MC2007-EVM [ETC]
Passive Optical Networks;
ETC 
MC2007-3
3.3 V PIN Pre-Amplifier with AGC for Applications to
200 Mbps
The MC2007-3 is a low-noise, transimpedance amplifier with AGC, manufactured in an advanced, low-cost, sub-
micron CMOS process. Its wide dynamic range, differential output and high PIN bias make it well suited to high-
performance telecommunications, especially OC-3/STM-1. However, due to its low cost, the MC2007-3 also meets
the needs of datacom applications.
The MC2007-3 is available in die form. For optimum system performance die should be mounted in close proximity
with the photodetector.
The MC2007-3 is designed to be used with the MC2045 or M02095 post amplifier IC. When combined with a
photodiode, the chip set forms a high performance, low cost 3.3V receiver.
Applications
Features
• Optical Receivers (Up to 200 Mbps Operation)
• SDH / SONET / ATM
• Fast Ethernet
• Low-cost, CMOS process
• Receiver sensitivity typically -39 dBm at 155 Mbps, when integrated
into a module with suitable photodiode and post-amplifier
• 140 MHz bandwidth allows wide range of operation: 100, 125, 155,
and 200 Mbps
• Typical differential gain of 62 kΩ at low signal levels
• AGC gives continuous operation to +3 dBm
• 65 mW power consumption at +3.3 V supply
• > 35 dB Power-supply noise rejection
• Available as die only
• ESCON
• Passive Optical Networks (PONs)
• SFP/SFF Transceivers
• BiDi Transceivers
Functional Block Diagram
Series Pass
Regulator
PINK
Bandgap
1.23 V
RREF
Reference
Generator
Set Max. Gain
AGC Control
R
DOUT
+1
TZA
PINA
+1
DOUT
+1
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Ordering Information
Part Number
Package
Operating Temperature
MC2007-XX
MC2007-XX
MC2007-EVM
Waffle pack
–40 °C to 85 °C
–40 °C to 85 °C
–40 °C to 85 °C
Expanded whole wafer on a ring
MC2007 evaluation board with MC2045 post amp
Revision History
Revision
Level
Date
Description
E
Preliminary
Preliminary
November 2007 Correct PinK absolute maximum information. Update format.
D
June 2006
Updated format.
Updated Absolute Maximum Ratings.
Added TIA Use with Externally Biased Detectors section.
C
B
A
Preliminary
Preliminary
Preliminary
June 2004
June 2003
Added Note 7 to Table 2-4.
Added externally biases diode maximum to Absolute Maximum Ratings table.
December 2000 Initial Release.
Typical Eye Diagram
Pad Configuration
Eye diagram for 155 Mbps at 3 µA input signal
PP
Die size ≈ 1010 x 960 µm
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1.0 Product Specification
1.1
Absolute Maximum Ratings
These are the absolute maximum ratings at or beyond which the IC can be expected to fail or be damaged.
Reliable operation at these extremes for any length of time is not implied.
Table 1-1.
Symbol
Absolute Maximum Ratings
Parameter
Rating
Units
V
Power supply (V - GND)
-0.4 to +4.5
+150
V
°C
CC
CC
T
Die Junction temperature
Storage temperature
J
T
-65 to +150
°C
STG
(1, 2, 3)
I
PinA maximum input current
Input voltage at PINA
4.5
mApp
V
PINA
(2)
V
-0.4 to +3.6
10
PINA
PINK
I
Maximum average current sourced out of PINK
Maximum input voltage at PINK and MON
mA
V
V
-0.4 to V +0.4
PINK
Dout
CC
(4)
I
Maximum average current sourced out of Dout and DoutB
Maximum input voltage at Dout and DoutB
10.0
mA
V
(4)
V
0.0 to V +0.4
Dout
CC
NOTES:
1. Equivalent to 2.8 mA average current.
2. Do not exceed either the I or V
rating. PINA damage will result in performance degradation which is difficult to detect.
PINA
PINA
3. Part must be powered up for PinA to accept this current. With the part unpowered, no current should be sourced into PinA.
4. Do not exceed either the I or V rating. Output device damage could occur.
Dout
Dout
1.2
Recommended Operating Conditions
Table 1-2.
Recommended Operating Conditions
Symbol
Parameter
Rating
Units
V
C
Power supply (V - GND)
3.3 10ꢀ
1.0
V
CC
PD
CC
Max. Photodiode capacitance (V = 1.8 V), for 155 Mbps data rate
pF
°C
PD
T
Operating ambient temperature
-40 to +85
A
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Product Specification
1.3
DC Characteristics
Table 1-3.
DC Characteristics
Symbol
Parameter
Min.
Typ.
Max.
Units
V
PIN PD bias voltage (PINK - PINA)
Common mode output voltage
Supply current
1.5
-
1.7
2.0
-
V
V
PD
CM
CC
V
V /2
CC
I
12
0.9
22
1.04
32
1.1
mA
V
V
PINA bias voltage with respect to GND
A
1.4
AC Characteristics
Table 1-4.
Symbol
AC Characteristics
Parameter
Min.
25
Typ.
Max.
Units
R
Output impedance (single ended)
40
1.5
-39
+3
100
2.6
-
Ω
pA/(rt(Hz))
dBm
OUT
(1), (2), (3)
I
Input noise current
1.0
-
NOISE
(1), (2)
Pin(mean), Min.
Pin(mean), Max.
G
Optical sensitivity
Optical saturation
(2)
+1
-
dBm
(3), (4)
Small signal transimpedance
Single ended:
kΩ
26
52
31
62
35
70
Differential:
(3)
V
Differential output voltage
-
110
-
-
800
-
mV
MHz
ns
D
(7)
BW
T, T
Bandwidth to -3 dB point (electrical)
140
Data out rise/fall times (20ꢀ - 80ꢀ points)
Pulse width distortion
-
-
-
-
-
-
-
2
r
f
T
-
10
10
100
12
-
ꢀ
PWD
PULSE
OS
Pulse overshoot
-
ꢀ
T
AGC setting time
-
µs
AGC
OS
AGC overshoot
-
ꢀ
AGC
PSRR
Power supply rejection ratio (<4 MHz)
35
30
dB
Ω
(5)
Z
Input impedance
3000
IN
NOTES:
1. Measured with input capacitance, C = 0.7 pF
IN
-10
2. Assuming photodiode response of 0.9 A/W, extinction ratio of 10 dB and BER of 10
3. The 2007 is designed to drive a load >500 Ω. Measurements are taken into high Z.
4. Measured at 100 kHz with a test current of 0.5 µA mean (1 µA ).
PP
5. Data input amplitude dependant Z is inversely proportional to input photo diode current and measured between 20 kHz and 100 MHz.
IN
6. All die are tested and guaranteed at 25°C 5°C. Die are characterized and designed to operate from -40 to +85°C. Optical sensitivity is
characterized in an optical assembly as an example of what can be achieved, and is not guaranteed. Consult factory for configuration details.
7. Measured electrically using a 50 Ω source with a 480 Ω resistor and 100 nF capacitor in series with the input to PINA pad and a 0.7 pF capacitor
to ground with mean input current = 0.5 µA.
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Product Specification
Figure 1-1. Typical Performance
Diff Gain vs Input
Diff Output vs Input
70.0
400
350
300
250
200
150
100
50
60.0
25°C
50.0
40.0
30.0
20.0
10.0
0.0
25°C
55°C
85°C
55°C
85°C
0
-40
-35
-30
-25
-20
-15
-10
-5
0
-40
-35
-30
-25
-20
-15
-10
-5
0
Input (dBm)
Input (dBm)
I
CC vs VCC
Diff Output vs Frequency
400
40.0
350
300
250
200
150
100
50
35.0
30.0
25.0
20.0
15.0
10.0
-5dBm
-10dBm
-15dBm
-20dBm
-25dBm
-30dBm
0
3.0
3.1
3.2
3.3
3.4
3.5
3.6
3.7
3.8
3.9
4.0
1
10
100
1000
Frequency (MHz)
Vcc (V)
Typical -3dB Electrical Bandwidth Vs. Photodiode Capacitance
130
120
110
100
90
80
70
60
50
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
Photodiode Capacitance (pF)
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Product Specification
Figure 1-2. Eye Diagrams
3 µApp Input
10 mV/Div.
1 ns/Div.
1 mApp Input
50 mV/Div.
1 ns/Div.
NOTE:
These eye diagrams illustrate how the AGC action changes the bandwidth from the optimum value for best sensitivity at low gain levels to a higher
value, giving faster rise/fall times at high signal levels, as well as reducing the dynamic range of the output level.
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2.0 Pin Description
2.1
Pin Description
Table 2-1.
Pin Description
Die Pad No
Name
Function
1, 8
2
GND
Ground pin. Connect to the most negative supply. Both pins should be used
D
Non-inverted data output. Differential output with D
OUT
OUT
3, 6
4
V
Power pin. Connect to most positive supply. Either or both pins may be used
PIN cathode connection. Connect photodiode between this pin and PINA
PIN anode connection. Connect photodiode between this pin and PINK
CC
PINK
PINA
5
7
D
Inverted data output. Differential output with D
OUT
OUT
Figure 2-1. Bare Die Layout
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3.0 Functional Description
3.1
Overview
The MC2007-3 is a low-noise, transimpedance amplifier with AGC, manufactured in an advanced, low-cost, sub-
micron CMOS process. Its wide dynamic range, differential output and high PIN bias make it well suited to high-
performance telecommunications, especially OC-3/STM-1. However, due to its low cost, the MC2007-3 also meets
the needs of Datacom applications.
The MC2007-3 is available in die form. For optimum system performance die should be mounted in close proximity
to the photodetector.
The MC2007-3 is designed to be used with the MC2045 or M02095 post amplifier IC. When combined with a
photodiode, the chip set forms a high performance, low cost 3.3V receiver.
Figure 3-1. Block Diagram
Series Pass
Regulator
PINK
Bandgap
1.23 V
RREF
Reference
Generator
Set Max. Gain
AGC Control
R
DOUT
+1
TZA
PINA
+1
DOUT
+1
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Functional Description
Figure 3-2. Top Level Diagram
V
GND
D
CC
OUT
PINK
PINA
D
V
GND
OUT
CC
3.2
Features
•
Low-cost, CMOS process
•
Receiver sensitivity typically -39 dBm at 155 Mbps, when integrated into a module with suitable photodiode and
post-amplifier
•
•
•
•
•
•
140 MHz bandwidth allows wide range of operation: 100, 125, 155, and 200 Mbps
Typical differential gain of 62 kΩ at low signal levels
AGC gives continuous operation to +3 dBm
65 mW power consumption at +3.3 V supply
> 35 dB Power-supply noise rejection
Available as die only
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Functional Description
3.3
General Description
3.3.1
TIA
The transimpedance amplifier consists of a high gain single-ended CMOS amplifier (TIA), with a feedback resistor.
The feedback creates a low impedance at the input and virtually all of the input current passes through the
feedback resistor, defining the voltage at the output. Advanced CMOS design techniques are employed to maintain
the stability of this stage across all input conditions.
Single-ended amplifiers have inherently poor power supply noise rejection. For this reason, an on-chip, low
dropout, linear regulator has been incorporated into the design to give excellent noise rejection up to several MHz.
Higher frequency power supply noise must be removed by external decoupling.
The circuit is designed for PIN photodiodes in the grounded cathode configuration, with the anode connected to the
input of the TIA and the cathode connected to the PIN K input. The PIN K pad supplies ~1.7V to reverse bias the
pin diode to reduce capacitance. If a higher reverse voltage is required, the user may supply their own low
impedance bias supply.
3.3.2
AGC
The MC2007-3 has been designed to operate over the input range of +3 dBm to –39 dBm at long wavelengths. To
do so, the AGC achieves a dynamic range compression of 50:1 in transimpedance.
The AGC only operates on signals greater than –30 dBm (@ 0.9 A/W). This knee in the gain response is important
when setting signal detect functions in the following post amplifier. It also aids in active photodiode alignment.
3.3.3
Output Stage
The signal from the TIA enters a phase splitter and a pair of voltage follower outputs. These are designed to drive a
high impedance (>500 Ω) load. They are stable for driving capacitive loads, such as interstage filters.
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4.0 Applications Information
4.1
Filter Design
The achievable sensitivity of the MC2007-3 is dependant on the noise bandwidth of the amplifier, which varies with
temperature and process. The bandwidth should therefore be limited by an interstage filter for maximum
performance. This will typically be a one pole filter, using a capacitor across the outputs. For maximum sensitivity, a
filter with steeper roll-off and better transient response can be implemented with inductors and capacitors. If the
module is intended to be used at several rates, interstage filtering should not be employed. Typical application
circuit shown in Figure 4-1.
Figure 4-1. Typical Applications Circuit
+3.3V
10 nF
*470 pF
10 nF
VCC
DOUT
Gnd
DIN
PINK
PINA
VCC
CFILT
D
IN
Gnd
DOUT
10 nF
100 pF
MC2045 or
M02095
Post amp
+3.3V
* The 470 pF capacitor should be mounted inside the TO can/optical sub assembly
with the MC2007-3 and the photodiode
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Applications Information
4.2
Alternative Input Arrangement
An alternative arrangement can be used to connect the photodiode, with the photodiode cathode being connected
directly to V (see Figure 4-2). This requires two decoupling capacitors, one connecting V to ground, and the
CC
CC
other from PIN K to ground. This arrangement reverse biases the photodiode more, but will have inferior low
frequency noise performance.
Figure 4-2. Alternative Application Arrangement
+3.3V
10 nF
VPD
1 nF
VCC
470 pF
PINK
PINA
VCC
100 pF
+3.3 V
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Applications Information
4.3
T0-Can Assembly Recommendations
Figure 4-3. Typical TO-Can Assembly
NOT Recommended Example
PIN Diode
This bond is
unreliable
This bond is too
long and
unreliable
MC2007
TO Can Leads
@4 or 5
Ceramic Shim
Submount
TO-CAN Header
Recommended Example
MC2007
PIN Diode
Metal
Shim
TO Can Leads
@4 or 5
Ceramic Shim
Submount
TO-CAN Header
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Applications Information
4.3.1
Assembly
The MC2007 is designed to work with a wirebond inductance of 1 nH 0.25 nH. Many existing TO-Can
configurations will not allow wirebond lengths that short, since the PIN diode submount and the TIA die are more
than 1 mm away in the vertical direction, due to the need to have the PIN diode in the correct focal plane. This can
be remedied by raising up the TIA die with a conductive metal shim. This will effectively reduce the bond wire
length. Refer to Figure 4-3 above for details.
Mindspeed recommends ball bonding with a 1 mil (25.4 µm) gold wire. For performance reasons the PINA pad is
smaller than the others and also has less via material connected to it. It therefore requires more care in setting of
the bonding parameters. For the same reason PINA has no ESD protection.
In addition, please refer to the Mindspeed Product Bulletin (document number 0201X-PBD-002). Care must be
taken when selecting chip capacitors, since they must have good low ESR characteristics up to several hundred
MHz. It is also important that the termination materials of the capacitor be compatible with the attach method used.
For example, Tin/Lead (Pb/Sn) solder finish capacitors are incompatible with silver-filled epoxies. Palladium/Silver
(Pd/Ag) terminations are compatible with silver filled epoxies. Solder can be used only if the substrate thick-film
inks are compatible with Pb/Sn solders.
4.3.2
Recommended Assembly Procedures
For ESD protection the following steps are recommended for TO-Can assembly:
a. Ensure good humidity control in the environment (to help minimize ESD).
b. Consider using additional ionization of the air (also helps minimize ESD).
c. As a minimum, it is best to ensure that the body of the TO-can header or the ground lead of the
header is grounded through the wire-bonding fixture for the following steps. The best solution also
ensures that the V lead of the TO-Can is also grounded. When this is done and the procedure
CC
below is followed, any positive charge on the wire bonder when bonding to PINA (the very last
bond placed) will have the PD acting as an ESD diode into PinK of the device. Internally, PinK has
an ESD diode between it and VCC that will turn on if V is at ground minimizing the ESD event at
CC
PINA.
d. The wire bonder (including the spool, clamp, etc.) must also be grounded.
1. Wire-bond the ground pad(s) of the die first.
2. Then wire bond the V pad to the TO-Can lead.
CC
3. Then wire bond any other pads going to the TO-Can leads (such as DOUT, DOUT and possibly
MON).
4. Next wire-bond any capacitors inside the TO-Can.
5. Inside the TO-Can, wire bond PINK.
6. The final step is to wire bond PINA.
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Applications Information
4.4
TIA Use with Externally Biased Detectors
In some applications, Mindspeed TIAs are used with detectors biased at a voltage greater than available from TIA
PIN cathode supply. This works well if some basic cautions are observed. When turned off, the input to the TIA
exhibits the following I/V characteristic:
Figure 4-4. TIA Use with Externally Biased Detectors, Powered Off
PINA Unbiased
100
50
0
-800
-600
-400
-200
0
200
400
600
800
1000
1200
-50
-100
-150
-200
-250
-300
mV
The impedance of the input is relatively high and can be easily damaged by ESD or EOS.
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Applications Information
After the TIA is turned on, the DC servo and AGC circuits attempt to null any input currents (up to the absolute
maximum stated in Table 1-1) as shown by the I/V curve in Figure 4-5.
Figure 4-5. TIA Use with Externally Biased Detectors, Powered On
PINA biased
1000
800
600
400
200
0
-300
-200
-100
0
100
200
300
400
500
600
700
-200
-400
-600
-800
-1000
mV
It can be seen that any negative voltage below 200 mV is nulled and that any positive going voltage above the PINA
standing voltage is nulled by the DC servo. The DC servo upper bandwidth varies from part to part, but is generally
at least 10 kHz.
When externally biasing a detector such as an APD where the supply voltage of the APD exceeds that for PINA
Table 1-1, care should be taken to power up the TIA first and to keep the TIA powered up until after the power
supply voltage of the APD is removed. Failure to do this with the TIA unpowered may result in damage to the input
FET gate at PINA. In some cases the damage may be very subtle, in that nearly normal operation may be
experienced with the damage causing slight reductions in bandwidth and corresponding reductions in input
sensitivity.
4.4.1
Treatment of PINK
PINK still requires bypassing to ground with a high quality 220-1000 pF (470 pF recommended) capacitor, even
with no other connection to it. The capacitor stabilizes the internal voltage regulator of the TIA.
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5.0 Packaging Specification
5.1
Die Details
Table 5-1.
Bare Die Information
GND
DOUT
GND
DOUT
VCC
VCC
Die size: 1.01 x 0.96 mm
Die Thickness: 300 µm ±10%
Die Process Technology: CMOS
Die Passivation: Silicon Nitride
PINK
PINA
Table 5-2.
Pad Coordinates
Pad No.
Description
X (µm)
Y (µm)
Pad No.
Description
X (µm)
Y (µm)
1
2
3
4
GND
-352.
-352.
216.7
111.7
-261.7
-352.
5
6
7
8
PINA
153.95
352.
-360.
-261.7
111.7
216.7
D
V
CC
OUT
V
-352.
D
352.
CC
OUT
PINK
-135.95
GND
352.
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General Information:
Telephone: (949) 579-3000
Headquarters - Newport Beach
4000 MacArthur Blvd., East Tower
Newport Beach, CA 92660
®
© 2006-2007 Mindspeed Technologies , Inc. All rights reserved.
®
®
Information in this document is provided in connection with Mindspeed Technologies ("Mindspeed ") products.
These materials are provided by Mindspeed as a service to its customers and may be used for informational
purposes only. Except as provided in Mindspeed’s Terms and Conditions of Sale for such products or in any
separate agreement related to this document, Mindspeed assumes no liability whatsoever. Mindspeed assumes
no responsibility for errors or omissions in these materials. Mindspeed may make changes to specifications and
product descriptions at any time, without notice. Mindspeed makes no commitment to update the information and
shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to its
specifications and product descriptions. No license, express or implied, by estoppel or otherwise, to any
intellectual property rights is granted by this document.
THESE MATERIALS ARE PROVIDED "AS IS" WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESS OR
IMPLIED, RELATING TO SALE AND/OR USE OF MINDSPEED PRODUCTS INCLUDING LIABILITY OR
WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, CONSEQUENTIAL OR INCIDENTAL
DAMAGES, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER
INTELLECTUAL PROPERTY RIGHT. MINDSPEED FURTHER DOES NOT WARRANT THE ACCURACY OR
COMPLETENESS OF THE INFORMATION, TEXT, GRAPHICS OR OTHER ITEMS CONTAINED WITHIN THESE
MATERIALS. MINDSPEED SHALL NOT BE LIABLE FOR ANY SPECIAL, INDIRECT, INCIDENTAL, OR
CONSEQUENTIAL DAMAGES, INCLUDING WITHOUT LIMITATION, LOST REVENUES OR LOST PROFITS,
WHICH MAY RESULT FROM THE USE OF THESE MATERIALS.
Mindspeed products are not intended for use in medical, lifesaving or life sustaining applications. Mindspeed
customers using or selling Mindspeed products for use in such applications do so at their own risk and agree to
fully indemnify Mindspeed for any damages resulting from such improper use or sale.
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