to ensure
that these locations are not written to un-intentionally by an application which is intended to access only
the user area.
This area is included in a checksum which covers configuration areas of the memory, and so changing
any value can also cause this checksum to fail.
Configuration Memory Area (non-writable)
This is a reserved area and the application should not write to this area of memory. Any attempt to write
these locations will fail
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9 Package Parameters
The FT230X is available in two different packages. The FT230XS is the SSOP-16 option and the FT230XQ
is the QFN-16 package option. The solder reflow profile for both packages is described in Section 9.4.
9.1 SSOP-16 Package Mechanical Dimensions
Figure 9.1 SSOP-16 Package Dimensions
The FT230XS is supplied in a RoHS compliant 16 pin SSOP package. The package is lead (Pb) free and
uses a ‘green’ compound. The package is fully compliant with European Union directive 2002/95/EC.
This package is nominally 4.90mm x 3.91mm body (4.90mm x 5.99mm including pins). The pins are on a
0.635 mm pitch. The above mechanical drawing shows the SSOP-16 package.
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9.2 SSOP-16 Package Markings
-B
FT230XS
Figure 9.2 SSOP-16 Package Markings
The date code format is YYXX where XX = 2 digit week number, YY = 2 digit year number. This is
followed by the revision number.
The code XXXXXXXXXXXX is the manufacturing LOT code.
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9.3 QFN-16 Package Mechanical Dimensions
Figure 9.3 QFN-16 Package Dimensions
The FT230XQ is supplied in a RoHS compliant leadless QFN-16 package. The package is lead (Pb) free,
and uses a ‘green’ compound. The package is fully compliant with European Union directive 2002/95/EC.
This package is nominally 4.00mm x 4.00mm. The solder pads are on a 0.65mm pitch. The above
mechanical drawing shows the QFN-16 package. All dimensions are in millimetres.
The centre pad on the base of the FT230XQ is internally connected to ground.
.
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9.4 QFN-16 Package Markings
1
12
XXXXXXXXXX
FT230XQ
YYWW-B
5
8
Figure 9.4 QFN-16 Package Markings
The date code format is YYXX where XX = 2 digit week number, YY = 2 digit year number. This is
followed by the revision number.
The code XXXXXXX is the manufacturing LOT code.
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9.5 Solder Reflow Profile
The FT230X is supplied in Pb free 16 LD SSOP and QFN-16 packages. The recommended solder reflow
profile for both package options is shown in Figure 9.5.
tp
T
p
Critical Zone: when
T is in the range
Ramp Up
T to T
p
L
T
L
tL
T Max
S
Ramp
Down
T Min
S
tS
Preheat
25
T = 25º C to TP
Time, t (seconds)
Figure 9.5 FT230X Solder Reflow Profile
The recommended values for the solder reflow profile are detailed in Table 9.1. Values are shown for both
a completely Pb free solder process (i.e. the FT230X is used with Pb free solder), and for a non-Pb free
solder process (i.e. the FT230X is used with non-Pb free solder).
Profile Feature
Pb Free Solder Process
Non-Pb Free Solder Process
Average Ramp Up Rate (Ts to Tp)
3°C / second Max.
3°C / Second Max.
Preheat
- Temperature Min (Ts Min.)
- Temperature Max (Ts Max.)
- Time (ts Min to ts Max)
100°C
150°C
150°C
200°C
60 to 120 seconds
60 to 120 seconds
Time Maintained Above Critical Temperature
TL:
217°C
183°C
- Temperature (TL)
- Time (tL)
60 to 150 seconds
60 to 150 seconds
Peak Temperature (Tp)
260°C
240°C
Time within 5°C of actual Peak Temperature
(tp)
20 to 40 seconds
20 to 40 seconds
Ramp Down Rate
6°C / second Max.
8 minutes Max.
6°C / second Max.
6 minutes Max.
Time for T= 25°C to Peak Temperature, Tp
Table 9.1 Reflow Profile Parameter Values
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10 Contact Information
Branch Office – Hillsboro, Oregon, USA
Head Office – Glasgow, UK
Future Technology Devices International Limited
(USA)
7130 SW Fir Loop
Tigard, OR 97223
Future Technology Devices International Limited
Unit 1, 2 Seaward Place, Centurion Business Park
Glasgow G41 1HH
United Kingdom
Tel: +44 (0) 141 429 2777
Fax: +44 (0) 141 429 2758
USA
Tel: +1 (503) 547 0988
Fax: +1 (503) 547 0987
E-mail (Sales)
sales1@ftdichip.com
E-mail (Support)
E-mail (General Enquiries) admin1@ftdichip.com
support1@ftdichip.com
E-Mail (Sales)
E-Mail (Support)
E-Mail (General Enquiries)
us.sales@ftdichip.com
us.support@ftdichip.com
us.admin@ftdichip.com
Branch Office – Taipei, Taiwan
Branch Office – Shanghai, China
Future Technology Devices International Limited
(Taiwan)
2F, No. 516, Sec. 1, NeiHu Road
Taipei 114
Taiwan , R.O.C.
Tel: +886 (0) 2 8791 3570
Fax: +886 (0) 2 8791 3576
Future Technology Devices International Limited
(China)
Room 408, 317 Xianxia Road,
Shanghai, 200051
China
Tel: +86 21 62351596
Fax: +86 21 62351595
E-mail (Sales)
E-mail (Support)
E-mail (General Enquiries) tw.admin1@ftdichip.com
tw.sales1@ftdichip.com
tw.support1@ftdichip.com
E-mail (Sales)
E-mail (Support)
E-mail (General Enquiries)
cn.sales@ftdichip.com
cn.support@ftdichip.com
cn.admin@ftdichip.com
Web Site
http://ftdichip.com
System and equipment manufacturers and designers are responsible to ensure that their systems, and any Future Technology
Devices International Ltd (FTDI) devices incorporated in their systems, meet all applicable safety, regulatory and system-level
performance requirements. All application-related information in this document (including application descriptions, suggested
FTDI devices and other materials) is provided for reference only. While FTDI has taken care to assure it is accurate, this
information is subject to customer confirmation, and FTDI disclaims all liability for system designs and for any applications
assistance provided by FTDI. Use of FTDI devices in life support and/or safety applications is entirely at the user’s risk, and the
user agrees to defend, indemnify and hold harmless FTDI from any and all damages, claims, suits or expense resulting from
such use. This document is subject to change without notice. No freedom to use patents or other intellectual property rights is
implied by the publication of this document. Neither the whole nor any part of the information contained in, or the product
described in this document, may be adapted or reproduced in any material or electronic form without the prior written consent
of the copyright holder. Future Technology Devices International Ltd, Unit 1, 2 Seaward Place, Centurion Business Park,
Glasgow G41 1HH, United Kingdom. Scotland Registered Company Number: SC136640
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Appendix A – References
Useful Application Notes
http://www.ftdichip.com/Documents/AppNotes/AN232R-01_FT2302RBitBangModes.pdf
http://www.ftdichip.com/Documents/AppNotes/AN_107_AdvancedDriverOptions_AN_000073.pdf
http://www.ftdichip.com/Documents/AppNotes/AN_121_FTDI_Device_EEPROM_User_Area_Usage.pdf
http://www.ftdichip.com/Documents/AppNotes/AN_120_Aliasing_VCP_Baud_Rates.pdf
http://www.ftdichip.com/Documents/AppNotes/AN_100_Using_The_FT232_245R_With_External_Osc(FT_
000067).pdf
http://www.ftdichip.com/Resources/Utilities/AN_126_User_Guide_For_FT232_Factory%20test%20utility.
pdf
http://www.ftdichip.com/Documents/AppNotes/AN232B-05_BaudRates.pdf
http://www.ftdichip.com/Documents/InstallGuides.htm
http://www.ftdichip.com/Support/Documents/TechnicalNotes/TN_100_USB_VID-PID_Guidelines.pdf
http://www.ftdichip.com/Support/Documents/AppNotes/AN_175_Battery%20Charging%20Over%20USB
%20with%20FTEX%20Devices.pdf
http://www.ftdichip.com/Support/Documents/ProgramGuides/D2XX_Programmer's_Guide(FT_000071).p
df
http://www.usb.org/developers/devclass_docs/BCv1.2_011912.zip
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Appendix B - List of Figures and Tables
List of Figures
Figure 2.1 FT230X Block Diagram ...................................................................................................4
Figure 3.1 QFN Schematic Symbol ..................................................................................................7
Figure 3.2 SSOP Schematic Symbol ................................................................................................9
Figure 6.1 Bus Powered Configuration ........................................................................................... 22
Figure 6.2 Self Powered Configuration........................................................................................... 23
Figure 6.3 Bus Powered with Power Switching Configuration ............................................................ 24
Figure 7.1 Application Example showing USB to RS232 Converter..................................................... 25
Figure 7.2 Application Example Showing USB to RS485 Converter .................................................... 26
Figure 7.3 USB to RS422 Converter Configuration........................................................................... 27
Figure 7.4 USB Battery Charging Detection (1 pin).......................................................................... 28
Figure 7.5 USB Battery Charging Detection (2 pin).......................................................................... 29
Figure 7.6 USB Battery Charging Detection (3 pin).......................................................................... 30
Figure 7.7 Dual LED Configuration ................................................................................................ 31
Figure 7.8 Single LED Configuration .............................................................................................. 31
Figure 8.1: Simplified memory map for the FT-X ............................................................................ 34
Figure 9.1 SSOP-16 Package Dimensions....................................................................................... 35
Figure 9.2 SSOP-16 Package Markings .......................................................................................... 36
Figure 9.3 QFN-16 Package Dimensions......................................................................................... 37
Figure 9.4 QFN-16 Package Markings ............................................................................................ 38
Figure 9.5 FT230X Solder Reflow Profile......................................................................................... 39
List of Tables
Table 3.1 Power and Ground ..........................................................................................................7
Table 3.2 Common Function pins....................................................................................................7
Table 3.3 UART Interface and CBUS Group (see note 1) ....................................................................8
Table 3.4 Power and Ground ..........................................................................................................9
Table 3.5 Common Function pins....................................................................................................9
Table 3.6 UART Interface and CBUS Group (see note 1) .................................................................. 10
Table 3.7 CBUS Configuration Control ........................................................................................... 12
Table 5.1 Absolute Maximum Ratings ............................................................................................ 16
Table 5.2 ESD and Latch-Up Specifications .................................................................................... 16
Table 5.3 Operating Voltage and Current ....................................................................................... 17
Table 5.4 I/O Pin Characteristics VCCIO = +3.3V (except USB PHY pins)........................................... 18
Table 5.5 I/O Pin Characteristics VCCIO = +2.5V (except USB PHY pins)........................................... 19
Table 5.6 I/O Pin Characteristics VCCIO = +1.8V (except USB PHY pins)........................................... 20
Table 5.7 USB I/O Pin (USBDP, USBDM) Characteristics .................................................................. 21
Table 5.8 MTP Memory Characteristics........................................................................................... 21
Table 5.9 Internal Clock Characteristics......................................................................................... 21
Table 8.1 Default Internal MTP Memory Configuration ..................................................................... 33
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FT230X USB TO BASIC UART IC
Version 1.2
Document No.: FT_000566 Clearance No.: FTDI# 260
Table 9.1 Reflow Profile Parameter Values ..................................................................................... 39
Copyright © 2013 Future Technology Devices International Limited
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FT230X USB TO BASIC UART IC
Version 1.2
Document No.: FT_000566 Clearance No.: FTDI# 260
Appendix C - Revision History
Document Title:
USB to BASIC UART IC FT230X
Document Reference No.:
Clearance No.:
FT_000566
FTDI# 260
Product Page:
http://www.ftdichip.com/FT-X.htm
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Version Draft
Version 1.0
Version 1.1
Initial draft available
Initial release
2nd December 2011
7th February 2012
17th April 2012
Added USB compliance in section 1.3
Clarified MTP Reliability in table 5.8
Section 8.1, Added a Note “VCP disabled in Rev B Silicon in error
Edited EEPROM Table 8.1, Product Description
Clarified IO is tolerant of 5V input
Version 1.2
Updated TID info
14 Feb 2013
Copyright © 2013 Future Technology Devices International Limited
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