MLV0603ES012V0010NT [ETC]
Surface Mount Multilayer Varistors;
| 型号： | MLV0603ES012V0010NT |
| 厂家： | 
ETC |
| 描述： | Surface Mount Multilayer Varistors |
| 文件： | 总6页 (文件大小：151K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Rev. Aug.11
Surface Mount Multilayer Varistors
Product Identificationꢂ
MLV 0402 ES 012V 0100 N T
(1)
(2) (3) (4)
(5) (6) (7)ꢂ
(1) Series Code:
MLV – Surface Mount Multilayer Varistor
MVA -- MLV Array
MVF -- ESD-EMI Filter
(2) Size Code:
Standard EIA Chip Size
(3) Application Code:
ES – Electro-static Discharge Protection
NA – Normal Surge Protection
HA – High Surge Protection
L4 -- 4 lines
(4) Max. Working Voltage:
012V – 12 V
(5) Capacitance for ES Series:
0100 – 100 pF
02R5 – 2.5 pF
Peak Current for HA/NA Series: 0100 – 100 A
(6) Capacitance Tolerance for ES Series:
N – 30 %
P – Special
(7) Packaging Code:
T – Tape & Reel
B – Bulk
Operating Temperatures:ꢂ
-55ºC to +85ºC for size 0603 or smaller
-55ºC to +125ºC for size 0805 or largerꢂ
Terms and Definitions ꢂ
Term
Definition
Maximum steady-state DC operating voltage with typical leakage current less than
Max. Working Voltage
50 ȝA at 25ꢂ°C ꢂ
Breakdown DC voltage measured at current of 1 mA
Varistor Voltage˄BDV˅ꢂ
Maximum peak voltage across the part, measured at a specified pulse current
and waveform
Max. Clamping Voltage
Maximum peak current with the specified 8/20 ȝs waveform without
Surge Current
Surge Shift Ƹ V/V
Energy Absorption
damage
The change of varistor voltage after applying the specified surge current
Maximum energy dissipated with a specified 10/1000 ȝs waveform
without damage
Typical Capacitance
Nonlinear ExponentĮ
Leakage Current
Capacitance measured with voltage bias less than 0.5 VRMS at 1 KHZ or 1 MHz
Į=ǒlog˄V1mA/V0.1mA˅/ log˄IV1mA/IV0.1mA˅Ǔꢂ
Typical leakage current at 25 °C ꢃꢂ50 ȝA; Maximum leakage 200 ȝA.
The frequency of -3 dB insertion loss
Cut-off Frequency
ꢀꢁꢂ
Website: www.aemchina.com & www.aemcomponents.com
Rev. Aug.11
Surface Mount Multilayer Varistors
Shape and Dimensions
MLV Seriesꢂ
Size
L
(mm)
W
(mm)
T
(mm)
E
(mm)
W
0201
0402
0603
0805
1206
1210
1812
2220
0.60 0.03
1.00 0.10
1.60 0.15
2.00 0.20
3.20 0.20
3.20 0.20
4.50 0.20
5.70 0.20
0.30 0.03
0.50 0.10
0.80 0.15
1.25 0.15
1.60 0.15
2.50 0.20
3.20 0.20
5.00 0.20
0.30 0.03
0.50 0.10
0.90 max.
1.00 max.
1.20 max.
1.50 max.
2.00 max.
3.00 max.
0.30 0.03
0.25 0.10
0.30 0.10
0.30 0.10
0.50 0.20
0.50 0.20
0.60 0.20
0.60 0.20
E
L
T
ESD Arrayꢂ
Size
0508
0612
L (mm)
W (mm)
T (mm)
A (mm)
B (mm)
2.00 0.20
1.25 0.20
0.80 max.
3.20 0.20
1.60 0.15
0.95 max.
0.20 0.10
0.25 0.05
0.20 0.10
0.40 0.15
ESD-EMI Seriesꢂ
L
(mm)
W
(mm)
T
(mm)
e
p
(mm)
g
(mm)
Size
(mm)
0508 2.00 0.20 1.25 0.20 0.75 0.15 0.25 0.10 0.50 0.25 0.15
ꢀꢄꢂ
Website: www.aemchina.com & www.aemcomponents.comꢂ
Rev. Aug.11
Recommended Land Patterns
MLV Seriesꢂ
Solder pad layoutꢂ
Sizeꢂ
A
C
D
(mm)ꢂ
(mm)ꢂ
(mm)ꢂ
0201
0402
0603
0805
1206
1210
1812
2220
0.25~0.35
0.4~0.6
0.9~1.2
1.0~1.5
1.8~2.5
1.8~2.5
2.5~3.3
3.8~4.6
0.20~0.30
0.5~0.6
0.6~1.0
1.2~1.5
1.2~1.8
2.2~3.0
2.8~3.6
4.8~5.5
0.25~0.35
0.5~0.7
0.8~1.2
1.0~1.4
1.0~1.4
1.0~1.4
1.2~1.8ꢂ
1.2~1.8ꢂ
ESD Array Seriesꢂ
A
(mm)
B
(mm)
D
(mm)
F
(mm)
G
(mm)
Size
0508
0612
2.10
2.60
0.40
2.50
3.60
0.50
0.80
0.35
0.80
0.50
ESD-EMI Seriesꢂ
A
(mm)
B
(mm)
C
(mm)
D
(mm)
E
(mm)
F
(mm)
G
(mm)
Size
0508
2.00
0.60
0.25
2.50
1.60
0.50
0.25
ꢀꢅꢂ
Website: www.aemchina.com & www.aemcomponents.com
Rev. Aug.11
Surface Mount Multilayer Varistors
Environmental Tests
No.
Test
Requirement
Test condition
Test reference
MIL-STD-202
Method 210
Soldering heat
resistance
BDV change f10 %
No mechanical damage
1
One dip at 260ºC for 5 sec.
IEC 60068-2-20
MIL-STD-202
Method 208
One dip at 255ºC for 5 sec.
Non-active flux
2
3
Solderability
New solder coverage 80 %
IEC 60068-2-20
100 pulses of 8/20 ȝs with
maximum surge current and 30 sec.
interval at 25ºC and 30~65 % RH
Maximum surge
current
CECC 42000
IEC 1051-1 Test 4.5
BDV change f10 %
No mechanical damage
100 pulses of 10/1000 ȝs with
Maximum surge
energy
BDV change f10 %
4
5
maximum surge current and 90 sec. CECC 42000ꢂ
No mechanical damage
interval at 25ºC and 30~65 % RH
5 cycles between -40嘙C and 125ºC
BDV change f10 %
No mechanical damage
Leakage current 200 ȝA
with 30 min. dwell time at the
CECC 42000
Thermal cycling
temperature extremes and 60 min. IEC 60068-2-14
dwell time at 25嘙C ꢂ
BDV change f10 %
No mechanical damage
Leakage current 200 ȝA
Low temperature
resistance
6
7
8
9
IEC 60068-2-1
1000 hr at -50嘙C ꢂ
BDV change f10 %
No mechanical damage
Leakage current 200 ȝA
Low temperature
load resistance
1000 hr at -50嘙C with working
voltage applied
IEC 60068-2-1ꢂ
MIL-STD-202
Method 108
CECC 42000ꢂ
BDV change f10 %
No mechanical damage
Leakage current 200 ȝA
High temperature
resistance
1000 hr at 150嘙C ꢂ
BDV change f10 %
No mechanical damage
Leakage current 200 ȝA
High temperature
load resistance
1000 hr at 85嘙C with working
voltage applied
CECC 42000
MIL-STD-202
Method 103
BDV change f10 %
No mechanical damage
Leakage current 200 ȝAꢂ
Humidity
10ꢂ
11ꢂ
500 hr at 40嘙C and 90 ~ 95 % RHꢂ
resistanceꢂ
IEC 60068-2-3
CECC 42000;
MIL-STD-202
Method 103
BDV change f10%
Humidity
load resistanceꢂ
500 hr at 40°C and 90 ~ 95 % RH
No mechanical damage
IEC 60068-2-3
CECC 42000
with working voltage appliedꢂ
Leakage current 200 ȝAꢂ
Contact electrostatic discharge 100
Varistor voltage change
ꢂ
12ꢂ
13ꢂ
times with 1 second intervals at 8 KV IEC 61000-4-2ꢂ
(Level 4 ) and polarity: +,-ꢂ
ESD contact test*
>115 % working voltageꢂ
Air contact electrostatic discharge 100
times with 1 second intervals atꢂ 15 IEC 61000-4-2ꢂ
KV (Level 4 ) and polarity:+,-ꢂ
Varistor voltage change
>115 % working voltageꢂ
ESD air test*ꢂ
ꢇꢂFor ES series only.ꢂ
ꢀꢆꢂ
Website: www.aemchina.com & www.aemcomponents.comꢂ
Rev. Aug.11
Surface Mount Multilayer Varistors
Soldering Temperature Profile
Recommended Temperature Profile
for Reflow Solderingꢂ
Natural
Cooling
10 Seconds
245°C
175°C
Preheat 60 — 120 Seconds Min.
Recommended conditions for hand soldering:
1. Appropriate temperature (max.) of soldering iron tip/soldering time (max.): 280°C /10 s or
350 °C / 3 s
2. Using hot air rework station with tip that can melt the solder on both terminations at the
same time is strongly recommended. Do not directly contact the chip termination with the tip
of soldering iron.
ꢀꢈꢂ
Website: www.aemchina.com & www.aemcomponents.com
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Authorized Distributor
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