ISD1200SERIES [ETC]
ISD1210/ISD1212 Part3 ; ISD1210 / ISD1212第三部分\n
| 型号： | ISD1200SERIES |
| 厂家： | 
ETC |
| 描述： | ISD1210/ISD1212 Part3
|
| 文件： | 总11页 (文件大小：436K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
ꢀꢁꢂꢃꢄꢅꢅꢆꢁꢇꢈꢉꢇꢊ
Table 8:
Absolute Maximum Ratings
(Die)
Table 9:
Operating Conditions (Die)
(1)
Condition
Value
Condition
Value
Table 10: DC Parameters (Die)
Symbol
Parameters
Min(2)
Typ (1)
Max(2)
Units
Conditions
∞
Ω
Ω
Ω
ISD
11
ꢀꢁꢂꢃꢄꢅꢅꢆꢁꢇꢈꢉꢇꢊ
Table 10: DC Parameters (Die)
Symbol
Parameters
Min(2)
Typ (1)
Max(2)
Units
Conditions
Ω
Table 11: AC Parameters (Die)
Symbol
Characteristic
Min(2) Typ (1)
Max(2)
Units
Conditions
Voice Solutions in Silicon™
12
ꢀꢁꢂꢃꢄꢅꢅꢆꢁꢇꢈꢉꢇꢊ
Table 11: AC Parameters (Die)
Symbol
Characteristic
Min(2) Typ (1)
Max(2)
Units
Conditions
Ω
Ω
Ω
ISD
13
ꢀꢁꢂꢃꢄꢅꢅꢆꢁꢇꢈꢉꢇꢊ
ꢋꢌꢍꢀꢎꢏꢐꢆꢍꢏꢑꢏꢒꢓꢋꢓꢑꢆꢔꢏꢑꢀꢏꢋꢀꢕꢖꢆꢗꢀꢋꢘꢆꢔꢕꢐꢋꢏꢙꢓꢆꢏꢖꢂꢆꢋꢓꢒꢍꢓꢑꢏꢋꢚꢑꢓꢀꢁꢂꢃꢄꢅ
Chart 5:
Record Mode Operating Current
(I
Chart 7:
Standby Current (I
)
SB
)
CC
Chart 8:
Oscillator Stability
Chart 6:
Total Harmonic Distortion
Voice Solutions in Silicon™
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ꢀꢁꢂꢃꢄꢅꢅꢆꢁꢇꢈꢉꢇꢊ
Figure 4: Application Example
ꢛꢚꢖꢎꢋꢀꢕꢖꢏꢐꢆꢂꢓꢁꢎꢑꢀꢍꢋꢀꢕꢖꢆꢓꢜꢏꢒꢍꢐꢓ
1.
3.
2.
4.
ISD
15
ꢀꢁꢂꢃꢄꢅꢅꢆꢁꢇꢈꢉꢇꢊ
5.
ꢏꢍꢍꢐꢀꢎꢏꢋꢀꢕꢖꢁꢆꢖꢕꢋꢓ
6.
7.
8.
Voice Solutions in Silicon™
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ꢀꢁꢂꢃꢄꢅꢅꢆꢁꢇꢈꢉꢇꢊ
ꢀꢁꢂꢃꢄꢅꢅꢆꢁꢓꢑꢀꢓꢁꢆꢍꢘꢌꢁꢀꢎꢏꢐꢆꢂꢀꢒꢓꢖꢁꢀꢕꢖꢁ
Figure 5: 28-Lead 0.600-Inch Plastic Dual Inline Package (PDIP) (P)
Table 12: Plastic Dual Inline Package (PDIP) (P) Dimensions
INCHES
Nom
MILLIMETERS
Nom
Min
Max
Min
Max
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Figure 6: 28-Lead 0.300-Inch Plastic Small Outline Integrated Circuit (SOIC) (S)
Table 13: Plastic Small Outline Integrated Circuit (SOIC) (S) Dimensions
INCHES
Nom
MILLIMETERS
Nom
Min
Max
Min
Max
Voice Solutions in Silicon™
18
ꢀꢁꢂꢃꢄꢅꢅꢆꢁꢇꢈꢉꢇꢊ
1
Figure 7: ISD1200 Series Bonding Physical Layout
I.
II.
III.
ISD
19
ꢀꢁꢂꢃꢄꢅꢅꢆꢁꢇꢈꢉꢇꢊ
Table 14: ISD1200 Series PIN/PAD Designations, with Respect to Die Center (µm)
Pin
Pin Name
X Axis
Y Axis
Voice Solutions in Silicon™
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ꢕꢑꢂꢓꢑꢀꢖꢙꢆꢀꢖꢛꢕꢑꢒꢏꢋꢀꢕꢖꢆ
ꢀꢁꢂꢃꢄꢅꢆꢅꢆꢅꢆꢅꢆ
Part Number
Part Number
ISD
21
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