MC36205 [ETC]
Surface Mountable PTC Resettable Fuse;
| 型号： | MC36205 |
| 厂家： | 
ETC |
| 描述： | Surface Mountable PTC Resettable Fuse |
| 文件： | 总5页 (文件大小：71K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Surface Mountable PTC
Resettable Fuse
Specifications:
Applications
: All high-density boards.
Product features
: Small surface mountable, solid state, faster time to trip than standard SMD
devices, lower resistance than standard SMD devices.
Maximum voltage
Temperature range
: 6V to 60V.
: -40°C to 85°C.
UL : E-345437
Electrical Characteristics (23°C)
Maximum Time to Trip
Resistance
Hold
Current Current
Trip
Rated
Voltage
Maximum Typical
Current Power
RMin
R1Max
Current
Time
Part Number
IH,
A
IT, A
VMax, V dc
IMax,
A
Pd, W
Ω
Ω
Amperes
Seconds
0.05
0.10
0.20
0.35
0.50
0.75
1.10
1.50
1.75
2.00
0.15
0.25
0.40
0.70
1.00
1.50
2.20
3.00
4.00
4.00
60
60
30
16
16
8
10
10
10
40
40
40
0.60
0.60
0.60
0.60
0.60
0.60
0.80
0.80
0.8
0.25
0.50
8.00
8.00
8.00
8.00
8.00
8.00
8.00
8.00
3.00
1.50
0.02
0.20
0.10
0.10
0.30
0.50
0.60
1.00
3.600
1.600
0.800
0.320
0.250
0.130
0.060
0.040
0.020
0.015
50.000
15.000
5.000
1.300
0.900
0.400
0.210
0.110
0.080
0.070
MC36203
MC36205
MC36208
MC36212
MC36214
MC36217
MC36223
MC36230
MC36236
MC36239
6
100
100
100
100
6
6
6
0.8
IH
IT
= Hold current-maximum current at which the device will not trip at 23°C still air.
= Trip current-minimum current at which the device will always trip at 23°C still air.
= Maximum voltage device can withstand without damage at it rated current (I maximum).
VMAX
IMAX
Pd
= Maximum fault current device can withstand without damage at rated voltage (V maximum).
= Typical power dissipated-type amount of power dissipated by the device when in the tripped state in 23°C still air
environment.
RMIN
= Minimum device resistance at 23°C prior to tripping.
R1MAX = Maximum device resistance at 23°C measured 1 hour after tripping or reflow soldering of 260°C for 20 seconds.
Termination pad characteristics
Termination pad materials: Pure tin.
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Surface Mountable PTC
Resettable Fuse
FSMD Production Dimensions (Millimetre)
Dimensions Table
A
B
C
D
E
Figure Part Number
Minimum Maximum Minimum Maximum Minimum Maximum Minimum Maximum Minimum Maximum
3.00
3.00
3.00
3.00
3.00
3.00
3.00
3.00
3.00
3.00
3.43
3.43
3.43
3.43
3.43
3.43
3.43
3.43
3.43
3.43
2.35
2.35
2.35
2.35
2.35
2.35
2.35
2.35
2.35
2.35
2.80
2.80
2.80
2.80
2.80
2.80
2.80
2.80
2.80
2.80
0.60
0.60
0.40
0.40
0.30
0.30
0.60
0.50
0.80
0.80
1.15
1.15
0.85
0.80
0.75
0.70
1.00
0.90
1.40
1.40
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.75
0.75
0.75
0.75
0.75
0.75
0.75
0.75
0.75
0.75
1
1
1
1
1
1
2
2
2
2
MC36203
MC36205
MC36208
MC36212
MC36214
MC36217
MC36223
MC36230
MC36236
MC36239
0.10
0.10
0.10
0.10
0.45
0.45
0.45
0.45
Dimensions : Millimetres
Thermal Derating Curve
Thermal Derating Curve
Ambient Temperature (°C)
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17/05/11 V1.1
surface Mountable PTC Resettable Fuse
Typical Time-To-Trip at 23°C
A = MC36203
B = MC36205
C = MC36208
D = MC36212
E = MC36214
F = MC36217
G = MC36223
H = MC36230
I = MC36236
J = MC36239
Fault current (A)
Material Specification
Terminal pad material
: Pure tin.
Soldering characteristics : Meets EIA specification RS 186-9E, ANSI/J-std-002 category 3.
Pad Layouts Solder Reflow and Rework Recommendations
The dimension in the table below provide the recommended pad layout for each 1210 device.
Pad Dimensions
A
B
C
Device
Nominal
Nominal
Nominal
All 1210 Series
2.00
1.00
2.80
Dimensions : Millimetres
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Surface Mountable PTC
Resettable Fuse
Profile Feature
Pb-Free Assembly
Average Ramp-Up Rate (Ts maximum to Tp)
3°C/seconds maximum
Preheat:
Temperature Minimum (Ts minimum)
Temperature Maximum (Ts maximum)
150°C
200°C
Time (ts minimum to ts maximum)
60 -180 seconds
Time maintained above:
Temperature(TL)
217°C
Time (tL)
60-150 seconds
Peak/Classification Temperature(Tp):
260°C
Time within 5°C of actual Peak :
Temperature (tp)
20-40 seconds
Ramp-Down Rate:
6°C/seconds maximum
8 minutes maximum
Time 25°C to Peak Temperature:
Note: 1All temperatures refer to of the package, measured on the package body surface.
Solder reflow
Due to “Lead Free” nature, Temperature and Dwelling time for the soldering zone is higher than those for Regular. This may cause
damage to other components.
1. Recommended max past thickness > 0.25mm.
2. Devices can be cleaned using standard methods and aqueous solvent.
3. Rework use standard industry practices.
4. Storage Environment : < 30°C/60% RH.
Caution:
1. If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements.
2. Devices are not designed to be wave soldered to the bottom side of the board.
Reflow Profile
Time
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Surface Mountable PTC
Resettable Fuse
Part Number Table
Description
Part Number
Surface Mountable PTC Resettable Fuse
MC36203
MC36205
MC36208
MC36212
MC36214
MC36217
MC36223
MC36230
MC36236
MC36239
Surface Mountable PTC Resettable Fuse
Surface Mountable PTC Resettable Fuse
Surface Mountable PTC Resettable Fuse
Surface Mountable PTC Resettable Fuse
Surface Mountable PTC Resettable Fuse
Surface Mountable PTC Resettable Fuse
Surface Mountable PTC Resettable Fuse
Surface Mountable PTC Resettable Fuse
Surface Mountable PTC Resettable Fuse
Disclaimer This data sheet and its contents (the "Information") belong to the Premier Farnell Group (the "Group") or are licensed to it. No licence is granted for the use of it other than for information purposes
in connection with the products to which it relates. No licence of any intellectual property rights is granted. The Information is subject to change without notice and replaces all data sheets previously supplied.
The Information supplied is believed to be accurate but the Group assumes no responsibility for its accuracy or completeness, any error in or omission from it or for any use made of it. Users of this data
sheet should check for themselves the Information and the suitability of the products for their purpose and not make any assumptions based on information included or omitted. Liability for loss or damage
resulting from any reliance on the Information or use of it (including liability resulting from negligence or where the Group was aware of the possibility of such loss or damage arising) is excluded.
This will not operate to limit or restrict the Group's liability for death or personal injury resulting from its negligence. SPC Multicomp is the registered trademark of the Group. © Premier Farnell plc 2011.
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http://www.cpc.co.uk
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