HX324C11T3K4-32 [ETC]
DDR3-2400 CL11 240-Pin DIMM Kit;
| 型号： | HX324C11T3K4-32 |
| 厂家： | 
ETC |
| 描述： | DDR3-2400 CL11 240-Pin DIMM Kit 双倍数据速率 |
| 文件： | 总2页 (文件大小：882K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
HX324C11T3K2/16
16GB (8GB 1G x 64-Bit x 2 pcs.)
DDR3-2400 CL11 240-Pin DIMM Kit
SPECIFICATIONS
CL(IDD)
11 cycles
Row Cycle Time (tRCmin)
48.125ns (min.)
260ns (min.)
Refresh to Active/Refresh
Command Time (tRFCmin)
Row Active Time (tRASmin)
Maximum Operating Power
UL Rating
35ns (min.)
TBD W* (per module)
94 V - 0
Operating Temperature
Storage Temperature
0o C to 85o C
-55o C to +100o C
*Power will vary depending on the SDRAM used.
DESCRIPTION
FEATURES
HyperX HX324C11T3K2/16 is a kit of two 1G x 64-bit (8GB)
DDR3-2400 CL11 SDRAM (Synchronous DRAM), 2Rx8
memory modules, based on sixteen 512M x 8-bit FBGA
components per module. Each module kit supports Intel®
XMP (Extreme Memory Profiles). Total kit capacity is 16GB.
Each module kit has been tested to run at DDR3-2400 at a
low latency timing of 11-13-14 at 1.65V. The SPDs are
programmed to JEDEC standard latency DDR3-1600 timing of
11-11-11 at 1.5V. Each 240-pin DIMM uses gold contact
fingers. The JEDEC standard electrical and mechanical
specifications are as follows:
• JEDEC standard 1.5V (1.425V ~ 1.575V) Power Supply
• VDDQ = 1.5V (1.425V ~ 1.575V)
• 800MHz fCK for 1600Mb/sec/pin
• 8 independent internal bank
• Programmable CAS Latency: 11, 10, 9, 8, 7, 6
• Programmable Additive Latency: 0, CL - 2, or CL - 1 clock
• 8-bit pre-fetch
• Burst Length: 8 (Interleave without any limit, sequential with
starting address “000” only), 4 with tCCD = 4 which does not
allow seamless read or write [either on the fly using A12 or
MRS]
• Bi-directional Differential Data Strobe
XMP TIMING PARAMETERS
• Internal(self) calibration : Internal self calibration through ZQ
• JEDEC: DDR3-1600 CL11-11-11 @1.5V
pin (RZQ : 240 ohm ± 1%)
• XMP Profile #1: DDR3-2400 CL11-13-14 @1.65V
• XMP Profile #2: DDR3-2133 CL11-13-13 @1.6V
• On Die Termination using ODT pin
• Average Refresh Period 7.8us at lower than TCASE 85°C,
3.9us at 85°C < TCASE < 95°C
• Asynchronous Reset
• Height 1.827” (46.41mm) w/ heatsink, double sided
component
Continued >>
kingston.com/hyperx
Document No. 4807103-001.A00 07/23/14 Page 1
continued
HyperX
MODULE DIMENSIONS
MODULE WITH HEAT SPREADER
FOR MORE INFORMATION, GO TO WWW.KINGSTON.COM/HYPERX
All Kingston products are tested to meet our published specifications. Some motherboards or system configurations may not operate at
the published HyperX memory speeds and timing settings. Kingston does not recommend that any user attempt to run their computers
faster than the published speed. Overclocking or modifying your system timing may result in damage to computer components.
kingston.com/hyperx
Document No. 4807103-001.A00
Page 2
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