HF42A040SCE [ETC]
;Preliminary Data Sheet PD-20611 12/98
HF42A040SCE
Hexfred Die in Wafer Form
400 V
Size 42
5" Wafer
Electrical Characteristics ( Wafer Form )
Parameter
Description
Guaranteed (Min/Max)
Test Conditions
TJ = 25°C, IF = 60A
VFM
Forward Voltage
1.2V Max.
400V Min.
6µA Max.
BVR
Reverse Breakdown Voltage
Reverse Leakage Current
TJ = 25°C, IR = 200µA
TJ = 25°C, VR = 400V
IRM
Mechanical Data
Nominal Back Metal Composition, Thickness
Nominal Front Metal Composition, Thickness
Chip Dimensions
Cr-Ni-Ag ( 1kA-4kA-6kA )
Ti-Ni-Ag ( 2kA-1kA-35kA )
0.1988" x 0.1988"
Wafer Diameter
125mm, with std. < 100 > flat
.015" ± .003"
Wafer Thickness
Relevant Die Mechanical Dwg. Number
MinimumStreetWidth
01-5313
100 Microns
Reject Ink Dot Size
0.25mmDiameterMinimum
Store in original container, in dessicated
nitrogen, with no contamination
Recommended Storage Environment
Reference Standard IR packaged part ( for design ) : HFA120MD40C
Die Outline
NOTES:
1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS ( INCHES )
2. CONTROLLING DIMENSION : ( INCH )
3. DIMENSIONALTOLERANCES:
BONDING PADS : <0.635TOLERANCE=± 0.013
WIDTH
&
<(.0250)TOLERANCE=± (.0005)
>0.635TOLERANCE=± 0.025
>(.0250)TOLERANCE=± (.0010)
< 1.270TOLRANCE=± 0.102
< (.050) TOLERANCE = ± (.004)
>1.270 TOLERANCE=± 0.203
> (.050) TOLERANCE = ± (.008)
LENGTH
OVERALLDIE
WIDTH
&
LENGTH
相关型号:
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