LZ9-J0NW00-0040 [ETC]
LED EMITTER WHT 1650LM 1CH MCPCB;型号: | LZ9-J0NW00-0040 |
厂家: | ETC |
描述: | LED EMITTER WHT 1650LM 1CH MCPCB PC |
文件: | 总20页 (文件大小:1268K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
High Luminous Efficacy
Neutral White LED Emitter
LZ9-00NW00
Key Features
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High Luminous Efficacy, Neutral White LED
CRI 80 minimum
Single 4000K ANSI bin distribution
Can dissipate up to 20W
Ultra-small foot print – 7.0mm x 7.0mm
Surface mount ceramic package with integrated glass lens
Low Thermal Resistance (1.3°C/W)
Very high Luminous Flux density
JEDEC Level 1 for Moisture Sensitivity Level
Autoclave complaint (JEDEC JESD22-A102-C)
Lead (Pb) free and RoHS compliant
Reflow solderable (up to 6 cycles)
Emitter available on MCPCB (optional)
Full suite of TIR secondary optics family available
Part Number Options
Base part number
Part number
Description
LZ9-00NW00-xxxx
LZ9-J0NW00-xxxx
LZ9-M0NW00-xxxx
9-die emitter CRI 80 minimum
9-die emitter CRI 80 minimum on Star MCPCB in 1x9 electrical configuration
9-die emitter CRI 80 minimum on Star MCPCB in 3x3 electrical configuration
COPYRIGHT © 2014 LED ENGIN. ALL RIGHTS RESERVED.
LZ9-00NW00 (1.7-02/23/14)
LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Bin Kit Option Codes
NW, Neutral-White (4000K)
Min
flux
Bin
Kit number
suffix
Color Bin Ranges
Description
5B2, 5C2, 5B1, 5C1, 5A2, 5D2, 5A1, 5D1
0040
Y
full distribution flux; 4000K ANSI CCT bin
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Neutral White Chromaticity Groups
0.44
0.42
0.40
0.38
5C2
5C1
5D2
5D1
5B2
5B1
5A2
5A1
Planckian Locus
0.36
0.34
0.32
4000K ANSI
C78.377A bin
0.34
0.36
0.38
CIEx
0.40
0.42
Standard Chromaticity Groups plotted on excerpt from the CIE 1931 (2°) x-y Chromaticity Diagram.
Coordinates are listed below in the table.
Neutral White Bin Coordinates
Bin code CIEx
0.3719
CIEy
Bin code CIEx
0.3847
CIEy
0.3797
0.3874
0.3958
0.3877
0.3797
0.3722
0.3797
0.3877
0.3798
0.3722
0.3649
0.3722
0.3798
0.3721
0.3649
0.3578
0.3649
0.3721
0.3646
0.3578
0.3877
0.3958
0.4044
0.3958
0.3877
0.3798
0.3877
0.3958
0.3875
0.3798
0.3721
0.3798
0.3875
0.3794
0.3721
0.3646
0.3721
0.3794
0.3716
0.3646
0.3736
0.3869
0.3847
0.3719
0.3702
0.3719
0.3847
0.3825
0.3702
0.3686
0.3702
0.3825
0.3804
0.3686
0.367
0.3869
0.4006
0.3978
0.3847
0.3825
0.3847
0.3978
0.395
5B2
5B1
5A2
5A1
5C2
5C1
5D2
5D1
0.3825
0.3804
0.3825
0.395
0.3924
0.3804
0.3783
0.3804
0.3924
0.3898
0.3783
0.3686
0.3804
0.3783
0.367
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Luminous Flux Bins
Table 1:
Minimum
Maximum
Luminous Flux (Φv)
@ IF = 700mA[1,2]
(lm)
Luminous Flux (Φv)
@ IF = 700mA[1,2]
(lm)
Bin Code
Y
1357
1696
1696
2120
Z
Notes for Table 1:
1.
Luminous flux performance guaranteed within published operating conditions. LED Engin maintains a tolerance of ± 10% on flux measurements.
Forward Voltage Range per String
Table 2:
Minimum
Maximum
Forward Voltage (VF)
Forward Voltage (VF)
@ IF = 700mA[1,2]
(V)
Bin Code
@ IF = 700mA[1,2]
(V)
0
9.0
10.8
Notes for Table 2:
1.
2.
LED Engin maintains a tolerance of ± 0.04V for forward voltage measurements.
Forward Voltage per string of 3 LED dies in series.
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Absolute Maximum Ratings
Table 3:
Parameter
Symbol
Value
Unit
mA
mA
mA
V
°C
°C
°C
DC Forward Current at Tjmax=135°C[1]
DC Forward Current at Tjmax=150°C[1]
Peak Pulsed Forward Current[2]
Reverse Voltage
IF
IF
IFP
VR
Tstg
TJ
800
700
1000
See Note 3
-40 ~ +150
150
Storage Temperature
Junction Temperature
Soldering Temperature[4]
Allowable Reflow Cycles
Tsol
260
6
121°C at 2 ATM,
100% RH for 168 hours
Autoclave Conditions[5]
> 8,000 V HBM
Class 3B JESD22-A114-D
ESD Sensitivity[6]
Notes for Table 3:
1.
Maximum DC forward current (per die) is determined by the overall thermal resistance and ambient temperature. Follow the curves in Figure 10 for current
de-rating.
2:
3.
4.
5.
6.
Pulse forward current conditions: Pulse Width ≤ 10msec and Duty Cycle ≤ 10%.
LEDs are not designed to be reverse biased.
Solder conditions per JEDEC 020c. See Reflow Soldering Profile Figure 3.
Autoclave Conditions per JEDEC JESD22-A102-C.
LED Engin recommends taking reasonable precautions towards possible ESD damages and handling the LZ9-00NW00 in an electrostatic protected area (EPA).
An EPA may be adequately protected by ESD controls as outlined in ANSI/ESD S6.1.
Optical Characteristics @ TC = 25°C
Table 4:
Typical
Parameter
Symbol
Unit
Luminous Flux (@ IF = 700mA)[1]
Luminous Efficacy (@ IF =350mA)
Correlated Color Temperature
Color Rendering Index (CRI)
Viewing Angle[2]
Φv
lm
lm/W
K
1650
98
CCT
Ra
4000
82
110
135
2Θ
Degrees
Degrees
½
Total Included Angle[3]
Θ0.9
Notes for Table 4:
1.
2.
3.
Luminous flux typical value is for all 9 LED dies operating concurrently at rated current.
Viewing Angle is the off axis angle from emitter centerline where the luminous intensity is ½ of the peak value.
Total Included Angle is the total angle that includes 90% of the total luminous flux.
Electrical Characteristics @ TC = 25°C
Table 5:
Parameter
Symbol
Typical
Unit
Forward Voltage per String (@ IF = 700mA)
VF
9.7
V
Temperature Coefficient
of Forward Voltage (per String)
ΔVF/ΔTJ
-6.0
1.3
mV/°C
Thermal Resistance
(Junction to Case)
RΘJ-C
°C/W
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
IPC/JEDEC Moisture Sensitivity Level
Table 6 - IPC/JEDEC J-STD-20 MSL Classification:
Soak Requirements
Floor Life
Conditions
Standard
Conditions
Accelerated
Level
1
Time
Time (hrs)
Time (hrs)
Conditions
≤ 30°C/
168
+5/-0
85°C/
85% RH
Unlimited
n/a
n/a
85% RH
Notes for Table 6:
1.
The standard soak time is the sum of the default value of 24 hours for the semiconductor manufacturer’s exposure time (MET) between bake and bag
and the floor life of maximum time allowed out of the bag at the end user of distributor’s facility.
Average Lumen Maintenance Projections
Lumen maintenance generally describes the ability of a lamp to retain its output over time. The useful lifetime for
solid state lighting devices (Power LEDs) is also defined as Lumen Maintenance, with the percentage of the original
light output remaining at a defined time period.
Based on accelerated lifetime testing, LED Engin projects that the LZ Series will deliver, on average, 70% Lumen
Maintenance at 65,000 hours of operation at a forward current of 700 mA per die. This projection is based on
constant current operation with junction temperature maintained at or below 120°C.
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Mechanical Dimensions (mm)
Emitter pin layout
Emitter Emitter
channel pin
Die
Color
Ch1 -
23, 24
E
B
A
G
I
White
White
White
White
White
White
White
White
White
Ch1
Ch1 +
Ch2 -
Ch2
17, 18
2, 3
Ch2 +
Ch3 -
Ch3
14, 15
5, 6
C
D
H
F
Ch3+
11, 12
NC pins: 1, 4, 7, 8, 9, 10, 13, 16, 19, 20,
21, 22
DNC pins: none
Notes:
Figure 1: Package outline drawing.
Notes for Figure 1:
NC = Not internally Connected (Electrically isolated)
DNC = Do Not Connect (Electrically Non isolated)
1.
2.
Index mark indicates case temperature measurement point.
Unless otherwise noted, the tolerance = ± 0.20 mm.
Recommended Solder Pad Layout (mm)
Figure 2a: Recommended solder pad layout for anode, cathode, and thermal pad.
Unless otherwise noted, the tolerance = ± 0.20 mm.
LED Engin recommends the use of pedestal MCPCB’s which allow the emitter thermal slug to be soldered directly to the metal core of the MCPCB. Such
MCPCB technologies eliminate the high thermal resistance dielectric layer that standard MCPCB technologies use in between the emitter thermal slug and the
metal core of the MCPCB, thus lowering the overall system thermal resistance.
Note for Figure 2a:
1.
2.
3.
LED Engin recommends x-ray sample monitoring for solder voids underneath the emitter thermal slug. The total area covered by solder voids should be less
than 20% of the total emitter thermal slug area. Excessive solder voids will increase the emitter to MCPCB thermal resistance and may lead to higher failure
rates due to thermal over stress.
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Recommended Solder Mask Layout (mm)
Figure 2b: Recommended solder mask opening (hatched area) for anode, cathode, and thermal pad.
Note for Figure 2b:
1.
Unless otherwise noted, the tolerance = ± 0.20 mm.
Recommended 8mil Stencil Apertures Layout (mm)
Figure 2c: Recommended 8mil stencil apertures layout for anode, cathode, and thermal pad.
Note for Figure 2c:
1.
Unless otherwise noted, the tolerance = ± 0.20 mm.
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Reflow Soldering Profile
Figure 3: Reflow soldering profile for lead free soldering.
Typical Radiation Pattern
100
90
80
70
60
50
40
30
20
10
0
-90 -80 -70 -60 -50 -40 -30 -20 -10
0
10 20 30 40 50 60 70 80 90
Angular Displacement (Degrees)
Figure 4: Typical representative spatial radiation pattern.
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Typical Relative Spectral Power Distribution
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
380 430 480 530 580 630 680 730 780 830 880
Wavelength (nm)
Figure 5: Typical relative spectral power vs. wavelength @ TC = 25°C
Typical Chromaticity Coordinate Shift over Temperature
0.02
0.015
Cx
0.01
Cy
0.005
3E-17
-0.005
-0.01
-0.015
-0.02
0
10
20
30
40
50
60
70
80
90
100
Case Temperature (°C)
Figure 6: Typical dominant wavelength shift vs. Case temperature.
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Typical Relative Light Output
140%
120%
100%
80%
60%
40%
20%
0%
0
200
400
600
800
1000
IF - Forward Current (mA)
Figure 7: Typical relative light output vs. forward current @ TC = 25°C.
Typical Normalized Radiant Flux over Temperature
110
100
90
80
70
60
0
10
20
30
40
50
60
70
80
90
100
Case Temperature (°C)
Figure 8: Typical relative light output vs. case temperature.
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Typical Forward Voltage Characteristics per String
1200
1000
800
600
400
200
0
6.0
7.0
8.0
9.0
10.0
11.0
VF - Forward Voltage (V)
Figure 9: Typical forward current vs. forward voltage1 @ TC = 25°C.
Note for Figure 9:
1. Forward Voltage per string of 3 LED dies connected in series.
Current De-rating
1000
800
700
(Rated)
600
400
200
R J-A = 4°C/W
R J-A = 5°C/W
R J-A = 6°C/W
0
0
25
50
75
100
125
150
Maximum Ambient Temperature (°C)
Figure 10: Maximum forward current vs. ambient temperature based on TJ(MAX) = 150°C.
Notes for Figure 10:
1.
2.
3.
Maximum current assumes that all 9 LED dice are operating concurrently at the same current.
RΘJ-C [Junction to Case Thermal Resistance] for the LZ9-00NW00 is typically 1.3°C/W.
RΘJ-A [Junction to Ambient Thermal Resistance] = RΘJ-C + RΘC-A [Case to Ambient Thermal Resistance].
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Emitter Tape and Reel Specifications (mm)
Figure 11: Emitter carrier tape specifications (mm).
Figure 12: Emitter Reel specifications (mm).
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
LZ9 MCPCB Family
Emitter + MCPCB
Thermal Resistance
(oC/W)
Diameter
(mm)
Typical Vf Typical If
Part number Type of MCPCB
(V)
(mA)
LZ9-Jxxxxx
1-channel
3-channel
19.9
19.9
1.3 + 0.2 = 1.5
1.3 + 0.2 = 1.5
29.1
700
LZ9-Mxxxxx
9.7/ ch
700/ ch
Mechanical Mounting of MCPCB
.
MCPCB bending should be avoided as it will cause mechanical stress on the emitter, which could lead to
substrate cracking and subsequently LED dies cracking.
.
To avoid MCPCB bending:
o
o
Special attention needs to be paid to the flatness of the heat sink surface and the torque on the screws.
Care must be taken when securing the board to the heat sink. This can be done by tightening three M3
screws (or #4-40) in steps and not all the way through at once. Using fewer than three screws will
increase the likelihood of board bending.
o
o
It is recommended to always use plastics washers in combinations with the three screws.
If non-taped holes are used with self-tapping screws, it is advised to back out the screws slightly after
tightening (with controlled torque) and then re-tighten the screws again.
Thermal interface material
.
.
.
To properly transfer heat from LED emitter to heat sink, a thermally conductive material is required when
mounting the MCPCB on to the heat sink.
There are several varieties of such material: thermal paste, thermal pads, phase change materials and thermal
epoxies. An example of such material is Electrolube EHTC.
It is critical to verify the material’s thermal resistance to be sufficient for the selected emitter and its operating
conditions.
Wire soldering
.
To ease soldering wire to MCPCB process, it is advised to preheat the MCPCB on a hot plate of 125-150oC.
Subsequently, apply the solder and additional heat from the solder iron will initiate a good solder reflow. It is
recommended to use a solder iron of more than 60W.
.
It is advised to use lead-free, no-clean solder. For example: SN-96.5 AG-3.0 CU 0.5 #58/275 from Kester (pn:
24-7068-7601)
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
LZ9-Jxxxxx
1 channel, Standard Star MCPCB (1x9) Dimensions (mm)
Notes:
•
•
.
.
.
Unless otherwise noted, the tolerance = ± 0.2 mm.
Slots in MCPCB are for M3 or #4-40 mounting screws.
LED Engin recommends plastic washers to electrically insulate screws from solder pads and electrical traces.
LED Engin recommends using thermal interface material when attaching the MCPCB to a heatsink.
The thermal resistance of the MCPCB is: RΘC-B 0.2°C/W. This low thermal resistance is possible by utilizing a copper based MCPCB with pedestal design. The
emitter thermal slug is in direct contact with the copper core. There are several vendors that offer similar solutions, some of them are: Rayben, Bergquist,
SinkPad, Bridge-Semiconductor.
Components used
MCPCB:
ESD chips: BZX585-C47
MHE-301 copper
(Rayben)
(NXP, for 9 LED die)
Jumpers:
CRCW06030000Z0 (Vishay)
Pad layout
MCPCB
Pad
Ch.
String/die Function
1
2
Cathode -
Anode +
1/ABCDEF
GHI
1
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
LZ9-Mxxxxx
3 channel, Standard Star MCPCB (3x3) Dimensions (mm)
Notes:
•
•
.
.
.
Unless otherwise noted, the tolerance = ± 0.2 mm.
Slots in MCPCB are for M3 or #4-40 mounting screws.
LED Engin recommends plastic washers to electrically insulate screws from solder pads and electrical traces.
LED Engin recommends using thermal interface material when attaching the MCPCB to a heatsink.
The thermal resistance of the MCPCB is: RΘC-B 0.2°C/W. This low thermal resistance is possible by utilizing a copper based MCPCB with pedestal design. The
emitter thermal slug is in direct contact with the copper core. There are several vendors that offer similar solutions, some of them are: Rayben, Bergquist,
SinkPad, Bridge-Semiconductor.
Components used
MCPCB:
ESD chips: BZX884-C18
MHE-301 copper
(Rayben)
(NXP, for 3 LED die)
Pad layout
MCPCB
Pad
4
3
5
2
6
1
Ch.
1
String/die Function
Cathode -
Anode +
Cathode -
Anode +
Cathode -
Anode +
1/ABE
2/CGI
3/DFH
2
3
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LZ9 secondary TIR optics family
LLxx-3T06-H
Optical Specification
Optical
efficiency 4
%
On-axis
intensity 5
cd/lm
Beam angle 2
degrees
17
Field angle 3
Part number 1
degrees
LLSP-3T06-H
LLNF-3T06-H
LLFL-3T06-H
36
90
90
90
5.4
2.2
1.2
26
39
49
83
Notes:
1.
2.
3.
4.
5.
Lenses can also be ordered without the holder. Replace –H with –O for this option.
Beam angle is defined as the full width at 50% of the max intensity (FWHM).
Field angle is defined as the full width at 10% of the max intensity.
Optical efficiency is defined as the ratio between the incoming flux and the outgoing flux.
On-axis intensity is defined as the ratio between the total input lumen and the intensity in the optical center of the lens.
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Typical Relative Intensity over Angle
100%
LZ9 emitter
LLSP-3T06-H
LLNF-3T06-H
LLFL-3T06-H
80%
60%
40%
20%
0%
-90
-60
-30
0
30
60
90
Angle (degrees)
General Characteristics
Symbol
Value
Rating
Unit
Mechanical
Height from Seating Plane
Diameter
19.2
38.9
Typical
Typical
mm
mm
Material
Lens
PMMA
Holder
Polycarbonate
Optical
Transmission1 (>90%)
Environmental
Storage Temperature
Operating Temperature
λ
410-1100
Min-Max.
nm
Tstg
Tsol
-40 ~ +110
-40 ~ +110
Min-Max.
Min-Max.
°C
°C
Notes:
1.
It is not recommended to use a UV emitter with this lens due to lower transmission at wavelengths < 410nm.
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Mechanical Dimensions
Lens with Holder
Lens
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Company Information
LED Engin, based in California’s Silicon Valley, develops, manufactures, and sells advanced LED emitters, optics and
light engines to create uncompromised lighting experiences for a wide range of entertainment, architectural,
general lighting and specialty applications. LuxiGen™ multi-die emitter and secondary lens combinations reliably
deliver industry-leading flux density, upwards of 5000 quality lumens to a target, in a wide spectrum of colors
including whites, tunable whites, multi-color and UV LEDs in a unique patented compact ceramic package. Our
LuxiTuneTM series of tunable white lighting modules leverage our LuxiGen emitters and lenses to deliver quality,
control, freedom and high density tunable white light solutions for a broad range of new recessed and
downlighting applications. The small size, yet remarkably powerful beam output and superior in-source color
mixing, allows for a previously unobtainable freedom of design wherever high-flux density, directional light is
required.
LED Engin is committed to providing products that conserve natural resources and reduce greenhouse emissions.
LED Engin reserves the right to make changes to improve performance without notice.
Please contact sales@ledengin.com or (408) 922-7200 for more information.
COPYRIGHT © 2014 LED ENGIN. ALL RIGHTS RESERVED.
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
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