HSMS-820X [ETC]
Surface Mount Schottky Diodes -- Reliability Data (27K in pdf) ; 表面贴装肖特基二极管 - 可靠性数据（ 27K PDF格式）\n
| 型号： | HSMS-820X |
| 厂家： | 
ETC |
| 描述： | Surface Mount Schottky Diodes -- Reliability Data (27K in pdf)
|
| 文件： | 总4页 (文件大小：30K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Surface Mount Schottky Diodes
Reliability Data
HSMS-8101
HSMS-820X
HSMS-286A/6X
and/or mechanical specification
listed in the Hewlett-Packard
Communications Components
Designer’s Catalog.
The following cumulative test
results have been obtained from
testing performed at Hewlett-
Packard Communications Com-
ponents Division in accordance
with the latest revision of
from the product qualification,
reliability monitor, and
engineering evaluation.
For the purpose of this reliability
data sheet, a failure is any part
which fails to meet the electrical
MIL-STD-750. Data was gathered
1. Life Test
A. Demonstrated Performance
Units
Tested
Total
Device Hrs.
Total
Failed
Failure Rate
1%/1K Hrs.
Test
Test Conditions
High Temp. Rev.
Bias (HTRB)
V = 80% VBR, TA = 150°C
127
129
127,000
0
0
0
R
High Temp.
Operating
Life (HTOL)
Pfm = 75 mW, TA = 65°C
129,000
129,000
0
V = 80% VBR
R
High Temp.
TA = 150°C
129
0
0
Storage (HTS)
B. Failure Rate Prediction
The failure rate will depend on the
junction temperature of the
Point[1]
90% Confidence Level[2]
MTTF
Junction
Temp.
TJ ( °C)
MTTF
( Hours)
FIT[3]
( Hours)
FIT[3]
device. The estimated life at
3.6 x 106
7.3 x 106
1.5 x 107
3.2 x 107
1.7 x 108
1.8 x 109
2.6 x 1010
278.0
137.0
67.0
31.0
6.0
1.6 x 106
3.2 x 106
6.5 x 106
1.4 x 107
7.4 x 107
7.8 x 108
1.1 x 1010
625.0
312.0
153.0
71.0
14.0
1.3
different temperatures is calcu-
lated, using the Arrhenius plot
with activation energy of 1.05 eV,
and listed in the following table.
150
140
130
120
100
75
0.56
0.04
50
0.09
2
400
350
4.0
3.0
300
250
2.0
1.5
200
150
1.0
0.9
E
= 1.05 eV
a
0.8
0.7
100
0.6
0.5
50
25
2
3
4
5
6
7
8
9
10
10
10
10
10
10
10
10
MEAN TIME TO FAILURE, MTTF (HRS)
Notes:
1. The point MTTF is simply the total
device hours divided by the number of
failures.
2. The MTTF and failure rate represent the
performance level for which there is a
90% probability of the device doing
3. FIT is defined as Failure in Time, or
specifically, failures per billion hours.
The relationship between MTTF and FIT
is as follows: FIT = 109/(MTTF).
better than the stated value. The
confidence level is based on the
statistics of failure distribution. The
assumed distribution is exponential.
This particular distribution is commonly
used in describing useful life failures.
C. Example of Failure Rate Calculation
At 50°C with a device operating 8 hours a day, 5 days a week, the percent utilization is:
% Utilization = (8 hrs/day x 5 days/wk) ÷ 168 hrs/wk = 25%
Then the point failure rate per year is:
(4.0 x 10-11/1000 hrs.) x (25%) x (8760 hrs/yr) = 8.76 x 10-6% per year
Likewise, the 90% confidence level failure rate per year is:
(9.0 x 10-11/1000 hrs.) x (25%) x (8760 hrs/yr) = 1.97 x 10-5% per year
3
2. Environmental and Mechanical Tests
MIL-STD-750
Reference
Units
Tested
Total
Failed
Test
Solderability
Test Conditions
215°C, 5 seconds
2026
500
426
98
0
0
0
0
0
0
Solder Heat
2031
260°C, 10 seconds
4 solvent groups
Resistance to Solvent
Autoclave
1022
121°C, 15 PSIG, 96 hrs.
116
118
163
Moisture Resistance
Thermal Shock
85°C/85% RH, biased, 1000 hrs.
1056
1051
-65/150°C, 5 min dwell,
200 cycles
Temperature Cycle
Lead Integrity
-65/150°C, 10 min dwell,
200 cycles
169
140
0
0
3. Flammability Test:
Meets Needle Flame Test Category D (Flaming Time <3 sec.) under
material classification 94V0.
4. DOD-HDBK-1686A ESD Classification:
HSMS-8101/820X/286X/286A
Class I
www.hp.com/go/rf
For technical assistance or the location of
your nearest Hewlett-Packard sales
office, distributor or representative call:
Americas/Canada: 1-800-235-0312 or
408-654-8675
Far East/Australasia: Call your local HP
sales office.
Japan: (81 3) 3335-8152
Europe: Call your local HP sales office.
Data subject to change.
Copyright © 1998 Hewlett-Packard Co.
Obsoletes 5965-9142E
Printed in U.S.A.
5967-6074E (5/98)
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