IQS213A [ETC]

3-Channel Capacitive Touch/Swipe Function Controller;


型号：	IQS213A
厂家：	ETC
描述：	3-Channel Capacitive Touch/Swipe Function Controller
文件：	总46页 (文件大小：1711K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

IQ Switch^®

ProxSense^®Series

IQS213/A Datasheet

IQSwitch^®- ProxSense^®Series

3-Channel Capacitive Touch/Swipe Function Controller

Overview

Unparalleled Features



Sub 5µA* current consumption (“Zero-Power” electronic switch).

Internal Capacitor Implementation (ICI) – Reference capacitor on-chip

Automatic Tuning Implementation (ATI) - Automatic tuning for optimal operation in various

environments & compensation against sensitivity reducing objects



IQS213A advised for applications with high load-capacitances and high sensitivity

requirements.

The IQS213(A) ProxSense^®IC is a fully integrated two or three channel capacitive swipe function

sensor with market leading sensitivity and automatic tuning of the sense electrodes. The

IQS213(A) provides a minimalist implementation requiring few external components, with OTP-

option settings and an I²C-compatible interface that allow configuration for numerous applications.

Main Features



2 or 3 Channel (Projected or Self Capacitance) Input device

Swipe Function or Differentiated Touch and Distributed Proximity Electrode Implementation

Variable User Interface with Adjustable Swipe Function Configuration

Auto-Off and Advanced Auto-Off Warning Function

Supply voltage: 1.8V to 3.6V

Internal voltage regulator and reference capacitor

Advanced on-chip digital signal processing

OTP (One Time Programmable) options available

I²C compatible interface

Low Power Modes (sub 4µA*)

Variable Proximity & Touch Thresholds

Small outline MSOP-10 package

Applications



Sanitary ware, toys, office equipment

Flashlights, headlamps, keychain lights

Splash- / waterproof devices

Swipe-to-Unlock / Wake from Standby applications

Replacement for electro-mechanical

switches

Advantages



Prevents accidental activation of conventional touch sensors

Improved digital filtering to reduce external noise

High immunity against aqueous substances

Highly adjustable device with continuous data or event driven I²C communication

Available options

T_A

MSOP10

-40°C to 85°C

IQS213A / IQS213

*Current consumption dependant on selected Low Power settings.

IQS213A (IQS213) Datasheet

Revision 2.1

Page 1 of 46

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8.3

8.4

SELF- OR PROJECTED CAPACITANCE ............. 26

RATE OF CHARGE CYCLES............................ 27

8.4.1 Normal Power rate................................ 27

8.4.2 Low Power rates................................... 27

Contents

OVERVIEW ..........................................................1

8.5

TOUCH REPORT RATE.................................. 27

ACTIVE CHANNELS ....................................... 27

LONG TERM AVERAGE (LTA)........................ 28

DETERMINE TOUCH OR PROX........................ 28

ATI ............................................................ 28

FUNCTIONAL OVERVIEW..........................3

8.6

8.7

8.8

8.9

1.1

APPLICABILITY............................................... 3

ANALOGUE FUNCTIONALITY...................3

DIGITAL FUNCTIONALITY .........................3

HARDWARE CONFIGURATION.................4

8.9.1 ATI Sensitivity....................................... 28

8.9.2 ATI Target............................................. 28

8.9.3 ATI Base (MULTIPLIER) ...................... 28

8.9.4 Re-ATI .................................................. 29

4.1

4.2

IQS213A (IQS213) - MSOP10 PIN-OUT ....... 4

REFERENCE DESIGN...................................... 5

8.10

RF DETECTION............................................ 29

8.10.1

RF detector sensitivity...................... 29

4.2.2 Power Supply and PCB Layout .............. 5

4.2.3 Design Rules for Harsh EMC

Environments ...................................................... 6

4.2.4 High Sensitivity....................................... 6

COMMUNICATION.................................... 30

9.1

9.2

EVENT MODE .............................................. 30

I²C SPECIFIC COMMANDS.............................. 30

USER CONFIGURABLE OPTIONS ............7

9.2.1 IC Reset indication ............................... 30

9.2.2 WDT ..................................................... 30

9.3

5.1

5.2

5.3

CONFIGURING OF DEVICES ............................. 7

USER SELECTABLE CONFIGURATION OPTIONS.. 8

IQS213A (IQS213) SETUP EXAMPLES ......... 14

I²C READ AND WRITE SPECIFICS ................... 30

10 IQS213A (IQS213) MEMORY MAP .......... 31

5.3.1 Example 1: 3-Channel Self Capacitive,

Active Low Logic Output, SwipeSwitch with

Auxiliary Touch Output. ..................................... 14

5.3.2 Example 2: 3-Channel Projected

Capacitive, Active High Logic Output,

SwipeSwitch with Auxiliary Swipe Pulse Output.15

5.3.3 Example 3: Normal Mode Operation .... 16

10.1

10.2

MEMORY REGISTERS ................................... 31

MEMORY REGISTERS DESCRIPTION............... 33

10.2.1

10.2.2

10.2.3

10.2.4

Device Information ........................... 33

Device Specific Data ........................ 34

Current Sample (CS) or Count Data. 35

Device Settings ................................ 37

11 ELECTRICAL SPECIFICATIONS – ALL

PRELIMINARY .................................................. 40

DESCRIPTION OF USER SELECTABLE

OPTIONS............................................................18

11.1

11.2

25°C) 40

ABSOLUTE MAXIMUM SPECIFICATIONS ........... 40

GENERAL CHARACTERISTICS (MEASURED AT

6.1

6.2

IQS213A (IQS213) IC TYPE ....................... 18

SELF- / PROJECTED CAPACITANCE................ 18

6.2.1 Capacitive Sense Electrode Design

Samples ............................................................ 19

11.3

TIMING CHARACTERISTICS ............................ 42

6.3

6.4

6.5

6.6

6.7

6.8

6.9

6.10

6.11

6.12

FLOAT RX................................................... 19

OUTPUT LOGIC SELECT................................ 19

HALT TIME .................................................. 20

LOW POWER MODES ................................... 20

PROXIMITY THRESHOLD ............................... 21

TOUCH THRESHOLDS ................................... 21

IQS213A (IQS213) SWIPE UI ................... 22

ZERO STATES ALLOWED .............................. 22

END ON ZERO STATE ................................... 22

STATE TIMES .............................................. 22

12 PACKAGING INFORMATION................... 43

FIGURE 12.1 MSOP-10 BACK VIEW........................... 43

FIGURE 12.2 MSOP-10 SIDE VIEW............................ 43

FIGURE 12.3 MSOP-10 TOP VIEW............................. 43

FIGURE 12.4 MSOP-10 FOOTPRINT. ......................... 43

13 DEVICE MARKING ................................... 44

13.1

13.2

TOP MARKING.............................................. 44

BOTTOM MARKING ....................................... 44

6.12.1

6.12.2

6.12.3

Minimum State Time ........................ 22

Maximum State Time ....................... 23

Overall State Time ........................... 23

14 ORDERING INFORMATION ..................... 45

14.1

15 CONTACT INFORMATION....................... 46

GENERAL PART ORDER NUMBER .................. 45

6.13

6.14

6.15

6.16

6.17

6.18

TOUCH/SWIPE (PIN7) OUTPUT...................... 23

AC FILTER.................................................. 23

ATI METHOD............................................... 23

BASE VALUE ............................................... 23

ATI TARGET VALUE ..................................... 23

AUTO-OFF / ADVANCED AUTO-OFF WARNING 24

6.18.1

Advanced Auto-Off Warning (AAOW)

6.18.2

6.19

AAOW Clear / Reset........................ 24

I²C DEBUG ................................................. 24

ADDITIONAL FEATURES .........................24

7.1

NOISE DETECTION ....................................... 24

7.1.1 Notes for layout: ................................... 24

PROXSENSE^®MODULE...........................26

8.1

8.2

CHARGE TRANSFER CONCEPTS .................... 26

PROXSENSE MODULE SETUP...................... 26

IQS213A (IQS213) Datasheet

Revision 2.1

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IQ Switch^®

ProxSense^®Series

1 Functional Overview

by the digital circuitry. For projected-

capacitance configurations the capacitance is

measured between the transmit (TX) and

receive (CRX) pins. The measuring process

is referred to as a conversion and consists of

the discharging of C_Sand C_X, the charging of

C_Xand then a series of charge transfers from

C_Xto C_Suntil a trip voltage is reached. The

number of charge transfers required to reach

the trip voltage is referred to as the Count

(CS) Value.

The capacitance measurement circuitry

makes use of an internal C_Sand voltage

reference (V_REG).

The analogue circuitry further provides

functionality for:

The IQS213A (IQS213) is a two or three

channel capacitive proximity and touch

sensor with variable swipe function

configurations. Additional features include

internal voltage regulation and reference

capacitor (C_S), which enables cost efficient

and minimal component designs. The device

offers flexible design approaches by allowing

the connection of two or three sense

antennas in either surface or projected

capacitance configurations.

For swipe function applications the device

has a single logic output to indicate swipe

actions and one complementary output for

consecutive swipe/touch activities.

The

device can also be configured to operate with

individual touch outputs, with an additional

proximity output when implementing surface

capacitance sense electrodes.

Power on reset (POR) detection.

Brown out detection (BOD).

Full control by a master device is achieved by

configuring the logic outputs in a serial data

(I²C) communication option on TO0 (SCL),

TO1 (SDA) and TO2 (RDY).

3 Digital Functionality

The digital processing functionality is

responsible for:

The device automatically tracks slow varying

environmental changes via various filters,

detects noise and has an Automatic Tuning

Implementation (ATI) to tune the device for

optimal sensitivity.

Device setup from OTP settings after

POR.

Management of BOD and WDT

events.

Initiation of conversions at the

selected rate.

Processing of CS and execution of

algorithms.

1.1 Applicability

All specifications, except where specifically

mentioned otherwise, provided by this

datasheet are applicable to the following

ranges:

Monitoring and automatic execution of

the ATI algorithm.

Signal processing and digital filtering.

Detection of PROX and TOUCH

events.

Temperature: -40°C to +85°C

Managing outputs of the device.

Managing serial communications.

Supply voltage (V_DDHI): 1.8V to 3.6V

Manage

options.

programming

OTP

2 Analogue Functionality

For self-capacitance configured sense

electrodes the analogue circuitry measures

the capacitance of the sense antennas

attached to the C_Xpins through a charge

transfer process that is periodically initiated

IQS213A (IQS213) Datasheet

Revision 2.1

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IQ Switch^®

ProxSense^®Series

4 Hardware Configuration

4.1 IQS213A (IQS213) - MSOP10 Pin-Out

Figure 4.1 : Pin-out of IQS213 Surface package

Table 4.1 : IQS213 Pin-out

IQS213 Pin-out

Type

Name

Function

Ground Reference

Sense Electrode 0

GND

Supply Input

Analogue

CX0 (CRX0)

CX1 (CRX1)

VDDHI

Analogue

Sense Electrode 1

Supply Input

Supply Voltage Input

Internal Regulator Pin (Connect 1µF

bypass capacitor)

VREG

Analogue Output

Swipe Output/Touch Output/I²C:

RDY Output

Pulse Output/Touch Output/I²C:

SDA Output

SWIPE/TO2/RDY Digital Output

PULSE/T01/SDA Digital Output

AAOW/TO0/SCL Digital I/O

Auto-Off Warning/Touch

Output/I²C: SCL Input

CX2 (CRX2)

Analogue

Sense Electrode 2

Digital Output / Proximity Output/ Projected Sense

10 PO/TX

Transmitter

Electrode

IQS213A (IQS213) Datasheet

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4.2 Reference Design (IQS213A, Self-Capacitance, Active-Low Output)

*For IQS213, use C3 = 470nF.

Figure 4.2 : IQS213A Reference Design (Self-Capacitance, Active-Low)

4.2.2 Power Supply and PCB Layout

Azoteq IC's provide a high level of on-chip hardware and software noise filtering and ESD

protection (refer to application note “AZD013 – ESD Overview”). Designing PCB's with better

noise immunity against EMI, FTB and ESD in mind, it is always advisable to keep the critical noise

suppression components like the de-coupling capacitors and series resistors in Figure 4.2 as close

as possible to the IC. Always maintain a good ground connection and ground pour underneath the

IC. For more guidelines please refer to the relevant application notes as mentioned in Section

4.2.3.

IQS213A (IQS213) Datasheet

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4.2.3 Design Rules for Harsh EMC Environments

Figure 4.3 : EMC Design Rules

 Applicable application notes: AZD013, AZD015, AZD051, AZD052.

4.2.4 High Sensitivity

Through patented design and advanced signal processing, the device is able to provide

extremely high sensitivity to detect proximity. This enables designs to detect proximity at

distances that cannot be equaled by most other products. When the device is used in

environments where high levels of noise exist, a reduced proximity threshold is proposed to

ensure reliable functioning of the sensor.

When the capacitance between the sense antenna and ground becomes too large the

sensitivity of the device may be influenced. For more guidelines on layout, please refer to

application note AZD008, available on the Azoteq web page: www.azoteq.com.

IQS213A (IQS213) Datasheet

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5 User Configurable Options

The IQS213A (IQS213) provides One Time Programmable (OTP) user options (each option can be

modified only once). However, with the use of Azoteq‟s IQS213(A) GUI software, the IQS213A can

enter streaming mode in a start-up state (Test Mode) where the OTP options can be configured

and evaluated, before programming.

The device is fully functional in the default (un-configured) state, as a 2-Channel Self-capacitive

SwipeSwitch IC.

The configuration of the device can be done on packaged devices or in-circuit. In-circuit

configuration may be limited by the type and/or values of external components chosen.

Please see Section 5.3 for IQS213A device setup and output configuration examples.

5.1 Configuring of Devices

Azoteq offers a Configuration Tool (CT210 or later) and associated software (USBProg.exe) that

can be used to program the OTP user options for prototyping purposes. More details regarding the

configuration of the device with the USBProg program can be found in "AZD007 - USBProg

Overview" available on the Azoteq website.

For further enquiries regarding this subject, please contact your local distributor or submit enquiries

to Azoteq at: ProxSenseSupport@azoteq.com

IQS213A (IQS213) Datasheet

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IQ Switch^®

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5.2 User Selectable Configuration Options

Table 5.1 : User Selectable Configuration Options : Bank 0

bit7

Bank 0

bit0

THALT1

THALT0

LOGIC

FLOAT RX

PROJ

IC TYPE2

IC TYPE1

IC TYPE0

Bank0: bit7:6

THALT1:THALT0: LTA Halt Time

Section 6.5

00 = 2.5s

01 = 20s

10 = 60s

11 = Never

Bank0: bit5

Bank0: bit4

Bank0: bit3

Bank0: bit2:0

LOGIC: Output Logic

Section 6.4

Section 6.8

Section 6.2

Section 6.1

0 = Active Low¹

1 = Active High

FLOAT RX: Float Sense Electrodes

0 = No

1 = Yes

PROJ: Capacitive Technology

0 = Self Capacitance

1 = Projected Capacitance

IC TYPE: Select IC type

000 = 1zz 12z z2z

- 2CH SWIPE

001 = 1zz x2x zz3

- 3CH SWIPE (Thresholds * 2)

- 3CH SWIPE

010 = 1zz z2z zz3

011 = 1zz 12z z2z z23 zz3

100 = 2CH Normal

101 = 3CH Normal

110 = 1zz 1xz x2x zx3 zz3

111 = 1zz, x2x, zz3

- 3CH SWIPE

- 2 Channel Touch Sensor

- 3 Channel Touch Sensor

- 3CH SWIPE

¹Active Low configurations are software open-drain (SW OD).

Note: The proximity output on the PO/TX-pin (pin 10) is multiplexed with the transmit signal (TX)

for projected capacitance electrodes, and is Active High ONLY for Projected configurations.

IQS213A (IQS213) Datasheet

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Table 5.2 : User Selectable Configuration Options : Bank 1

bit7

Bank 1

bit0

LP0

CH2 TTH1 CH2 TTH0 CH1, CH3

TTH1

CH1, CH3

TTH0

TTH ALT

PTH DIV

LP1

Bank1: bit7:6

CH2 TTH1:CH2 TTH0: Channel 2 Touch Threshold

Section 6.8

TTH ALT = 0

00 = 4

TTH ALT = 1

00 = 22

01 = 8

01 = 28

10 = 12

11 = 16

10 = 36

11 = 48

Bank1: bit5:bit4

CH1, CH3 TTH: Ch 1 & Ch 3 Touch Threshold

Section 6.8

TTH ALT = 0

00 = 4

TTH ALT = 1

00 = 22

01 = 8

01 = 28

10 = 12

11 = 16

10 = 36

11 = 48

Bank1: bit3

Bank1: bit2

Bank1: bit1:0

TTH ALT: Alternative Touch Thresholds

Section 6.8

Section 6.7

Section 6.6

0 = No

1 = Yes

PTH: Proximity Threshold Selection

0 = 3 Counts

1 = 8 Counts

(IQS213: PTH = CH1 TTH / 2)

(IQS213: PTH = CH1 TTH / 4)

LP1:LP0: Low Power Selection

00 = NP

- Normal Power

01 = 128ms

10 = 256ms

11 = 512ms

- Low Power Mode 1

- Low Power Mode 2

- Low Power Mode 3

IQS213A (IQS213) Datasheet

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Table 5.3 : User Selectable Configuration Options : Bank 2

bit7

ACF

Bank 2: SWIPE IC

bit0

Pin7_OUT CHG_FRQ Min_State

Zero_End Zero_State SWIPE UI1 SWIPE UI0

Bank2: bit7

Bank2: bit6

Bank2: bit5

Bank2: bit4

Bank2: bit3

Bank2: bit 2

Bank2: bit 1:bit0

ACF: AC Filter Selection

Section 6.14

0 = Disabled

1 = Enabled

Pin7_OUT: SWIPE IC Pin 7 Output Selection

Section 6.13

Section 8.3

Section 6.12

Section 6.11

Section 6.10

Section 6.9

0 = Touch

1 = Pulse

CHG_FRQ: Charge Transfer Frequency

0 = 0.5MHz / 1.0MHz

1 = 1.0MHz / 2.0 MHz

(Self - / Projected Capacitance)

Min_State: Minimum State Time

0 = 1 Sample

1 = 2 Samples

Zero_End: End Swipe on Zero State (zzz)

0 = Disabled

1 = Enabled

Zero_State: Allow Zero States In Swipe Sequence

0 = Disabled

1 = Enabled

SWIPE UI1: SWIPE UI0: Swipe UI Selection

00 = Single Direction

01 = Bi-Directional

10 = Directional

11 = Dual Swipe

IQS213A (IQS213) Datasheet

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Table 5.4 : User Selectable Configuration Options : Bank 2

bit7

ACF

Bank 2: Normal Touch IC

bit0

CHG_FRQ

Toggle

CH3

Toggle

CH2

Toggle

CH1

Bank2: bit7

ACF: AC Filter Selection

Section 6.14

0 = Disabled

1 = Enabled

Bank2: bit6

Bank2: bit5

CHG_FRQ: Charge Transfer Frequency

Section 8.3

0 = 0.5MHz / 1.0MHz

1 = 1.0MHz / 2.0 MHz

(Self - / Projected Capacitance)

Bank2: bit4

Bank2: bit3

Bank2: bit 2

Toggle CH3: Channel 3 Touch Output = Toggle

0 = Disabled

1 = Enabled

Bank2: bit 1

Bank2: bit 0

Toggle CH2: Channel 2 Touch Output = Toggle

0 = Disabled

1 = Enabled

Toggle CH1: Channel 1 Touch Output = Toggle

0 = Disabled

1 = Enabled

IQS213A (IQS213) Datasheet

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Table 5.5 : User Selectable Configuration Options : Bank 3

bit7

Bank 3

bit0

AAO_CLR

AAO

ATI_Target ATI_Base

Bank3: bit7

Bank3: bit6

Bank3: bit5

Bank3: bit4

Bank3: bit3

System Use

AAO_CLR: Clear Auto-Off Timer On Event

Section 6.18

Section 6.17

0 = Touch Event

1 = Proximity Event

Bank3: bit 2

Bank3: bit 1

AAO: Advanced Auto-Off Function Selection

0 = Enabled

1 = Disabled

ATI_Target: ATI Target Value

Proximity

320

Touch

160

0 =

1 =

640

320

Bank3: bit 0

ATI_Base: ATI Base Value (All Channels)

Section 6.16

0 = 75

(IQS213: 0 = 50)

(IQS213: 1 = 100)

1 = 100

IQS213A (IQS213) Datasheet

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Table 5.6 : User Selectable Configuration Options : Bank 4

bit7

Bank 4

bit0

I²C Debug

Bank4: bit7

Bank4: bit6

Bank4: bit5

Bank4: bit4

Bank4: bit3

System Use

I²C Debug: I²C Interface (Default = Event-Mode)

Section 6.19

0 = Disabled

1 = Enabled

Bank4: bit 2

Bank4: bit 1

Bank4: bit 0

System Use

IQS213A (IQS213) Datasheet

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5.3 IQS213A (IQS213) Setup Examples

5.3.1 Example 1: 3-Channel Self Capacitive, Active Low Logic Output, SwipeSwitch

with Auxiliary Touch Output.

Example 1 (see Figure 5.1) illustrates the user interface (UI) and device outputs for a 3-

Channel Self Capacitive SwipeSwitch (output on pin 6), in an active low configuration with

the Directional UI and Auxiliary Touch Output on pin 7.

5.3.1.1 Selected User Configuration Options (Example 1):

bit7

THALT1

Bank 0

bit0

IC TYPE0

THALT0

LOGIC

FLOAT RX

N/A

PROJ

IC TYPE2

IC TYPE1

*** The IC TYPE can be any 3-Channel SwipeSwitch™ option, e.g. 001,110 or 111.

THALT1:0 = 00 – 2.5s Halt time selected for this example.

bit7

Bank 1

bit0

CH1, CH3

TTH1

CH1, CH3

CH2 TTH1 CH2 TTH0

TTH ALT

N/A

PTH DIV

N/A

LP1

N/A

LP0

N/A

TTH0

N/A

bit7

ACF

N/A

Bank 2: SWIPE IC

bit0

Pin7_OUT CHG_FRQ Min_State

N/A N/A

Zero_End Zero_State SWIPE UI1 SWIPE UI0

N/A

bit7

Bank 4

bit0

I²C Debug

5.3.1.2 Device outputs (Directional SwipeSwitch™ UI)

Figure 5.1 : IQS213A (IQS213) setup example 1

IQS213A (IQS213) Datasheet

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5.3.2 Example 2: 3-Channel Projected Capacitive, Active High Logic Output,

SwipeSwitch with Auxiliary Swipe Pulse Output.

Example 2 (see Figure 5.2) illustrates the user interface (UI) and device outputs for a 3-

Channel Projected Capacitive SwipeSwitch (output on pin 6), in an active high configuration

with the Bi-Directional UI and Auxiliary Swipe Pulse Output on pin 7.

5.3.2.1 Selected User Configuration Options (Example 2):

bit7

THALT1

N/A

Bank 0

bit0

IC TYPE0

THALT0

N/A

LOGIC

FLOAT RX

N/A

PROJ

IC TYPE2

IC TYPE1

*** The IC TYPE can be any 3-Channel SwipeSwitch option, e.g. 001,110 or 111.

bit7

Bank 1 bit0

CH1, CH3

TTH1

CH1, CH3

CH2 TTH1 CH2 TTH0

TTH ALT

N/A

PTH DIV

N/A

LP1

N/A

LP0

N/A

TTH0

N/A

bit7

ACF

N/A

Bank 2: SWIPE IC

bit0

Pin7_OUT CHG_FRQ Min_State

N/A N/A

Zero_End Zero_State SWIPE UI1 SWIPE UI0

N/A N/A

Pin7_OUT = 1 : The output on pin 7 will be a pulse signal *(within a 2-second window),

of which the pulse length depends on the direction of the swipe event. See Section

6.13. *The 2-second window is reset after each swipe event.

bit7

Bank 4

bit0

I²C Debug

5.3.2.2 Device outputs (Bi-Directional SwipeSwitch UI)

Figure 5.2 : IQS213A (IQS213) Setup example 2

IQS213A (IQS213) Datasheet

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5.3.3 Example 3: Normal Mode Operation

Example 3 illustrates the user interface (UI) and device outputs for a 2- or 3-Channel Normal

Mode (TOUCH) Device, with optional toggle state outputs. Note that the lower three bits of

Bank2 are reserved for Toggle options, when the IC TYPE is selected in a Normal Mode

configuration. The Normal Mode (i.e Touch) device can be either Self- or Projected Capacitive

with either Active High or Active Low (Logic) outputs.

5.3.3.1 Example 3.1: 2-Channel Normal Mode – No Toggle Active, Active Low Logic

bit7

THALT1

N/A

Bank 0

bit0

IC TYPE0

THALT0

N/A

LOGIC

FLOAT RX

N/A

PROJ

N/A

IC TYPE2

IC TYPE1

bit7

ACF

N/A

Bank 2: Normal Touch IC

bit0

Toggle

CH1

Toggle

CH3

Toggle

CH2

CHG_FRQ

N/A

Figure 5.3 : IQS213A (IQS213) Setup example 3.1

5.3.3.2 Example 3.2: 3-Channel Normal Mode – All Toggles Active, Active High Logic

bit7

THALT1

N/A

Bank 0

bit0

IC TYPE0

THALT0

N/A

LOGIC

FLOAT RX

N/A

PROJ

N/A

IC TYPE2

IC TYPE1

bit7

ACF

N/A

Bank 2: Normal Touch IC

bit0

Toggle

CH1

Toggle

CH3

Toggle

CH2

CHG_FRQ

N/A

IQS213A (IQS213) Datasheet

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Figure 5.4 : IQS213A (IQS213) Setup example 3.2

IQS213A (IQS213) Datasheet

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IQ Switch^®

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The IQS213(A) also has 2 selectable normal

6 Description

User

setup configurations, which allows the user to

implement standard touch and proximity

sensing features.

Selectable Options

This section briefly describes the individual

user programmable options of the IQS213A

(IQS213), with additional information and

detailed descriptions being provided in

Section 8.

2CH Normal Mode

2-Channel Normal Touch operation.

3CH Normal Mode

3-Channel Normal Touch operation.

Thresholds and other settings can also be

evaluated in Test Mode streaming without

programming the OTP options. For the

With the device setup in either 2-channel or

3-channel Normal Mode, touch events

corresponding to the different sense

electrodes will be output on TO0 (pin 8), TO1

(pin 7) and TO2 (pin 6), with a proximity

output available on PO (pin 10).

appropriate

software,

please

visit:

www.azoteq.com

6.1 IQS213A (IQS213) IC Type

The IQS213(A) has 6 selectable SwipeSwitch

setup configurations, allowing the user

maximum freedom in the design of the

intended application. The device type

configuration specifies the required user

input, which is identified by a sequence of a

combination of input states, where a [number]

During Normal Mode operation, setting the

different “Toggle_CHx” bits in Bank 2, will

enable the touch output signals to toggle.

6.2 Self- / Projected Capacitance

(e.g. 1,

or 3) indicates

touch

Enabling the projected capacitance option,

will cause the measurement of the sense

electrode capacitance between the transmit

(TX) and receive (CRX) pins.

condition/state on that specific channel, a [z-

character] indicates a zero condition/state

and a [x-character] indicates a “don't care”

condition/state (i.e. a number or zero

condition is acceptable). The input states

related to sequences accepting x-character

conditions are also referred to as relaxed

states.

The proximity output on the PO/TX-pin (pin

10) is multiplexed with the transmit signal

(TX) for projected capacitance electrodes,

and is Active High ONLY for such

configurations.

The

implementation

projected

2CH SWIPE - 1zz 12z z2z

2-Channel swipe switch operation.

capacitance sense electrode will result in a

higher charge frequency (i.e. f_Cm= 1MHz)

compared to that of a self capacitance

configuration (i.e. f_Cs= 500kHz). Setting bit5 in

Bank2 will double the charge frequency for

both projected- and self capacitance

configurations (i.e. f_Cm/ f_Cs= 2MHz / 1MHz).

3CH SWIPE – 1zz x2x zz3 (TH*2)

3-Channel swipe switch operation.

3CH SWIPE - 1zz z2z zz3

3-Channel swipe switch operation.

3CH SWIPE - 1zz 12z z2z z23 zz3 :

3-Channel swipe switch operation.

A higher charge frequency selection is

preferred for increased immunity against

aqueous substances when used in most

3CH SWIPE - 1zz 1xz x2x zx3 zz3 :

3-Channel swipe with relaxed states.

3CH SWIPE - 1zz x2x zz3

3-Channel swipe with relaxed states.

projected

capacitance

configurations.

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6.2.1 Capacitive Sense Electrode Design Samples

6.2.1.1 Self Capacitance Electrodes

2-Channel Self Capacitance Electrode

3-Channel Self Capacitance Electrode

Figure 6.1 : Self Capacitance Swipe Switch Sample Electrodes.

6.2.1.2 Projected Capacitance Electrodes

2-Channel Projected Capacitance Electrode

3-Channel Projected Capacitance Electrode

Figure 6.2 : Projected Capacitance Swipe Switch Sample Electrodes.

Disabled), by setting the logic output Active

High (Push-Pull) or Active Low (SW OD).

6.3 Float Rx

During the charge transfer process (see

Figure 8.1) the channels that are not being

processed during the current cycle, is

effectively grounded to decrease the effects

of noise-coupling between the sense

electrodes. Selecting the "Float RX" option

(Bank0 bit4), will thus result in the non-

current channels to float (i.e. not grounded)

during the charge cycle of the current

channel.

For Active Low operation, the device output

pins are set in a software open-drain (SW

OD) configuration, which requires the use of

external pull-up resistors on the output pins.

The proximity output on the PO/TX-pin (pin

10) is multiplexed with the transmit signal

(TX) for projected capacitance electrodes,

and is Active High ONLY for Projected

configurations. Thus for self capacitance

configurations, the proximity output on PO

(pin10) depends on the selected output logic

(Bank0 bit5).

6.4 Output Logic Select

The IQS213(A) can be set to sink or source

current in stand-alone mode (I²C Debug =

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6.5 Halt Time

The Halt Timer is started when a proximity or

touch event occurs and is restarted when that

event is removed or reoccurs. When a

proximity condition occurs on any of the

channels, the LTA (Long-Term Average)

value for that channel will be "halted", thus its

value will be kept fixed, until the proximity

event is cleared, or the halt timer reaches the

halt time. The halt timer will count to the

selected halt time (t_HALT), which can be

configured in the user selectable options (i.e.

Bank0 bit7:6), and if the timer expires, all

outputs will be cleared.

It is possible that the CS (Count) value could

be outside the ATI band (ATI Target +-

12.5%) when the timer expires, which will

cause the device to perform a re-ATI event.

The designer needs to select a halt timer

value (t_HALT) to best accommodate the

required application:

2.5 seconds : Halt LTA for 2.5 seconds after the last proximity or touch event.

20 seconds : Halt LTA for 20 seconds after the last proximity or touch event.

60 seconds : Halt LTA for 60 seconds after the last proximity or touch event.

Never

: Never halt LTA

With the 'Never' option, the detection of a proximity or touch event

will not halt the LTA and the LTA will adjust towards the CS value

until the CS value is reached. The touch and proximity output of a

channel will thus be cleared automatically when the difference

between the LTA and CS is less than the specified threshold value.

6.6 Low Power Modes

The IQS213(A) IC has three low power

modes specifically designed to reduce

current consumption for battery applications.

While in any low power mode, only Channel 0

is active and the device will zoom to NP

whenever the CS value indicates a possible

proximity or touch event on CH0 (refer to

Figure 6.3). This improves the response

time. The device will remain in NP for t_ZOOM

seconds and then return to the selected low

power mode. The Zoom function allows

reliable detection of events with the current

samples being produced at the NP rate.

Please see Section 8.4 or refer to

“Application Note AZD079 – IQS213 Touch

response rate” for more information.

The power modes are implemented around

the occurrence of a charge cycle every

t_SAMPLEseconds (refer to Table 6.1). Lower

sampling

frequencies

typically

yield

significant lower power consumption (but also

decreases the response time).

During normal operation charge cycles are

initiated approximately every 2.6ms in the

stand-alone setup and 3.9ms in the I²C

debug setup. This is referred to as Normal

Power Mode (NP). The IQS213(A) by default

charges in Normal Power Mode.

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Table 6.1 : Low Power Mode Timing (t_LP)

Power Mode

t_SAMPLE

(I²C )

(Stand-alone)

NP (Default)

LP1

2.6 ms

128 ms

256 ms

512 ms

3.9ms

128ms

256ms

512ms

LP2

LP3

Figure 6.3 : LP Modes – Charge Cycles

6.7 Proximity Threshold

6.8 Touch Thresholds

The IQS213A has 2 proximity threshold (P_TH)

settings. The proximity threshold is selected by

the designer to obtain the desired sensitivity

and noise immunity. The proximity event is

triggered based on the selected proximity

threshold, which is either 3 or 8 counts.

The IQS213(A) has 8 touch threshold settings.

The touch threshold is selected by the

designer to obtain the desired touch sensitivity.

The touch event is triggered based on the

selected touch threshold, which is expressed

as a fraction of the LTA, given by:

(For IQS213, P_THis calculated by dividing the

selected touch threshold value of channel 1

(CH1_TTH) with the value corresponding to the

PROX_DIVbit (i.e. either 2 or 4). The proximity

threshold is expressed in terms of counts, the

same as the CS value)

. (See Section 8.8)

For a touch event, the difference between LTA

and CS (counts) of the touch channel should

be greater than the selected touch threshold

for at least 2 consecutive samples.

On the IQS213(A) device, the touch threshold

settings are grouped for channels 1 and 3

(CH1,3 T_TH) and is separate for channel 2 (CH2

T_TH).

For proximity events, the difference between

the LTA and CS (in counts) of the proximity

channel should be greater than P_THfor at least

4 consecutive samples, unless the CS delta is

greater than the touch threshold of any active

channel. (See Section 8.8)

The IQS213(A) device is by default setup

without the alternative threshold settings. The

alternative threshold values can be selected by

setting the TTH_ALT bit (i.e. bit3 in Bank1).

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If for specific applications the designer requires

6.10 Zero States Allowed

larger touch threshold values than the

available selections, they may select the “3CH

SWIPE – 1zz x2x zz3 (TH*2)” IC TYPE in

Bank0 of the user configurable options.

Setting the Zero_State bit in Bank2, will allow

the occurrence of zero or "no touch" conditions

between the different state combinations in

each sequence of the selected IC type (refer to

Section 6.1 for IC types).

This selection is for a three channel sense

electrode

configuration

only

and

will

This grants the designer a certain degree of

freedom in the selected device sensitivity and

implemented sense electrode.

automatically multiply the threshold selections

by two.

6.9 IQS213A (IQS213) SWIPE UI

If for example the IC type is selected to be

“3CH SWIPE - 1zz z2z zz3”, then the

sequence „1zz zzz z2z zzz zz3‟ of state

combinations will also be acknowledged as a

valid swipe event.

The IQS213(A) has 4 selectable swipe switch

user interface (UI) configurations. The swipe UI

specifies the required event(s) to activate the

outputs of the device:

Single Direction:

The device only acknowledges

6.11 End on Zero State

swipe events in the direction of

CH1>CH2 for a 2-channel and

CH1>CH2>CH3 for a 3-channel

device setup.

Setting the Zero_End bit in Bank2, will append

an additional zero or "no touch" state to the

required sequence of state combinations.

If for example the IC type is selected to be

“3CH SWIPE - 1zz z2z zz3”, then the

sequence „1zz z2z zz3 zzz’ of state

combinations will be acknowledged as a valid

swipe event ONLY.

Bi-Directional:

The device acknowledges swipe

events in both the forward

(CH1>CH2>...) and reverse

(...>CH2>CH1) directions.

Directional:

6.12 State Times

A swipe event in the forward

(CH1>CH2>...) direction will

enable the swipe output (ON)

and a swipe in the reverse

The minimum, maximum and overall swipe

state times controls the effective period during

which a successful swipe event can be

recognized. The state times are defined in

swipe state samples, where each sample

period t_STATEis equal to 4 charge transfer

periods. For stand-alone device operation this

results in a state sample time of approximately

t_STATE= 10.4ms.

(...>CH2>CH1)

direction

will disable the output (OFF).

Dual Swipe:

This UI requires a swipe event

in one direction, followed by a

swipe event in the opposite

direction within 1 second, to

enable the swipe output (ON).

Thereafter, a single swipe in

any direction will subsequently

disable the swipe output again

(OFF).

The state time values can also be set up or

changed in I²C debug mode.

6.12.1 Minimum State Time

The minimum state time (t_MIN) defines the

minimum period (in multiples of t_STATE) for

which each combination of states (e.g. 1zz)

must be present during processing of the

current sequence of the state combination.

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Selecting shorter minimum state times will

(CS) measurements in electrically noisy

effectively allow faster swipe events.

environments by setting the ACF bit in Bank2.

The AC filter also enforces a longer minimum

sample time for detecting proximity events,

which may result in a slower response rate

when the device enters low power modes.

6.12.2 Maximum State Time

The maximum state time defines the maximum

period for which each combination of states

(e.g. 1zz) may be present during processing of

the current sequence of the state combination.

This value is fixed at t_MAX= 45*t_STATEby default,

but is accessible in I²C debug mode. Selecting

longer maximum state times will effectively

allow slower swipe events.

6.15 ATI Method

In the stand-alone configuration the IQS213(A)

is automatically set up in Full ATI to set up the

device for optimal sensitivity.

6.12.3 Overall State Time

In the I²C debug configuration, the IQS213(A)

can be set up to start in two ways, Full ATI and

Partial ATI. In Full ATI mode, the device

automatically selects the multipliers through

the ATI algorithm to setup the IQS213(A) as

close as possible to its default sensitivity for

the environment where it was placed. The

designer can, however, select Partial ATI, and

set the multipliers to a pre configured value.

This will cause the IQS213(A) to only calculate

the compensation (not the compensation and

multipliers as in Full ATI), which allows the

freedom to make the IQS213(A) more or less

sensitive for its intended environment of use.

(Please refer to Section 8.9.)

The overall state time is the total allowable

time for performing a swipe event and is by

default set to 1 second. This value can also be

changed in I²C debug mode in steps of 250ms.

6.13 Touch/Swipe (Pin7) Output

The IQS213(A) has one complementary output

on pin 7 of the IC. This pin can be configured

to output either touch events or pulses upon

swipe events, after the swipe output (pin 6) has

been enabled.

By default the IQS213(A) will output a logic

signal for touch events on any of the three

sense electrodes. If the Pin7_Out bit in Bank2

is set, the device will output a short pulse for

every consecutive swipe event within 2

seconds after the first swipe event.

6.16 Base Value

The IQS213(A) has the option to change the

base value of all channels during the ATI

algorithm. Depending on the application, this

provides the user with another option to select

the sensitivity of the IQS213(A) without

changes in the hardware (CX sizes and

routing, etc). By setting the ATI_Base bit in

Bank3, the base value can be set to be 75

(IQS213 = 50) or 100. A lower base value will

typically result in a higher sensitivity of the

device. (Refer to Section 8.9)

The generated pulses have different pulse

widths (t_PULSE), depending on the direction of

the swipe event:

Long Pulse: A long pulse (t_PULSE

9ms) will be output for swipes in the

forward ( ) direction.

≈

Short Pulse: A short pulse (t_PULSE

3ms) will be output for swipes in the

reverse ) direction.

≈

6.17 ATI Target Value

6.14 AC Filter

The default target counts of the IQS213(A) are

320 for the proximity channel, and 160 for the

touch channels.

The AC filter can be implemented to provide

better stability of the proximity channel‟s count

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However, for some applications, a more

be active low when it is ready for

communication, and it will go high when it is

doing conversions. The IQS213(A) will not

acknowledge (ACK) on its address while the

RDY line is high (i.e. while the IQS213(A) is

doing conversions).

sensitive device and higher target is required.

Therefore, the ATI_Target bit in Bank3 can be

set, changing the targets to 640 for the

proximity channel, and 320 for the touch

channels. (See Section 8.9)

6.18 Auto-Off / Advanced Auto-

Off Warning

7 Additional Features

7.1 Noise Detection

To prevent battery drainage in the unlikely

event of a false activation of the output load,

the IQS213(A) is equipped with an Auto-Off

functionality. The Auto-Off (AAO) feature can

be disabled by setting the AAO bit in Bank3.

The IQS213(A) has advanced integrated

immunity to RF noise sources such as GSM

cellular telephones, DECT, Bluetooth and WIFI

devices. Design guidelines should however be

followed to ensure the best noise immunity.

(Please see Section 8.10)

6.18.1 Advanced

(AAOW)

Auto-Off

Warning

In stand-alone operation the Advanced Auto-

Off Warning (AAOW) timer is set for 10

minutes. After the first warning, a second

warning will be given after 30s. Another 30s

after the second warning, the device will switch

off automatically (i.e. disable all outputs).

7.1.1 Notes for layout:

A ground plane should be placed under

the IC, except under the CX lines.

Place the sensor IC as close as

possible to the sense electrodes.

In I²C operation the Auto-Off (AAO) and

Advanced Auto-Off Warning (AAOW) timers

can be set to any value in multiples of 30s.

All the tracks on the PCB must be kept

as short as possible.

The capacitor between VDDHI and

GND as well as between VREG and

GND must be placed as close as

possible to the IC.

6.18.2 AAOW Clear / Reset

The AAO timer is by default cleared (reset) on

a touch event on any channel. Setting the

AAO_CLR bit in Bank3, the AAO timer will be

reset upon a proximity event.

A 100 pF capacitor can be placed in

parallel with the 1uF capacitor between

VDDHI and GND. Another 100 pF

capacitor can be placed in parallel with

the 1uF capacitor between VREG and

GND.

6.19 I²C Debug

A streaming option is available that allows for

serial data communication on the IQS213(A).

Data streaming is done via an I²C compatible

3-wire interface, which consist of a data (SDA),

clock (SCL) and ready (RDY) line (for

IQS213(A) pin-out refer to Figure 4.1).

When the device is too sensitive for a

specific application a parasitic capacitor

(max 5pF) can be added between the

CX line and ground.

Proper sense antenna and button

design principles must be followed.

The IQS213(A) can only function as a slave

device on the bus, and will only acknowledge

on address 0x44H.

Unintentional

coupling

sense

antenna to ground and other circuitry

must be limited by increasing the

distance to these sources.

The RDY line is to be used by the host

controller as an indication of when to start

communication to the device. The RDY line will

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In some instances a ground plane

some distance from the device and

sense antenna may provide significant

shielding from undesirable interference.

However, if after proper layout,

interference from an RF noise

source persists, see application

note AZD015.

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unsigned integer values) are processed and

compared to the LTA to detect Touch and

Proximity events.

8 ProxSense^®Module

The IQS213(A) contains a ProxSense^®module

that uses patented technology to provide

detection of PROX/TOUCH on numerous

sensing lines.

For more information regarding capacitive

sensing, refer to the application note: “AZD004

– Azoteq Capacitive Sensing”.

The ProxSense^®module is a combination of

hardware and software, based on the

principles of charge transfer measurements.

Please note: Attaching scope probes to the

Cx/CTX/CRX pins will influence the

capacitance of the sense electrodes and

therefore the related CS values of those

channels. This will have an instant effect on

the CS measurements.

For I²C communication related data registers,

please refer to the IQS213(A) Memory Map in

Section 10.

8.1 Charge Transfer Concepts

8.2 ProxSense^®Module Setup

Capacitance measurements are taken with a

charge transfer process that is periodically

initiated.

The IQS213(A) samples its channels in 4 time

slots, with one internal Cs capacitor. The

charge sequence is illustrated in Fig. 8.1.

Self capacitance sensing measures the

capacitance between the sense electrode (Cx)

relative to ground.

Projected capacitance sensing measures the

capacitance between 2 electrodes referred to

as the transmitter (CTX) and receiver (CRX).

The measuring process is referred to as a

charge transfer cycle and consists of the

following:

Discharging of an internal sampling

capacitor (Cs) and the antenna

capacitors (self: Cx or projected: CTX &

CRx) on a channel.

Figure 8.1 IQS213(A) Charge Transfers

The IQS213(A) charges its four channels, CH0

(Distributed Proximity Channel) and three

Touch Channels (CH1, CH2 and CH3)

independently during the four time slots.

During these time slots, the non-current

channels can either be grounded or set to float.

charging of Cx‟s / CTX‟s connected to

the channel

and then a series of charge transfers

from the Cx‟s / CRX‟s to the internal

sampling capacitors (Cs), until the trip

voltage is reached.

The number of charge transfers required to

reach the trip voltage on a channel is referred

to as the Count or CS value.

8.3 Self-

Projected

Capacitance

The device continuously repeats charge

transfers on the sense electrodes connected to

the Cx pin. For each channel a Long Term

Average (LTA) is calculated (12 bit unsigned

integer values). The CS values (12 bit

The IQS213(A) IC can be used in either self-

or projected capacitance configurations. The

IC is default in a 2-channel self capacitance

setup. This can be changed to a projected

capacitance configuration in the user

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selectable

options

(Bank0

bit3).

The

8.4.2 Low Power rates

technology enabled on the IC will be reported

in the SYSFLAGS register.

Low current consumption charging modes are

available. In any Low Power (LP) mode, there

will be an applicable low power time (t_LP). This

is determined by the LP_PERIOD register. The

value written into this register multiplied by

16ms will yield the LP time (t_LP).

The IQS213(A) has two selectable charge

transfer frequencies. For projected capacitance

sense electrodes the charge frequency is by

default set at f_Cm= 1MHz, and for self

capacitance configurations f_Cs= 500kHz.

Setting the CHG_FRQ bit in Bank2 will double

the charge frequency for both projected- and

self capacitance configurations (i.e. f_Cm/ f_Cs=

2MHz / 1MHz).

Please note that this time is only applicable

from value 03h and higher loaded into the

LP_PERIOD register. The values 01h and 02h

will have a different time. See Table 6.1 for all

timings.

A higher charge frequency selection is

preferred for increased immunity against

aqueous substances when used in most

projected capacitance electrode configurations.

With the detection of an undebounced

proximity event the IC will zoom to NP mode,

allowing a very fast reaction time for further

possible touch / proximity events. All active

channels will be consecutively charged every

T_LP.

8.4 Rate of Charge Cycles

If a LP rate is selected through register

LP_Period and charging is not in the zoomed

in state (NP mode), the LP_Active bit

(SYSFLAGS register) will be set.

8.4.1 Normal Power rate

With the IQS213(A) in Normal Power (NP)

mode, the sense channels are charged at a

fixed sampling frequency (f_SAMPLE) per channel.

This is done to ensure regular samples for

processing of results. It is calculated as each

sample having a time (t_SAMPLE= charge period

(t_CHARGE) + computation time)) of approximately

2.6ms, thus the time between consecutive

samples on a channel (t_CHANNEL) will optimally

be t_SAMPLE= 4 * t_SAMPLE≈ 10.4ms (or 96Hz). The

charge sequence and timings are illustrated in

Figure 8.2.

8.5 Touch Report Rate

During Normal Mode operation, the touch

report rate of the IQS213 device depends on

the charge transfer frequency, the number of

channels enabled and the length of

communications performed by the master

device.

If a channel is thus disabled, the sampling rate

on the remaining channels will reduce with

approximately 2.6ms.

8.6 Active channels

The user has the option to enable the third

channel (CH3) during I²C operation. This can

be done in the SWIPE_SETTINGS register

(SET_3CH bit). Only two channels (CH1 and

CH2) are default enabled.

Note: During Low Power (LP) modes only CH0

is active.

Figure 8.2 Signals on CX’s / CRX’s during

Normal Power Mode.

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ATI allows the designer to optimize a specific

8.7 Long Term Average (LTA)

design by adjusting the sensitivity and stability

of each channel through the adjustment of the

ATI parameters.

The LTA filter can be seen as the baseline or

reference value. The LTA is calculated to

continuously adapt to any environmental drift.

The LTA filter is calculated from the CS value

for each channel. The LTA filter allows the

device to adapt to environmental (slow moving)

changes/drift. Actuation (Touch or Prox)

decisions are made by comparing the CS

value with the LTA reference value.

The IQS213(A) has an automated ATI

function. The auto-ATI function is default

enabled, but can be disabled by setting the

ATI_OFF and ATI_Partial bits in the

PROX_SETTINGS registers.

The ATI_Busy bit in the SYSFLAGS register

will be set while an ATI event is busy.

The 12bit LTA value is contained in the LTA_H

and LTA_L registers.

8.9.1 ATI Sensitivity

In I²C mode, the designer can specify the

global BASE value for all channels and the

TARGET values for the proximity (CH0) and

touch (CH1,CH2,CH3) channels. A rough

estimation of sensitivity can be calculated as:

Please refer to Section 6.5 for LTA Halt Times.

8.8 Determine Touch or Prox

An event is determined by comparing the CS

with the LTA. Since the CS reacts differently

when comparing the self- with the projected

capacitance technology, the user should

consider only the conditions for the technology

used.

As can be seen from this equation, the

sensitivity can be increased by either

increasing the Target value or decreasing the

Base value. It should, however, be noted that a

higher sensitivity will yield a higher noise

susceptibility.

An event is recorded if:

Self: CS < LTA – Threshold

Projected: CS > LTA + Threshold

8.9.2 ATI Target

Threshold can be either a Proximity or Touch

threshold, depending on the current channel

being processed.

The target is reached by adjusting the

COMPENSATION bits for each channel.

The target value is written into the respective

channel‟s TARGET registers. The value written

into these registers multiplied by 8 will yield the

new target value.

Please refer to Section 6.7 and 6.8 for

proximity and touch threshold selections.

8.9 ATI

8.9.3 ATI Base (MULTIPLIER)

The Automatic Tuning Implementation (ATI) is

a sophisticated technology implemented on the

new ProxSense^®series devices. It allows for

optimal performance of the devices for a wide

range of sense electrode capacitances, without

The following parameters will influence the

base value:

CS_SIZEⁱ: Size of sampling capacitor.

PROJ_BIAS bits: Adjusts the biasing of

some analogue parameters in the projected

modification

components.

addition

external

The ATI allows the tuning of two parameters,

an ATI Multiplier and an ATI Compensation, to

adjust the sample value for an attached

sensing antenna.

Changing CS_SIZE if ATI_OFF = 0 will

change CS

IQS213A (IQS213) Datasheet

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capacitive operated IC. (Only applicable in

projected capacitance mode.)

the detection of noise, the NOISE_FOUND bit

in SYSFLAGS will be set.

MULTIPLIER bits.

8.10.1 RF detector sensitivity

The base value used for the ATI function can

be implemented in 2 ways:

The sensitivity of the RF detector can be

selected by setting an appropriate RF

detection voltage through the RF_TRIM bits.

Please see application note AZD015 for further

details regarding this option.

1. ATI_PARTIAL = 0. ATI automatically

adjusts MULTIPLIER bits to reach a

selected base valueⁱⁱ. Base values are

available in the BASE_VALUE register.

2. ATI_PARTIAL = 1. The designer can

specify the multiplier settings. These

settings will give a custom base value

from where the compensation bits will

be automatically implemented to reach

the required target value.

8.9.4 Re-ATI

An automatic re-ATI event will occur if the CS

is outside its re-ATI limits. The re-ATI limit is

calculated as the target value divided by 8. For

example:

Target = 320

Re-ATI will occur if CS is outside 320±40.

During I²C operation, a re-ATI event can also

be issued by the master by setting the

REDO_ATI bit. It will clear automatically after

the ATI event was started.

8.10 RF Detection

In cases of extreme RF interference, the on-

chip RF detection is suggested. This detector

can be enabled by setting the Noise_Detect bit

in the PROX_SETTINGS1 register. By

connecting a suitable antenna to the RF pin, it

allows the device to detect RF noise and notify

the master of possible corrupt data.

Noise affected samples are not allowed to

influence the LTA filter, and also do not

contribute to proximity or touch detection. With

ATI function will use user selected CS_SIZE and

PROJ_BIAS (if applicable) and will only adjust the

MULTIPLIER bits to reach the base values.

IQS213A (IQS213) Datasheet

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communication. The WDT will time-out after

t_WDT, if no valid communication occurs for this

time.

9 Communication

The IQS213(A) can communicate on the I²C

compatible bus structure. It uses a 3-wire serial

interface bus which is I²C compatible and

comprise of a data (SDA), clock (SCL) and

optional ready (RDY) line (for IQS213(A) pin-

out refer to Figure 4.1).

9.3 I²C Read and Write specifics

For more details, please refer to the IQS213

Memory Map (Section 10) for device memory

“AZD066: IQS213 Communication Interface

The IQS213(A) has one available I²C address,

I²C address = 0x44H.

Guideline”

www.azoteq.com.

document

available

at:

The maximum I²C compatible communication

speed for the IQS213(A) is 400kbit/s.

9.1 Event Mode

The IQS213(A) will by default be configured to

only communicate with the master if a change

in an event occurs. For this reason, it would be

highly recommended to use the RDY line when

communicating with the IQS213(A), especially

in Low Power

(LP)

modes. These

communication requests are referred to as

Event Mode triggering (only changes in events

are reported).

Event mode can be disabled by setting the

EVENT_MODE_OFF bit.

The events responsible for resuming

communication can be chosen through the

EVENT_MASK register. By default all events

are enabled.

The device can also communicate on polling

basis, using only the SDA and SCL lines.

9.2 I²C Specific commands

9.2.1 IC Reset indication

SHOW_RESET can be read to determine

whether a reset occurred on the device. This

bit will be a „1‟ after a reset. The value of

SHOW_RESET can be cleared to „0‟ by writing

a „1‟ in the ACK_RESET bit.

9.2.2 WDT

The WDT is used to reset the IC if a problem

(for example a voltage spike) occurs during

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10 IQS213A (IQS213) Memory Map

10.1 Memory Registers

Table 10.1 : IQS213(A) Memory Registers

Product Number

Version Number

Sys_flags0

Description

00H

01H

10H

11H

35H

3DH

42H

43H

83H

84H

C4H

C5H

C6H

C7H

C8H

C9H

CAH

CBH

CCH

CDH

CEH

CFH

D0H

D1H

D2H

„D43‟ / „2BH‟

Device Information

„02‟ (IQS213 = „01‟)

System Flags - See Table 10.2

Swipe Switch Flags - See Table 10.2

Channels Touched - See Table 10.2

Number of Currently Processed Channel

Count (CS) value [high byte]

Device Specific Data

Swipe Flags

Touch CHs

Chan_num

CS High

Count Data

CS Low

Count (CS) value [low byte]

LTA High

Long Term Average [high byte]

Long Term Average [low byte]

LTA Low

Current Sate

Measured State

Next State

Swipe Engine Current State

Current Measured State (Acc. to Touches)

Swipe Engine Next Expected State

Combination of States Required for Swipe

Minimum timer counts – swipe periods

Maximum Overall timer – 250ms periods

Swipe States

Swipe Min Timer

Swipe Max Timer

Swipe Max State Timer Maximum Per State timer – swipe periods

Swipe Settings

IQS213 Set Up - See Table 10.2

Prox Settings 0

Prox Settings 1

Prox Settings 2

ATI Target CH0

ATI Target CH1-CH3

Prox Threshold

Touch Threshold 1

IQS213 Set Up - See Table 10.2

Device Settings

(Target CH0) *8 = Channel 0 Target Value

(Target CH1-CH3) *8 = Channel 1-3 Target Value

Proximity Threshold Value (In Counts)

Channel 1 Touch Threshold [In Counts]

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Touch Threshold 2

Touch Threshold 3

Base Value

Description

D3H

D4H

D5H

D6H

D7H

D8H

D9H

DAH

DBH

DCH

DDH

DEH

DFH

E0H

E1H

E2H

E3H

E4H

E5H

E6H

E7H

E8H

E9H

EAH

EBH

ECH

EDH

Channel 2 Touch Threshold [In Counts]

Channel 3 Touch Threshold [In Counts]

ATI Base Value [0-256 - In Counts]

Events Allowed - See Table 10.2

Mirror – lower 6 bits – NN PPP

CH0 Compensation

Device Settings

Event Mask

Mirror_CH0

Mirror_CH1

Mirror_CH2

Mirror_CH3

PCC0

PCC1

CH1 Compensation

PCC2

CH2 Compensation

PCC3

CH3 Compensation

AAOW Timer

AO Timer

(AAOW Timer)*30s = Auto-Off Warning time

(AO Timer)*30s = Auto-Off time

Set minimum samples per state [x+1]

Set maximum samples per state [x+1]

Set Overall Swipe Length Limit [*250ms]

(LP Period)*16ms = Low Power Charge Timing (t_LP

Swipe Engine Configuration

Swipe Min Samples

Swipe Max Samples

Swipe Overall Limit

LP Period

Device Settings

)

Touch States 0

Touch States 1

Touch States 2

Touch States 3

Touch States 4

Touch States 5

Touch States6

Touch States 7

Default Comms

Swipe Engine Configuration

Default Comms pointer

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Table 10.2 : IQS213(A) Memory Register bits

bit7

bit6

bit5

bit4

bit3

bit2

bit1

bit0

Prox

Settings 0

Show

Reset

ACK Reset

Reseed

Redo ATI

ATI Partial

Float CX

THALT1

THALT0

Prox

Settings 1

Comms

WDT OFF

Event

Mode OFF

AO Clear

Prox

Noise

Detect OFF

Debug I2C

AO OFF

IO_OUT

ACF OFF

CS_Cap

ATI OFF

Proj_B1

Prox

Settings 2

Proj_B0

Swipe

Settings

Touches/P

ulses

States

Relaxed

Swipe

Active

Set_3CH

Swipe UI

End_Zero

Zero_State

Swipe

Pulse Flag

Time Out

Flag

Slide

Occurred

DualSwipe

Active

Swipe

Direction

Triggered

Final State

Start State

Prox Event

Zoom

Swipe Flags

Event Mask

Sys_flags0

Touch CHs

Noise

Event

Swipe

Event

Touch

Event

ATI Event

Filter Halt

CH3

System

Use

Active

High

Projected

CapSense

Noise

Found

LP Active

ATI Busy

CH2

Swipe

Output

CH1

CH0/Prox

10.2 Memory Registers Description

10.2.1 Device Information

00H

Product Number (Prod_NR)

Access

Bit

43 (Decimal)

Value

01H

Version Number (Ver_NR)

Access

Bit

Ver_NR

Value

[00H] PROD_NR :

[01H] VER_NR :

The product number for the IQS213(A) is 43 (decimal).

Device ROM software version number can be read in this byte.

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10.2.2 Device Specific Data

10H

System Flags (Sys_flags0)

Access

Bit

System

Use

Active

High

Projected

CapSense

Filter

Halt

ATI

Busy

Noise

Found

Name

Zoom

[10H] Sys_flags0:

bit7:

bit6:

bit5:

bit4:

System Use

LP Active – Indicates if device is in a Low Power Mode.

Active High – Bit is set if Output Logic is Active High.

Projected CapSense – Bit is set if Projected Capacitance

technology is used.

bit3:

bit2:

bit1:

Filter Halt – Indicates if LTA filters are halted.

ATI Busy – Indicates if ATI algorithm is being performed.

Noise Found – Bit is set if RF noise is detected. (RF Detection

must be enabled)

bit0:

Zoom – Indicates if device is zoomed to Normal Power.

11H

Swipe Switch Flags (Swipe Flags)

Access

R/W

Bit

Time

Out

Swipe

Pulse

Flag

Slide

Occurred

DualSwipe

Active

Swipe

Direction Triggered

Final

State

Start

State

Name

Flag

[11H] Swipe Flags: bit7:

Swipe Pulse Flag – Bit is set if Pin7 Output = Pulses

bit6:

bit5:

Time Out Flag – Bit is set if Max State Timer is exceeded.

Slide Occurred – Bit is set if Swipe event has occured.

(Note: Bit must be cleared manually)

bit4:

bit3:

bit2:

bit1:

bit0:

DualSwipe Active – Bit is set if Swipe UI = Dual Swipe.

Swipe Direction – 0 = Forward direction, 1 = Reverse direction.

AO Triggered – Bit is set if Auto-Off Warning has been set.

Final State – Bit is set if Swipe Engine is in Final State.

Start State – Bit is set if Swipe Engine is in Start State.

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10.2.3 Current Sample (CS) or Count Data

35H

Touch/Output Data (Touch CHs)

Access

Bit

Swipe

Output

Name

CH3

CH2

CH1

CH0/Prox

[35H] Touch CHs:

bit7:

Swipe Output – Bit is toggled on Swipe Events. (Note: This bit

corresponds to the IC swipe output (Pin6) and is UI dependent.)

bit6:

bit5:

bit4:

bit3:

Not used.

CH3 – Bit is set if a Touch is present on this channel.

bit2:

bit1:

bit0:

CH2 – Bit is set if a Touch is present on this channel.

CH1 – Bit is set if a Touch is present on this channel.

CH0/Prox – Bit is set if a Proximity Event is present.

3DH

Channel Number (Chan_num)

Access

Bit

Name

Variable: Value between 0x00 and 0x03

[3DH] Chan_num:

bit7:0: The Chan_Num byte indicates which channel‟s data is currently

available in the CS and LTA bytes:

0 = Ch0 (Distributed PROX channel)

1 = Ch1 (CRX0)

2 = Ch2 (CRX1)

3 = Ch3 (CRX2)

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42H

Count (CS) Value High byte (CS High)

Access

Bit

Value

Variable (High byte)

[42H] CS High:

bit7:0: Count (CS) Value High Byte of currently processed channel.

(See Channel Number.)

43H

Count (CS) Value Low byte (CS Low)

Access

Bit

Value

Variable (Low byte)

[43H] CS Low:

bit7:0: Count (CS) Value Low Byte of currently processed channel.

(See Channel Number.)

83H

Long Term Average High byte (LTA High)

Access

Bit

Value

Variable (High byte)

[83H] LTA High:

bit7:0: Long Term Average (LTA) value High Byte of currently

processed channel. (See Channel Number.)

84H

Long Term Average Low byte (LTA Low)

Access

Bit

Value

Variable (Low byte)

[84H] LTA Low:

bit7:0: Long Term Average (LTA) value Low Byte of currently

processed channel. (See Channel Number.)

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10.2.4 Device Settings

CBH

SwipeSwitch Settings (Swipe Settings)

Access

R/W

Bit

Swipe

UI1

Swipe

UI0

States

Relaxed Active

Swipe

Name Set_3CH Touches/Pulses

End_Zero Zero_State

[CBH] Swipe Settings:

bit7:

Set_3CH – R/W bit. Set bit to enable 3^rdchannel (CRX2).

Touches/Pulses – Bit indicates/set output on IC pin 7.

bit6:

bit5:4: Swipe UI – Bits indicate/set selected swipe user

interface (UI).

bit3:

bit2:

bit1:

bit0:

End_Zero – R/W bit. (See Section 6.11)

Zero_State – R/W bit. (See Section 6.10)

States Relaxed – R/W bit. (See Section 6.1)

Swipe Active – Bit indicates/set selection of Swipe/Normal

Mode IC TYPE. (See Section 6.1)

CCH

ProxSense Module Settings 0 (Prox Settings 0)

Access

R/W

Bit

Show

Reset

Redo

ATI

Partial

Name

ACK Reset

Reseed

Float CX

THALT1 THALT0

[CCH] Prox Settings 0:

bit7:

Show Reset – Bit is set if device was reset.

bit6:

ACK Reset – Set bit to acknowledge device reset (Setting this bit

will clear Show Reset bit).

bit5:

bit4:

bit3:

bit2:

Reseed – Set bit to reseed LTA filter values.

Redo ATI – Set bit to perform ATI algorithm.

ATI Partial – R/W bit. (See Section 8.9)

Float CX – R/W bit. (See Section 6.3)

bit1:0: THALT1:THALT0 – Bits indicate/set LTA halt period.

(See Section 6.5)

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CDH

ProxSense Module Settings 1 (Prox Settings 1)

Access

R/W

Bit

Clear

Prox

Comms

WDT

OFF

Noise

Detect

OFF

Event Mode

OFF

Debug

I2C

ATI

OFF

Name

AO OFF

ACF OFF

[CDH] Prox Settings 1:

bit7:

Comms WDT OFF – R/W bit. (See Section 9.2)

bit6:

bit5:

bit4:

bit3:

bit2:

bit1:

Event Mode OFF – Set bit to disable Event Mode I²C.

Debug I²C – Bit is set during I²C operation. (Do not clear)

AO Clear Prox – Set bit to clear Auto-OFF timer on Prox.

AO OFF – Set bit to disable Auto-OFF function.

ACF OFF – Bit is set if AC Filter is Disabled. (R/W)

ATI OFF – Set bit to disable Auto-ATI functionality.

(See Section 8.9)

bit0:

Noise Detect OFF – Set bit to disable RF detection.

CEH

ProxSense Module Settings 2 (Prox Settings 2)

Access

R/W

Bit

Name

IO_OUT

CS_Cap

Proj_B1 Proj_B0

[CEH] Prox Settings 2:

bit7:

Not used.

bit6:

bit5:

bit4:

bit3:

IO_OUT – Set bit to enable/disable additional output on PO/TX

pin (IC pin 10) during I²C operation.

bit2:

*CS_Cap – R/W bit for selection of Internal Reference

Capacitor size. (0 =29.9pF; 1= 59.8pF)

bit1:0 *Proj_B1:Proj_B0 – R/W bits for selection of internal bias

current for projected capacitance configurations.

*Please Note: It is not recommended to adjust the settings of the internal reference capacitor (Cs)

and bias current (i.e. bit2:0) of the ProxSense^®Module Settings 2 register.

IQS213A (IQS213) Datasheet

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D6H

I²C Debug – Event Mode Event Mask (Event Mask)

Access

R/W

Bit

Noise

Event

ATI

Event

Swipe

Event

Touch

Event

Prox

Event

Name

[D6H] Event Mask:

bit7:

bit6:

bit5:

bit4:

Not used.

Noise Event – Set bit to mask RF Noise events during

Event Mode I²C comms. (Requires RF-detection = Enabled.)

bit3:

bit2:

bit1:

bit0:

ATI Event – Set bit to mask ATI events during Event Mode

I²C comms.

Swipe Event – Set bit to mask Swipe events during Event

Mode I²C comms.

Touch Event – Set bit to mask Touch events during Event

Mode I²C comms.

Prox Event – Set bit to mask Proximity events during Event

Mode I²C comms.

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11 Electrical Specifications – All Preliminary

11.1 Absolute Maximum Specifications

Note: Exceeding these maximum specifications may cause damage to the device.

Operating temperature

-40°C to 85°C

Supply Voltage (V_DDHI– V_SS)

Maximum pin voltage

3.6V

V_DDHI+ 0.5V

2mA

Maximum continuous current (specific pins)

Pin voltage (Cx)

V_REG

Minimum pin voltage

V_SS- 0.5V

100V/s

Minimum power-on slope

ESD protection (Human Body Model)

Maximum pin temperature during soldering

Maximum load capacitance – Cx to GND

Maximum Rx-Tx Mutual capacitance (Cm)

±4kV

350°C (5 seconds)

100pF

9pF

11.2 General Characteristics (Measured at 25°C)

Table 11.1 IQS213(A) General Operating Conditions (a)

DESCRIPTION

Conditions

PARAMETER MIN TYP MAX UNIT

Supply voltage

V_DDHI

V_REG

1.80

1.63

3.30

1.70

3.60

1.77

Internal regulator output

1.80 ≤ V_DDHI≤ 3.60

Normal Power operating current¹

2CH Self

145

150

175

180

210

215

μA

I_{IQS213A_NP}

t_LP= N/A

3CH Self

2CH Self

3CH Self

2CH Self

1.80 ≤ V_DDHI≤ 3.60

Low power 1 operating current¹

3.85

3.90

2.50

4.65

4.70

3.00

5.65

5.70

3.60

t_LP= 128ms

I_{IQS213A LP1}

I_{IQS213A LP2}

I_{IQS213A LP3}

1.80 ≤ V_DDHI≤ 3.60

Low power 2 operating current¹

t_LP= 256ms

3CH Self

2CH Self

2.55

1.75

3.10

2.10

3.65

2.65

μA

1.80 ≤ V_DDHI≤ 3.60

Low power 3 operating current¹

t_LP= 512ms

3CH Self

1.80

2.20

2.75

μA

1.80 ≤ V_DDHI≤ 3.60

1. CHG FRQ = 500kHz, ATI Target = 320/160, Normal Touch IC, Stand-Alone, Active High Output. Altering the projected current

bias settings, reference capacitor (CS) size, number of active channels and ATI Target values will affect the measured

current.

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Table 11.2 IQS213(A) Current Consumption (b)

DESCRIPTION

Conditions

PARAMETER MIN TYP MAX UNIT

Normal Power operating current²

2CH Self

150

180

210

μA

I_{IQS213A_NP}

t_LP= N/A

3CH Self

150

185

215

μA

1.80 ≤ V_DDHI≤ 3.60

Low power 1 operating current²

2CH Self

3CH Self

2CH Self

3CH Self

2CH Self

3CH Self

4.35

4.40

2.85

2.90

2.15

2.25

4.90

4.95

3.45

3.50

2.60

2.70

5.75

5.80

4.10

4.15

3.15

3.25

μA

I_{IQS213A LP1}

I_{IQS213A LP2}

I_{IQS213A LP3}

t_LP= 128ms

Low power 2 operating current²

t_LP= 256ms

Low power 3 operating current²

t_LP= 512ms

2. CHG FRQ = 500kHz, ATI Target = 320/160, Event-Mode I2C, 10k Pull-Up‟s. Altering the projected current bias settings,

reference capacitor (CS) size, number of active channels and ATI Target values will affect the measured current.

Table 11.3 IQS213(A) Current Consumption (c)

DESCRIPTION

Conditions

PARAMETER MIN TYP MAX UNIT

Normal Power operating current³

2CH Projected

230

250

μA

I_{IQS213A_NP}

t_LP= N/A

3CH Projected

235

250

μA

1.80 ≤ V_DDHI≤ 3.60

Low power 1 operating current³

2CH Projected

3CH Projected

2CH Projected

3CH Projected

2CH Projected

3CH Projected

4.30

4.35

2.65

2.70

1.85

1.90

5.10

5.15

3.20

3.25

2.25

2.30

5.90

6.00

3.80

3.90

2.70

2.75

μA

I_{IQS213A LP1}

I_{IQS213A LP2}

I_{IQS213A LP3}

t_LP= 128ms

Low power 2 operating current³

t_LP= 256ms

Low power 3 operating current³

t_LP= 512ms

3. CHG FRQ = 2MHz, ATI Target = 320/160, Stand-Alone, Active High Output. Altering the projected current bias settings,

reference capacitor (CS) size, number of active channels and ATI Target values will affect the measured current.

Table 11.4 IQS213(A) Current Consumption (d)

DESCRIPTION

Conditions

PARAMETER MIN TYP MAX UNIT

Normal Power operating current⁴

2CH Projected

230

250

μA

I_{IQS213A_NP}

t_LP= N/A

3CH Projected

235

260

μA

1.80 ≤ V_DDHI≤ 3.60

Low power 1 operating current⁴

2CH Projected

3CH Projected

2CH Projected

3CH Projected

2CH Projected

3CH Projected

5.45

5.60

3.30

3.40

2.40

2.50

6.35

6.50

3.95

4.00

2.90

3.00

7.50

7.60

4.65

4.75

3.40

3.45

μA

I_{IQS213A LP1}

I_{IQS213A LP2}

I_{IQS213A LP3}

t_LP= 128ms

Low power 2 operating current⁴

t_LP= 256ms

Low power 3 operating current⁴

t_LP= 512ms

4. CHG FRQ = 2MHz, ATI Target = 640/320, Event-Mode I2C, 10k Pull-Up‟s. Altering the projected current bias settings,

reference capacitor (CS) size, number of active channels and ATI Target values will affect the measured current.

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Table 11.5 Start-up and shut-down slope Characteristics

DESCRIPTION

Conditions

PARAMETER

POR

MIN

MAX

1.55

1.5

UNIT

POR

BOD

V_DDHISlope ≥ 100V/s

BOD

Table 11.6 Debounce employed on IQS213(A)

DESCRIPTION

Proximity debounce value

Touch debounce value

Conditions

Debounce Value

4 (Up and Down)

2 (Up and Down)

Proximity event

Touch event

11.3 Timing Characteristics

Table 11.7 Main Oscillator¹

SYMBOL

DESCRIPTION

Conditions

MIN

TYP

MAX

UNIT

F_OSC

IQS213(A) Main oscillator 1.80 ≤ V_DDHI≤ 3.60

MHz

1. All timings derived from Main Oscillator

Table 11.8 General Timing Characteristics for 1.80V ≤ V_DDHI≤ 3.60V

SYMBOL

DESCRIPTION

Conditions MIN

TYP

MAX UNIT

Start-up time before the first

communication is initiated by

the IQS213(A)

t_START-UP

See CHG_FRQ in

f_CX

Charge transfer frequency

Charge time per channel

Stand-alone / I²C Mode

MHz

Section 8.3

t_CHARGE

t_CHANNEL

t_SAMPLE

t_WDT

CS * (1/f_CX)

Normal

Power

2.6 / 3.9

Active channels * t_CHANNEL

160

WDT time-out while

communicating

Table 11.9 IQS213(A) Charging Times

POWER MODE

TYPICAL (ms)

Stand-

alone

I²C

2.6

128

256

512

3.9

128

256

512

Normal Power Mode

Low Power Mode 1

Low Power Mode 2

Low Power Mode 3

**NOTE: with ACF = ON, “wake-on-prox” times will increase due to the CS having to go through an

additional filtering process adding a delay.

Please refer to “Application Note AZD079 – IQS213 Touch response rate” for more

information.

IQS213A (IQS213) Datasheet

Revision 2.1

Page 42 of 46

March 2014

IQ Switch^®

ProxSense^®Series

12 Packaging Information

Figure 12.3 MSOP-10 Top view.

Figure 12.1 MSOP-10 Back view.

Figure 12.4 MSOP-10 Footprint.

Figure 12.2 MSOP-10 Side view.

Table 12.1 MSOP-10 Footprint Dimensions from

Figure 12.4.

Dimension

[mm]

0.50

4.40

1.45

0.30

Pitch

IQS213A (IQS213) Datasheet

Revision 2.1

Page 43 of 46

March 2014

IQ Switch^®

ProxSense^®Series

13 Device Marking

13.1 Top marking

IC NAME

IQS213(A) =

IQS213(A)

IC Revision Number

REVISION

TEMPERATURE RANGE

-40°C to 85°C (Industrial)

0°C to 70°C (Commercial)

DATE CODE

Package House

Week

Year

13.2 Bottom Marking

Configuration

zzzzzzzz

Device Configuration /

User Programmable Options

[Default = 00000000]

IQS213A (IQS213) Datasheet

Revision 2.1

Page 44 of 46

March 2014

IQ Switch^®

ProxSense^®Series

14 Ordering Information

Orders will be subject to a MOQ (Minimum Order Quantity) of a full reel. Contact the official

distributor for sample quantities. A list of the distributors can be found under the “Distributors”

section of www.azoteq.com.

14.1 General Part Order Number

IC NAME

IQS213(A)

zzzzzzzz

IQS213(A)

CONFIGURATION

PACKAGE TYPE

BULK PACKAGING

User Programmable Option Selection

MSOP10

Reel (4000pcs/reel)

IQS213A (IQS213) Datasheet

Revision 2.1

Page 45 of 46

March 2014

IQ Switch^®

ProxSense^®Series

15 Contact Information

USA

Asia

South Africa

Physical

Address

Rm1725, Glittery City

Shennan Rd

Futian District

Shenzhen, 518033

China

109 Main Street

Paarl

7646

6507 Jester Blvd

Bldg 5, suite 510G

Austin

TX 78750

USA

South Africa

Postal

Address

Rm1725, Glittery City

Shennan Rd

Futian District

Shenzhen, 518033

China

PO Box 3534

Paarl

7620

6507 Jester Blvd

Bldg 5, suite 510G

Austin

TX 78750

USA

South Africa

Tel

+1 512 538 1995

+1 512 672 8442

+86 755 8303 5294

ext 808

+27 21 863 0033

+27 21 863 1512

info@azoteq.com

Fax

kobusm@azoteq.com linayu@azoteq.com.cn

Please visit www.azoteq.com for a list of distributors and worldwide representation.

The following patents relate to the device or usage of the device: US 6,249,089 B1, US 6,621,225 B2, US 6,650,066 B2, US 6,952,084 B2, US

6,984,900 B1, US 7,084,526 B2, US 7,084,531 B2, US 7,265,494 B2, US 7,291,940 B2, US 7,329,970 B2, US 7,336,037 B2, US 7,443,101 B2, US

7,466,040 B2, US 7,498,749 B2, US 7,528,508 B2, US 7,755,219 B2, US 7,772,781, US 7,781,980 B2, US 7,915,765 B2, US 7,994,726 B2, US 8,

035,623 B2, US 8,288,952 B2, EP 1 120 018 B1, EP 1 206 168 B1, EP 1 308 913 B1, EP 1 530 178 B1, ZL 200880005683.2, ZL 99 8 14357.X,

AUS 761094, HK 104 14100A

IQ Switch^®, SwipeSwitch™, ProxSense^®, LightSense™, AirButton^®and the

logo are trademarks of Azoteq.

The information in this Datasheet is believed to be accurate at the time of publication. Azoteq uses reasonable effort to maintain the information up-to-date

and accurate, but does not warrant the accuracy, completeness or reliability of the information contained herein. All content and information are provided

on a “as is” basis only, without any representations or warranties, express or implied, of any kind, including representations about the suitability of these

products or information for any purpose. Azoteq disclaims all warranties and conditions with regard to these products and information, including but not

limited to all implied warranties and conditions of merchantability, fitness for a particular purpose, title and non-infringement of any third party intellectual

property rights. Azoteq assumes no liability for any damages or injury arising from any use of the information or the product or caused by, without limitation,

failure of performance, error, omission, interruption, defect, delay in operation or transmission, even if Azoteq has been advised of the possibility of such

damages. The applications mentioned herein are used solely for the purpose of illustration and Azoteq makes no warranty or representation that such

applications will be suitable without further modification, nor recommends the use of its products for application that may present a risk to human life due to

malfunction or otherwise. Azoteq products are not authorized for use as critical components in life support devices or systems. No licenses to patents are

granted, implicitly, express or implied, by estoppel or otherwise, under any intellectual property rights. In the event that any of the abovementioned

limitations or exclusions does not apply, it is agreed that Azoteq’s total liability for all losses, damages and causes of action (in contract, tort (including

without limitation, negligence) or otherwise) will not exceed the amount already paid by the customer for the products. Azoteq reserves the right to alter its

products, to make corrections, deletions, modifications, enhancements, improvements and other changes to the content and information, its products,

programs and services at any time or to move or discontinue any contents, products, programs or services without prior notification. For the most up-to-date

information and binding Terms and Conditions please refer to www.azoteq.com.

WWW.AZOTEQ.COM

info@azoteq.com

IQS213A (IQS213) Datasheet

Revision 2.1

Page 46 of 46

March 2014

IQS213A [ETC]

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