IMSSG559AYB [ETC]

CPU System Clock Generator ; CPU的系统时钟发生器\n
IMSSG559AYB
型号: IMSSG559AYB
厂家: ETC    ETC
描述:

CPU System Clock Generator
CPU的系统时钟发生器\n

时钟发生器
文件: 总8页 (文件大小:89K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
SG559  
Mobile Pentium Processor Application Clock Generator with SSCG, USB and Power  
Management Support  
Approved Product  
FREQUENCY TABLE  
CPU  
PRODUCT FEATURES  
SEL100/66#  
PCI  
33.3 Mhz  
33.2 MHz  
Supports clock requirements for Mobile Pentium®  
Processor  
0
1
66.4 Mhz*  
99.8 Mhz**  
*Down Spread 1.25% (total); **Down Spread .5% (total)  
2 Host and 5 PCI clocks  
Separate supply pins for mixed (3.3/2.5V) voltage  
application.  
<175ps skew among CPU clocks.  
< 250ps skew among PCI clocks.  
48mhz for USB.  
CONNECTION DIAGRAM  
28-pin SSOP package for minimum board space.  
Power management capabilities  
28  
1
XIN  
XOUT  
VSS  
VSS  
2
27  
26  
25  
24  
23  
22  
21  
20  
19  
18  
17  
16  
15  
VDDR  
REF  
BLOCK DIAGRAM  
3
4
PCI_F  
PCI1  
VDDP  
PCI2  
PCI3  
VDDP  
PCI4  
PCI5  
VSS  
VDDC  
CPU0  
VDDR  
XIN  
XOUT  
REF  
5
OSC  
6
CPU1  
7
VSS  
VDDC  
CPUCLK (0:1)  
8
VDD  
CPU_STOP#  
PLL  
9
VSS  
PCI_STOP#  
SEL1066#  
VDDP  
10  
11  
12  
13  
14  
PCI_STOP#  
CPU_STOP#  
PWR_DWN#  
48M  
PCI (1:5)  
PCI_F  
PWR_DWN#  
VDD  
VSS  
48 MHz  
SEL100/ 66#  
PLL  
INTERNATIONAL MICROCIRCUITS, INC. 525 LOS COCHES ST.  
MILPITAS, CA 95035 TEL: 408-263-6300 ext. 275 FAX 408-263-6571  
Rev. 1.0  
4/12/1999  
Page 1 of 8  
SG559  
Mobile Pentium Processor Application Clock Generator with SSCG, USB and Power  
Management Support  
Approved Product  
PIN DESCRIPTION  
PIN No.  
1
Pin Name  
PWR  
VDD  
I/O  
I
TYPE  
Description  
OSC1 On-chip reference oscillator input pin. Requires either an  
external parallel resonant crystal (nominally 14.318 MHz) or  
externally generated reference signal  
XIN  
2
VDD  
O
OSC1 On-chip reference oscillator output pin. Drives an external  
parallel resonant crystal. When an externally generated  
reference signal is used at Xin, this pin is left unconnected  
PADI4 Frequency select input pins. See frequency select table on  
XOUT  
15  
23, 24  
4
-
I
SEL100/66#  
PU  
page 1.This pin has internal pull-up.  
VDDC  
VDDP  
O
O
BUF1 Clock outputs. CPU frequency table specified on page 1.  
CPUCLK  
(0:1)  
PCI_F  
BUF4 Free running PCI clock. When PCI_STP# = 0, this clock does  
NOT stop.  
16  
5, 7, 8,  
10, 11  
26  
VDD48  
VDDP  
O
O
BUF3 48 MHz fixed clock.  
BUF4 PCI bus clocks. See frequency select table on page 1.  
48M  
PCI(1:5)  
VDDR  
-
O
I
BUF3 Buffered outputs of on-chip reference oscillator.  
REF  
PCI_STOP#  
19  
PAD  
PU  
PAD  
PU  
PAD  
PU  
-
When driven to a logic low level, this pin will synchronously stop  
all PCI clocks (except PCI_F) at a logic low level.  
When driven to a logic low level, this pin will synchronously stop  
all CPU clocks at a logic low level.  
This pin is active low. When asserted low, the device is in  
shutdown mode. VCO’s, Crystal, and outputs are turned off.  
3.3 volt power supply for core logic.  
18  
17  
-
-
I
I
CPU_STOP#  
PWR_DWN#  
13, 21  
3, 12,  
14, 20,  
22, 28  
9, 6  
-
-
P
P
VDD  
VSS  
-
Ground pins for the device.  
-
P
-
-
3.3 Volt power supply pins for PCI (1:5) and PCI_F clock output  
buffers.  
3.3 or 2.5 Volt power supply for CPUCLK (0:1) outputs.  
3.3 Volt power supply pins for reference clock output buffers  
and crystal circuit.  
VDDP  
25  
27  
-
-
P
P
VDDC  
VDDR  
INTERNATIONAL MICROCIRCUITS, INC. 525 LOS COCHES ST.  
MILPITAS, CA 95035 TEL: 408-263-6300 ext. 275 FAX 408-263-6571  
Rev. 1.0  
4/12/1999  
Page 2 of 8  
SG559  
Mobile Pentium Processor Application Clock Generator with SSCG, USB and Power  
Management Support  
Approved Product  
POWER MANAGEMENT FUNCTIONS  
All PCI (excluding PCI_F) and CPU clocks can be enabled or stopped via the PCI_STOP# and CPU_STOP# input pins.  
All clocks are stopped in the low state. All clocks maintain a valid high period on transitions from running to stopped and  
on transitions from stopped to running when the chip was not powered down. On power up, the VCOs will stabilize to  
the correct pulse widths within 0.2 mS. The CPU and PCI clocks transition between running and stopped by waiting for  
one positive edge on PCI_F followed by a negative edge on the clock of interest, after which high levels of the output are  
either enabled or disabled.  
PWR_DWN#  
CPU_STOP#  
PCI_STOP#  
CPUCLK  
PCICLK  
OTHER CLKs  
XTAL & VCOs  
1
1
1
1
0
0
1
1
0
1
0
1
LOW  
LOW  
RUNNING  
RUNNING  
LOW  
RUNNING  
LOW  
RUNNING  
RUNNING  
RUNNING  
RUNNING  
RUNNING  
RUNNING  
RUNNING  
RUNNING  
RUNNING  
0
x (don’t care)  
x (don’tcare)  
LOW  
LOW  
LOW  
OFF  
POWER MANAGEMENT TIMING  
PCI_F  
PCI_STOP#  
PCICLK(1:5)  
CPU_STOP#  
CPUCLK(0:1)  
POWER MANAGEMENT TIMING  
Signal State  
Latency  
Signal  
No. of rising edges of free  
running PCICLK (PCIF)  
CPU_ST0P#  
PCI_ST0P#  
0 (disabled)  
1 (enabled)  
0 (disabled)  
1 (enabled)  
1
1
1
1
NOTES:  
1. Clock on/off latency is defined in the number of rising edges of free running PCI CLOCK between the clock disable  
goes low/high to the first valid clock comes out of the device.  
INTERNATIONAL MICROCIRCUITS, INC. 525 LOS COCHES ST.  
MILPITAS, CA 95035 TEL: 408-263-6300 ext. 275 FAX 408-263-6571  
Rev. 1.0  
4/12/1999  
Page 3 of 8  
SG559  
Mobile Pentium Processor Application Clock Generator with SSCG, USB and Power  
Management Support  
Approved Product  
SPECTRUM SPREAD CLOCKING  
Down Spread  
Amplitude  
(dB)  
Without Spectrum Spread  
With Spectrum Spread  
Frequency (MHz)  
Center  
Spectrum Analysis  
MAXIMUM RATINGS  
This device contains circuitry to protect the inputs  
against damage due to high static voltages or electric  
field; however, precautions should be taken to avoid  
application of any voltage higher than the maximum  
rated voltages to this circuit. For proper operation, Vin  
and Vout should be constrained to the range:  
VSS<(Vin or Vout)<VDD  
Voltage Relative to VSS:  
Voltage Relative to VDD:  
Storage Temperature:  
Operating Temperature:  
Maximum Power Supply:  
-0.3V  
0.3V  
-65ºC to + 150ºC  
-40ºC to +85ºC  
7V  
Unused inputs must always be tied to an appropriate  
logic voltage level (either VSS or VDD).  
INTERNATIONAL MICROCIRCUITS, INC. 525 LOS COCHES ST.  
MILPITAS, CA 95035 TEL: 408-263-6300 ext. 275 FAX 408-263-6571  
Rev. 1.0  
4/12/1999  
Page 4 of 8  
SG559  
Mobile Pentium Processor Application Clock Generator with SSCG, USB and Power  
Management Support  
Approved Product  
ELECTRICAL CHARACTERISTICS  
Characteristic  
Symbol Min  
Typ  
Max  
0.8  
Units  
Conditions  
Input Low Voltage  
Input High Voltage  
Input Low Current  
Input High Current  
VIL  
VIH  
IIL  
-
-
-
Vdc  
Vdc  
µA  
-
-
2.0  
-
-66  
5
IIH  
µA  
Output Low Voltage  
IOL = 4mA  
VOL  
-
-
-
0.4  
Vdc  
All Outputs (see buffer spec)  
Output High Voltage  
IOH = 4mA  
VOH  
2.4  
-
Vdc  
All Outputs Using 3.3V Power  
(see buffer spec)  
Tri-State leakage Current  
Dynamic Supply Current  
Static Supply Current  
Short Circuit Current  
Ioz  
Idd  
-
-
-
-
-
-
10  
140  
70  
-
µA  
mA  
µA  
CPU = 66.6 MHz, PCI = 33.3 MHz  
pwr_dwn# (PIN17) = 0  
Isdd  
ISC  
-
25  
mA  
1 output at a time - 30 seconds  
VDD = VDDP=VDDR =3.3V ±5%, VDDC = 2.5V ±5%,, TA = -40ºC to +85ºC  
SWITCHING CHARACTERISTICS  
Characteristic  
Symbol  
Min  
Typ  
Max  
Units  
Conditions  
Measured at 1.5V  
Output Duty Cycle  
CPU to PCI Offset  
-
45  
1
50  
3
55  
4
%
ns  
ps  
tOFF  
tSKEW  
15 pf Load Measured at 1.5V  
15 pf Load Measured at 1.5V  
Buffer out Skew All CPU  
and PCI Buffer Outputs  
-
-
250  
-
-
+250  
500  
ps  
-
Period Adjacent Cycles  
P  
Jitter Spectrum 20 dB  
Bandwidth from Center  
BWJ  
KHz  
VDD = VDDP =VDDR =3.3V ±5%, VDDC = 2.5V ±5%,, TA = -40ºC to +85ºC  
INTERNATIONAL MICROCIRCUITS, INC. 525 LOS COCHES ST.  
MILPITAS, CA 95035 TEL: 408-263-6300 ext. 275 FAX 408-263-6571  
Rev. 1.0  
4/12/1999  
Page 5 of 8  
SG559  
Mobile Pentium Processor Application Clock Generator with SSCG, USB and Power  
Management Support  
Approved Product  
BUFFER 1 CHARACTERISTICS FOR CPUCLK(0:1)  
Characteristic  
Symbol  
Min  
Typ  
Max  
Units  
Conditions  
Pull-Up Current Min  
IOHmin  
IOHmax  
IOLmin  
IOLmax  
Zo  
-27  
-
-
-
-
-
-
-
-
mA  
mA  
Vout = 1.0 V  
Vout = 2.6 V  
Vout = 1.2 V  
Vout = 0.3 V  
66 and 100 MHz  
20 pF Load  
Pull-Up Current Max  
-27  
Pull-Down Current Min  
Pull-Down Current Max  
Dynamic Output Impedance  
27  
-
-
mA  
27  
15  
1.6  
mA  
10  
0.4  
Ohms  
nS  
Rise Time Between  
0.4 V and 2.0 V  
TR  
Fall Time  
TF  
0.5  
-
1.6  
nS  
20 pF Load  
Between 0.4 V and 2.0 V  
VDD = VDDP= VDDR =3.3V ±5%, VDDC = 2.5V ±5%,, TA = -40ºC to +85ºC  
BUFFER 3 CHARACTERISTICS FOR REF, 48M  
Characteristic  
Symbol  
Min  
Typ  
Max  
Units  
Conditions  
Pull-Up Current Min  
IOHmin  
IOHmax  
IOLmin  
IOLmax  
Zo  
-29  
-
-
-
-
-
-
-
-
mA  
mA  
Vout = 1.0 V  
Vout = 3.135 V  
Vout = 1.95 V  
Vout = 0.4 V  
Pull-Up Current Max  
-23  
Pull-Down Current Min  
Pull-Down Current Max  
Dynamic Output Impedance  
29  
-
-
mA  
27  
25  
2.0  
mA  
18  
0.5  
Ohms  
nS  
66 and 100 MHz  
20 pF Load  
Rise Time  
TR  
Between 0.4 V and 2.4 V  
Fall Time  
TF  
0.5  
-
2.0  
nS  
20 pF Load  
Between 0.4 V and 2.4 V  
VDD = VDDP= VDDR =3.3V ±5%, VDDC = 2.5V ±5%,, TA = -40ºC to +85ºC  
INTERNATIONAL MICROCIRCUITS, INC. 525 LOS COCHES ST.  
MILPITAS, CA 95035 TEL: 408-263-6300 ext. 275 FAX 408-263-6571  
Rev. 1.0  
4/12/1999  
Page 6 of 8  
SG559  
Mobile Pentium Processor Application Clock Generator with SSCG, USB and Power  
Management Support  
Approved Product  
BUFFER 4 CHARACTERISTICS FOR PCI_F, PCI(1:5)  
Characteristic  
Symbol  
Min  
Typ  
Max  
Units  
Conditions  
Pull-Up Current Min  
Pull-Up Current Max  
Pull-Down Current Min  
Pull-Down Current Max  
IOHmin  
IOHmax  
IOLmin  
IOLmax  
-33  
-
-
-
-
-
-
mA  
mA  
mA  
mA  
Vout = 1.0 V  
Vout = 3.135 V  
Vout = 1.95 V  
Vout = 0.4 V  
-33  
30  
-
-
38  
Dynamic Output Impedance  
Rise Time  
Zo  
TR  
14  
0.5  
-
-
20  
2.0  
Ohms  
nS  
66 and 100 MHz  
30 pF Load  
Between 0.4 V and 2.4 V  
Fall Time  
TF  
0.5  
-
2.0  
nS  
30 pF Load  
Between 0.4 V and 2.4 V  
VDDP= VDDR =3.3V ±5%, VDDC = 2.5V ±5%,, TA = -40ºC to +85ºC  
CRYSTAL AND REFERENCE OSCILLATOR PARAMETERS  
Characteristic  
Symbol  
Min  
Typ  
Max  
Units  
Conditions  
Frequency  
Tolerance  
Fo  
TC  
TS  
12.00  
14.31818  
16.00  
+/-100  
+/- 100  
5
MHz  
PPM  
PPM  
PPM  
-
-
-
-
-
Calibration note 1  
-
Stability (Ta -10 to +60C) note 1  
Aging (first year @ 25C) note 1  
Parallel Resonant  
TA  
-
Mode  
OM  
CP  
VBIAS  
Ts  
-
-
Pin Capacitance  
DC Bias Voltage  
Startup time  
5
pF  
V
Capacitance of XIN and Xout pins  
0.3Vdd  
Vdd/2  
0.7Vdd  
-
-
-
-
20  
-
30  
-
µS  
Load Capacitance  
CL  
pF  
note 1  
Effective Series  
resonant  
R1  
40  
Ohms  
resistance  
Power Dissipation  
Shunt Capacitance  
X1 and X2 Load  
DL  
CO  
CL  
-
-
-
0.10  
7
mW  
pF  
note 1  
--  
17  
pF  
internal crystal loading capacitors on  
each pin (to ground)  
For maximum accuracy, the total circuit loading capacitance should be equal to CL. This loading capacitance is the  
effective capacitance across the crystal pins and includes the device pin capacitance (CP) in parallel with any circuit  
traces, the clock generator and any onboard discrete load capacitors.  
Budgeting Calculations  
Typical trace capacitance, (< half inch) is 4 pF, Load to the crystal is therefore  
Clock generator internal pin capacitance of 36 pF, Load to the crystal is therefore  
the total parasitic capacitance would therefore be  
2.0 pF  
18.0 pF  
= 20.0 pF(matching CL)  
Note 1: It is recommended but not mandatory that a crystal meets these specifications.  
INTERNATIONAL MICROCIRCUITS, INC. 525 LOS COCHES ST.  
MILPITAS, CA 95035 TEL: 408-263-6300 ext. 275 FAX 408-263-6571  
Rev. 1.0  
4/12/1999  
Page 7 of 8  
SG559  
Mobile Pentium Processor Application Clock Generator with SSCG, USB and Power  
Management Support  
Approved Product  
PACKAGE DRAWING AND DIMENSIONS  
28 PIN SSOP OUTLINE DIMENSIONS  
C
L
INCHES  
MILLIMETERS  
SYMBOL  
MIN  
NOM  
MAX  
MIN  
NOM  
MAX  
H
E
A
A1  
A2  
B
0.068  
0.002  
0.066  
0.010  
0.005  
0.397  
0.205  
0.073  
0.005  
0.078 1.73  
0.008 0.05  
0.070 1.68  
0.015 0.25  
0.009 0.13  
0.407 10.07  
0.212 5.20  
1.86  
0.13  
1.99  
0.21  
1.78  
0.38  
0.22  
10.33  
5.38  
0.068  
1.73  
D
a
0.012  
0.30  
A2  
C
D
E
0.006  
0.15  
A
0.402  
10.20  
5.30  
A1  
0.209  
e
B
e
0.0256 BSC  
0.307  
0.65 BSC  
7.80  
H
a
0.301`  
0°  
0.311 7.65  
7.90  
8°  
4°  
8°  
0°  
4°  
L
0.022  
0.030  
0.037 0.55  
0.75  
0.95  
ORDERING INFORMATION  
Part Number  
Package Type  
Production Flow  
Commercial, -40ºC to +85ºC  
IMISG559AYB  
28 PIN SSOP  
Note:  
The ordering part number is formed by a combination of device number, device revision, package style, and  
screening as shown below.  
Marking: Example: IMI  
SG559AYB  
Date Code, Lot #  
IMISG559AYB  
Flow  
B = Commercial, -40ºC to + 85ºC  
Package  
Y = SSOP  
Revision  
IMI Device Number  
INTERNATIONAL MICROCIRCUITS, INC. 525 LOS COCHES ST.  
MILPITAS, CA 95035 TEL: 408-263-6300 ext. 275 FAX 408-263-6571  
Rev. 1.0  
4/12/1999  
Page 8 of 8  

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