HX428C14PBK4-32 [ETC]
DDR4-2800 CL14 288-Pin DIMM;
| 型号： | HX428C14PBK4-32 |
| 厂家： | 
ETC |
| 描述： | DDR4-2800 CL14 288-Pin DIMM 双倍数据速率 |
| 文件： | 总2页 (文件大小：393K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
HX428C14PBK4/32
32GB (8GB 1G x 64-Bit x 4 pcs.)
DDR4-2800 CL14 288-Pin DIMM
SPECIFICATIONS
CL(IDD)
15 cycles
Row Cycle Time (tRCmin)
46.5ns(min.)
260ns(min.)
Refresh to Active/Refresh
Command Time (tRFCmin)
Row Active Time (tRASmin)
Maximum Operating Power
UL Rating
33ns(min.)
TBD W*
94 V - 0
0o C to +85o C
-55o C to +100o C
Operating Temperature
Storage Temperature
*Power will vary depending on the SDRAM used.
DESCRIPTION
FEATURES
• Power Supply: VDD=1.2V Typical
HyperX HX428C14PBK4/32 is a kit of four 1G x 64-bit (8GB)
DDR4-2800 CL14 SDRAM (Synchronous DRAM) 2Rx8,
memory module, based on sixteen 512M x 8-bit FBGA
components per module. Each module kit supports Intel®
Extreme Memory Profiles (Intel® XMP) 2.0. Total kit
capacity is 32GB. Each module has been tested to run at
DDR4-2800 at a low latency timing of 14-15-15 at 1.35V. The
SPDs are programmed to JEDEC standard latency
DDR4-2133 timing of 15-15-15 at 1.2V. Each 288-pin
DIMM uses gold contact fingers. The JEDEC standard
electrical and mechanical specifications are as follows:
• VDDQ = 1.2V Typical
• VPP - 2.5V Typical
• VDDSPD=2.2V to 3.6V
• Nominal and dynamic on-die termination (ODT) for
data, strobe, and mask signals
• Low-power auto self refresh (LPASR)
• Data bus inversion (DBI) for data bus
• On-die VREFDQ generation and calibration
• Dual-rank
• On-board I2 serial presence-detect (SPD) EEPROM
• 16 internal banks; 4 groups of 4 banks each
• Fixed burst chop (BC) of 4 and burst length (BL) of 8
via the mode register set (MRS)
XMP TIMING PARAMETERS
•JEDEC: DDR4-2133 CL15-15-15 @1.2V
•XMP Profile #1: DDR4-2800 CL14-15-15 @1.35V
•XMP Profile #2: DDR4-2666 CL14-14-14 @1.35V
• Selectable BC4 or BL8 on-the-fly (OTF)
• Fly-by topology
• Terminated control command and address bus
• Height 2.167” (55.05mm), w/heatsink
Continued >>
kingston.com/hyperx
Document No. 4807266-001.B00 04/21/15 Page 1
continued
HyperX
MODULE WITH HEAT SPREADER
8.12 mm
133.35 mm
MODULE DIMENSIONS
133.35
129.55
2.10±0.15
3.00
Detail A
28.90
Detail B
Detail D
Detail E
Detail C
Pin 105 Pin 117
Pin 35
Pin 47
Pin 1
3.35
64.60
56.10
22.95
FOR MORE INFORMATION, GO TO WWW.KINGSTON.COM/HYPERX
All Kingston products are tested to meet our published specifications. Some motherboards or system configurations may not operate at the
published HyperX memory speeds and timing settings. Kingston does not recommend that any user attempt to run their computers faster than
the published speed. Overclocking or modifying your system timing may result in damage to computer components.
kingston.com/hyperx
Document No. 4807266-001.B00
Page 2
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