HFCT-5951TL [ETC]
Optoelectronic ; 光电\n
| 型号： | HFCT-5951TL |
| 厂家： | 
ETC |
| 描述： | Optoelectronic
|
| 文件： | 总18页 (文件大小：347K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Agilent HFCT-5951xxx/HFCT-5952xxx
Single Mode SFF Transceivers for
SONET OC-12/SDH STM-4 (S4.1)
Part of the Agilent METRAK family
Data Sheet
Features
•
HFCT-5951xxx/HFCT-5952xxx are
compliant to the intermediate
reach SONET OC12/SDH STM-4
(S4.1) specifications
•
Multisourced 2 x 5 and 2 x 10
package styles with LC receptacle
Single +3.3 V power supply
Temperature range:
•
•
Description
The HFCT-5951xxx/HFCT-
5952xxx SFF transceivers are
high performance, cost effective
modules for serial optical data
communication applications
specified at SONET/SDH
622 Mbit/s for Intermediate
Reach links.
The receiver section uses a
MOVPE grown planar PIN
photodetector for low dark
current and excellent
responsivity.
HFCT-595xTL/TG: 0°C to +70°C
HFCT-595xATL/ATG:
-40°C to +85°C
Wave solder and aqueous wash
process compatible
Manufactured in an ISO9002
certified facility
Performance
HFCT-5951xxx/HFCT-5952xxx:
Links of 15 km with 9/125 µm SMF
Fully Class 1 CDRH/IEC 825
compliant
•
•
•
A pseudo-ECL logic interface
simplifies interface to external
circuitry.
All modules are designed for
single mode fiber and operate at
a nominal wavelength of 1300
nm. They incorporate high
These transceivers are supplied
in 2 x 5 and 2 x 10 DIP style
footprint with the LC fiber
connector interface and are fully
compliant with SFF Multi Source
Agreement (MSA).
•
•
performance, reliable, long
Pin Outs:
HFCT-5951xxx 2 x 5
HFCT-5952xxx 2 x 10
wavelength optical device and
proven circuit technology to give
long life and consistent service.
Applications
The transmitter section consists
of a Fabry Perot Laser (FP). The
transmitter has full IEC 825 and
CDRH Class 1 eye safety.
•
SONET/SDH equipment
interconnect,
STS-12/SDH STM-4 rate
Intermediate reach (up to 15 km)
ATM links
•
Functional Description
Receiver Section
Design
Noise Immunity
The receiver section contains an
InGaAs/InP photo detector and
a preamplifier mounted in an
Figure 1 also shows a filter
function which limits the
bandwidth of the preamp output power supply noise. However
The receiver includes internal
circuit components to filter
optical subassembly. This optical signal. The filter is designed to
under some conditions of EMI
and power supply noise,
external power supply filtering
may be necessary (see
subassembly is coupled to a
postamp/decision circuit.
bandlimit the preamp output
noise and thus improve the
receiver sensitivity.
The postamplifier is ac coupled
application section).
to the preamplifier as illustrated These components will reduce
in Figure 1. The coupling
capacitors are large enough to
pass the SONET/SDH test
pattern at 622 MBd without
significant distortion or
performance penalty. If a lower
signal rate, or a code which has
significantly more low frequency
content is used, sensitivity, jitter
and pulse distortion could be
degraded.
the sensitivity of the receiver as
the signal bit rate is increased
above 622 Mb/s.
The Signal Detect Circuit
The signal detect circuit works
by sensing the peak level of the
received signal and comparing
this level to a reference. The SD
output is low voltage TTL.
The device incorporates a
photodetector bias circuit. This
output must be connected to V
and can be monitored by
CC
connecting through a series
resistor (see application section).
PHOTODETECTOR
BIAS
DATA OUT
FILTER
TRANS-
IMPEDANCE
PRE-
PECL
OUTPUT
BUFFER
AMPLIFIER
AMPLIFIER
DATA OUT
GND
TTL
OUTPUT
BUFFER
SIGNAL
DETECT
CIRCUIT
SD
Figure 1 - Receiver Block Diagram
2
Functional Description
Transmitter Section
Design
The transmitter section uses a
Fabry Perot (FP) laser as its
The transmitter section also
includes monitor circuitry for
optical source, see Figure 2. The both the laser diode bias current
package has been designed to be
compliant with IEC 825 eye
safety requirements under any
single fault condition. The
optical output is controlled by a
custom IC that detects the laser
output via the monitor
and laser diode optical power.
photodiode. This IC provides
both dc and ac current drive to
the laser to ensure correct
modulation, eye diagram and
extinction ratio over
temperature, supply voltage and
operating life.
PHOTODIODE
(rear facet monitor)
Note 1
FP
LASER
DATA
LASER
MODULATOR
DATA
PECL
INPUT
LASER BIAS
DRIVER
BMON(+)
BMON(-)
Note 1
LASER BIAS
CONTROL
PMON(+)
PMON(-)
Note 1
Note 1: THESE FUNCTIONS ONLY AVAILABLE ON 2 x 10 PINOUT DESIGN
Figure 2 - Simplified Transmitter Schematic
3
Package
The overall package concept for
the Agilent transceiver consists
of four basic elements; two
optical subassemblies and two
electrical subassemblies. They
are housed as illustrated in the
block diagram in Figure 3.
The receiver electrical
The PCB’s for the two electrical
subassemblies both carry the
signal pins that exit from the
bottom of the transceiver. The
solder posts are fastened into
the molding of the device and
are designed to provide the
mechanical strength required to
withstand the loads imposed on
the transceiver by mating with
the LC connectored fiber cables.
Although they are not connected
electrically to the transceiver, it
is recommended to connect
them to chassis ground.
subassembly includes an
internal shield for the electrical
and optical subassemblies to
ensure high immunity to
external EMI fields.
The optical subassemblies are
each attached to their respective
transmit or receive electrical
The package outline drawing
and pin out are shown in
Figures 4, 5 and 6. The details of subassemblies. These two units
this package outline and pin out
are compliant with the multi-
source definition of the 2 x 5
and 2 x 10 DIP.
are than fitted within the outer
housing of the transceiver that is
molded of filled nonconductive
plastic to provide mechanical
strength. The housing is then
encased with a metal EMI
protective shield. Four ground
connections are provided for
connecting the EMI shield to
signal ground.
The electrical subassemblies
consist of high volume
multilayer printed circuit boards
on which the IC and various
surface-mounted passive circuit
elements are attached.
RX SUPPLY
Note 3
PHOTO DETECTOR
BIAS Note 2
DATA OUT
DATA OUT
PIN PHOTODIODE
PREAMPLIFIER
SUBASSEMBLY
QUANTIZER IC
RX GROUND
SIGNAL
DETECT
LC
TX GROUND
Note 1
RECEPTACLE
DATA IN
DATA IN
Tx DISABLE
LASER BIAS
MONITORING
LASER
OPTICAL
SUBASSEMBLY
LASER DRIVER
AND CONTROL
CIRCUIT
B
B
MON(+) Note 1
MON(-) Note 1
LASER DIODE
OUTPUT POWER
MONITORING
Note 1
PMON(+) Note 1
MON(-) Note 1
P
TX SUPPLY
CASE
Note 1: THESE FUNCTIONS ONLY AVAILABLE ON 2 x 10 PINOUT DESIGN
Note 2: CONNECTED TO RXVCC IN 2 x 5 DESIGN
Note 3: NOSE CLIP PROVIDES CONNECTION TO CHASSIS GROUND FOR BOTH EMI AND THERMAL DISSIPATION.
Figure 3 - Block Diagram.
4
+ 0
13.59
0.535
13.59
(0.535)
MAX
- 0.2
+0
15.0 0.2
(0.591 0.008)
(
)
-0.008
TOP VIEW
48.2
(1.898)
6.25
(0.246)
9.8
(0.386)
MAX
10.8 0.2
9.6 0.2
(0.425 0.008)(0.378 0.008)
4.06
(0.16)
3.81
(0.15)
1
Ø 1.07
0.25
(0.01)
10.16
(0.4)
1
(0.039)
(0.042)
20 x 0.5
(0.02)
(0.039)
19.5 0.3
(0.768 0.012)
1.78
(0.07)
BACK VIEW
FRONT VIEW
SIDE VIEW
48.2
(1.898)
9.8
(0.386)
MAX
G MODULE - NO EMI NOSE SHIELD
3.81
(0.15)
Ø 1.07
0.25
(0.01)
1
(0.042)
20 x 0.5
(0.02)
(0.039)
19.5 0.3
(0.768 0.012)
1.78
(0.07)
SIDE VIEW
20 x 0.25 (PIN THICKNESS)
(0.01)
NOTE: END OF PINS
CHAMFERED
BOTTOM VIEW
DIMENSIONS IN MILLIMETERS (INCHES)
DIMENSIONS SHOWN ARE NOMINAL. ALL DIMENSIONS MEET THE MAXIMUM PACKAGE OUTLINE DRAWING IN THE SFF MSA.
Figure 4 - HFCT-5951xxx/HFCT-5952xxx Package Outline Drawing (2 x 10 Design shown)
5
Connection Diagram (HFCT-5952xxx)
RX
TX
Mounting Studs/
Solder Posts
Package
Grounding Tabs
o
o
o
o
o
o
o
o
o
o
o
PHOTO DETECTOR BIAS
RECEIVER SIGNAL GROUND
RECEIVER SIGNAL GROUND
NOT CONNECTED
1
2
3
4
5
6
7
8
9
20
19
18
17
16
15
14
13
12
11
LASER DIODE OPTICAL POWER MONITOR - POSITIVE END
LASER DIODE OPTICAL POWER MONITOR - NEGATIVE END
LASER DIODE BIAS CURRENT MONITOR - POSITIVE END
LASER DIODE BIAS CURRENT MONITOR - NEGATIVE END
TRANSMITTER SIGNAL GROUND
TRANSMITTER DATA IN BAR
TRANSMITTER DATA IN
TRANSMITTER DISABLE
TRANSMITTER SIGNAL GROUND
o
o
o
o
o
o
o
o
o
Top
View
NOT CONNECTED
RECEIVER SIGNAL GROUND
RECEIVER POWER SUPPLY
SIGNAL DETECT
RECEIVER DATA OUTPUT BAR
RECEIVER DATA OUTPUT
10
TRANSMITTER POWER SUPPLY
Figure 5 - Pin Out Diagram (Top View)
Pin Descriptions:
Pin 9 Receiver Data Out Bar RD-:
No internal terminations are
provided. See recommended
circuit schematic.
Pin 17 Laser Diode Bias Current
Monitor - Negative End B
The laser diode bias current is
accessible by measuring the
voltage developed across pins 17
and 18. Dividing the voltage by
10 Ohms (internal) will yield the
value of the laser bias current.
Pin 1 Photo Detector Bias, VpdR:
Pin 1 must be connected to VCC
for the receiver to work. This
pin enables monitoring of photo
detector bias current. It must be
–
MON
Pin 10 Receiver Data Out RD+:
No internal terminations are
provided. See recommended
circuit schematic.
connected directly to V RX, or
CC
to V RX through a resistor
CC
(Max 200 R) for monitoring
photo detector bias current.
Pin 18 Laser Diode Bias Current
Pin 11 Transmitter Power Supply
Monitor - Positive End B
+
MON
Pins 2, 3, 6 Receiver Signal Ground
V
TX:
CC
See pin 17 description.
V
RX:
EE
Provide +3.3 V dc via the
Directly connect these pins to
the receiver ground plane.
recommended transmitter
power supply filter circuit.
Locate the power supply filter
circuit as close as possible to the
Pin 19 Laser Diode Optical Power
Monitor - Negative End P
–
MON
The back facet diode monitor
current is accessible by measuring
the voltage developed across
pins 19 and 20. The voltage
across a 200 Ohm internal
resistor between pins 19 and 20
will be proportional to the photo
current.
Pins 4, 5 DO NOT CONNECT
V
TX pin.
CC
Pin 7 Receiver Power Supply V RX:
CC
Provide +3.3 V dc via the
Pins 12, 16 Transmitter Signal Ground
TX:
recommended receiver power
supply filter circuit. Locate the
power supply filter circuit as
V
EE
Directly connect these pins to
the transmitter signal ground
plane.
close as possible to the V RX
CC
pin. Note: the filter circuit
Pin 20 Laser Diode Optical Power
should not cause V to drop
Pin 13 Transmitter Disable T
:
CC
DIS
Monitor - Positive End P
+
MON
below minimum specification.
Optional feature, connect this
pin to +3.3 V TTL logic high “1”
to disable module. To enable
module connect to TTL logic low
“0”.
See pin 19 description.
Pin 8 Signal Detect SD:
Normal optical input levels to
the receiver result in a logic “1”
output.
Mounting Studs/Solder Posts
The two mounting studs are
provided for transceiver
mechanical attachment to the
circuit board. It is
recommended that the holes in
the circuit board be connected to
chassis ground.
Pin 14 Transmitter Data In TD+:
No internal terminations are
provided. See recommended
circuit schematic.
Low optical input levels to the
receiver result in a logic “0”
output.
This Signal Detect output can be
used to drive a low voltage TTL
input on an upstream circuit,
such as Signal Detect input or
Loss of Signal-bar.
Pin 15 Transmitter Data In Bar TD-:
No internal terminations are
provided. See recommended
circuit schematic.
Package Grounding Tabs
Connect four package grounding
tabs to signal ground.
6
Connection Diagram (HFCT-5951xxx)
RX
TX
Mounting Studs/
Solder Posts
Package
Grounding Tabs
Top
View
o
o
o
o
o
o
o
o
o
o
RECEIVER SIGNAL GROUND
RECEIVER POWER SUPPLY
SIGNAL DETECT
RECEIVER DATA OUT BAR
RECEIVER DATA OUT
1
2
3
4
5
10
9
8
7
6
TRANSMITTER DATA IN BAR
TRANSMITTER DATA IN
TRANSMITTER DISABLE
TRANSMITTER SIGNAL GROUND
TRANSMITTER POWER SUPPLY
Figure 6 - Pin Out Diagram (Top View)
Pin Descriptions:
Mounting Studs/Solder Posts
The two mounting studs are
provided for transceiver
mechanical attachment to the
circuit board. It is
recommended that the holes in
the circuit board be connected to
chassis ground.
Pin 5 Receiver Data Out RD+:
No internal terminations are
provided. See recommended
circuit schematic.
Pin 1 Receiver Signal Ground V RX:
Directly connect this pin to the
receiver ground plane.
EE
Pin 6 Transmitter Power Supply
Pin 2 Receiver Power Supply V RX:
Provide +3.3 V dc via the
recommended receiver power
supply filter circuit. Locate the
power supply filter circuit as
close as possible to the V RX
pin. Note: the filter circuit
should not cause V to drop
below minimum specification.
CC
V
TX:
CC
Provide +3.3 V dc via the
recommended transmitter
power supply filter circuit.
Locate the power supply filter
circuit as close as possible to the
Package Grounding Tabs
Connect four package grounding
tabs to signal ground.
CC
V
TX pin.
CC
CC
Pin 7 Transmitter Signal Ground
TX:
V
EE
Pin 3 Signal Detect SD:
Normal optical input levels to
the receiver result in a logic “1”
output.
Directly connect this pin to the
transmitter signal ground plane.
Pin 8 Transmitter Disable T
:
DIS
Optional feature, connect this
pin to +3.3 V TTL logic high “1”
to disable module. To enable
module connect to TTL logic low
“0”.
Low optical input levels to the
receiver result in a logic “0”
output.
This Signal Detect output can be
used to drive a low voltage TTL
input on an upstream circuit,
such as Signal Detect input or
Loss of Signal-bar.
Pin 9 Transmitter Data In TD+:
No internal terminations are
provided. See recommended
circuit schematic.
Pin 10 Transmitter Data In Bar TD-:
No internal terminations are
provided. See recommended
circuit schematic.
Pin 4 Receiver Data Out Bar RD-:
No internal terminations are
provided. See recommended
circuit schematic.
7
Application Information
establish a working fiber-optic
PECL signals. The transmitter
The Applications Engineering
Group at Agilent is available to
assist you with technical
link. The OPB is allocated for the driver circuit regulates the
fiber-optic cable length and the
corresponding link penalties.
output optical power. The
regulated light output will
maintain a constant output
optical power provided the data
pattern is reasonably balanced
understanding and design trade- For proper link performance, all
offs associated with these
transceivers. You can contact
them through your Agilent sales
representative.
penalties that affect the link
performance must be accounted
for within the link optical power in duty cycle. If the data duty
budget.
cycle has long, continuous state
times (low or high data duty
cycle), then the output optical
power will gradually change its
average output optical power
level to its preset value.
The following information is
provided to answer some of the
most common questions about
the use of the parts.
Electrical and Mechanical Interface
Recommended Circuit
Figures 7 and 8 shows the
recommended interface for
deploying the Agilent
Optical Power Budget and Link
Penalties
The worst-case Optical Power
Budget (OPB) in dB for a fiber-
optic link is determined by the
difference between the
transceivers in a +3.3 V system.
Data Line Interconnections
Agilent’s HFCT-5951xxx/HFCT-
5952xxx fiber-optic transceivers
are designed to couple to +3.3 V
minimum transmitter output
optical power (dBm avg) and the
lowest receiver sensitivity (dBm
avg). This OPB provides the
necessary optical signal range to
VCC (+3.3 V)
82 Ω
Z = 50 Ω
100 nF
VCC (+3.3 V)
TDIS (LVTTL)
VCC (+3.3 V)
130 Ω
BMON
-
130 Ω
82 Ω
TD-
Z = 50 Ω
100 nF
BMON
+
NOTE A
130 Ω
130 Ω
PMON
PMON
-
TD+
+
20 19 18 17 16 15 14 13 12 11
VCC (+3.3 V)
1 µH
10 µF
TX
C2
C1
C3
V
CC (+3.3 V)
RX
1 µH
RD+
RD-
10 µF
1
2
3
4
5
6
7
8
9
10
Z = 50 Ω
VCCRX (+3.3 V)
200 Ω
100 Ω
NOTE B
100 nF
100 nF
Z = 50 Ω
NOTE C
VCC (+3.3 V)
10 nF
3 k
130 Ω
130 Ω
10 kΩ
SD
LVTTL
Note: C1 = C2 = C3 = 10 nF or 100 nF
Note A: CIRCUIT ASSUMES OPEN EMITTER OUTPUT
Note B: CIRCUIT ASSUMES HIGH IMPENDANCE INTERNAL BIAS @ VCC - 1.3 V.
Note C: THE BIAS RESISTOR FOR VpdR SHOULD NOT EXCEED 200 OHM.
THIS IS NOT REQUIRED
BY THE HFCT-5952ATL/TL
Figure 7 - Recommended Interface Circuit (HFCT-5952xxx)
8
VCC (+3.3 V)
100 nF
100 nF
82 Ω
Z = 50 Ω
Z = 50 Ω
VCC (+3.3 V)
TDIS (LVTTL)
130 Ω
130 Ω
82 Ω
130 Ω
6
TD-
100 nF
NOTE A
130 Ω
TD+
10
9
8
7
VCC (+3.3 V)
VCC (+3.3 V)
1 µH
TX
10 µF
1 µH
C2
C1
C3
100 nF
V
CC (+3.3 V)
82 Ω
82 Ω
RX
RD+
C4 *
10 µF
1
2
3
4
5
Z = 50 Ω
130 Ω
NOTE B
100 nF
100 nF
RD-
Z = 50 Ω
VCC (+3.3 V)
130
Ω
130 Ω
130 Ω
10 k Ω
SD
LVTTL
THIS IS NOT REQUIRED
BY THE HFCT-5951ATL/TL
Note: C1 = C2 = C3 = 10 nF or 100 nF
Note A: CIRCUIT ASSUMES OPEN EMITTER OUTPUT
Note B: WHEN INTERNAL BIAS IS PROVIDED REPLACE SPLIT RESISTORS WITH 100WTERMINATION
* C4 IS AN OPTIONAL BYPASS CAPACITOR FOR ADDITIONAL LOW FREQUENCY NOISE FILTERING.
Figure 8 - Recommended Interface Circuit (HFCT-5951xxx)
The HFCT-5951xxx/HFCT-
5952xxx have a transmit disable
internally ac-coupled between
on circuits because of its
infrequent state changes.
As for the receiver section, it is
function which is a single-ended
+3.3 V TTL input which is dc-
coupled to pin 13 on the HFCT-
5952xxx and pin 8 on HFCT-
5951xxx. In addition the HFCT-
5952xxx offers the designer the
option of monitoring the laser
diode bias current and the laser
diode optical power. The voltage
measured between pins 17 and
18 is proportional to the bias
current through an internal 10 Ω
resistor. Similarly the optical
power rear facet monitor circuit
provides a photo current which
is proportional to the voltage
measured between pins 19 and
20 on the 2 x 10 version, this
voltage is measured across an
internal 200 Ω resistor.
the preamplifier and the
The HFCT-5952xxx offers the
designer the option of
monitoring the PIN photo
detector bias current. Figures 7
and 8 show a resistor network,
which could be used to do this.
Note that the photo detector bias
current pin must be connected
postamplifier stages. The actual
Data and Data-bar outputs of the
postamplifier are dc-coupled to
their respective output pins
(pins 9 and 10 on the HFCT-
5951xxx and pins 14 and 15 on
the
HFCT-5952xxx). The two data
outputs of the receiver should be
terminated with identical load
circuits to avoid unnecessarily
to V . Agilent also recommends
CC
that a decoupling capacitor is
used on this pin.
large ac currents in V . If the
CC
outputs are loaded identically
the ac current is largely nulled.
Signal Detect is a single-ended,
+3.3 V TTL compatible output
signal that is dc-coupled to pin 3
on the HFCT-5951xxx and pin 8
on the HFCT-5952xxx modules.
Signal Detect should not be ac-
coupled externally to the follow-
9
8.89
(0.35)
Power Supply Filtering and Ground
Planes
3.56
(0.14)
2 x Ø 2.29 MAX. 2 x Ø 1.4 0.1
2 x Ø 1.4 0.1
(0.055 0.004)
7.11
(0.28)
(0.09)
(0.055 0.004)
It is important to exercise care
in circuit board layout to
achieve optimum performance
from these transceivers. Figures
7 and 8 show the power supply
circuit which complies with the
small form factor multisource
agreement. It is further
4 x Ø 1.4 0.1
(0.055 0.004)
10.16
(0.4)
13.34
(0.525)
recommended that a continuous
ground plane be provided in the
circuit board directly under the
transceiver to provide a low
inductance ground for signal
return current. This
recommendation is in keeping
with good high frequency board
layout practices.
7.59
(0.299)
9.59
(0.378)
2
(0.079)
9 x 1.78
(0.07)
2
3
3
2 x Ø 2.29
(0.079)
(0.118)
(0.118)
(0.09)
4.57
(0.18)
20 x Ø 0.81 0.1
(0.032 0.004)
6
16
3.08
(0.236)
(0.63)
(0.121)
Package footprint and front panel
considerations
DIMENSIONS IN MILLIMETERS (INCHES)
NOTES:
1. THIS FIGURE DESCRIBES THE RECOMMENDED CIRCUIT BOARD LAYOUT FOR THE SFF TRANSCEIVER.
2. THE HATCHED AREAS ARE KEEP-OUT AREAS RESERVED FOR HOUSING STANDOFFS. NO METAL TRACES OR
GROUND CONNECTION IN KEEP-OUT AREAS.
3. 2 x 10 TRANSCEIVER MODULE REQUIRES 26 PCB HOLES (20 I/O PINS, 2 SOLDER POSTS AND 4 PACKAGE
GROUNDING TABS).
PACKAGE GROUNDING TABS SHOULD BE CONNECTED TO SIGNAL GROUND.
4. 2 x 5 TRANSCEIVER MODULE REQUIRES 16 PCB HOLES (10 I/O PINS, 2 SOLDER POSTS AND 4 PACKAGE
GROUNDING TABS).
The Agilent transceiver complies
with the circuit board “Common
Transceiver Footprint” hole
pattern defined in the current
multisource agreement which
defined the 2 x 5 and 2 x 10
package styles. This drawing is
reproduced in Figure 9 with the
addition of ANSI Y14.5M
PACKAGE GROUNDING TABS SHOULD BE CONNECTED TO SIGNAL GROUND.
5. THE MOUNTING STUDS SHOULD BE SOLDERED TO CHASSIS GROUND FOR MECHANICAL INTEGRITY AND TO
ENSURE FOOTPRINT COMPATIBILITY WITH OTHER SFF TRANSCEIVERS.
6. HOLES FOR HOUSING LEADS MUST BE TIED TO SIGNAL GROUND.
compliant dimensioning to be
used as a guide in the
mechanical layout of your
circuit board. Figure 10 shows
the front panel dimensions
associated with such a layout.
Figure 9 - Recommended Board Layout Hole Pattern
Signal Detect
The Signal Detect circuit
Electromagnetic Interference (EMI)
One of a circuit board designer’s
foremost concerns is the control
of electromagnetic emissions
from electronic equipment.
Success in controlling generated
Electromagnetic Interference
(EMI) enables the designer to
pass a governmental agency’s
EMI regulatory standard and
more importantly, it reduces the
possibility of interference to
neighboring equipment. Agilent
has designed the HFCT-
provides a deasserted output
signal when the optical link is
broken (or when the remote
transmitter is OFF). The Signal
Detect threshold is set to
transition from a high to low
state between the minimum
receiver input optional power
and -45 dBm avg. input optical
power indicating a definite
optical fault (e.g. unplugged
connector for the receiver or
transmitter, broken fiber, or
failed far-end transmitter or
data source). The Signal Detect
does not detect receiver data
error or error-rate. Data errors
can be determined by signal
processing offered by upstream
PHY ICs.
Eye Safety Circuit
For an optical transmitter
device to be eye-safe in the event
of a single fault failure, the
transmitter must either
maintain eye-safe operation or
be disabled.
The HFCT-5951xxx/HFCT-
5952xxx is intrinsically eye safe
and does not require shut down
circuitry.
5951xxx/HFCT-5952xxx to
provide excellent EMI
performance. The EMI
performance of a chassis is
dependent on physical design
and features which help improve
EMI suppression. Agilent
encourages using standard RF
suppression practices and
avoiding poorly EMI-sealed
enclosures.
10
Agilent’s HFCT-5951ATL/TL/
HFCT-5952ATL/TL OC-12/STM-
4 LC transceivers have nose
shields which provide a
convenient chassis connection to
the nose of the transceiver. This
nose shield improves system
EMI performance by closing off
the LC aperture. Localized
shielding is also improved by
tying the four metal housing
package grounding tabs to signal
ground on the
PCB. Though not obvious by
inspection, the nose shield and
metal housing are electrically
separated for customers who do
not wish to directly tie chassis
and signal grounds together.
Figure 10 shows the
recommended positioning of the
transceivers with respect to the
PCB and faceplate.
15.24
(0.6)
10.16 0.1
(0.4 0.004)
TOP OF PCB
B
B
DETAIL A
1
(0.039)
15.24
(0.6)
A
SOLDER POSTS
14.22 0.1
(0.56 0.004)
15.75 MAX. 15.0 MIN.
(0.62 MAX. 0.59 MIN.)
SECTION B - B
DIMENSIONS IN MILLIMETERS (INCHES)
Package and Handling Instructions
Flammability
1. FIGURE DESCRIBES THE RECOMMENDED FRONT PANEL OPENING FOR A LC OR SG SFF TRANSCEIVER.
2. SFF TRANSCEIVER PLACED AT 15.24 mm (0.6) MIN. SPACING.
The HFCT-5951xxx/HFCT-
5952xxx transceivers housing
consist of high strength, heat
resistant and UL 94 V-0 flame
retardant plastic and metal
packaging.
Figure 10 - Recommended Panel Mounting
Recommended Solder fluxes
Solder fluxes used with the
HFCT-5951xxx/HFCT-5952xxx
should be water-soluble, organic
fluxes. Recommended solder
fluxes include Lonco 3355-11
from London Chemical West,
Inc. of Burbank, CA, and 100
Flux from Alpha-Metals of
Jersey City, NJ.
use of cleaners that use
halogenated hydrocarbons
because of their potential
environmental harm.
Recommended Solder and Wash
Process
The HFCT-5951xxx/HFCT-
5952xxx are compatible with
industry-standard wave
processes.
LC SFF Cleaning Recommendations
In the event of contamination of
the optical ports, the
recommended cleaning process
is the use of forced nitrogen. If
contamination is thought to have
remained, the optical ports can
be cleaned using a NTT
international Cletop stick type
(diam. 1.25 mm) and HFE7100
cleaning fluid.
Process plug
The transceivers are supplied
with a process plug for
Recommended Cleaning/
Degreasing Chemicals
Alcohols: methyl, isopropyl,
isobutyl.
Aliphatics: hexane, heptane
Other: naphtha.
protection of the optical port
within the LC connector
receptacle. This process plug
prevents contamination during
wave solder and aqueous rinse
as well as during handling,
shipping and storage. It is made
of a high-temperature, molded
sealing material.
Do not use partially halogenated
hydrocarbons such as 1,1.1
trichloroethane, ketones such as
MEK, acetone, chloroform, ethyl
acetate, methylene dichloride,
phenol, methylene chloride, or
N-methylpyrolldone. Also,
Agilent does not recommend the
11
Regulatory Compliance
The second case to consider is
static discharges to the exterior
of the equipment chassis
Eye Safety
The Regulatory Compliance for
transceiver performance is
shown in Table 1. The overall
These laser-based transceivers
are classified as AEL Class I
(U.S. 21 CFR(J) and AEL Class 1
per EN 60825-1 (+A11). They are
eye safe when used within the
data sheet limits per CDRH.
They are also eye safe under
normal operating conditions and
under all reasonably foreseeable
single fault conditions per
containing the transceiver parts.
equipment design will determine To the extent that the LC
the certification level. The
transceiver performance is
offered as a figure of merit to
assist the designer in
considering their use in
equipment designs.
connector receptacle is exposed
to the outside of the equipment
chassis it may be subject to
whatever system-level ESD test
criteria that the equipment is
intended to meet.
EN60825-1. Agilent has tested
the transceiver design for
compliance with the
requirements listed below under
normal operating conditions and
under single fault conditions
where applicable. TUV Rheinland
has granted certification to these
transceivers for laser eye safety
and use in EN 60950 and
Electrostatic Discharge (ESD)
There are two design cases in
which immunity to ESD damage
is important.
Electromagnetic Interference (EMI)
Most equipment designs utilizing
these high-speed transceivers
from Agilent will be required to
meet FCC regulations in the
United States, CENELEC
EN55022 (CISPR 22) in Europe
and VCCI in Japan. Refer to EMI
section (page 9) for more details.
The first case is during handling
of the transceiver prior to
mounting it on the circuit board.
It is important to use normal
ESD handling precautions for
ESD sensitive devices. These
precautions include using
grounded wrist straps, work
benches, and floor mats in ESD
controlled areas.
EN 60825-2 applications. Their
performance enables the
transceivers to be used without
concern for eye safety up to 3.6
Immunity
Transceivers will be subject to
radio-frequency electromagnetic
fields following the IEC 61000-4-3
test method.
V transmitter V
.
CC
Table 1: Regulatory Compliance - Targeted Specification
Feature
Electrostatic Discharge
(ESD) to the
Test Method
MIL-STD-883
Method 3015
Performance
Class 2 (>2 kV).
Electrical Pins
Electrostatic Discharge
(ESD) to the LC
Receptacle
Variation of IEC 61000-4-2
Tested to 8 kV contact discharge.
Electromagnetic
Interference (EMI)
FCC Class B
CENELEC EN55022 Class B
(CISPR 22A)
Margins are dependent on customer board and chassis
designs.
VCCI Class I
Immunity
Variation of IEC 61000-4-3
Typically show no measurable effect from a
10 V/m field swept from 27 to 1000 MHz applied to the
transceiver without a chassis enclosure.
Accession Number: ) 9521220-43
Laser Eye Safety
and Equipment Type
Testing
FDA CDRH 21-CFR 1040
Class 1
IEC 60825-1
License Number: ) 933/510104/02
Amendment 2 2001-01
Component
Recognition
Underwriters Laboratories and
Canadian Standards Association
Joint Component Recognition
for Information Technology
Equipment Including Electrical
Business Equipment.
UL File. E173874
12
CAUTION:
There are no user serviceable
parts nor any maintenance
required for the HFCT-5951xxx/
HFCT-5952xxx. All adjustments
are made at the factory before
shipment to our customers.
Tampering with or modifying the
performance of the
HFCT-5951xxx/HFCT-5952xxx
will result in voided product
warranty. It may also result in
improper operation of the
HFCT-5951xxx/HFCT-5952xxx
circuitry, and possible
overstress of the laser source.
Device degradation or product
failure may result.
Connection of the HFCT-
5951xxx/HFCT-5952xxx to a
non-approved optical source,
operating above the
recommended absolute
maximum conditions or
operating the HFCT-5951xxx/
HFCT-5952xxx in a manner
inconsistent with their design
and function may result in
hazardous radiation exposure
and may be considered an act of
modifying or manufacturing a
laser product. The person(s)
performing such an act is
required by law to recertify and
reidentify the laser product
under the provisions of U.S. 21
CFR (Subchapter J).
13
Absolute Maximum Ratings
Stresses in excess of the absolute maximum ratings can cause catastrophic damage to the device. Limits apply to each parameter in
isolation, all other parameters having values within the recommended operating conditions. It should not be assumed that limiting
values of more than one parameter can be applied to the product at the same time. Exposure to the absolute maximum ratings for
extended periods can adversely affect device reliability.
Parameter
Symbol
Min.
-40
Typ.
Max.
+85
3.6
Unit
°C
V
Reference
Storage Temperature
Supply Voltage
TS
VCC
VI
-0.5
-0.5
1
Data Input Voltage
Data Output Current
Relative Humidity
VCC
50
V
ID
mA
%
RH
85
Recommended Multirate Operating Conditions
Parameter
Symbol
Min.
Typ.
Max.
Unit
Reference
Ambient Operating Temperature
HFCT-5951TL/TG/HFCT-5952TL/TG
HFCT-5951ATL/ATG/HFCT-5952ATL/ATG TA
Supply Voltage VCC
TA
0
-40
3.14
+70
+85
3.47
°C
°C
V
2
2
Power Supply Rejection
PSR
VD
100
50
mVPk-Pk
3
Transmitter Differential Input Voltage
Data Output Load
0.3
1.6
1.0
0.6
V
W
RDL
TTL Signal Detect Output Current - Low
TTL Signal Detect Output Current - High
Transmit Disable Input Voltage - Low
Transmit Disable Input Voltage - High
Transmit Disable Assert Time
IOL
mA
µA
V
IOH
-400
2.2
TDIS
TDIS
V
TASSERT
TDEASSERT
10
µs
ms
4
5
Transmit Disable Deassert Time
1.0
Process Compatibility
Parameter
Symbol
Min.
Typ.
Max.
Unit
Reference
Wave Soldering and Aqueous Wash
TSOLD/tSOLD
+260/10 °C/sec.
6
Notes:
1. The transceiver is class 1 eye safe up to V = 3.6 V.
2. Ambient operating temperature utilizes air flow of 2 ms over the device.
CC
-1
3. Tested with a sinusoidal signal in the frequency range from 10 Hz to 1 MHz on the V supply with the recommended power supply filter in place.
CC
Typically less than a 1 dB change in sensitivity is experienced.
4. Time delay from Transmit Disable Assertion to laser shutdown.
5. Time delay from Transmit Disable Deassertion to laser startup.
6. Aqueous wash pressure <110 psi.
14
Transmitter Electrical Characteristics
HFCT-5951TL/TG/HFCT-5952TL/TG: T = 0°C to +70°C, V = 3.14 V to 3.47 V
A
CC
HFCT-5951ATL/ATG/HFCT-5952ATL/ATG: T = -40°C to +85°C, V = 3.14 V to 3.47 V
A
CC
Parameter
Symbol
ICCT
Min.
Typ.
30
Max.
120
Unit
mA
W
Reference
Supply Current
1
Power Dissipation
PDIST
0.10
800
0.42
930
Data Input Voltage Swing (single-ended)
VIH - VIL
250
mV
Transmitter Differential
Data Input Current - Low
Transmitter Differential
IIL
-350
µA
Data Input Current - High
Laser Diode Bias Monitor Voltage
IIH
350
700
200
µA
mV
mV
2, 3
2, 3
Power Monitor Voltage
10
Receiver Electrical Characteristics
HFCT-5951TL/TG/HFCT-5952TL/TG: T = 0°C to +70°C, V = 3.14 V to 3.47 V
A
CC
HFCT-5951ATL/ATG/HFCT-5952ATL/ATG: T = -40°C to +85°C, V = 3.14 V to 3.47 V
A
CC
Parameter
Symbol
ICCR
Min.
Typ.
70
Max.
110
0.38
930
0.5
Unit
mA
W
Reference
Supply Current
1
4
5
6
6
7
7
Power Dissipation
PDISR
VOH - VOL
tr
0.23
800
Data Output Voltage Swing (single-ended)
Data Output Rise Time
575
mV
ns
ns
V
Data Output Fall Time
tf
0.5
Signal Detect Output Voltage - Low
Signal Detect Output Voltage - High
Signal Detect Assert Time (OFF to ON)
Signal Detect Deassert Time (ON to OFF)
VOL
0.8
VOH
2.0
2.3
V
ASMAX
ANSMAX
100
100
µs
µs
Notes:
1. Excludes data output termination currents.
2. The laser bias monitor current and laser diode optical power are calculated as ratios of the corresponding voltages to their current sensing resistors,
10 W and 200 W (see Figure 7). On the 2 x 10 version only.
3. On the 2 x 10 version only.
4. Power dissipation value is the power dissipated in the receiver itself. It is calculated as the sum of the products of V and I minus the sum of the
CC
CC
products of the output voltages and currents.
5. These outputs are compatible with 10 k, 10 kH, and 100 k ECL and PECL inputs.
6. These are 20-80% values.
7. SD is LVTTL compatible.
15
Transmitter Optical Characteristics
HFCT-5951TL/TG/HFCT-5952TL/TG: T = 0°C to +70°C, V = 3.14 V to 3.47 V
A
CC
HFCT-5951ATL/ATG/HFCT-5952ATL/ATG: T = -40°C to +85°C, V = 3.14 V to 3.47 V
A
CC
Parameter
Symbol
POUT
Min.
-15
Typ.
Max.
-8
Unit
dBm
nm
Reference
Output Optical Power 9 µm SMF
Center Wavelength
Spectral Width - rms
Optical Rise Time
1
lC
s
1274
1356
2.5
nm rms
ps
2
3
3
tr
250
250
1000
1000
Optical Fall Time
tf
ps
Extinction Ratio
ER
8.2
dB
Output Optical Eye
Back Reflection Sensitivity
Jitter Generation
Compliant with eye mask Bellcore GR-CORE-000253 and ITU-T G.957
-8.5
70
7
dB
4
5
5
pk to pk
RMS
25
2
mUI
mUI
Receiver Optical Characteristics
HFCT-5951TL/TG/HFCT-5952TL/TG: T = 0°C to +70°C, V = 3.14 V to 3.47 V
A
CC
HFCT-5951ATL/ATG/HFCT-5952ATL/ATG: T = -40°C to +85°C, V = 3.14 V to 3.47 V
A
CC
Parameter
Symbol
Min.
Typ.
Max.
Unit
Reference
Receiver Sensitivity
P
P
l
IN MIN
-32
-28
dBm avg. 6
dBm avg. 6
nm
Receiver Overload
IN MAX
-8
Input Operating Wavelength
Signal Detect - Asserted
Signal Detect - Deasserted
Signal Detect - Hysteresis
Optical Return Loss, ORL
1270
1570
-28
PA
PD
PH
-34
-34.3
1.7
dBm avg.
dBm avg.
dB
-45
0.5
4
-35
-14
dB
Notes:
1. The output power is coupled into a 1 m single-mode fiber. Minimum output optical level is at end of life.
2. The relationship between FWHM and RMS values for spectral width can be derived from the assumption of a Gaussian shaped spectrum which
results in RMS = FWHM/2.35.
3. These are unfiltered 20-80% values. The typical value is for OC12 operation only.
4. This meets the “desired” requirement in SONET specification (GR253). The figure given is the allowable mismatch for 1 dB degradation in receiver
sensitivity.
23
5. For the jitter measurements, the device was driven with SONET OC-12C data pattern filled with a 2 -1 PRBS payload.
23
6. Minimum sensitivity and saturation levels for a 2 -1 PRBS with 72 ones and 72 zeros inserted. Over the range the receiver is guaranteed to provide
-10
output data with a Bit Error Rate better than or equal to 1 x 10
.
16
Design Support Materials
Agilent has created a number of
reference designs with major
PHY IC vendors in order to
demonstrate full functionality
and interoperability. Such design
information and results can be
made available to the designer
as a technical aid. Please contact
your Agilent representative for
further information if required.
Ordering Information
Temperature range 0°C to +70°C
HFCT-5951TL 2 x 5 footprint with EMI nose shield
HFCT-5952TL 2 x 10 footprint with EMI nose shield
HFCT-5951TG 2 x 5 footprint without EMI nose shield
HFCT-5952TG 2 x 10 footprint without EMI nose shield
Temperature range -40°C to +85°C
HFCT-5951ATL 2 x 5 footprint with EMI nose shield
HFCT-5952ATL 2 x 10 footprint with EMI nose shield
HFCT-5951ATG 2 x 5 footprint without EMI nose shield
HFCT-5952ATG 2 x 10 footprint without EMI nose shield
Class 1 Laser Product: This product conforms to the
applicable requirements of 21 CFR 1040 at the date of
manufacture
Date of Manufacture:
Agilent Technologies Inc., No 1 Yishun Ave 7, Singapore
Handling Precautions
1. The HFCT-5951xxx/HFCT-5952xxx can be damaged by current surges or overvoltage.
Power supply transient precautions should be taken.
2. Normal handling precautions for electrostatic sensitive devices
should be taken.
17
www.agilent.com/
semiconductors
For product information and a complete list of
distributors, please go to our web site.
For technical assistance call:
Americas/Canada: +1 (800) 235-0312 or
(408)654-8675
Europe: +49 (0) 6441 92460
China: 10800 650 0017
Hong Kong: (+65) 6271 2451
India, Australia, New Zealand: (+65) 6271 2394
Japan: (+81 3) 3335-8152(Domestic/International), or
0120-61-1280(DomesticOnly)
Korea: (+65) 6271 2194
Malaysia, Singapore: (+65) 6271 2054
Taiwan: (+65) 6271 2654
Data subject to change.
Copyright © 2002 Agilent Technologies, Inc.
Obsoleters:5988-7856EN
October 18, 2002
5988-8205EN
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