HFCT-5006 [ETC]
Evaluation Kit for SFF LC Singlemode for SONET/SDH. ATM (OC-3/OC-12) Applications ; 评估板SFF LC单模用于SONET / SDH 。 ATM （ OC - 3 / OC- 12 ）的应用\n
| 型号： | HFCT-5006 |
| 厂家： | 
ETC |
| 描述： | Evaluation Kit for SFF LC Singlemode for SONET/SDH. ATM (OC-3/OC-12) Applications
|
| 文件： | 总16页 (文件大小：287K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Agilent HFCT-5964xxx Single Mode
Laser Small Form Factor Transceivers
for ATM, SONET OC-3/SDH STM-1
Part of the Agilent METRAK family
Data Sheet
Features
•
•
•
HFCT-5964TL/ATL:
Links of 15 km with 9/125 µm
single mode fiber (S1.1)
HFCT-5964NL:
Links of 40 km with 9/125 µm
single mode fiber (L1.1)
Multisourced 2 x 10 package style
with LC receptacle
Description
The HFCT-5964xxx are high
performance, cost effective
modules for serial optical data
communications applications
specified for a signal rate of
155 Mb/s. They are designed to
provide SONET/SDH compliant
intermediate and long reach
links at 155 Mb/s.
The receiver section uses an
MOVPE grown planar PIN
photodetector for low dark
current and excellent
responsivity.
•
•
Single +3.3 V power supply
Temperature range:
HFCT-5964TL:
0°C to +70°C
HFCT-5964ATL: -40°C to +85°C
HFCT-5964NL: -5°C to +70°C
Wave solder and aqueous wash
process compatible
Manufactured in an ISO9002
certified facility
Fully Class 1 CDRH/IEC 825
compliant
+3.3 V TTL signal detect output
Transceivers are available with
and without EMI nose shield
(see ordering information details)
These transceivers are supplied
in the new industry standard 2 x
10 DIP style package with the LC
fiber connector interface and is
footprint compatible with SFF
Multi Source Agreement (MSA).
•
•
•
All modules are designed for
single mode fiber and operate at
a nominal wavelength of 1300
nm. They incorporate high
•
•
performance, reliable, long
wavelength optical devices and
proven circuit technology to give
long life and consistent service.
Applications
The transmitter section of the
HFCT-5964xxx incorporates a
1300 nm Fabry Perot (FP) laser.
The transmitter has full IEC 825
and CDRH Class 1 eye safety.
•
SONET/SDH equipment
interconnect, OC-3/SDH STM-1
rate
•
•
Long and intermediate reach
ATM/SONET links
Suitable for Fast Ethernet
Applications
Functional Description
Receiver Section
Design
Noise Immunity
Figure 1 also shows a filter
function which limits the
bandwidth of the preamp output
signal. The filter is designed to
bandlimit the preamp output
noise and thus improve the
receiver sensitivity.
The receiver section for the
HFCT-5964xxx contains an
InGaAs/InP photo detector and
a preamplifier mounted in an
optical subassembly. This optical
subassembly is coupled to a
postamp/decision circuit on a
circuit board. The design of the
optical assembly is such that it
provides better than 14 dB
Optical Return Loss (ORL).
The receiver includes internal
circuit components to filter
power supply noise. However
under some conditions of EMI
and power supply noise,
external power supply filtering
may be necessary (see
Application Section).
These components will reduce
the sensitivity of the receiver as
the signal bit rate is increased
above 155 Mb/s.
The Signal Detect Circuit
The signal detect circuit works
by sensing the level of the
received signal and comparing
this level to a reference. The SD
output is +3.3 V TTL.
The postamplifier is ac coupled
to the preamplifier as illustrated
in Figure 1. The coupling
capacitors are large enough to
pass the SONET/SDH test
pattern at 155 Mb/s without
significant distortion or
performance penalty. If a lower
signal rate, or a code which has
significantly more low frequency
content is used, sensitivity, jitter
and pulse distortion could be
degraded.
The device incorporates a
photodetector bias circuit. This
output must be connected to V
and can be monitored by
connecting through a series
resistor (see Application
Section).
CC
PHOTODETECTOR
BIAS
DATA OUT
FILTER
TRANS-
IMPEDANCE
PRE-
LVPECL
OUTPUT
BUFFER
AMPLIFIER
AMPLIFIER
DATA OUT
GND
LVTTL
OUTPUT
BUFFER
SIGNAL
DETECT
CIRCUIT
SD
Figure 1. Receiver Block Diagram
2
Functional Description
Transmitter Section
Design
A schematic diagram for the
The transmitter also includes
transmitter is shown in Figure 2. monitor circuitry for both the
The HFCT-5964xxx incorporates laser diode bias current and
an FP laser as its optical source.
All part numbers have been
designed to be compliant with
IEC 825 eye safety requirements
under any single fault condition
and CDRH under normal
laser diode optical power.
operating conditions. The
optical output is controlled by a
custom IC that detects the laser
output via the monitor
photodiode. This IC provides
both dc and ac current drive to
the laser to ensure correct
modulation, eye diagram and
extinction ratio over
temperature, supply voltage and
operating life.
FP
LASER
PHOTODIODE
(rear facet monitor)
DATA
LASER
MODULATOR
DATA
LVPECL
INPUT
LASER BIAS
DRIVER
BMON(+)
BMON(-)
LASER BIAS
CONTROL
PMON(+)
PMON(-)
Figure 2. Simplified Transmitter Schematic
3
Package
The overall package concept for
these devices consists of the
following basic elements; two
optical subassemblies, two
electrical subassemblies and the
housing as illustrated in the
block diagram in Figure 3.
The electrical subassemblies
consist of high volume
multilayer printed circuit boards connected to signal ground and
on which the IC and various
surface-mounted passive circuit
elements are attached.
encased with a metal EMI
protective shield. The case is
we recommend soldering the
four ground tabs to host card
signal ground.
The receiver electrical
The PCBs for the two electrical
subassemblies both carry the
signal pins that exit from the
bottom of the transceiver. The
solder posts are fastened into
the molding of the device and
are designed to provide the
mechanical strength required to
withstand the loads imposed on
the transceiver by mating with
the LC connectored fiber cables.
Although they are not connected
electrically to the transceiver, it
is recommended to connect
them to chassis ground.
The package outline drawing
and pin out are shown in
Figures 4 and 5. The details of
this package outline and pin out
are compliant with the multi-
source definition of the 2 x 10
DIP. The low profile of the
Agilent transceiver design
complies with the maximum
height allowed for the LC
connector over the entire length
of the package.
subassembly includes an
internal shield for the electrical
and optical subassembly to
ensure high immunity to
external EMI fields.
The optical subassemblies are
each attached to their respective
transmit or receive electrical
subassemblies. These two units
are then fitted within the outer
housing of the transceiver that is
molded of filled nonconductive
plastic to provide mechanical
strength. The housing is then
RX SUPPLY
NOTE
DATA OUT
DATA OUT
PIN PHOTODIODE
PREAMPLIFIER
SUBASSEMBLY
QUANTIZER IC
RX GROUND
SIGNAL
DETECT
LC
TX GROUND
RECEPTACLE
DATA IN
DATA IN
Tx DISABLE
LASER BIAS
MONITORING
LASER
OPTICAL
SUBASSEMBLY
LASER DRIVER
AND CONTROL
LASER DIODE
CIRCUIT
MODULATOR
TX SUPPLY
CASE
NOTE: NOSE CLIP PROVIDES CONNECTION TO CHASSIS GROUND FOR BOTH EMI AND THERMAL DISSIPATION.
Figure 3. Block Diagram
4
+ 0
- 0.2
+0
13.59
0.535
13.59
(0.535)
MAX
15.0 0.2
(0.591 0.008)
(
)
-0.008
TOP VIEW
48.2
(1.898)
6.25
(0.246)
9.8
(0.386)
MAX
10.8 0.2
9.6 0.2
(0.425 0.008) 0.378 0.008)
3.81
(0.15)
4.06
(0.16)
1
Ø 1.07
0.25
(0.01)
10.16
(0.4)
1
(0.039)
(0.042)
20 x 0.5
(0.02)
(0.039)
19.5 0.3
(0.768 0.012)
1.78
(0.07)
BACK VIEW
FRONT VIEW
SIDE VIEW
48.2
(1.898)
9.8
(0.386)
MAX
G MODULE - NO EMI NOSE SHIELD
3.81
(0.15)
Ø 1.07
0.25
(0.01)
(0.042)
1
20 x 0.5
(0.02)
(0.039)
19.5 0.3
(0.768 0.012)
1.78
(0.07)
SIDE VIEW
20 x 0.25 (PIN THICKNESS)
(0.01)
NOTE: END OF PINS
CHAMFERED
BOTTOM VIEW
DIMENSIONS IN MILLIMETERS (INCHES)
DIMENSIONS SHOWN ARE NOMINAL. ALL DIMENSIONS MEET THE MAXIMUM PACKAGE OUTLINE DRAWING IN THE SFF MSA.
Figure 4. HFCT-5964xxx Package Outline Drawing
5
RX
TX
Connection Diagram
Mounting Studs/
Solder Posts
Package
Grounding Tabs
o
o
o
o
o
o
o
o
o
o
o
o
o
o
o
o
o
o
o
o
PHOTO DETECTOR BIAS
RECEIVER SIGNAL GROUND
RECEIVER SIGNAL GROUND
NOT CONNECTED
1
2
3
4
5
6
7
8
9
20
Top 19
LASER DIODE OPTICAL POWER MONITOR - POSITIVE END
LASER DIODE OPTICAL POWER MONITOR - NEGATIVE END
LASER DIODE BIAS CURRENT MONITOR - POSITIVE END
LASER DIODE BIAS CURRENT MONITOR - NEGATIVE END
TRANSMITTER SIGNAL GROUND
TRANSMITTER DATA IN BAR
TRANSMITTER DATA IN
TRANSMITTER DISABLE
TRANSMITTER SIGNAL GROUND
18
17
16
15
14
13
12
11
View
NOT CONNECTED
RECEIVER SIGNAL GROUND
RECEIVER POWER SUPPLY
SIGNAL DETECT
RECEIVER DATA OUTPUT BAR
RECEIVER DATA OUTPUT
10
TRANSMITTER POWER SUPPLY
Figure 5. Pin Out Diagram (Top View)
Pin Descriptions:
Pin 9 Receiver Data Out Bar RD-:
No internal terminations are
provided. See recommended
circuit schematic.
Pin 17 Laser Diode Bias Current
Monitor - Negative End B
The laser diode bias current is
accessible by measuring the
Pin 1 Photo Detector Bias, VpdR:
This pin enables monitoring of
photo detector bias current. It
must be connected directly to
–
MON
voltage developed across pins 17
and 18. Dividing the voltage by
10 Ohms (internal) will yield the
value of the laser bias current.
V
RX, or to V RX through a
CC
CC
Pin 10 Receiver Data Out RD+:
No internal terminations are
provided. See recommended
circuit schematic.
resistor (Max. 200 Ω) for
monitoring photo detector bias
current.
Pin 18 Laser Diode Bias Current
Pins 2, 3, 6 Receiver Signal Ground
Pin 11 Transmitter Power Supply
Monitor - Positive End B
+
V
RX:
MON
EE
V
TX:
CC
See pin 17 description.
Directly connect these pins to
the receiver ground plane.
Provide +3.3 V dc via the
recommended transmitter
power supply filter circuit.
Locate the power supply filter
circuit as close as possible to the
Pin 19 Laser Diode Optical Power
Monitor - Negative End P
–
Pins 4, 5 DO NOT CONNECT
MON
The back facet diode monitor
current is accessible by measuring
the voltage developed across
pins 19 and 20. The voltage
across a 200 Ohm resistor
between pins 19 and 20 will be
proportional to the photo
current.
Pin 7 Receiver Power Supply V RX:
CC
Provide +3.3 V dc via the
V
TX pin.
CC
recommended receiver power
supply filter circuit. Locate the
power supply filter circuit as
Pins 12, 16 Transmitter Signal
Ground V TX:
EE
Directly connect these pins to
the transmitter signal ground
plane.
close as possible to the V RX
CC
pin. Note: the filter circuit
should not cause V to drop
CC
Pin 20 Laser Diode Optical Power
below minimum specification.
Pin 13 Transmitter Disable T
:
DIS
Monitor - Positive End P
+
MON
Optional feature, connect this
pin to +3.3 V TTL logic high “1”
to disable module. To enable
module connect to TTL logic low
“0”.
Pin 8 Signal Detect SD:
Normal optical input levels to
the receiver result in a logic “1”
output.
See pin 19 description.
Mounting Studs/Solder Posts
The two mounting studs are
provided for transceiver
mechanical attachment to the
circuit board. It is
recommended that the holes in
the circuit board be connected to
chassis ground.
Low optical input levels to the
receiver result in a logic “0”
output.
Pin 14 Transmitter Data In TD+:
No internal terminations are
provided. See recommended
circuit schematic.
This Signal Detect output can be
used to drive a +3.3 V TTL input
on an upstream circuit, such as
Signal Detect input or Loss of
Signal-bar.
Pin 15 Transmitter Data In Bar TD-:
No internal terminations are
provided. See recommended
circuit schematic.
Package Grounding Tabs
Connect four package grounding
tabs to signal ground.
6
Application Information
minimum transmitter output
Data Line Interconnections
The Applications Engineering
Group at Agilent is available to
assist you with technical
understanding and design trade-
offs associated with these
transceivers. You can contact
them through your Agilent sales
representative.
optical power (dBm avg) and the Agilent’s HFCT-5964xxx fiber-
lowest receiver sensitivity (dBm
avg). This OPB provides the
necessary optical signal range to
establish a working fiber-optic
optic transceivers are designed
to couple to +3.3 V PECL signals.
The transmitter driver circuit
regulates the output optical
link. The OPB is allocated for the power. The regulated light
fiber-optic cable length and the
corresponding link penalties.
For proper link performance, all
penalties that affect the link
performance must be accounted
output will maintain a constant
output optical power provided
the data pattern is reasonably
balanced in duty cycle. If the
data duty cycle has long,
The following information is
provided to answer some of the
most common questions about
the use of the parts.
for within the link optical power continuous state times (low or
budget.
high data duty cycle), then the
output optical power will
gradually change its average
output optical power level to its
preset value.
Optical Power Budget and
Link Penalties
The worst-case Optical Power
Budget (OPB) in dB for a fiber-
optic link is determined by the
difference between the
Electrical and Mechanical Interface
Recommended Circuit
Figures 6a and 6b show
recommended dc and ac coupled
circuits for deploying the Agilent
transceivers in +3.3 V systems.
PHY DEVICE
VCC (+3.3 V)
TERMINATE AT
TRANSCEIVER INPUTS
Z = 50 W
Z = 50 W
T
DIS(LVTTL)
100 W
130 W
BMON
-
TD-
BMON
PMON
PMON
+
LVPECL
130 W
-
TD+
+
20 19 18 17 16 15 14 13 12 11
VCC (+3.3 V)
1 µH
TX
C5 *
10 µF
C2
C3
10 µF
VCC (+3.3 V)
RX
1 µH
RD+
RD-
C4 *
10 µF
C1
1
2
3
4
5
6
7
8
9
10
Z = 50 W
Z = 50 W
100 W
VCCRX (+3.3 V)
LVPECL
200 W
NOTE A
10 nF
130 W
130 W
Z = 50 W
SD
LVTTL
Note: C1 = C2 = C3 = 10 nF or 100 nF
Note A: THE BIAS RESISTOR FOR VpdR SHOULD NOT EXCEED 200
* C4 AND C5 ARE OPTIONAL BYPASS CAPACITORS FOR ADDITIONAL
LOW FREQUENCY NOISE FILTERING.
W
TERMINATE AT
DEVICE INPUTS
Figure 6a. Recommended dc coupled interface circuit
7
VCC (+3.3 V)
82 Ω
100 nF
100 nF
Z = 50 Ω
Z = 50 Ω
VCC (+3.3 V)
TDIS (LVTTL)
BMON
130 Ω
-
130 Ω
82 Ω
TD-
100 nF
BMON
PMON
PMON
+
-
NOTE A
130 Ω
130 Ω
TD+
+
20 19 18 17 16 15 14 13 12 11
VCC (+3.3 V)
VCC (+3.3 V)
1 µH
C5 *
TX
10 µF
100 nF
C2
C3
VCC (+3.3 V)
10 µF
82 Ω
82 Ω
RX
1 µH
RD+
C4 *
10 µF
C1
1
2
3
4
5
6
7
8
9
10
Z = 50 Ω
Z = 50 Ω
130 Ω
VCCRX (+3.3 V)
NOTE B
100 nF
200 Ω
RD-
NOTE C
10 nF
100 nF
130
Ω
130 Ω
130 Ω
Z = 50 Ω
SD
LVTTL
Note: C1 = C2 = C3 = 10 nF or 100 nF
Note A: CIRCUIT ASSUMES OPEN EMITTER OUTPUT
Note B: WHEN INTERNAL BIAS IS PROVIDED REPLACE SPLIT RESISTORS WITH 100 Ω TERMINATION
Note C: THE BIAS RESISTOR FOR VpdR SHOULD NOT EXCEED 200 Ω
* C4 AND C5 ARE OPTIONAL BYPASS CAPACITORS FOR ADDITIONAL LOW FREQUENCY NOISE FILTERING.
Figure 6b. Recommended ac coupled interface circuit
The HFCT-5964xxx have a
transmit disable function which
is a single-ended +3.3 V TTL
input which is dc-coupled to pin
13. In addition these devices
offer the designer the option of
monitoring the laser diode bias
current and the laser diode
optical power. The voltage
amplifier stages. The actual Data that a decoupling capacitor is
and Data-bar outputs of the
post-amplifier are dc-coupled to
their respective output pins
(pins 9, 10). The two data
outputs of the receiver should be
terminated with identical load
circuits.
used on this pin.
Power Supply Filtering and Ground
Planes
It is important to exercise care
in circuit board layout to
achieve optimum performance
from these transceivers. Figures
6a and 6b show the power
supply circuit which complies
with the small form factor
multisource agreement. It is
further recommended that a
continuous ground plane be
provided in the circuit board
directly under the transceiver to
provide a low inductance
ground for signal return current.
This recommendation is in
keeping with good high
Signal Detect is a single-ended,
+3.3 V TTL output signal that is
dc-coupled to pin 8 of the
module. Signal Detect should not
be ac-coupled externally to the
follow-on circuits because of its
infrequent state changes.
measured between pins 17 and
18 is proportional to the bias
current through an internal 10 Ω
resistor. Similarly the optical
power rear facet monitor circuit
provides a photo current which
is proportional to the voltage
measured between pins 19 and
20, this voltage is measured
across an internal 200 Ω
The designer also has the option
of monitoring the PIN photo
detector bias current. Figure 6b
shows a resistor network, which
could be used to do this. Note
that the photo detector bias
current pin must be connected
resistor.
As for the receiver section, it is
internally ac-coupled between
the preamplifier and the post-
frequency board layout
practices.
to V . Agilent also recommends
CC
8
Package footprint and front panel
considerations
8.89
(0.35)
3.56
(0.14)
2 x Ø 2.29 MAX. 2 x Ø 1.4 0.1
2 x Ø 1.4 0.1
(0.055 0.004)
7.11
(0.28)
(0.09)
(0.055 0.004)
Agilent transceivers comply with
the circuit board “Common
Transceiver Footprint” hole
pattern defined in the current
multisource agreement which
defined the 2 x 10 package style.
This drawing is reproduced in
Figure 7 with the addition of
ANSI Y14.5M compliant
dimensioning to be used as a
guide in the mechanical layout
of your circuit board. Figure 8
shows the front panel
4 x Ø 1.4 0.1
(0.055 0.004)
10.16
(0.4)
13.34
(0.525)
7.59
(0.299)
9.59
(0.378)
2
(0.079)
9 x 1.78
(0.07)
2
3
3
2 x Ø 2.29
(0.09)
(0.079)
(0.118)
(0.118)
4.57
(0.18)
dimensions associated with such
a layout.
20 x Ø 0.81 0.1
(0.032 0.004)
6
16
(0.63)
3.08
(0.121)
(0.236)
Eye Safety Circuit
For an optical transmitter
device to be eye-safe in the event
of a single fault failure, the
transmit-ter must either
maintain eye-safe operation or
be disabled.
DIMENSIONS IN MILLIMETERS (INCHES)
NOTES:
1. THIS FIGURE DESCRIBES THE RECOMMENDED CIRCUIT BOARD LAYOUT FOR THE SFF TRANSCEIVER.
2. THE HATCHED AREAS ARE KEEP-OUT AREAS RESERVED FOR HOUSING STANDOFFS. NO METAL TRACES OR
GROUND CONNECTION IN KEEP-OUT AR EAS.
3. 2 x 10 TRANSCEIVER MODULE REQUIRES 26 PCB HOLES (20 I/O PINS, 2 SOLDER POSTS AND 4 PACKAGE
The HFCT-5964xxx is
GROUNDING TABS).
intrinsically eye safe and does
not require shut down circuitry.
PACKAGE GROUNDING TABS SHOULD BE CONNECTED TO SIGNAL GROUND.
4. THE MOUNTING STUDS SHOULD BE SOLDERED TO CHASSIS GROUND FOR MECHANICAL INTEGRITY AND TO
ENSURE FOOTPRINT COMPATIBILITY WITH OTHER SFF TRANSCEIVERS.
5. HOLES FOR HOUSING LEADS MUST BE TIED TO SIGNAL GROUND.
Signal Detect
The Signal Detect circuit
Figure 7. Recommended Board Layout Hole Pattern
provides a deasserted output
signal when the optical link is
broken (or when the remote
transmitter is OFF). The Signal
Detect threshold is set to
transition from a high to low
state between the minimum
receiver input optical power and
-45 dBm avg. input optical
power indicating a definite
optical fault (e.g. unplugged
connector for the receiver or
transmitter, broken fiber, or
failed far-end transmitter or
data source). The Signal Detect
does not detect receiver data
error or error-rate. Data errors
can be determined by signal
processing offered by upstream
PHY ICs.
from electronic equipment.
Success in controlling generated the nose of the transceiver. This
Electromagnetic Interference
(EMI) enables the designer to
pass a governmental agency’s
EMI regulatory standard and
convenient chassis connection to
nose shield improves system
EMI performance by effectively
closing off the LC aperture.
Localized shielding is also
more importantly, it reduces the improved by tying the four metal
possibility of interference to
neighboring equipment. Agilent
has designed the HFCT-5964xxx
to provide excellent EMI
performance. The EMI
performance of a chassis is
dependent on physical design
housing package grounding tabs
to signal ground on the PCB.
Though not obvious by
inspection, the nose shield and
metal housing are electrically
separated for customers who do
not wish to directly tie chassis
and features which help improve and signal grounds together.
EMI suppression. Agilent
encourages using standard RF
suppression practices and
avoiding poorly EMI-sealed
enclosures.
The recommended transceiver
position, PCB layout and panel
opening for these devices are the
same, making them mechanically
drop-in compatible. Figure 8
shows the recommended
positioning of the transceivers
with respect to the PCB and
faceplate.
Electromagnetic Interference (EMI)
One of a circuit board designer’s
foremost concerns is the control
of electromagnetic emissions
Agilent’s OC-3 LC transceivers
(HFCT-5964xxx) have nose
shields which provide a
9
Package and Handling Instructions
Flammability
The HFCT-5964xxx transceiver
housing consists of high
strength, heat resistant and UL
94 V-0 flame retardant plastic
and metal packaging.
15.24
(0.6)
10.16 0.1
(0.4 0.004)
TOP OF PCB
B
B
Recommended Solder and Wash
Process
DETAIL A
The HFCT-5964xxx are
compatible with industry-
standard wave solder processes.
1
(0.039)
15.24
(0.6)
Process plug
A
This transceiver is supplied with
a process plug for protection of
the optical port within the LC
connector receptacle. This
process plug prevents
contamination during wave
solder and aqueous rinse as well
as during handling, shipping and
storage. It is made of a high-
temperature, molded sealing
material that can withstand
+85°C and a rinse pressure of
110 lbs per square inch.
SOLDER POSTS
14.22 0.1
(0.56
0.004)
15.75 MAX. 15.0 MIN.
(0.62 MAX. 0.59 MIN.)
SECTION B - B
DIMENSIONS IN MILLIMETERS (INCHES)
1. FIGURE DESCRIBES THE RECOMMENDED FRONT PANEL OPENING FOR A LC OR SG SFF TRANSCEIVER.
2. SFF TRANSCEIVER PLACED AT 15.24 mm (0.6) MI N. SPACING.
Figure 8. Recommended Panel Mounting
The process plug should only be
used once. After removing it
from the transceiver, it must not
be used again as a process plug;
however, if it has not been
contaminated, it can be reused
as a dust cover.
MEK, acetone, chloroform, ethyl
acetate, methylene dichloride,
phenol, methylene chloride, or
N-methylpyrolldone. Also,
Agilent does not recommend the
use of cleaners that use
halogenated hydrocarbons
because of their potential
environmental harm.
Recommended Solder fluxes
Solder fluxes used with the
HFCT-5964xxx should be
water-soluble, organic fluxes.
Recommended solder fluxes
include Lonco 3355-11 from
London Chemical West, Inc. of
Burbank, CA, and 100 Flux from
Alpha-Metals of Jersey City, NJ.
LC SFF Cleaning Recommendations
In the event of contamination of
the optical ports, the
recommended cleaning process
is the use of forced nitrogen. If
contamination is thought to have
remained, the optical ports can
be cleaned using a NTT
Recommended Cleaning/Degreasing
Chemicals
Alcohols: methyl, isopropyl,
isobutyl.
Aliphatics: hexane, heptane
Other: naphtha.
international Cletop stick type
(diam. 1.25mm) and HFE7100
cleaning fluid.
Do not use partially halogenated
hydrocarbons such as 1,1.1
trichloroethane, ketones such as
10
Regulatory Compliance
The second case to consider is
static discharges to the exterior
of the equipment chassis
Eye Safety
The Regulatory Compliance for
transceiver performance is
shown in Table 1. The overall
These laser-based transceivers
are classified as AEL Class I
(U.S. 21 CFR(J) and AEL Class 1
per EN 60825-1 (+A11). They are
eye safe when used within the
data sheet limits per CDRH.
They are also eye safe under
normal operating conditions and
under all reasonably foreseeable
single fault conditions per
EN60825-1. Agilent has tested
the transceiver design for
compliance with the
requirements listed below under
normal operating conditions and
under single fault conditions
where applicable. TUV
Rheinland has granted
certification to these
containing the transceiver parts.
equipment design will determine To the extent that the LC
the certification level. The
transceiver performance is
offered as a figure of merit to
assist the designer in
considering their use in
equipment designs.
connector receptacle is exposed
to the outside of the equipment
chassis it may be subject to
whatever system-level ESD test
criteria that the equipment is
intended to meet.
Electrostatic Discharge (ESD)
There are two design cases in
which immunity to ESD damage
is important.
Electromagnetic Interference (EMI)
Most equipment designs utilizing
these high-speed transceivers
from Agilent will be required to
meet FCC regulations in the
United States, CENELEC
EN55022 (CISPR 22) in Europe
and VCCI in Japan. Refer to EMI
section (page 9) for more details.
The first case is during handling
of the transceiver prior to
mounting it on the circuit board.
It is important to use normal
ESD handling precautions for
ESD sensitive devices. These
precautions include using
grounded wrist straps, work
benches, and floor mats in ESD
controlled areas.
transceivers for laser eye safety
and use in EN 60825-2
applications. Their performance
enables the transceivers to be
used without concern for eye
safety up to 3.5 V transmitter
Immunity
Transceivers will be subject to
radio-frequency electromagnetic
fields following the IEC 61000-4-3
test method.
V
CC
.
Table 1: Regulatory Compliance - Targeted Specification
Feature Test Method
Performance
Class 1 (>500 V).
Electrostatic Discharge (ESD) MIL-STD-883
to the
Method 3015
Electrical Pins
Electrostatic Discharge (ESD) Variation of IEC 61000-4-2
Tested to 8 kV contact discharge.
to the LC Receptacle
Electromagnetic Interference FCC Class B
Margins are dependent on customer board and chassis designs.
(EMI)
Immunity
Variation of IEC 61000-4-3
Typically show no measurable effect from a
10 V/m field swept from 27 to 1000 MHz applied to the transceiver
without a chassis enclosure.
Accession Number:
Laser Eye Safety
FDA CDRH 21-CFR 1040
and Equipment Type Testing Class 1
QFCT-5987TL ) 9521220-47
QFCT-5987TL ) 933/510201/02 18 Jan. 2002
License Number:
IEC 60825-1
Amendment 2 2001-01
Component
Recognition
Underwriters Laboratories and Canadian UL File Number: E173874, 01SC14051
Standards Association Joint Component
Recognition
for Information Technology Equipment
Including Electrical Business Equipment.
11
CAUTION:
There are no user serviceable
parts nor any maintenance
required for the HFCT-5964xxx.
All adjustments are made at the
factory before shipment to our
customers. Tampering with or
modifying the performance of
the parts will result in voided
product warranty. It may also
result in improper operation of
the circuitry, and possible
overstress of the laser source.
Device degradation or product
failure may result.
Connection of the devices to a
non-approved optical source,
operating above the
recommended absolute
maximum conditions or
operating the HFCT-5964xxx in
a manner inconsistent with its
design and function may result
in hazardous radiation exposure
and may be considered an act of
modifying or manufacturing a
laser product. The person(s)
performing such an act is
required by law to recertify and
reidentify the laser product
under the provisions of U.S. 21
CFR (Subchapter J).
12
Absolute Maximum Ratings (HFCT-5964xxx)
Stresses in excess of the absolute maximum ratings can cause catastrophic damage to the device. Limits apply to each parameter in
isolation, all other parameters having values within the recommended operating conditions. It should not be assumed that limiting
values of more than one parameter can be applied to the product at the same time. Exposure to the absolute maximum ratings for
extended periods can adversely affect device reliability.
Parameter
Symbol
Min.
Typ.
Max.
Unit
Reference
Storage Temperature
TS
-40
+85
°C
Supply Voltage
VCC
VI
-0.5
-0.5
3.6
VCC
50
V
Data Input Voltage
Data Output Current
Relative Humidity
V
ID
mA
%
RH
85
Recommended Operating Conditions (HFCT-5964xxx)
Parameter
Symbol
Min.
Typ.
Max.
Unit
Reference
Ambient Operating Temperature
HFCT-5964TL/TG
TA
TA
0
+70
+70
°C
°C
1
HFCT-5964NL/NG
-5
HFCT-5964ATL/ATG
Supply Voltage
TA
VCC
-40
3.1
+85
3.5
°C
V
2
3
Power Supply Noise Rejection
Transmitter Differential Input Voltage
Data Output Load
PSNR
VD
100
50
mVP-P
V
0.3
2.2
1.6
0.6
W
RDL
Transmit Disable Input Voltage - Low
Transmit Disable Input Voltage - High
Transmit Disable Assert Time
Transmit Disable Deassert Time
TDIS
V
TDIS
V
TASSERT
TDEASSERT
10
µs
ms
4
5
1.0
Process Compatibility (HFCT-5964xxx)
Parameter
Symbol
Min.
Typ.
Max.
Unit
Reference
Wave Soldering and Aqueous Wash
TSOLD/tSOLD
+260/10
°C/sec.
6
Notes:
-1
1. Ambient operating temperature utilizes air flow of 2 ms over the device.
2. The transceiver is class 1 eye safe up to V = 3.5 V.
CC
3. Tested with a sinusoidal signal in the frequency range from 10 Hz to 1 MHz on the V supply with the recommended power supply filter in place.
CC
Typically less than a 1 dB change in sensitivity is experienced.
4. Time delay from Transmit Disable Assertion to laser shutdown.
5. Time delay from Transmit Disable Deassertion to laser startup.
6. Aqueous wash pressure <110 psi.
The transceivers are compliant to OC3 parametric specification when operating at 125 Mbit/s.
13
Transmitter Electrical Characteristics
HFCT-5964TL/TG: T = 0°C to +70°C, V = 3.1 V to 3.5 V)
A
CC
HFCT-5964NL/NG: T = -5°C to +70°C, V = 3.1 V to 3.5 V)
A
CC
HFCT-5964ATL/ATG: T = -40°C to +85°C, V = 3.1 V to 3.5 V)
A
CC
Parameter
Symbol
Min.
Typ.
Max.
Unit
Reference
Supply Current
ICCT
57
140
mA
Power Dissipation
PDIST
0.5
W
Data Input Voltage Swing (single-ended)
VIH - VIL
250
930
mV
Transmitter Differential
Data Input Current - Low
IIL
-350
µA
Transmitter Differential
Data Input Current - High
IIH
350
700
200
µA
Laser Diode Bias Monitor Voltage
Power Monitor Voltage
mV
mV
1
1
10
Receiver Electrical Characteristics
HFCT-5964TL/TG: T = 0°C to +70°C, V = 3.1 V to 3.5 V)
A
CC
HFCT-5964NL/NG: T = -5°C to +70°C, V = 3.1 V to 3.5 V)
A
CC
HFCT-5964ATL/ATG: T = -40°C to +85°C, V = 3.1 V to 3.5 V)
A
CC
Parameter
Symbol
Min.
Typ.
Max.
Unit
Reference
Supply Current
ICCR
95
140
mA
2
Power Dissipation
PDISR
0.5
930
2.2
2.2
0.6
W
mV
ns
ns
V
Data Output Voltage Swing (single-ended)
Data Output Rise Time
VOH - VOL
575
3
4
4
tr
tf
Data Output Fall Time
Signal Detect Output Voltage - Low
Signal Detect Output Voltage - High
Signal Detect Assert Time (OFF to ON)
Signal Detect Deassert Time (ON to OFF)
2.2
2.3
V
ASMAX
100
100
µs
µs
ANSMAX
Notes:
1. The laser bias monitor current and laser diode optical power are calculated as ratios of the corresponding voltages to their current sensing resistors,
10 Ω and 200 Ω (under modulation). Laser bias monitor voltage will be a minimum at low temperatures, refer to characterization report.
2. Includes current for biasing Rx data outputs.
3. These outputs are compatible with low voltage PECL inputs.
4. These are 20-80% values.
14
Transmitter Optical Characteristics
HFCT-5964TL/TG: T = 0°C to +70°C, V = 3.1 V to 3.5 V)
A
CC
HFCT-5964ATL/ATG: T = -40°C to +85°C, V = 3.1 V to 3.5 V)
A
CC
Parameter
Symbol
Min.
Typ.
Max.
Unit
Reference
Output Optical Power 9 µm SMF
Center Wavelength
Spectral Width - rms
Optical Rise Time
POUT
-15
-8
dBm
1
lC
s
1261
1360
7.7
2
nm
nm rms
ns
2
3
3
tr
Optical Fall Time
tf
2
ns
Extinction Ratio
ER
8.2
dB
Output Optical Eye
Compliant with eye mask Telcordia GR-253 CORE and ITU-T G.957
Transmitter Optical Characteristics
HFCT-5964NL/NG: T = -5°C to +70°C, V = 3.1 V to 3.5 V)
A
CC
Parameter
Symbol
POUT
Min.
-5
Typ.
Max.
0
Unit
dBm
Reference
1
Output Optical Power 9 µm SMF
Center Wavelength
Spectral Width - rms
Optical Rise Time
lC
1270
1360
nm
s
tr
3
2
2
nm rms
ns
2
3
3
Optical Fall Time
tf
ns
Extinction Ratio
ER
10
dB
Output Optical Eye
Compliant with eye mask Telcordia GR-253-CORE and ITU-T G.957
Receiver Optical Characteristics
HFCT-5964TL/TG: T = 0°C to +70°C, V = 3.1 V to 3.5 V)
A
CC
HFCT-5964NL/NG: T = -5°C to +70°C, V = 3.1 V to 3.5 V)
A
CC
HFCT-5964ATL/ATG: T = -40°C to +85°C, V = 3.1 V to 3.5 V)
A
CC
Parameter
Symbol
Min.
Typ.
Max.
Unit
Reference
Receiver Sensitivity
P MIN
IN
-31
dBm avg.
4
Receiver Overload
P MAX
-8
0
dBm avg.
nm
4
IN
l
Input Operating Wavelength
Signal Detect - Asserted
Signal Detect - Deasserted
Signal Detect - Hysteresis
1261
1580
-34
PA
-40.3
-42.2
1.89
dBm avg.
dBm avg.
dB
PD
-45
0.5
PA - PD
4
Notes:
1. The output power is coupled into a 1 m single-mode fiber. Minimum output optical level is at end of life.
2. The relationship between FWHM and RMS values for spectral width can be derived from the assumption of a Gaussian shaped spectrum which
results in RMS = FWHM/2.35.
3. These are unfiltered 10-90% values.
23
4.
P
represents the typical optical input sensitivity of the receiver. Sensitivity (P MIN) and saturation (P MAX) levels for a 2 -1 PRBS with 72 ones
IN
IN
IN
-10
and 72 zeros inserted. Over the range the receiver is guaranteed to provide output data with a Bit Error Rate better than or equal to 1 x 10
.
15
Ordering Information
1300 nm FP Laser (Temperature range 0°C to +70°C)
HFCT-5964TL = 2 x 10 LC connector,IR, +3.3 V TTL SD with EMI nose shield
HFCT-5964TG = 2 x 10 LC connector,IR, +3.3 V TTL SD without EMI nose shield
1300nm FP Laser (Temperature range -5°C to +70°C)
HFCT-5964NL = 2 x 10 LC connector.LR, +3.3 V TTL SD with EMI nose shield
HFCT-5964NG = 2 x 10 LC connector.LR, +3.3 V TTL SD without EMI nose shield
1300 nm FP Laser (Temperature range -40°C to +85°C)
HFCT-5964ATL = 2 x 10 LC connector.IR, +3.3 V TTL SD with EMI nose shield
HFCT-5964ATG = 2 x 10 LC connector,IR, +3.3 V TTL SD without EMI nose shield
Related Products
Other single mode OC-3 transceivers in this product family are:-
HFCT-5961xxx = 2 x 5 LC connector. LR/IR, LVPECL SD
HFCT-5962xxx = 2 x 10 LC connector.LR/IR, LVPECL SD
HFCT-5963xxx = 2 x 5 LC connector, LR/IR, +3.3 V TTL SD
Class 1 Laser Product: This product conforms to the
applicable requirements of 21 CFR 1040 at the date of
manufacture
Date of Manufacture:
Agilent Technologies Inc., No 1 Yishun Ave 7, Singapore
Handling Precautions
1. The HFCT-5964xxx can be damaged by current surges or overvoltage.
Power supply transient precautions should be taken.
2. Normal handling precautions for electrostatic sensitive devices
should be taken.
www.agilent.com/
semiconductors
For product information and a complete list of
distributors, please go to our web site.
For technical assistance call:
Americas/Canada: +1 (800) 235-0312 or
(408)654-8675
Europe: +49 (0) 6441 92460
China: 10800 650 0017
Hong Kong: (+65) 6271 2451
India, Australia, New Zealand: (+65) 6271 2394
Japan: (+81 3) 3335-8152(Domestic/International), or
0120-61-1280(DomesticOnly)
Korea: (+65) 6271 2194
Malaysia, Singapore: (+65) 6271 2054
Taiwan: (+65) 6271 2654
Data subject to change.
Copyright © 2002 Agilent Technologies, Inc.
Obsoletes:5988-7875EN
December 18, 2002
5988-8395EN
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