HPL1117-25U_技术文档

HPL1117

1A Low Dropout Fast Response Positive Adjustable Regulator and Fixed

1.8V, 2.5V, 2.85V, 3.3V and 5V

Features

General Description

The HPL1117 is a low dropout three-terminal adjust-

able regulators with 1A output current capability. In

order to obtain lower dropout voltage and faster tran-

sient response, which is critical for low voltage ap-

plications , the HPL1117 has been optimized. The

device is available in an adjustable version and fixed

output voltages of 1.8V, 2.5V, 2.85V, 3.3V and 5V.

The output available voltage range of an adjustable

version is from 1.25~10.7V with an input supply be-

low 12V. Dropout voltage is guaranteed at a maxi-

mum of 1.3V at 1A. Current limit is trimmed to ensure

specified output current and controlled short-circuit

current. On-chip thermal limiting provides protection

against any combination of overload that would cre-

ate excessive junction temperatures. The HPL1117

is available in the industry standard 3-pin TO-220, TO-

252, TO-263, and the low profile surface mount SOT-

223 power packages which can be used in applica-

tions where space is limited.

•

Guaranteed Output Voltage Accuracy within 2%

Fast Transient Response

Guaranteed Dropout Voltage at Multiple

Currents

•

Load Regulation : 0.1% Typ.

Line Regulation : 0.03% Typ.

Low Dropout Voltage : 1.1V Typ. at I_OUT=1A

Current Limit : 1A Typ. at T_J=25°C

On-Chip Thermal Limiting : 150°C Typ.

Adjustable Output : 1.25~10.7V

Standard 3-pin TO-220, TO-252, TO-263 and

SOT-223 Power Packages

Applications

Pin Description

Front View for TO-220

•

Active SCSI Terminators

3

Low Voltage Logic Supplies

V_IN

2

1

V_OUT

Post Regulator for Switching Power Supply

ADJ/GND

Front View for TO-263

V_IN

V_OUT

3

2

TAB is V_OUT

ADJ/GND

1

Front View for TO-252

V_IN

3

TAB IS V_OUT

2

1

V_OUT

ADJ/GND

1

 Copyright HIPAC Semiconductor, Inc.

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Rev. B.13 - Mar., 2004

HPL1117

Pin Description (Cont.)

Front View for SOT-223

3

2

1

IN

T A B IS V _{O U T}

O U T

A D J /G N D

Ordering and Marking Information

Package Code

HPL1117-

F : TO-220 G : TO-263

Temp. Range

U : TO-252 V : SOT-223

°

Lead Free Code

C : 0 to 70 C

Handling Code

Temp. Range

Package Code

Voltage Code

TU : Tube

Voltage Code

18 : 1.8V

TR : Tape & Reel

25 : 2.5V 28 : 2.85V

33 : 3.3V

50 : 5V

Blank : Adjustable Version

Lead Free Code

L : Lead Free Device

Blank : Orginal Device

XXXXX - Date Code

HPL1117

- Date Code

XXXXX

HPL1117 F/G/U :

HPL1117 V :

XXXXX

HPL1117

XXXXX

18

HPL1117

XXXXX

HPL1117

HPL1117-18F/G/U :

HPL1117-18V :

XXXXX18

XXXXX - Date Code

25

HPL1117

XXXXX

HPL1117

HPL1117-25V :

XXXXX - Date Code

HPL1117-25F/G/U :

HPL1117-28F/G/U :

HPL1117 -33F/G/U :

XXXXX - Date Code

XXXXX25

28

HPL1117

XXXXX

HPL1117

HPL1117-28V :

XXXXX28

33

HPL1117

XXXXX

HPL1117

HPL1117-33V :

XXXXX - Date Code

XXXXX33

50

HPL1117

XXXXX

HPL1117

HPL1117-50V :

HPL1117 -50F/G/U :

XXXXX - Date Code

XXXXX50

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Rev. B.13 - Mar., 2004

HPL1117

Absolute Maximum Ratings

Symbol

Parameter

Rating^(Note)

Unit

V_I

Input Voltage

HPL1117, HPL1117-50, HPL1117-33

HPL1117-25, HPL1117-18, HPL1117-28

15

9

V

T_J

Operating Junction Temperature Range

Control Section

°C

0 to 125

0 to 150

Power Transistor

T_STG

T_L

Storage Temperature Range

-65 to +150

°C

Lead Temperature (Soldering, 10 second)

260

Note : The values here show the absolute maximum rating, and for normal usage please refer the test condition in Electrical

Characteristics Table.

Electrical Characteristics

Unless otherwise noted , these specifications apply over CIN=10uF , COUT=10uF , and TJ=0 to 125°C. Typical

values refer to TJ=25°C.

Symbol

Parameter

Test Conditions

HPL1117

Typ. Max.

Unit

Min.

V_REF

Reference Voltage

V

10mA≤ I_OUT≤1A, 1.4V≤(V_IN-V_OUT) ≤10.75V,

T_J=0~125°C

1.225 1.250 1.275

V_OUT

Output Voltage

HPL1117-18

T_J=0~125°C,

1.764 1.800 1.836

2.450 2.500 2.550

2.790 2.850 2.910

0≤ I_OUT≤ 1A, 3.1V≤V_IN≤9V,

T_J=0~125°C,

0≤ I_OUT≤ 1A, 3.8V≤V_IN≤9V,

T_J=0~125°C,

0≤ I_OUT≤1A, 4.25V≤V_IN≤9V,

T_J=0~125°C,

0≤ I_OUT≤ 1A, 4.6V≤V_IN≤12V,

HPL1117-25

HPL1117-28

HPL1117-33

HPL1117-50

V

3.235 3.300 3.365

4.900 5.000 5.100

T_J=0~125°C,

0≤ I_OUT≤ 1A, 6.45V≤V_IN≤12V,

REG_LINELine Regulation

HPL1117

0.03

0.2

6

I

_OUT=10mA, 1.5V≤(V_IN-V_OUT)≤10.75V ^(Note1)

_OUT=0A, 3.5V≤V_IN≤9V ^(Note1)

HPL1117-18

HPL1117-25

HPL1117-28

HPL1117-33

HPL1117-50

1

_OUT=0A, 4V≤V_IN≤9V ^(Note1)

%mV

_OUT=0A, 4.25V≤V_IN≤9V ^(Note1)

_OUT=0A, 4.75V≤V_IN≤12V ^(Note1)

_OUT=0A, 6.45V≤V_IN≤12V ^(Note1)

6

REG_LOADLoad Regulation

(V_IN-V_OUT)=3V, 0≤ I_OUT≤1A ^(Note1)

V_IN=3.5V, 0≤ I_OUT≤1A ^(Note1)

V_IN=4V, 0≤ I_OUT≤1A ^(Note1)

HPL1117

HPL1117-18

HPL1117-25

HPL1117-28

HPL1117-33

HPL1117-50

0.1

1

0.4

10

%mV

V_IN=4.25V, 0≤ I_OUT≤1A ^(Note1)

V_IN=4.75V, 0≤ I_OUT≤1A ^(Note1)

V_IN=6.45V, 0≤ I_OUT≤1A ^(Note1)

1

 Copyright HIPAC Semiconductor, Inc.

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Rev. B.13 - Mar., 2004

HPL1117

Electrical Characteristics (Cont.)

HPL1117

Typ. Max.

Symbol

Parameter

Test Conditions

Unit

Min.

V_D

Dropout Voltage

I_OUT=100mA ^(Note2)

1

1.1

1.2

1.3

I_OUT=500mA ^(Note2)

_OUT=1A ^(Note2)

(V_IN-V_OUT)=5V, T_J=25°C

1.05

1.1

V

I

I_LIMITCurrent Limit

1000

mA

I_ADJ

∆I_ADJ

I_O

Adjust Pin Current (V_IN-V_OUT)=3V, I_OUT=10mA

HPL1117

60

120

5

µA

Adjust Pin Current

Change HPL1117

0.2

10mA≤ I_OUT≤1A,

1.4V≤(V_IN-V_OUT) ≤10.75V

(V_IN-V_OUT)=10.75V ^(Note3)

µA

Minimum Load

1.7

75

mA

dB

Current HPL1117

PSRR Ripple Rejection

f_RIPPLE=120Hz, V_RIPPLE=1V_P-P,

(V_IN-V_OUT)=3V

60

T_R

T_S

Thermal Regulation

0.01

0.5

0.02 %/W

%

T_J=25°C, 30ms Pulse

Temperature

Stability

L_S

V_N

θ_th

Long -Term Stability

0.3

%

T_J=125°C,1000Hrs.

RMS Output Noise

0.003

T_J=25°C,10Hz≤F≤10kHz, (% of V_OUT

)

Thermal Resistance Junction to Case, at Tab

Junction to Ambient

Over Temperature

15

50

150

°C/ W

OT

°C

Point

IQ

Quiescent Current

HPL1117-18

HPL1117-25

HPL1117-28

HPL1117-33

HPL1117-50

5.5

10

mA

V_IN≤9V

V_IN≤12V

Note 1 : See thermal regulation specifications for changes in output voltage due to heating effects. Load line regulations are mea-

sured at a constant junction temperature by low duty cycle pulse testing.

Note 2 : Dropout voltage is specified over the full output current range of the device. Dropout voltage is defined as the minimum input/output

differential measured at the specified output current. Test points and limits are also shown on the Dropout Voltage curve.

Note 3 : Minimum load current is defined as the minimum output current required to maintain regulation.

 Copyright HIPAC Semiconductor, Inc.

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Rev. B.13 - Mar., 2004

HPL1117

Block Diagram

VOUT

VIN

Current

Limit

Thermal

Voltage

Protection

Regulation

ADJ/GND

Application Circuits

1.25V to 10.7V Adjustable Regulator

Improving Ripple Rejection

HPL1117

V_IN

IN

OUT

ADJ

V_OUT1

V_IN

IN

OUT

ADJ

V_OUT

R1

121Ω

1%

+

121Ω

10µF

100µ F

C₂

150µF

+

10µ F

C_1*

R2

1k

R2

365Ω

1%

C1

10µF

+

* C1 improves ripple rejection.

X_Cshould be approximately

equal to R1 at ripple frequency

* Needed if device is far from filter capacitors

R1 + R2

VOUT = 1.250V X

R1

 Copyright HIPAC Semiconductor, Inc.

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Rev. B.13 - Mar., 2004

HPL1117

Typical Characteristics

Load Transietn Response

Line Transient Response

HPL1117-33

5

0.02

0.01

0

6

5

4

3

2

1

0

0.15

0.1

4.5

4

3.5

3

CIN=10µF

C^OUT=10µF Tantalum

2.5

IOUT=0.1A

0.05

0

CIN=10µF

2

1.5

1

-0.01

-0.02

-0.03

C^OUT=10µF Tantalum

VIN=5V

0.5

0

-0.05

-100

100

300

500

700

900

-20

30

80

130

180

Time (µS)

Dropout Voltage vs. Output Current

Output Voltage vs. Input Voltage

HPL1117-33

1.25

1.2

6

5

4

3

2

1

0

1.15

1.1

1.05

1

.

0.95

0.9

0

0.2

0.4

0.6

0.8

1

0

1

2

3

4

5

6

7

8

9

Output Current (A)

Input Voltage (V)

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Rev. B.13 - Mar., 2004

HPL1117

Typical Characteristics Cont.

Input Current vs. Input Voltage

Current Limit vs. Input Voltage

HPL1117-33

2.4

2.2

2

6

5

4

3

2

1

0

1.8

1.6

1.4

1.2

1

0

2

4

6

8

10

12

5

7

9

11

13

Input Voltage (V)

Output Voltage vs. Temperature

2.6

3.4

3.3

3.2

3.1

3

2.5

2.4

2.3

2.2

2.1

2

1.9

1.8

1.7

1.6

2.9

2.8

2.7

-50

-25

0

25

50

75

100

125

-50

-25

0

25

50

75

100

125

Temperature (°C)

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Rev. B.13 - Mar., 2004

HPL1117

Typical Characteristics Cont.

Output Voltage vs. Temperature

5.3

Input Current vs. Tmeperature

HPL1117-33

8

7

6

5

4

3

2

5.2

5.1

5

4.9

4.8

4.7

-50

-25

0

25

50

75

100

125

-50

-25

0

25

50

75

100 125

Temperature (°C)

Current Limit vs. Temperature

PSRR vs. Frequency

HPL1117-33

1.9

1.8

1.7

1.6

1.5

1.4

1.3

1.2

1.1

1

+0

C

adj=22µF

-10

-20

-30

-40

-50

-60

-70

-80

IOUT=0.1A

Vripple=1V

p-p

VIN-VOUT=5V

V

IN-VOUT>=Vdropout

-90

V

IN-VOUT>=3V

-100

10k 20k

50 100 200

500 1k 2k

5k

50k 200k

-50

0

50

100

150

10 20

Temperature (°C)

Frequency (Hz)

 Copyright HIPAC Semiconductor, Inc.

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Rev. B.13 - Mar., 2004

HPL1117

Typical Characteristics Cont.

Adjustable Pin Current vs. Temperature

HPL1117-Adj

70

68

66

64

62

60

58

56

54

52

50

-50

-25

0

25

50

75

100 125

Temperature (°C)

 Copyright HIPAC Semiconductor, Inc.

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Rev. B.13 - Mar., 2004

HPL1117

Application Information

Rp

Output Voltage

PARASITIC

HPL1117

IN OUT

ADJ

LINE RESISTANCE

The HPL1117 develops a 1.25V reference voltage be-

tween the output and the adjust terminal. By placing

a resistor between these two terminals, a constant

Current is caused to flow through R1 and down through

R2 to set the overall output voltage. Normally this

current is chosen to be the specified minimum load

current of 10mA. For fixed voltage devices R1 and R2

are included in the device.

V_IN

R1

RL

CONNECT

R1 TO CASE

R2

CONNECT

R2 TO LOAD

HPL1117

V_IN

V_OUT

IN

OUT

Figure 2. Connections for Best Load Regulation

ADJ

VREF

R1

R2

Input Capacitor

I

ADJ

60µA

An input capacitor of 10µF or greater is

recommended. Tantalum, or aluminum electrolytic

capacitors can be used for bypassing. Larger Val-

ues will improve ripple rejection by bypassing the in-

put to the regulator.

R2

R1

VOUT = VREF(1+

)+IADJR2

Figure 1. Basic Adjustable Regulator

Load Regulation

Output Capacitor

When the adjustable regulator is used. Load regula-

tion will be limited by the resistance of the wire con-

necting the regulator to the load. The data sheet speci-

fication for load regulation is measured at the output

pin of the device. Best load regulation is obtained

when the top of the resistor divider (R1) is tied di-

rectly to the output pin of the device, not to the load.

For fixed voltage devices the top of R1 is internally

connected to the output, and the ground pin can be

connected to low side of the load. If R1 were con-

nected to the load, RP is multiplied by the divider

ratio, the effective resistance between the regulator

and the load would be:

The HPL1117 requires an output capacitor to maintain

stability and improve transient response. Proper ca-

pacitor selection is important to ensure proper

operation. The HPL1117 output capacitor selection is

dependent upon the ESR (equivalent series resistance)

of the output capacitor to maintain stability. When the

output capacitor is 10uF or greater, the output capaci-

tor should have an ESR less than 1Ω.This will improve

transient response as well as promote stability. A low-

ESR solid tantalum capacitor works extremely well

and provides good transient response and stability over

temperature.

R2

Rp X (1+ ), Rp = Parasitic Line Resistance

R1

 Copyright HIPAC Semiconductor, Inc.

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Rev. B.13 - Mar., 2004

HPL1117

Application Information (Cont.)

Figure 3&4 shows for the TO-252 and SOT-223 the

measured values of θ(J-A) for different copper area

sizes using a 2 layers, 1.6mm, and 6Sq. cm FR-4

PCB with 2oz. copper and a ground plane layer on

the backside area used for heatsinking. It can be

used as a rough guideline in estimating thermal

resistance.

Output Capacitor (Cont.)

Aluminum electrolytics can also be used, as long as

the ESR of the capacitor is <1Ω. The value of the

output capacitor can be increased without limit. Higher

capacitance values help to improve transient response

and ripple rejection and reduce output noise.

Ripple Rejection

50

TA=25°C

The curves for Ripple Rejection were generated us-

ing an adjustable device with the adjust pin bypassed.

With a 22µF bypassing capacitor 75dB ripple rejec-

tion is obtainable at any output level. The impedance

of the adjust pin capacitor, at the ripple frequency,

should be < R1. R1 is normally in the range of 100Ω-

200Ω. The size of the required adjust pin capacitor

is a function of the input ripple frequency. At 120Hz,

with R1=100Ω, the adjust pin capacitor should be

13µF. For fixed voltage devices, and adjustable de-

vices without an adjust pin capacitor, the output ripple

will increase as the ratio of the output voltage to the

reference voltage (V^OUT/VREF ).

45

40

35

30

25

0

2

4

6

8

10

12

14

2

Top Copper Area (cm )

Figure 3.

θ(J-A) vs. copper area for the TO-252 package

Thermal Considerations

HPL1117 has thermal protection which limits junction

temperature to 150°C. However, device functionality

is only guaranteed to a maximum junction tempera-

ture of +125°C.

Both the TO-220, TO-252, TO-263 and SOT-223

packages use a copper plane on the PCB and the

PCB itself as a heatsink. To optimize the heat sinking

ability of the plane and PCB, solder the tab of the

package to the plane.

 Copyright HIPAC Semiconductor, Inc.

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Rev. B.13 - Mar., 2004

HPL1117

Application Information (Cont.)

Thermal Considerations (Cont.)

60

TA=25°C

55

50

45

40

35

30

0

2

4

6

8

10

12

14

2

Top Copper Area (cm )

Figure 4.

θ(J-A) vs. copper area for the SOT-223 package

The thermal resistance for each application will be

affected by thermal interactions with other compo-

nents on the board. Some experimentation will be

necessary to determine the actual value.

The power dissipation of HPL1117 is equal to :

PD = (VIN - VOUT) x IOUT

Maximum junction temperature is equal to :

TJUNCTION = TAMBIENT + (PD x θJA)

Note: TJUNCTION must not exceed 125°C

 Copyright HIPAC Semiconductor, Inc.

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Rev. B.13 - Mar., 2004

HPL1117

Package Information

TO-220 ( Reference JEDEC Registration TO-220)

D

Q

b

e

E

b1

e1

L1

L

H1

A

c

J1

F

Millimeters

Dim

Inches

Min.

3.56

1.14

0.51

0.31

14.23

2.29

4.83

9.65

0.51

5.84

2.03

12.7

3.65

3.53

2.54

Max.

4.83

1.78

1.14

16.51

2.79

5.33

10.67

1.40

6.86

2.92

14.73

6.35

4.09

3.43

Min.

0.140

0.045

0.020

0.012

0.560

0.090

0.190

0.380

0.020

0.230

0.080

0.500

0.143

0.139

0.100

Max.

0.190

0.070

0.045

0.650

0.110

0.210

0.420

0.055

0.270

0.115

0.580

0.250

0.161

0.135

A

b1

b

c

D

e

e1

E

F

H1

J1

L

L1

R

Q

 Copyright HIPAC Semiconductor, Inc.

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Rev. B.13 - Mar., 2004

HPL1117

Package Informaion

TO-252( Reference JEDEC Registration TO-252)

E

A

b2

C1

L2

D

H

L1

L

b

C

e1

A1

D1

E1

Millimeters

Dim

Inches

Min.

2.18

Max.

2.39

1.27

0.89

5.461

0.58

6.22

Min.

Max.

0.094

0.050

0.035

0.215

0.023

0.245

A

A1

b

0.086

0.035

0.020

0.205

0.018

0.210

0.89

0.508

5.207

0.46

b2

C

C1

D

0.46

5.334

D1

E

5.2 REF

5.3 REF

0.205 REF

0.209 REF

6.35

6.73

0.250

0.265

E1

e1

H

3.96

9.398

0.51

0.64

0.89

5.18

0.156

0.370

0.020

0.025

0.035

0.204

0.410

10.41

L

L1

L2

1.02

0.040

0.080

2.032

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Rev. B.13 - Mar., 2004

HPL1117

Package Information

TO-263 ( Reference JEDEC Registration TO-263)

E

TERMINAL 4

L2

E1

D1

D

L

L3

b2

b

e

e1

A

c2

R

Φ 1

L1

DETAIL "A"ROTED

L4

c

Millimeters

Inches

Min.

Max.

Min.

Max.

Dim

A

b

4.06

0.51

1.14

4.83

1.016

1.651

0.160

0.02

0.190

0.040

0.065

b2

c

0.045

0.38 TYP.

2.54 TYP

0.015 TYP.

0.100 TYP

c2

D

e

e1

L

L1

L2

L3

1.14

8.64

9.65

1.40

9.65

10.54

0.045

0.340

0.380

0.055

0.380

0.415

14.60

2.24

1.02

1.20

15.88

2.84

2.92

1.78

0.575

0.090

0.040

0.050

0.625

0.110

0.112

0.070

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Rev. B.13 - Mar., 2004

HPL1117

Package Information

SOT-223( Reference JEDEC Registration SOT-223)

D

A

a

B1

c

H

E

L

K

e

A1

e1

b

B

Dim

Millimeters

Inches

Min.

Max.

1.80

0.08

0.80

3.10

0.32

6.70

3.70

Min.

0.06

Max.

0.07

A

A1

B

B1

c

1.50

0.02

0.60

2.90

0.28

6.30

3.30

0.02

0.11

0.01

0.25

0.13

0.03

0.12

0.01

0.26

0.15

D

E

e

2.3 BSC

4.6 BSC

0.09 BSC

0.18 BSC

e1

H

L

6.70

0.91

1.50

7.30

1.10

2.00

0.26

0.04

0.06

0.29

0.04

0.08

K

0

10

0

10

°

α

°

13

°

β

°

 Copyright HIPAC Semiconductor, Inc.

16

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Rev. B.13 - Mar., 2004

HPL1117

Physical Specifications

Terminal Material

Lead Solderability

Packaging

Solder-Plated Copper (Solder Material : 90/10 or 63/37 SnPb

Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3.

2500 devices per reel

Reflow Condition (IR/Convection or VPR Reflow)

tp

T_P

Critical Zone

T_Lto T_P

Ramp-up

T_L

t_L

Tsmax

Tsmin

Ramp-down

ts

Preheat

25

°

t 25 C to Peak

Time

Classificatin Reflow Profiles

Profile Feature

Sn-Pb Eutectic Assembly

Large Body Small Body

Pb-Free Assembly

Large Body

Small Body

Average ramp-up rate

(T_Lto T_P)

3°C/second max.

Preheat

100°C

150°C

60-120 seconds

150°C

200°C

60-180 seconds

- Temperature Min (Tsmin)

- Temperature Mix (Tsmax)

- Time (min to max)(ts)

Tsmax to T_L

- Temperature(T_L)

- Time (t_L)

3°C/second max

Peak Temperature(Tp)

183°C

217°C

60-150 seconds

Time within 5°C of actual Peak

Temperature(tp)

Ramp-down Rate

225 +0/-5°C

10-30 seconds

240 +0/-5°C

245 +0/-5°C

250 +0/-5°C

10-30 seconds

10-30 seconds 20-40 seconds

6°C/second max.

Time 25°C to Peak Temperature

6°C/second max.

6 minutes max.

8 minutes max.

Note: All temperatures refer to topside of the package. Measured on the body surface.

 Copyright HIPAC Semiconductor, Inc.

17

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Rev. B.13 - Mar., 2004

HPL1117

Package Reflow Conditions

pkg. thickness ≥ 2.5mm

and all bgas

pkg. thickness < 2.5mm pkg. thickness < 2.5mm and pkg.

volume < 350mm³

and pkg. volume ≥ 350mm³

Convection 220 +5/-0°C

VPR 215-219°C

Convection 235 +5/-0°C

VPR 235 +5/-0°C

IR/Convection 220 +5/-0°C

IR/Convection 235 +5/-0°C

Reliability test program

Test item

SOLDERABILITY

HOLT

PCT

TST

Method

Description

MIL-STD-883D-2003

MIL-STD-883D-1005.7

JESD-22-B, A102

MIL-STD-883D-1011.9

MIL-STD-883D-3015.7

JESD 78

245 C , 5 SEC

°

1000 Hrs Bias @ 125 C

°

168 Hrs, 100 % RH , 121 C

°

-65 C ~ 150 C, 200 Cycles

VHBM > 2KV, VMM > 200V

10ms , I_tr> 100mA

°

ESD

Latch-Up

Carrier Tape & Reel Dimension

t

D

P

Po

E

P1

Bo

F

W

Ao

D1

Ko

T2

J

C

A

B

T1

 Copyright HIPAC Semiconductor, Inc.

18

www.hipacsemi.com

Rev. B.13 - Mar., 2004

HPL1117

Carrier Tape & Reel Dimension

A

B

C

J

T 1

T 2

W

P

E

A p p lic a tio n

1 6 .4 + 0 .3

-0 .2

1 6 + 0 .3

- 0 .1

3 3 0

3

1 0 0

2

1 3

0 . 5

2

0 .5

2 .5 0 .5

8

0 .1

±

1 .7 5 ± 0 .1

F

D

D 1

P o

P 1

A o

B o

K o

t

T O -2 5 2

7 .5

0 .1

1 .5 + 0 .1 1 .5 0 .2 5 4 .0

0 .1 2 .0

0 .1 6 .8

0 .1 1 0 .4 0 .1 2 .5 0 .1

0 .3 0 .0 5

±

P

±

A

B

C

J

T 1

T 2

W

E

A p p lic a tio n

T O -2 6 3

2 4 + 0 .3

- 0 .1

3 8 0

F

3

8 0

2

1 3

0 . 5

2

0 .5

2 4

4

2

0 .3

1 6

0 .1 1 .7 5 0 .1

±

D

D 1

0 .1 1 .5 + 0 .1 1 .5 0 .2 5 4 .0

P o

P 1

A o

0 .1 1 0 .8

B o

K o

t

0 .3 5 0 .0 1

±

11 .5

0 .1 2 .0

0 .1 1 6 .1 0 .1 5 .2 0 .1

±

W

±

3

A

3 3 0

F

B

C

J

T 1

T 2

0 .2

P

E

A p p lic a tio n

S O T -2 2 3

1 2 .7 5

0 .1 5

±

1

6 2 1 .5

2

0 .6

1 2 .4 + 0 .2

P 1

2

1 2

0 .3

8

0 .1

1 .7 5 0 .1

±

D

D 1

P o

±

A o

B o

7 .5 0 .1

K o

2 .1 0 .1

t

5 .5

0 .0 5 1 .5 + 0 .1

1 .5 + 0 .1 4 .0

0 .1 2 .0

0 .0 5 6 .9

0 .1

0 .3 0 .0 5

±

Cover Tape Dimensions

Application

TO- 252

TO- 263

Carrier Width

Cover Tape Width

Devices Per Reel

16

24

12

13.3

21.3

9.3

2500

1000

2500

SOT- 223

CONTACT

HIPAC Semiconductor, Inc.

2540 North First Street, Suite 308

San Jose, CA 95131-1016

U.S.A.

Tel:1-408-943-0808

Fax: 1-408-943-0878

E-Mail: info@hipacsemi.com

 Copyright HIPAC Semiconductor, Inc.

19

www.hipacsemi.com

Rev. B.13 - Mar., 2004


型号：	HPL1117-25U
厂家：	ETC
描述：	1A Low Dropout Fast Response Positive Adjustable Regulator and Fixed 1.8V, 2.5V, 2.85V, 3.3V and 5V 1A低压降快速响应正可调稳压器和固定1.8V ， 2.5V ， 2.85V ， 3.3V和5V 稳压器
文件：	总19页 (文件大小：202K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

HPL1117-25U [ETC]

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