LZ4-00UA00-00U7 [ETC]
EMITTER UV 405NM 1A;型号: | LZ4-00UA00-00U7 |
厂家: | ETC |
描述: | EMITTER UV 405NM 1A |
文件: | 总15页 (文件大小:1309K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
High Efficacy
VIOLET LED Emitter
LZ4-00UA00
Key Features
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High Efficacy 10W Violet LED
Ultra-small foot print – 7.0mm x 7.0mm
Surface mount ceramic package with integrated glass lens
Very low Thermal Resistance (1.1°C/W)
Electrically neutral thermal path
Individually addressable die
Very high Radiant Flux density
JEDEC Level 1 for Moisture Sensitivity Level
Autoclave complaint (JEDEC JESD22-A102-C)
Lead (Pb) free and RoHS compliant
Reflow solderable (up to 6 cycles)
Emitter available on Standard or Serially Connected MCPCB (optional)
Typical Applications
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Dental Curing and Teeth Whitening
Sterilization and Medical
Ink and Adhesive Curing
DNA Gel
Description
The LZ4-00UA00 VIOLET LED emitter provides superior radiometric power in the wavelength range specifically
required for sterilization, dental curing lights, and numerous medical applications. With a 7.0mm x 7.0mm ultra-
small footprint, this package provides exceptional optical power density. The radiometric power performance and
optimal peak wavelength of this LED are matched to the response curves of many dental resins, inks & adhesives,
resulting in a significantly reduced curing time. The patent-pending design has unparalleled thermal and optical
performance. The high quality materials used in the package are chosen to optimize light output, have excellent
VIOLET resistance, and minimize stresses which results in monumental reliability and radiant flux maintenance.
UV RADIATION
Avoid exposure to the beam
Wear protective eyewear
COPYRIGHT © 2016 LED ENGIN. ALL RIGHTS RESERVED.
LZ4-00UA00 (6.2 – 10/21/16)
LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Part number options
Base part number
Part number
Description
LZ4-00UA00-xxxx
LZ4-40UA00-xxxx
LZ4 emitter
LZ4 emitter on Standard Star 1 channel MCPCB
Bin kit option codes
Single wavelength bin (5nm range)
Kit number suffix Min flux Bin Color Bin Range Description
00U4
00U5
00U6
00U7
00U8
R
S
S
S
S
U4
U5
U6
U7
U8
R minimum flux; wavelength U4 bin only
S minimum flux; wavelength U5 bin only
S minimum flux; wavelength U6 bin only
S minimum flux; wavelength U7 bin only
S minimum flux; wavelength U8 bin only
COPYRIGHT © 2016 LED ENGIN. ALL RIGHTS RESERVED.
LZ4-00UA00 (6.2 – 10/21/16)
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Radiant Flux Bins
Table 1:
Minimum
Radiant Flux (Φ)
@ IF = 700mA[1,2]
(W)
Maximum
Radiant Flux (Φ)
@ IF = 700mA[1,2]
(W)
Bin Code
R
2.40
3.00
3.80
3.00
3.80
4.80
S
T
Notes for Table 1:
1.
Radiant flux performance guaranteed within published operating conditions. LED Engin maintains a tolerance of ± 10% on flux measurements.
2.
Future products will have even higher levels of radiant flux performance. Contact LED Engin Sales for updated information.
Peak Wavelength Bins
Table 2:
Minimum
Maximum
Peak Wavelength (λP)
@ IF = 700mA[1]
(nm)
Peak Wavelength (λP)
@ IF = 700mA[1]
(nm)
Bin Code
U4
385
390
395
400
405
390
395
400
405
410
U5
U6
U7
U8
Notes for Table 2:
1.
LED Engin maintains a tolerance of ± 2.0nm on peak wavelength measurements.
Forward Voltage Bins
Table 3:
Minimum
Forward Voltage (VF)
@ IF = 700mA[1,2]
(V)
Maximum
Forward Voltage (VF)
@ IF = 700mA[1,2]
(V)
Bin Code
0
13.76
18.56
Notes for Table 3:
1.
2.
LED Engin maintains a tolerance of ± 0.16V for forward voltage measurements.
Forward Voltage is binned with all four LED dice connected in series.
COPYRIGHT © 2016 LED ENGIN. ALL RIGHTS RESERVED.
LZ4-00UA00 (6.2 – 10/21/16)
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Absolute Maximum Ratings
Table 4:
Parameter
Symbol
Value
Unit
DC Forward Current[1]
Peak Pulsed Forward Current[2]
Reverse Voltage
IF
IFP
VR
Tstg
TJ
1000
1000
See Note 3
-40 ~ +150
125
mA
mA
V
°C
°C
Storage Temperature
Junction Temperature
Soldering Temperature
Allowable Reflow Cycles
Tsol
260
6
°C
121°C at 2 ATM,
100% RH for 168 hours
Autoclave Conditions[4]
> 2,000 V HBM
Class 2 JESD22-A114-D
ESD Sensitivity[5]
Notes for Table 4:
1.
Maximum DC forward current is determined by the overall thermal resistance and ambient temperature.
Follow the curves in Figure 10 for current derating.
2:
3.
4.
5.
Pulse forward current conditions: Pulse Width ≤ 10msec and Duty Cycle ≤ 10%.
LEDs are not designed to be reverse biased.
Autoclave Conditions per JEDEC JESD22-A102-C.
LED Engin recommends taking reasonable precautions towards possible ESD damages and handling the LZ4-00UA00
in an electrostatic protected area (EPA). An EPA may be adequately protected by ESD controls as outlined in
ANSI/ESD S6.1.
Optical Characteristics @ TC = 25°C
Table 5:
Typical
385-390nm 390-400nm 400-410nm
Parameter
Symbol
Unit
Radiant Flux (@ IF = 700mA)
Radiant Flux (@ IF = 1000mA)
Peak Wavelength[1]
Φ
Φ
2.95
4.10
385
3.50
4.90
395
97
3.90
5.45
405
W
W
λP
nm
Viewing Angle[2]
2Θ1/2
Θ0.9V
Degrees
Degrees
Total Included Angle[3]
120
Notes for Table 5:
1.
2.
3.
When operating the VIOLET LED, observe IEC 60825-1 class 3B rating. Avoid exposure to the beam.
Viewing Angle is the off axis angle from emitter centerline where the radiant power is ½ of the peak value.
Total Included Angle is the total angle that includes 90% of the total radiant flux.
Electrical Characteristics @ TC = 25°C
Table 6:
Typical
1 Die 4 Dice
Parameter
Symbol
Unit
Forward Voltage (@ IF = 700mA)
Forward Voltage (@ IF = 1000mA)
VF
VF
3.9
4.1
15.6
16.5
V
V
Temperature Coefficient
of Forward Voltage
ΔVF/ΔTJ
RΘJ-C
-14.2
1.1
mV/°C
°C/W
Thermal Resistance
(Junction to Case)
COPYRIGHT © 2016 LED ENGIN. ALL RIGHTS RESERVED.
LZ4-00UA00 (6.2 – 10/21/16)
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
IPC/JEDEC Moisture Sensitivity Level
Table 7 - IPC/JEDEC J-STD MSL-20 Classification:
Soak Requirements
Floor Life
Conditions
Standard
Conditions
Accelerated
Level
1
Time
Time (hrs)
Time (hrs)
Conditions
≤ 30°C/
168
+5/-0
85°C/
85% RH
Unlimited
n/a
n/a
85% RH
Notes for Table 7:
1.
The standard soak time is the sum of the default value of 24 hours for the semiconductor manufacturer’s exposure time (MET) between bake and bag
and the floor life of maximum time allowed out of the bag at the end user of distributor’s facility.
Average Radiant Flux Maintenance Projections
Lumen maintenance generally describes the ability of an emitter to retain its output over time. The useful lifetime
for power LEDs is also defined as Radiant Flux Maintenance, with the percentage of the original light output
remaining at a defined time period.
Based on long-term WHTOL testing, LED Engin projects that the LZ Series will deliver, on average, 70% Radiant Flux
Maintenance (RP70%) at 20,000 hours of operation at a forward current of 700 mA per die. This projection is
based on constant current operation with junction temperature maintained at or below 80°C.
COPYRIGHT © 2016 LED ENGIN. ALL RIGHTS RESERVED.
LZ4-00UA00 (6.2 – 10/21/16)
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Mechanical Dimensions (mm)
Pin Out
Pad
1
Die
Function
A
Anode
Cathode
Anode
2
A
3
B
4
B
Cathode
Anode
5
C
6
C
Cathode
Anode
7
D
8
9[2]
D
Cathode
Thermal
n/a
2
3
1
8
4
Figure 1: Package outline drawing.
7
5
6
Notes for Figure 1:
1.
2.
Unless otherwise noted, the tolerance = ± 0.20 mm.
Thermal contact, Pad 9, is electrically neutral.
Recommended Solder Pad Layout (mm)
Non-pedestal MCPCB Design
Pedestal MCPCB Design
Figure 2a: Recommended solder pad layout for anode, cathode, and thermal pad for
non-pedestal and pedestal design
Note for Figure 2a:
1. Unless otherwise noted, the tolerance = ± 0.20 mm.
2. Pedestal MCPCB allows the emitter thermal slug to be soldered directly to the metal core of the MCPCB. Such MCPCB eliminate the high thermal resistance
dielectric layer that standard MCPCB technologies use in between the emitter thermal slug and the metal core of the MCPCB, thus lowering the overall system
thermal resistance.
3. LED Engin recommends x-ray sample monitoring for solder voids underneath the emitter thermal slug. The total area covered by solder voids should be less
than 20% of the total emitter thermal slug area. Excessive solder voids will increase the emitter to MCPCB thermal resistance and may lead to higher failure
rates due to thermal over stress.
COPYRIGHT © 2016 LED ENGIN. ALL RIGHTS RESERVED.
LZ4-00UA00 (6.2 – 10/21/16)
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Recommended Solder Mask Layout (mm)
Non-pedestal MCPCB Design
Pedestal MCPCB Design
Figure 2b: Recommended solder mask opening for anode, cathode, and thermal pad for non-pedestal and pedestal design
Note for Figure 2b:
1. Unless otherwise noted, the tolerance = ± 0.20 mm.
Recommended 8 mil Stencil Apertures Layout (mm)
Non-pedestal MCPCB Design
Pedestal MCPCB Design
Figure 2c: Recommended 8mil stencil apertures for anode, cathode, and
thermal pad for non-pedestal and pedestal design
Note for Figure 2c:
1.
Unless otherwise noted, the tolerance = ± 0.20 mm.
COPYRIGHT © 2016 LED ENGIN. ALL RIGHTS RESERVED.
LZ4-00UA00 (6.2 – 10/21/16)
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Reflow Soldering Profile
Figure 3: Reflow soldering profile for lead free soldering.
Notes for Figure 3:
1.
Solder profile for low temperature solder. LED Engin recommends 58Bi-42Sn (wt.%) Solder for the LZ4-00UA00.
Typical Radiation Pattern
100
90
80
70
60
50
40
30
20
10
0
-90 -80 -70 -60 -50 -40 -30 -20 -10
0
10 20 30 40 50 60 70 80 90
Angular Displacement (Degrees)
Figure 4: Typical representative spatial radiation pattern.
COPYRIGHT © 2016 LED ENGIN. ALL RIGHTS RESERVED.
LZ4-00UA00 (6.2 – 10/21/16)
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Typical Relative Spectral Power Distribution
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
300
350
400
450
500
Wavelength (nm)
Figure 5: Typical relative spectral power vs. wavelength @ TC = 25°C.
Typical Peak Wavelength Shift over Temperature
5.0
4.0
3.0
2.0
1.0
0.0
0
20
40
60
80
100
120
Case Temperature (ºC)
Figure 6: Typical peak wavelength shift vs. case temperature.
COPYRIGHT © 2016 LED ENGIN. ALL RIGHTS RESERVED.
LZ4-00UA00 (6.2 – 10/21/16)
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Typical Normalized Radiant Flux
1.4
1.2
1
0.8
0.6
0.4
0.2
0
0
200
400
600
800
1000
IF - Forward Current (mA)
Figure 7: Typical normalized radiant flux vs. forward current @ TC = 25°C.
Typical Normalized Radiant Flux over Temperature
1.20
1.00
0.80
0.60
0.40
0.20
0.00
0
20
40
60
80
100
120
Case Temperature (oC)
Figure 8: Typical normalized radiant flux vs. case temperature @700mA
COPYRIGHT © 2016 LED ENGIN. ALL RIGHTS RESERVED.
LZ4-00UA00 (6.2 – 10/21/16)
10
LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Typical Forward Current Characteristics
1200
1000
800
600
400
200
0
11.0
12.0
13.0
14.0
15.0
16.0
17.0
18.0
VF - Forward Voltage (V)
Figure 9: Typical forward current vs. forward voltage @ TC = at 25°C.
Current De-rating
1200
1000
800
700
(Rated)
600
400
200
RΘJ-A = 4°C/W
RΘJ-A = 5°C/W
RΘJ-A = 6°C/W
0
0
25
50
75
100
125
Maximum Ambient Temperature (ºC)
Figure 10: Maximum forward current vs. ambient temperature based on TJ(MAX) = 125°C.
Notes for Figure 10:
1.
2.
RΘJ-C [Junction to Case Thermal Resistance] for the LZ4-00UA00 is typically 1.1°C/W.
RΘJ-A [Junction to Ambient Thermal Resistance] = RΘJ-C + RΘC-A [Case to Ambient Thermal Resistance].
COPYRIGHT © 2016 LED ENGIN. ALL RIGHTS RESERVED.
LZ4-00UA00 (6.2 – 10/21/16)
11
LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Emitter Tape and Reel Specifications (mm)
Figure 11: Emitter carrier tape specifications (mm).
Figure 12: Emitter Reel specifications (mm).
Notes:
1.
Packaging contains VIOLET caution labels. Avoid exposure to the beam and wear appropriate protective eyewear when operating the VIOLET LED.
COPYRIGHT © 2016 LED ENGIN. ALL RIGHTS RESERVED.
LZ4-00UA00 (6.2 – 10/21/16)
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
LZ4 MCPCB Family
Emitter + MCPCB
Thermal Resistance
(°C /W)
Diameter
(mm)
Typical Vf
(V)
Typical If
(mA)
Part number
Type of MCPCB
LZ4-4xxxxx
1-channel
19.9
1.1 + 1.1 = 2.2
15.6
700
Mechanical Mounting of MCPCB
.
MCPCB bending should be avoided as it will cause mechanical stress on the emitter, which could lead to
substrate cracking and subsequently LED dies cracking.
.
To avoid MCPCB bending:
o
o
Special attention needs to be paid to the flatness of the heat sink surface and the torque on the screws.
Care must be taken when securing the board to the heat sink. This can be done by tightening three M3
screws (or #4-40) in steps and not all the way through at once. Using fewer than three screws will
increase the likelihood of board bending.
o
o
It is recommended to always use plastics washers in combinations with the three screws.
If non-taped holes are used with self-tapping screws, it is advised to back out the screws slightly after
tightening (with controlled torque) and then re-tighten the screws again.
Thermal interface material
.
.
.
To properly transfer heat from LED emitter to heat sink, a thermally conductive material is required when
mounting the MCPCB on to the heat sink.
There are several varieties of such material: thermal paste, thermal pads, phase change materials and thermal
epoxies. An example of such material is Electrolube EHTC.
It is critical to verify the material’s thermal resistance to be sufficient for the selected emitter and its operating
conditions.
Wire soldering
.
To ease soldering wire to MCPCB process, it is advised to preheat the MCPCB on a hot plate of 125-150oC.
Subsequently, apply the solder and additional heat from the solder iron will initiate a good solder reflow. It is
recommended to use a solder iron of more than 60W.
.
It is advised to use lead-free, no-clean solder. For example: SN-96.5 AG-3.0 CU 0.5 #58/275 from Kester (pn:
24-7068-7601)
COPYRIGHT © 2016 LED ENGIN. ALL RIGHTS RESERVED.
LZ4-00UA00 (6.2 – 10/21/16)
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
LZ4-4xxxxx
1 channel, Standard Star MCPCB (1x4) Dimensions (mm)
Notes:
Unless otherwise noted, the tolerance = ± 0.2 mm.
Slots in MCPCB are for M3 or #4-40 mounting screws.
LED Engin recommends plastic washers to electrically insulate screws from solder pads and electrical traces.
Electrical connection pads on MCPCB are labeled “+” for Anode and “-” for Cathode
LED Engin recommends thermal interface material when attaching the MCPCB to a heatsink
The thermal resistance of the MCPCB is: RΘC-B 1.1°C/W
Components used
MCPCB:
HT04503
(Bergquist)
ESD chips:
BZX585-C30
(NXP, for 4 LED dies in series)
Pad layout
MCPCB
Pad
Ch.
String/die Function
1, 2, 3
4, 5
Cathode -
Anode +
1
1/ABCD
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LZ4-00UA00 (6.2 – 10/21/16)
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Company Information
LED Engin, Inc., based in California’s Silicon Valley, specializes in ultra-bright, ultra compact solid state lighting
solutions allowing lighting designers & engineers the freedom to create uncompromised yet energy efficient
lighting experiences. The LuxiGen™ Platform — an emitter and lens combination or integrated module
solution, delivers superior flexibility in light output, ranging from 3W to 90W, a wide spectrum of available colors,
including whites, multi-color and UV, and the ability to deliver upwards of 5,000 high quality lumens to a target.
The small size combined with powerful output allows for a previously unobtainable freedom of design wherever
high-flux density, directional light is required. LED Engin’s packaging technologies lead the industry with products
that feature lowest thermal resistance, highest flux density and consummate reliability, enabling compact and
efficient solid state lighting solutions.
LED Engin is committed to providing products that conserve natural resources and reduce greenhouse emissions.
LED Engin reserves the right to make changes to improve performance without notice.
Please contact sales@ledengin.com or (408) 922-7200 for more information.
COPYRIGHT © 2016 LED ENGIN. ALL RIGHTS RESERVED.
LZ4-00UA00 (6.2 – 10/21/16)
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
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