LESD5L5.0T1G [ETC]
LESD5L5.0T1G/5L LRC; LESD5L5.0T1G / 5L LRC型号: | LESD5L5.0T1G |
厂家: | ETC |
描述: | LESD5L5.0T1G/5L LRC |
文件: | 总4页 (文件大小:324K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
LESHAN RADIO COMPANY, LTD.
LESD5L5.0T1G
Transient Voltage
Suppressors
LESD5L5.0T1G
ESD Protection Diodes with Ultra−Low
Capacitance
1
The ESD5L is designed to protect voltage sensitive components that
require ultra−low capacitance from ESD and transient voltage events.
Excellent clamping capability, low capacitance, low leakage, and fast
response time, make these parts ideal for ESD protection on designs
where board space is at a premium. Because of its low capacitance, it is
suited for use in high frequency designs such as USB 2.0 high speed and
antenna line applications.
2
SOD– 523
Specification Features:
• Ultra Low Capacitance 0.5 pF
• Low Clamping Voltage
1
2
• Small Body Outline Dimensions:
0.047″ x 0.032″ (1.20 mm x 0.80 mm)
• Low Body Height: 0.024″ (0.6 mm)
• Stand−off Voltage: 5 V
PIN 1. CATHODE
2. ANODE
• Low Leakage
• Response Time is Typically < 1.0 ns
• IEC61000−4−2 Level 4 ESD Protection
• This is a Pb−Free Device
Ordering information
Shipping
Device
Marking
5L
3000/Tape&Reel
LESD5L5.0T1G
Mechanical Characteristics:
CASE: Void-free, transfer-molded, thermosetting plastic
Epoxy Meets UL 94 V−0
LEAD FINISH: 100% Matte Sn (Tin)
QUALIFIED MAX REFLOW TEMPERATURE:
Device Meets MSL 1 Requirements
260°C
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
IEC 61000−4−2 (ESD)
Contact
Air
10
15
kV
Total Power Dissipation on FR−5 Board
°P °
D
200
mW
(Note 1) @ T = 25°C
A
Storage Temperature Range
Junction Temperature Range
T
−55 to +150
−55 to +125
260
°C
°C
°C
stg
T
J
Lead Solder Temperature − Maximum
(10 Second Duration)
T
L
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. FR−5 = 1.0 x 0.75 x 0.62 in.
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LESHAN RADIO COMPANY, LTD.
LESD5L5.0T1G
ELECTRICAL CHARACTERISTICS
A
(T = 25°C unless otherwise noted)
I
Symbol
Parameter
Maximum Reverse Peak Pulse Current
Clamping Voltage @ I
I
F
I
PP
V
C
PP
V
RWM
Working Peak Reverse Voltage
V
C
V
V
BR RWM
I
Maximum Reverse Leakage Current @ V
V
R
RWM
I
R
I
T
V
F
V
BR
Breakdown Voltage @ I
Test Current
T
I
T
F
I
Forward Current
I
PP
V
F
Forward Voltage @ I
F
P
Peak Power Dissipation
Capacitance @ V = 0 and f = 1.0 MHz
pk
Uni−Directional TVS
C
R
*See Application Note AND8308/D for detailed explanations of
datasheet parameters.
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted, V = 1.0 V Max. @ I = 10 mA for all types)
A
F
F
V
(V)
C
V
RWM
I
R
(mA)
V (V) @ I
BR T
@ I = 1 A
PP
(V)
@ V
(Note 2)
(Note 3)
I
T
C (pF)
V
C
RWM
Per IEC61000−4−2
Device
Marking
(Note 4)
Max
Max
1.0
Min
mA
Typ
0.5
Max
Max
Device
LESD5L5.0T1G
5L
5.0
5.4
1.0
0.9
9.8
Figures 1 and 2
See Below
2. V is measured with a pulse test current I at an ambient temperature of 25°C.
BR
T
3. Surge current waveform per Figure 5.
4. For test procedure see Figures 3 and 4 and Application Note AND8307/D.
Figure 1. ESD Clamping Voltage Screenshot
Figure 2. ESD Clamping Voltage Screenshot
Positive 8 kV Contact per IEC61000−4−2
Negative 8 kV Contact per IEC61000−4−2
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86-755-83468588 www.fazhanIC.com
LESHAN RADIO COMPANY, LTD.
LESD5L5.0T1G
SOD−523
NOTES:
−X−
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M,
1982.
A
2. CONTROLLING DIMENSION: MILLIMETER.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM
THICKNESS OF BASE MATERIAL.
−Y−
B
MILLIMETERS
INCHES
NOM
0.047
0.032
0.024
0.012
1
2
DIM
A
B
C
D
J
K
S
MIN
1.10
0.70
0.50
0.25
0.07
0.15
1.50
NOM
1.20
0.80
0.60
0.30
0.14
0.20
1.60
MAX
MIN
MAX
0.051
0.035
0.028
0.014
1.30
0.90
0.70
0.35
0.043
0.028
0.020
0.010
D 2 PL
M
0.08 (0.003)
T
X
Y
0.20 0.0028 0.0055 0.0079
0.25
1.70
0.006
0.059
0.008
0.063
0.010
0.067
C
−T−
SEATING
PLANE
K
J
S
SOLDERING FOOTPRINT*
1.40
0.0547
0.40
0.0157
0.40
mm
inches
0.0157
ǒ
Ǔ
SCALE 10:1
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