MI1025HH [ETC]
5mm X 7mm Ceramic SMD; 采用5mm x 7mm陶瓷贴片型号: | MI1025HH |
厂家: | ETC |
描述: | 5mm X 7mm Ceramic SMD |
文件: | 总2页 (文件大小:318K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
MIH Series
5mm X 7mm Ceramic SMD
• Ceramic SMD Package
• 5.0, 3.3, 2.5, and 1.8 Volt
• HCMOS/TTL Compatible Output
• Stability to ±10ppm
• Tape and Reel Packaging
Electrical Specifications
Frequency Range
5V and 3.3V
2.5V
1.8V
1.500MHz to 156.250MHz
1.500MHz to 70.000MHz
1.544MHz to 40.000MHz
Frequency Stability (Inclusive of Temperature, Load, Voltage and Aging)
Operating Temperature Range
±100ppm to ±10ppm
0°C - 70°C to -40°C - 85°C
-55°C - 125°C
Storage Temperature Range
Supply Voltage (Vdd)
Supply Current
±5%
5.0Vdc, 3.3Vdc, 2.5Vdc, or 1.8Vdc
70mA max.
Vdd = 5V
Vdd = 3.3V
40mA max.
Vdd = 2.5V
35mA max.
Vdd = 1.8V
15mA max.
Output Voltage HCMOS
Logic 0
Logic 1
10% Vdd max.
90% Vdd min.
Duty Cycle
Load Drive Capability
50% of waveform
5V(less than 50MHz)
5V(greater than 50MHz)
3.3V(less than 50MHz)
3.3V(greater than 50MHz)
2.5V
40%/60% max. or 45%/55% max.
10 TTL Gates or 50pF
10 TTL Gates or 15pF
10 TTL Gates or 30pF
10 TTL Gates or 15pF
10 TTL Gates or 15pF
10 TTL Gates or 15pF
4nSec max.
1.8V
Rise / Fall Time
Start Up Time
Jitter
10mSec max.
10pSec max.*
RMS
*Please contact your MMD representative for up-to-date typical jitter information
Specifications subject to change without notice
www.mmdcomp.com
phone: 949-709-5075 / fax: 949-709-3536
OS11
Revision: 4/20/04 I
Part Numbering Guide
H
MI
T&R
H
Frequency
5X7 Ceramic SMD
Packaging*
Frequency Stability
100 = ±100ppm
050 = ±50ppm
025 = ±25ppm
020 = ±20ppm
015 = ±15ppm
010 = ±10ppm**
Operating Temperature
Blank = 0°C to 70°C
27 = -20°C to 70°C**
48 = -40°C to 85°C**
Pin 1 Connection
Supply Voltage
Blank = 5 Volt
3 = 3.3 Volt
Blank = Bulk
H = Tri-state
T&R = Tape and Reel
2 = 2.5 Volt***
1 = 1.8 Volt****
Symmetry
Output
Blank = 40%/60%
A = 45%/55%
H = HCMOS
*See page VA4 for Tape Specifications
**Not available in 2.5V and 1.8V
*** Available to 70MHz only
**** Available to 40MHz only
Mechanical Dimensions
1.7 max
5.08 ±0.15
.200 ±.006
7.0 ±0.2
.067 max
.278 ±.008
4
3
2
4
1
3
2
Markings
1
3.68 ±0.15
.145 ±.006
1.4 ±0.1
.055 ±.004
Pad Connections
Suggested Solder Pad Layout
Tri-state Operation
Logic 1 or NC = Oscillation
2.88
.113
Solder Pad
(X4)
Logic 0 or GND = High Impedance
Pin 1: Tri-State
Pin 2: Ground / Case
Pin 3: Output
Pin 4: Supply Voltage
2.2
.087
Environmental / Mechanical
Markings
Shock: MIL-STD-883, Method 2002, Condition B
Solderability: MIL-STD-883, Method 2003
Solvent Resistance: MIL-STD-202, Method 215
Vibration: MIL-STD-883, Method 2007, Condition A
Gross Leak Test: MIL-STD-883, Method 1014, Condition C
Fine Leak Test: MIL-STD-883, Method 1014, Condition A2
Line 1: MMD “Date Code”
Line 2: Frequency
www.mmdcomp.com
phone: 949-709-5075 / fax: 949-709-3536
Specifications subject to change without notice
OS11
Revision: 4/20/04 I
相关型号:
©2020 ICPDF网 联系我们和版权申明