HZU-LLSERIES [ETC]
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| 型号： | HZU-LLSERIES |
| 厂家： | 
ETC |
| 描述： |
|
| 文件： | 总5页 (文件大小：40K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
HZU-LL Series
Silicon Epitaxial Planar Zener Diode for Hard Knee Low Noise
ADE-208-236C (Z)
Rev.3
Dec. 2002
Features
•
•
•
•
Low noise voltage (approximately 1/3 to 1/10 lower than the HZU series).
Temperature coefficient is approximately 1/2 lower than the HZU series.
Vz-Iz characteristics are semi-logarithmic linear from Iz=1nA to 1mA.
Ultra small Resin Package(URP) is suitable for surface mount design.
Ordering Information
Type No.
Mark
Package Code
HZU-LL Series
Let to Mark Code
URP
Pin Arrangement
Cathode mark
Mark
1
2
1. Cathode
2. Anode
HZU-LL Series
Absolute Maximum Ratings
(Ta = 25°C)
Item
Symbol
Pd*1
Tj
Value
150
Unit
mW
°C
Power dissipation
Junction temperature
Storage temperature
Note: 1. See Fig.3.
150
Tstg
-55 to +150
°C
Electrical Characteristics
(Ta = 25°C)
Zener Voltage
Reverse Current Dynamic Resistance
Linearity
VZ(V) *1
IR(nA)
IZ(mA) Max
ZZT(Ω)
Max
350
ZZK(kΩ) *2
∆VZ(V) *3
Type
Grade Min
Max
2.0
2.3
2.6
2.9
3.2
3.5
3.8
4.1
4.4
4.7
5.0
5.3
VR(V)
IZT(mA) Typ IZK(µA) Max
HZU2LL
A
B
C
A
B
C
A
B
C
A
B
C
1.6
1.9
2.2
2.5
2.8
3.1
3.4
3.7
4.0
4.3
4.6
4.9
0.5
0.5
0.5
0.5
100
100
100
100
0.5
0.5
0.5
0.5
0.5
(1.2)
(1.2)
(1.5)
(1.5)
50
50
50
50
0.5
0.5
0.5
0.5
HZU3LL
HZU4LL
HZU5LL
1.0
2.0
3.0
360
370
380
Notes: 1. Tested with DC.
2. Reference only.
3. ∆VZ = VZ (IZ = 0.5 mA) - VZ (Iz = 0.05 mA)
4. Type No. is as follows; HZU2ALL, HZU2BLL, … HZU5CLL.
Mark Code
Type
Grade
MarK No.
2A
Type
Grade
Mark No.
4A
HZU2LL
A
B
C
A
B
C
HZU4LL
A
B
C
A
B
C
2B
4B
2C
4C
HZU3LL
3A
HZU5LL
5A
3B
5B
3C
5C
Rev.3, Dec. 2002, page 2 of 5
HZU-LL Series
Main Characteristic
10–2
10–3
10–4
10–5
10–6
10–7
10–8
0.01
0.02
0.03
0.04
0.05
0
0.5
%/°C
mV/°C
1.0
1.5
2.0
0
1
2
3
4
5
6
7
8
1
2
3
4
5
6
Zener Voltage VZ (V)
Fig.1 Zener current vs. Zener voltage
Zener Voltage VZ (V)
Fig.2 Temperature Coefficient vs. Zener voltage
250
200
150
100
50
0.8mm
1.5mm
Cu Foil
Printed circuit board
15 20 1.6t mm
×
×
Material: Glass Epoxy Resin
+Cu Foil
0
0
50
Ambient Temperature Ta (°C)
Fig.3 Power Dissipation vs. Ambient Temperature
100
150
200
Rev.3, Dec. 2002, page 3 of 5
HZU-LL Series
Package Dimensions
As of July, 2002
Unit: mm
1.7 ± 0.15
2.5 ± 0.15
Hitachi Code
JEDEC
JEITA
URP
Conforms
—
Mass (reference value)
0.004 g
Rev.3, Dec. 2002, page 4 of 5
HZU-LL Series
Disclaimer
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent,
copyright, trademark, or other intellectual property rights for information contained in this document.
Hitachi bears no responsibility for problems that may arise with third party’s rights, including
intellectual property rights, in connection with use of the information contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you have
received the latest product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,
contact Hitachi’s sales office before using the product in an application that demands especially high
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk
of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,
traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly
for maximum rating, operating supply voltage range, heat radiation characteristics, installation
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used
beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable
failure rates or failure modes in semiconductor devices and employ systemic measures such as fail-
safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other
consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without
written approval from Hitachi.
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor
products.
Sales Offices
Hitachi, Ltd.
Semiconductor & Integrated Circuits
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
Tel: (03) 3270-2111 Fax: (03) 3270-5109
URL
http://www.hitachisemiconductor.com/
For further information write to:
Hitachi Semiconductor
(America) Inc.
179 East Tasman Drive Whitebrook Park
Hitachi Europe Ltd.
Electronic Components Group
Hitachi Asia Ltd.
Hitachi Tower
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Hung-Kuo Building
Taipei (105), Taiwan
Tel : <886>-(2)-2718-3666
Fax : <886>-(2)-2718-8180
Telex : 23222 HAS-TP
Hitachi Europe GmbH
Electronic Components Group
Dornacher Str 3
D-85622 Feldkirchen
Postfach 201, D-85619 Feldkirchen
Germany
Tel: <49> (89) 9 9180-0
Fax: <49> (89) 9 29 30 00
URL : http://semiconductor.hitachi.com.tw
Copyright © Hitachi, Ltd., 2002. All rights reserved. Printed in Japan.
Colophon 7.0
Rev.3, Dec. 2002, page 5 of 5
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