LZ1-00UA00-00U5 [ETC]
EMITTER UV 395NM 1A SMD;型号: | LZ1-00UA00-00U5 |
厂家: | ETC |
描述: | EMITTER UV 395NM 1A SMD |
文件: | 总16页 (文件大小:856K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
High Efficacy
VIOLET LED Emitter
LZ1-00UA00
Key Features
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High Efficacy 5W VIOLET LED
Ultra-small foot print – 4.4mm x 4.4mm
Surface mount ceramic package with integrated glass lens
Very low Thermal Resistance (4.2°C/W)
Electrically neutral thermal path
Very high Radiant Flux density
Autoclave (121°C, 2 ATM, 100% RH, 168 Hours)
JEDEC Level 1 for Moisture Sensitivity Level
Lead (Pb) free and RoHS compliant
Reflow solderable (up to 6 cycles)
Emitter available on Standard or Miniature MCPCB (optional)
Typical Applications
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Dental Curing and Teeth Whitening
Ink and adhesive curing
Sterilization and Medical
DNA Gel
Description
The LZ1-00UA00 VIOLET LED emitter provides superior radiometric power in the wavelength range specifically
required for sterilization, dental curing lights, and numerous medical applications. With a 4.4mm x 4.4mm ultra-
small footprint, this package provides exceptional optical power density. The radiometric power performance and
optimal peak wavelength of this LED are matched to the response curves of dental resins, inks and adhesives,
resulting in a significantly reduced curing time. The patented design has unparalleled thermal and optical
performance. The high quality materials used in the package are chosen to optimize light output, have excellent
VIOLET resistance, and minimize stresses which results in monumental reliability and radiant flux maintenance.
UV RADIATION
Avoid exposure to the beam
Wear protective eyewear
COPYRIGHT © 2015 LED ENGIN. ALL RIGHTS RESERVED.
LZ1-00UA00 (6.1 – 02/06/15)
LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Part number options
Base part number
Part number
Description
LZ1-00UA00-xxxx
LZ1-10UA00-xxxx
LZ1-30UA00-xxxx
LZ1 emitter
LZ1 emitter on Standard Star MCPCB
LZ1 emitter on Miniature round MCPCB
Bin kit option codes
Single wavelength bin (5nm range)
Kit number suffix Min flux Bin Color Bin Range Description
00U4
00U5
00U6
00U7
00U8
K
L
L
L
L
U4
U5
U6
U7
U8
K minimum flux; wavelength U4 bin only
L minimum flux; wavelength U5 bin only
L minimum flux; wavelength U6 bin only
L minimum flux; wavelength U7 bin only
L minimum flux; wavelength U8 bin only
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Radiant Flux Bins
Table 1:
Minimum
Radiant Flux (Φ)
@ IF = 700mA[1,2]
(mW)
Maximum
Radiant Flux (Φ)
@ IF = 700mA[1,2]
(mW)
Bin Code
K
640
800
800
L
M
1000
1250
1000
Notes for Table 1:
1.
2.
Radiant flux performance guaranteed within published operating conditions. LED Engin maintains a tolerance of ± 10% on flux measurements.
Future products will have even higher levels of radiant flux performance. Contact LED Engin Sales for updated information.
Peak Wavelength Bins
Table 2:
Minimum
Maximum
Peak Wavelength (λP)
@ IF = 700mA[1]
(nm)
Peak Wavelength (λP)
@ IF = 700mA[1]
(nm)
Bin Code
U4
385
390
395
400
405
390
395
400
405
410
U5
U6
U7
U8
Notes for Table 2:
1.
LED Engin maintains a tolerance of ± 2.0nm on peak wavelength measurements.
Forward Voltage Bins
Table 3:
Minimum
Forward Voltage (VF)
@ IF = 700mA[1]
(V)
Maximum
Forward Voltage (VF)
@ IF = 700mA[1]
(V)
Bin Code
0
3.20
4.40
Notes for Table 3:
1.
LED Engin maintains a tolerance of ± 0.04V for forward voltage measurements.
COPYRIGHT © 2015 LED ENGIN. ALL RIGHTS RESERVED.
LZ1-00UA00 (6.1 – 02/06/15)
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Absolute Maximum Ratings
Table 4:
Parameter
Symbol
Value
Unit
DC Forward Current[1]
Peak Pulsed Forward Current[2]
Reverse Voltage
IF
IFP
1000
1000
mA
mA
V
VR
Tstg
TJ
See Note 3
-40 ~ +150
125
Storage Temperature
Junction Temperature
Soldering Temperature
Allowable Reflow Cycles
°C
°C
Tsol
260
°C
6
121°C at 2 ATM,
100% RH for 168 hours
Autoclave Conditions
> 2,000 V HBM
Class 2 JESD22-A114-D
ESD Sensitivity[4]
Notes for Table 4:
1.
Maximum DC forward current is determined by the overall thermal resistance and ambient temperature.
Follow the curves in Figure 10 for current derating.
Pulse forward current conditions: Pulse Width ≤ 10msec and Duty Cycle ≤ 10%.
LEDs are not designed to be reverse biased.
LED Engin recommends taking reasonable precautions towards possible ESD damages and handling the LZ1-00UA00 in an electrostatic protected area (EPA).
An EPA may be adequately protected by ESD controls as outlined in ANSI/ESD S6.1.
2:
3.
4.
Optical Characteristics @ TC = 25°C
Table 5:
Typical
385-390nm 390-400nm 400-410nm
Parameter
Symbol
Unit
Radiant Flux (@ IF = 700mA)
Radiant Flux (@ IF = 1000mA)
Peak Wavelength[1]
Φ
Φ
760
1070
385
900
1260
395
74
1000
1400
405
mW
mW
λP
nm
Viewing Angle[2]
2Θ1/2
Θ0.9V
Degrees
Degrees
Total Included Angle[3]
110
Notes for Table 5:
1.
2.
3.
When operating the VIOLET LED, observe IEC 60825-1 class 3B rating. Avoid exposure to the beam.
Viewing Angle is the off axis angle from emitter centerline where the radiometric power is ½ of the peak value.
Total Included Angle is the total angle that includes 90% of the total radiant flux.
Electrical Characteristics @ TC = 25°C
Table 6:
Parameter
Symbol
Typical
Unit
Forward Voltage (@ IF = 700mA)
Forward Voltage (@ IF = 1000mA)
VF
VF
3.9
4.1
V
V
Temperature Coefficient
of Forward Voltage
ΔVF/ΔTJ
RΘJ-C
-3.7
4.2
mV/°C
°C/W
Thermal Resistance
(Junction to Case)
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LZ1-00UA00 (6.1 – 02/06/15)
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
IPC/JEDEC Moisture Sensitivity Level
Table 7 - IPC/JEDEC J-STD-20D.1 MSL Classification:
Soak Requirements
Floor Life
Conditions
Standard
Conditions
Accelerated
Level
1
Time
Time (hrs)
Time (hrs)
Conditions
≤ 30°C/
168
+5/-0
85°C/
85% RH
Unlimited
n/a
n/a
85% RH
Notes for Table 7:
1.
The standard soak time includes a default value of 24 hours for semiconductor manufacturer’s exposure time (MET) between bake and bag and the
floor life of maximum time allowed out of the bag at the end user of distributor’s facility.
Average Radiant Flux Maintenance Projections
Lumen maintenance generally describes the ability of an emitter to retain its output over time. The useful lifetime
for power LEDs is also defined as Radiant Flux Maintenance, with the percentage of the original light output
remaining at a defined time period.
Based on long-term WHTOL testing, LED Engin projects that the LZ Series will deliver, on average, 70% Radiant Flux
Maintenance (RP70%) at 20,000 hours of operation at a forward current of 700 mA per die. This projection is
based on constant current operation with junction temperature maintained at or below 80°C.
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LZ1-00UA00 (6.1 – 02/06/15)
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Mechanical Dimensions (mm)
Pin Out
Function
Pad
1
Cathode
Anode
2
3
Anode
4
5[2]
Cathode
Thermal
1
2
5
4
3
Figure 1: Package outline drawing.
Notes for Figure 1:
1.
2.
Unless otherwise noted, the tolerance = ± 0.20 mm.
Thermal contact, Pad 5, is electrically neutral.
Recommended Solder Pad Layout (mm)
Figure 2a: Recommended solder pad layout for anode, cathode, and thermal pad
Note for Figure 2a:
1.
Unless otherwise noted, the tolerance = ± 0.20 mm.
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Recommended Solder Mask Layout (mm)
Figure 2b: Recommended solder mask opening for anode, cathode, and thermal pad
Note for Figure 2b:
1.
Unless otherwise noted, the tolerance = ± 0.20 mm.
Recommended 8mil Stencil Apertures Layout (mm)
Figure 2c: Recommended solder mask opening for anode, cathode, and thermal pad
Note for Figure 2c:
1.
Unless otherwise noted, the tolerance = ± 0.20 mm.
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LZ1-00UA00 (6.1 – 02/06/15)
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Reflow Soldering Profile
Figure 3: Reflow soldering profile for lead free soldering.
Typical Radiation Pattern
100%
90%
80%
70%
60%
50%
40%
30%
20%
10%
0%
-90 -80 -70 -60 -50 -40 -30 -20 -10
0
10 20 30 40 50 60 70 80 90
Angular Displacement (Degrees)
Figure 4: Typical representative spatial radiation pattern
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Typical Relative Spectral Power Distribution
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
300
350
400
450
500
Wavelength (nm)
Figure 5: Typical relative spectral power vs. wavelength @ TC = 25°C.
Typical Peak Wavelength Shift over Temperature
6.0
5.0
4.0
3.0
2.0
1.0
0.0
0
20
40
60
80
100
120
Case Temperature (ºC)
Figure 6: Typical peak wavelength shift vs. case temperature.
COPYRIGHT © 2015 LED ENGIN. ALL RIGHTS RESERVED.
LZ1-00UA00 (6.1 – 02/06/15)
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Typical Normalized Radiant Flux
1.4
1.2
1
0.8
0.6
0.4
0.2
0
0
200
400
600
800
1000
IF - Forward Current (mA)
Figure 7: Typical normalized radiant flux vs. forward current @ TC = 25°C.
Typical Normalized Radiant Flux over Temperature
1.20
1.00
0.80
0.60
0.40
0.20
0.00
0
20
40
60
80
100
120
Case Temperature (oC)
Figure 8: Typical normalized radiant flux vs. case temperature @700mA
COPYRIGHT © 2015 LED ENGIN. ALL RIGHTS RESERVED.
LZ1-00UA00 (6.1 – 02/06/15)
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Typical Forward Current Characteristics
1200
1000
800
600
400
200
0
2.5
3.0
3.5
4.0
4.5
5.0
VF - Forward Voltage (V)
Figure 9: Typical forward current vs. forward voltage @ TC = 25°C.
Current De-rating
1200
1000
800
700
(Rated)
600
400
200
RΘJ-A = 9°C/W
RΘJ-A = 11°C/W
RΘJ-A = 13°C/W
0
0
25
50
75
100
125
Maximum Ambient Temperature (ºC)
Figure 10: Maximum forward current vs. ambient temperature based on TJ(MAX) = 125°C.
Notes for Figure 10:
1.
RΘJ-C [Junction to Case Thermal Resistance] for the LZ1-00UA00 is typically 4.2°C/W.
2.
RΘJ-A [Junction to Ambient Thermal Resistance] = RΘJ-C + RΘC-A [Case to Ambient Thermal Resistance].
COPYRIGHT © 2015 LED ENGIN. ALL RIGHTS RESERVED.
LZ1-00UA00 (6.1 – 02/06/15)
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Emitter Tape and Reel Specifications (mm)
Figure 11: Emitter carrier tape specifications (mm).
Figure 12: Emitter reel specifications (mm).
Reel quantity minimum: 100 emitters. Reel quantity maximum: 2000 emitters
Notes:
1.
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
LZ1 MCPCB Family
Emitter + MCPCB
Thermal Resistance
(°C /W)
Diameter
(mm)
Typical Vf
(V)
Typical If
(mA)
Part number
Type of MCPCB
LZ1-1xxxxx
LZ1-3xxxxx
1-channel Star
1-channel Mini
19.9
11.5
4.2 + 1.5 = 5.7
4.2 + 2.0 = 6.2
3.9
3.9
700
700
Mechanical Mounting of MCPCB
.
MCPCB bending should be avoided as it will cause mechanical stress on the emitter, which could lead to
substrate cracking and subsequently LED dies cracking.
.
To avoid MCPCB bending:
o
o
Special attention needs to be paid to the flatness of the heat sink surface and the torque on the screws.
Care must be taken when securing the board to the heat sink. This can be done by tightening three M3
screws (or #4-40) in steps and not all the way through at once. Using fewer than three screws will
increase the likelihood of board bending.
o
o
It is recommended to always use plastics washers in combinations with the three screws.
If non-taped holes are used with self-tapping screws, it is advised to back out the screws slightly after
tightening (with controlled torque) and then re-tighten the screws again.
Thermal interface material
.
.
.
To properly transfer heat from LED emitter to heat sink, a thermally conductive material is required when
mounting the MCPCB on to the heat sink.
There are several varieties of such material: thermal paste, thermal pads, phase change materials and thermal
epoxies. An example of such material is Electrolube EHTC.
It is critical to verify the material’s thermal resistance to be sufficient for the selected emitter and its operating
conditions.
Wire soldering
.
To ease soldering wire to MCPCB process, it is advised to preheat the MCPCB on a hot plate of 125-150oC.
Subsequently, apply the solder and additional heat from the solder iron will initiate a good solder reflow. It is
recommended to use a solder iron of more than 60W.
.
It is advised to use lead-free, no-clean solder. For example: SN-96.5 AG-3.0 CU 0.5 #58/275 from Kester (pn:
24-7068-7601)
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LZ1-00UA00 (6.1 – 02/06/15)
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
LZ1-1xxxxx
1 channel, Standard Star MCPCB (1x1) Dimensions (mm)
Notes:
Unless otherwise noted, the tolerance = ± 0.2 mm.
Slots in MCPCB are for M3 or #4-40 mounting screws.
LED Engin recommends plastic washers to electrically insulate screws from solder pads and electrical traces.
LED Engin recommends using thermal interface material when attaching the MCPCB to a heat sink.
The thermal resistance of the MCPCB is: RΘC-B 1.5°C/W
Components used
MCPCB:
HT04503
(Bergquist)
(Diodes, Inc., for 1 LED die)
(Vishay Semiconductors, for 1 LED die)
ESD/TVS Diode: BZT52C5V1LP-7
VBUS05L1-DD1
Pad layout
MCPCB
Pad
Ch.
String/die Function
1,2,3
4,5,6
Cathode -
Anode +
1
1/A
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
LZ1-3xxxxx
1 channel, Mini Round MCPCB (1x1) Dimensions (mm)
Notes:
Unless otherwise noted, the tolerance = ± 0.20 mm.
LED Engin recommends using thermal interface material when attaching the MCPCB to a heat sink.
The thermal resistance of the MCPCB is: RΘC-B 2.0°C/W
Components used
MCPCB:
HT04503
(Bergquist)
(Diodes, Inc., for 1 LED die)
(Vishay Semiconductors, for 1 LED die)
ESD/TVS Diode: BZT52C5V1LP-7
VBUS05L1-DD1
Pad layout
MCPCB
Pad
Ch.
String/die Function
1
2
Anode +
Cathode -
1
1/A
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Company Information
LED Engin, Inc., based in California’s Silicon Valley, specializes in ultra-bright, ultra compact solid state lighting
solutions allowing lighting designers & engineers the freedom to create uncompromised yet energy efficient
lighting experiences. The LuxiGen™ Platform — an emitter and lens combination or integrated module
solution, delivers superior flexibility in light output, ranging from 3W to 90W, a wide spectrum of available colors,
including whites, multi-color and UV, and the ability to deliver upwards of 5,000 high quality lumens to a target.
The small size combined with powerful output allows for a previously unobtainable freedom of design wherever
high-flux density, directional light is required. LED Engin’s packaging technologies lead the industry with products
that feature lowest thermal resistance, highest flux density and consummate reliability, enabling compact and
efficient solid state lighting solutions.
LED Engin is committed to providing products that conserve natural resources and reduce greenhouse emissions.
LED Engin reserves the right to make changes to improve performance without notice.
Please contact sales@ledengin.com or (408) 922-7200 for more information.
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LZ1-00UA00 (6.1 – 02/06/15)
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
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