MC36222 [ETC]
Resettable Fuse; 自恢复保险丝
| 型号： | MC36222 |
| 厂家： | 
ETC |
| 描述： | Resettable Fuse |
| 文件： | 总4页 (文件大小：1170K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Resettable Fuse
Specifications:
Applications
: All high-density boards
Product Features
: Small surface mountable, Solid state, Faster time to
trip than standard SMD devices, Lower resistance
than standard SMD devices
Temperature Range
: -40°C to +85°C
Electrical Characteristics (23°C)
Max. Time to Trip
Resistance
Hold
Trip
Rated
Max.
Typical
Current Current Voltage Current Power
Part
Number
Current
Amp
Time
R Min. R1 Max.
V Max.,
V DC
I Max.,
A
IH, A
lT, A
Pd, W
Sec
ohms
ohms
0.2
0.4
0.75
1.5
30
16
10
40
0.6
0.3
2.5
1.2
MC36207
MC36211
MC36216
0.4
0.1
0.2
0.35
0.75
0.09
0.29
8
0.6
0.8
1
1.8
2.2
3
0.055
0.04
0.03
0.21
0.18
0.12
MC36221
MC36222
MC36229
6
100
0.3
1
1.1
1.50
IH
IT
= Hold current-maximum current at which the device will not trip at 23°C still air
= Trip current-minimum current at which the device will always trip at 23°C still air
VMAX
IMAX
Pd
= Maximum voltage device can withstand without damage at its rated current (I maximum)
= Maximum fault current device can withstand without damage at rated voltage (V maximum)
= Typical power dissipated-type amount of power dissipated by the device when in the tripped
state in 23°C still air environment
RMIN
= Minimum device resistance at 23°C prior to tripping
R1MAX
= Maximum device resistance at 23°C measured 1 hour after tripping or reflow soldering of
260°C for 20 seconds
Termination pad characteristics
Termination pad materials : Pure Tin
FSMD Product Dimensions
MC36207
MC36211
MC36216
MC36221
MC36222
MC36229
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11/10/12 V1.0
Resettable Fuse
A
B
C
D
E
Part
Number
Min. Max. Min. Max. Min. Max. Min. Max. Min. Max.
MC36207
MC36211
MC36216
MC36221
MC36222
MC36229
0.75
1.25
0.1
-
-
0.45
0.8
3
3.5
1.5
1.8
0.75
0.25
0.1
0.45
1
1.4
Dimensions : Millimetres
Thermal Derating Curve
Typical Time-To-Trip at 23°C
B=MC36207
C=MC36211
E=MC36216
F=MC36221
G=MC36222
H=MC36229
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www.farnell.com
www.newark.com
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Resettable Fuse
Material Specification
Terminal Pad Material
: Pure Tin
Soldering Characteristics : Meets EIA specification RS 186-9E, ANSI/J-std-002 Category 3
Pad Layouts, Solder Reflow and Rework Recommendations
The dimension in the table below provide the recommended pad layout for each FSMD1812 device
A
B
C
Device
Nominal
Nominal
Nominal
All 1206 Series
2
1
1.9
Dimensions : Millimetres
Profile Feature
Pb-Free Assembly
Average Ramp-Up Rate (Tsmax to Tp)
3°C/second maximum
Preheat :
Temperature Minimum (Tsmin)
Temperature Maximum (Tsmax)
Time (tsmin to tsmax)
150°C
200°C
60-180 seconds
Time maintained above:
Temperature(TL)
Time (tL)
217°C
60-150 seconds
Peak/Classification Temperature(Tp)
260°C
Time within 5°C of actual Peak
Temperature (tp)
20-40 seconds
Ramp-Down Rate :
6°C/second maximum
Time 25°C to Peak Temperature :
8 minutes maximum
Note 1: All temperatures refer to of the package, measured on the
package body surface
Solder Reflow:
Due to “Lead Free” nature, Temperature and Dwelling time for the soldering damage to other components.
1. Recommended max past thickness > 0.25mm.
2. Devices can be cleaned using standard methods and aqueous solvent.
3. Rework use standard industry practices.
4. Storage Environment : < 30°C / 60% RH
Caution:
1. If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements.
2. Devices are not designed to be wave soldered to the bottom side of the board.
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www.farnell.com
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Page <3>
11/10/12 V1.0
Resettable Fuse
Part Number Table
Description
Part Number
MC36207
MC36211
MC36216
MC36221
MC36222
MC36229
Surface Mountable PTC
Resettable Fuse
Important Notice : This data sheet and its contents (the “Information”) belong to the members of the Premier Farnell group of companies (the “Group”) or are licensed to it. No licence is granted
for the use of it other than for information purposes in connection with the products to which it relates. No licence of any intellectual property rights is granted. The Information is subject to change
without notice and replaces all data sheets previously supplied. The Information supplied is believed to be accurate but the Group assumes no responsibility for its accuracy or completeness, any
error in or omission from it or for any use made of it. Users of this data sheet should check for themselves the Information and the suitability of the products for their purpose and not make any
assumptions based on information included or omitted. Liability for loss or damage resulting from any reliance on the Information or use of it (including liability resulting from negligence or where the
Group was aware of the possibility of such loss or damage arising) is excluded. This will not operate to limit or restrict the Group’s liability for death or personal injury resulting from its negligence.
Multicomp is the registered trademark of the Group. © Premier Farnell plc 2012.
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11/10/12 V1.0
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