MTD505 [ETC]
5 Port 10M/100M Ethernet Switch; 5端口10M / 100M以太网交换机型号: | MTD505 |
厂家: | ETC |
描述: | 5 Port 10M/100M Ethernet Switch |
文件: | 总19页 (文件大小:204K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
MYSON
MTD505
TECHNOLOGY
(Preliminary)
5 Port 10M/100M Ethernet Switch
FEATURES
GENERAL DESCRIPTION
•
•
•
•
IEEE802.3 and IEEE802.3u compliant.
Provide 4 RMII and 1 MII/RMII ports.
Programmable 1K/8K MAC addresses filtering. is a non-blocking 5 port 10M/100M Ethernet
Store and forward switching function and bad
packet filtering function.
The MTD505 complies fully with the
IEEE802.3, 802.3u and 802.3x specifications and
switch device.
Support 4 RMII and 1 MII/RMII ports for
•
•
•
Optional back_pressure/802.3x flow control/
flooding control/broadcast control.
Optional EEPROM Interface for advanced
switch configurations.
1MB/2MB SGRAM/SDRAM flexible memory
interface.
10M/100M operation. 1MByte/2MBytes memory
interface provides maximum 1365 packet buffers
for Ethernet packet buffering. Up to 8192 address
entrys are provided by the MTD505, and the
MTD505 use full Ethernet address compare algo-
rithm to minimize hashing collision events.
•
•
Port VLAN/trunking.
Link/Rx activity, packet buffer utilization LED
display.
The MTD505 provides EEPROM interface
to config port trunking, port VLAN, static entry,
802.3x flow control threshold, flooding port,
•
50MHz for non-blocking for 5 ports switch oper- broadcast control threshold. Each MTD505 port
ation
support 10/100M auto-negotiation by MDC/MDIO
interface for connecting external PHY devices.
The MTD505 also provides 10 pins for
Link/RX activity, packet buffer utilization LED dis-
play function.
•
•
Build in internal/external memory test function.
128 pin PQFP package, 3.3V operation volt-
age.
BLOCK DIAGRAM
SDRAM/
SGRAM
Interface
Memory
Controller
RMII0
DMA0
MAC0
RMII1
RMII2
RMII3
DMA1
DMA2
DMA3
MAC1
MAC2
MAC3
Memory
Arbiter
RMII/MII4
DMA4
MAC4
Port
Switch
Logic
This datasheet contains new product information. Myson Technology reserves the rights to modify the product specification
without notice. No liability is assumed as a result of the use of this procuts. No rights under any patent accompany the sales of
the product.
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MYSON
MTD505
TECHNOLOGY
(Preliminary)
SYSTEM DIAGRAM
(**OPTION)
EEPROM
(**Programmable)
SGRAM
(256k32x1)
SGRAM
(512k32x1)
MTD505
LEDs
SGRAM
(256k32x2)
MII4
RMII0-3
QUAD
Single
PHYsceiver
PHYsceiver
MII management
QUAD
Single
Transformer
Transformer
RJ45
RJ45
This datasheet contains new product information. Myson Technology reserves the rights to modify the product specification
without notice. No liability is assumed as a result of the use of this procuts. No rights under any patent accompany the sales of
the product
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MYSON
MTD505
TECHNOLOGY
(Preliminary)
1.0 PIN CONNECTION
LEDDATA4
LEDDATA3
LEDDATA2
LEDDATA1
LEDDATA0
GNDI
64 VCCO
63 GNDO
62 AD5
103
104
105
106
107
108
109
110
111
112
113
114
115
116
117
118
119
120
121
122
123
124
125
126
127
128
61 AD6
60 AD7
59 AD8
CLK25M
VCCI
58 VCCI
57 MEMCLK
56 GNDI
55 DQ8
SDC
SDIO
EECLK
54 DQ9
EEDATA
RESETB
REFCLK
MDIO
53 DQ10
52 DQ11
51 DQ12
50 DQ13
49 DQ14
48 DQ15
47 DQ24
46 DQ25
45 DQ26
44 VCCO
43 GNDO
42 DQ27
41 DQ28
40 DQ29
39 DQ30
MTD505
MDC
CRSDV0
TXD0_1
TXD0_0
TXEN0
RXD0_0
RXD0_1
CRSDV1
TXD1_1
TXD1_0
TXEN1
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MTD505
TECHNOLOGY
(Preliminary)
2.0 PIN DESCRIPTIONS
RMII/MII Port Interface Pins
Descriptions
Name
CRSDV0
Pin Number I/O
I
Port0 RMII receive interface signal, CRSDV0 is asserted high when
port0 media is non_idle.
119
RXD0_0
RXD0_1
TXEN0
I
I
Port0 RMII receive data bit_0.
Port0 RMII receive data bit_1.
Port0 RMII transmit enable signal.
Port0 RMII transmit data bit_0.
Port0 RMII transmit data bit_1.
123
124
O
O
O
I
122
TXD0_0
TXD0_1
CRSDV1
121
120
Port1 RMII receive interface signal, CRSDV1 is asserted high when
port1 media is non_idle.
125
RXD1_0
RXD1_1
TXEN1
I
I
Port1 RMII receive data bit_0.
Port1 RMII receive data bit_1.
Port1 RMII transmit enable signal.
Port1 RMII transmit data bit_0.
Port1 RMII transmit data bit_1.
01
02
O
O
O
I
128
TXD1_0
TXD1_1
CRSDV2
127
126
Port2 RMII receive interface signal, CRSDV2 is asserted high when
port2 media is non_idle.
03
RXD2_0
RXD2_1
TXEN2
I
I
Port2 RMII receive data bit_0.
Port2 RMII receive data bit_1.
Port2 RMII transmit enable signal.
Port2 RMII transmit data bit_0.
Port2 RMII transmit data bit_1.
09
10
O
O
O
I
06
TXD2_0
TXD2_1
CRSDV3
05
04
Port3 RMII receive interface signal, CRSDV0 is asserted high when
port3 media is non_idle.
11
RXD3_0
RXD3_1
TXEN3
I
I
Port3 RMII receive data bit_0.
15
16
Port3 RMII receive data bit_1.
O
O
O
I
Port3 RMII transmit enable signal.
Port3 RMII transmit data bit_0.
14
TXD3_0
TXD3_1
CRSDV4
13
12
Port3 RMII transmit data bit_1.
Port4 RMII/MII receive interface signal, CRSDV4 is asserted high when
port4 media is non_idle.
17
26
25
RXDV4
I
I
Port4 MII receive data valid.
In RMII mode, this pin don’t use.
RXCLK4
Port4 MII receive clock signal.
In RMII mode, this pin is not used.
Port4 MII receive data bit_3. In RMII mode, this pin don’t use.
Port4 MII receive data bit_2. In RMII mode, this pin don’t use.
Port4 RMII/MII receive data bit_0.
Port4 RMII/MII receive data bit_1.
Port4 RMII transmit enable signal.
Port4 RMII transmit clock signal.
RXD4_3
RXD4_2
RXD4_0
RXD4_1
TXEN4
I
I
32
31
29
30
I
I
O
I
23
24
TXCLK4
In RMII mode, this pin is not used.
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MTD505
TECHNOLOGY
(Preliminary)
RMII/MII Port Interface Pins
Descriptions
Name
TXD4_3
Pin Number I/O
O
O
O
O
I
Port4 MII transmit data bit_3. In RMII mode, this pin don’t use.
Port4 MII transmit data bit_2. In RMII mode, this pin don’t use.
Port4 RMII/MII transmit data bit_0.
19
20
22
21
TXD4_2
TXD4_0
TXD4_1
COL4
Port4 RMII/MII transmit data bit_1.
Port4 MII collision input.
18
In RMII mode, this pin don’t use.
CLK25M
O
Port4 MII 25MHz clock output.
109
SGRAM/SDRAM Interface Pins
Name
Pin Number I/O
Descriptions
AD[8:0]
O
Memory row/column address bus outputs
59,60,61,62,
65,66,67,68,
69
AD[7:0] are row/column address [7:0].
AD[8] : This pin should connect to SGRAM/SDRAM MSB address bit.
DQ[31:0]
38~42,45~55 I/O Memory data bus
,78~80,
83~95
RASB
CASB
WEB
75
76
77
73
74
70
57
O
O
O
O
O
O
O
SGRAM/SDRAM row address select
SGRAM/SDRAM column address select
SGRAM/SDRAM write enable
SGRAM/SDRAM bank select
Memory chip select 0
BA
CS0B
CS1B
MEMCLK
Memory chip select 1
Memory clock output.
Note: SGRAM/SDRAM access time: 10 ns (max)
LED Interface Pins
Name
Pin Number I/O
Descriptions
LEDDATA
I/O LED data output.
[7:0]
These LED pins report Port0~7 Link/Rx activity status using
LEDCLK1 strobe , and report packet buffer utilization status using
LEDCLK2 strobe.
LEDDATA [0] [1] [2] [3] [4] [5] [6] [7]
LEDCLK1 LR0 LR1 LR2 LR3 LR4 --- --- ---
LEDCLK2 Uti0 Uti1 Uti2 Uti3 Uti4 --- BFull MFail
note:
100,101,102,
103,104,105,
106,107
LRn: means per port’s Link_RxAct status.
Uti0: 5%, Uti1: 10%, Uti2: 20%, Uti3: 35%, Uti4: 50 above .
BFull: Buffer almost full alarm signal.
Mfail: External memory poer on test failure.
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MTD505
TECHNOLOGY
(Preliminary)
LED Interface Pins
Name
LEDCLK1
LEDCLK2
Pin Number I/O
Descriptions
96
97
I/O LED strobe 1
I/O LED strobe 2
Miscellaneous Pins
Name
RESETB
SYSCLK
Pin Number I/O
Descriptions
115
I
I
System reset input, low active.
Switch core system clock input, using the same clock source with REF-
CLK.
36
REFCLK
MDC
116
118
117
111
112
114
113
I
RMII reference clock input, using 50Mhz.
I/O MII management clock inout
I/O MII management data inout
I/O MII register clock inout
I/O MII register data inout
I/O EEPROM data input
MDIO
SDC
SDIO
EEDATA
EECLK
VCC
I/O EEPROM clock output
08,28,34,37, PWR Power pins
44,58,64,72,
82,99,110
GND
02,27,33,35, GND Ground pins
43,56,63,71,
81,98,108
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MTD505
TECHNOLOGY
(Preliminary)
Jummper Configuration After Power On Reset
Pin Number I/O Descriptions
Name
LEDDATA[0]
I/O During power on reset duration, these pins are jumper setting pins
(pull_hgih = 1, pull_low = 0).
LEDDATA[1]
LEDDATA[2]
LEDDATA[3]
LEDDATA[4]
LEDDATA[5]
LEDDATA[6]
LEDDATA[7]
LEDDATA[0] : select SGRAM/SDRAM interface ,
“1” means 256K32 x 1 or 512K32 x 1 is selected.
“0” means 256K32 x 2 is selected, default is “1”.
LEDDATA[1] : config packet buffer size,
“1” means 2 M bytes buffer size is selected.
“0” means 1 M byte buffer size is selected, default is “0”
LEDDATA[2] : enable memory test function,
“1” means enable.
‘0” means disable, default is “1”.
LEDDATA[3] : enable aging function,
“1” means enable.
“0” means disable, default is “1”.
LEDDATA[4] : enable MII polling(MDC/MDIO),
“1” means enable.
“0” means disable, default is “1”.
LEDDATA[5] : enable broadcast storm control,
“1” means enable.
“0” means disable, default is “1”.
LEDDATA[6] : enable backpressure function (in half mode),
“1” means enable.
“0” means disable, default is “1”.
LEDDATA[7] : enable 802.3x flow control function (in full mode) ,
“1” means enable.
“0” means disable, default is ”1”.
LEDCLK1
LEDCLK2
I/O During power on reset duration, this pin is a jumper setting pin
(pull_hgh =1, pull_low = 0).
LEDCLK1 : select 1K or 8K address entry table,
“1” means 8K addres entry is selected.
“0” means 1K address entry is selected, default is “1”.
I/O During power on reset duration, this pin is a jumper setting pin
(pull_hgh =1, pull_low = 0).
LEDCLK2 : enable EEPROM interface.
“1” means enable.
“0” means disable, default is “1”.
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MTD505
TECHNOLOGY
(Preliminary)
Jummper Configuration After Power On Reset
Pin Number I/O Descriptions
Name
EEDATA
I/O During power on reset duration, this pin is a jumper setting pin
(pull_hgh =1, pull_low = 0).
EEDATA : enable EEPROM auto_load configuration function while
EEPROM interface is enabled,
“1” means enable.
“0” means disable, default is “1”.
TXEN[2:0]
TXEN[3]
I/O During power on reset duration, this pin is a jumper setting pin
(pull_hgh =1, pull_low = 0).
TXEN[2:0] : uplink port (flooding port) 0 ~7 selection; default is “000”.
I/O During power on reset duration, this pin is a jumper setting pin
(pull_hgh =1, pull_low = 0).
TXEN[3] : enable flooding control,
“1” means enable.
“0” means disable, default is “0”.
TXEN[4]
I/O During power on reset duration, this pin is a jumper setting pin
(pull_hgh =1, pull_low = 0).
TXEN[4] : enable VLAN tag 1522 bytes receiving,
“1” means enable.
“0” means disable, default is “0”.
SDC
I/O During power on reset duration, this pin is a jumper setting pin
(pull_hgh =1, pull_low = 0).
SDC : Port4 MII/RMII interface selection,
“1” means Port4 MII interface is selected.
“0” means Port4 RMII interface is selected, default is “0”.
EECLK
MDC
I/O During power on reset duration, this pin is a jumper setting pin
(pull_hgh =1, pull_low = 0).
EECLK : scan mode enable for debugging purpose,
“1” means scan mode enable.
“0” means scan mode disable, default is “0”.
I/O During power on reset duration, this pin is a jumper setting pin
(pull_hgh =1, pull_low = 0).
MDC : fast mode enable for testing purpose,
“1” means fast mode enable.
“0” means fast mode disable, default is “0”.
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MTD505
TECHNOLOGY
(Preliminary)
3.0 FUNCTIONAL DESCRIPTIONS
The MTD505 is an 5 ports 10/100 Mbps fast Ethernet switch controller. It is a low cost solution for eight
ports fast Ethernet SOHO switch design. No CPU interface is required; After power on reset, MTD505
provide an auto load configuration setting function through a 2 wire serial EEPROM interface to acess
external EEPROM device, and MTD505 can easily be configured to support port_trunking, port_ VLAN,
static entry, 802.3X flow control threshold setting , flooding port assignment ...etc functions. The follow-
ing descriptions are MTD505’s major functional blocks overview.
3.1 Packet store and forwarding
The MTD505 use simple store and forward algorithm as packet switching method. Input packet from
ports will be stored to external memory first, while packet is good for forward (CRC chech ok, 64Bytes <
length < 1518Bytes, not local packets, in the same VLAN group ) , if this packet’s DA hits, than forward
this packet to the destination port, otherwise this packet will be broadcasted.
3.2 Learning and Routing
The MTD505 supports 1K or 8K MAC entries for switching. Dynamic address learning is performed by
each good unicast packet is completely received. The static address learning is achieved by EEPROM
configuration. On the other hand, the routing process is performed whenever the packet’s DA is cap-
tured. If the DA can not get a hit result, the packet is going to switch broadcast or forward to the dedi-
cated port according to the flooding control selction.
3.3 Aging
Only the dynamic address entries are scheduled in the aging machine. If one station does not transmit
any packet for a period of time, the belonging MAC address will be kicked out from the address table.
The aging out time can be program through the EEPROM auto load configuration. (Default value is 300
seconds)
3.4 Buffer Queue Management
The buffer queue manager is implemented to manage the external shared memory (use SDRAM/
SGRAM) for packet buffering. The main function of the buffer queue manager is to maintain the linked
list consists of buffer IDs, which is used to show the corresponding memory address for each incoming
packet. In addition, the buffer queue manager monitors the rested free spaces status of the external
memory, If the packet storage achieve the predefined threshold value, the buffer queue manager will
raise the alarm signal which is used to enable the flow control mechanism for avoiding transmission ID
queue overflow happening. MTD505 provide 802.3x flow control in full duplex mode and back pressure
control in half duplex mode.
3.5 Full Duplex 802.3x Flow Control
In full duplex mode, MTD505 supports the standard flow control defined in IEEE802.3x standard. It
enables the stopping of remote node transmissions via a PAUSE frame information interactoin. When
the “802.3x flow control enable” bit is set during power on reset (LEDDATA[7] pin is external pull_high),
it enables MTD505 supporting 802.3x flow control function in full_duplex mode; When output port buffer
queue’s on_using value reach the initialization setting threshold value (recommended Xon_TH = 74’h
when using 2Mbytes external memory; Xon_TH = 2e’h when using 1Mbytes external memory),
MTD505 will send out a PAUSE packet with pause time equal to FFF to stop the remote node transmis-
sion; When the output port buffer queue’s on_using value reduce to the initialization threshold
value(recommended Xoff_TH = 30’h when using 2Mbytes external memory; Xoff_TH=18’h when using
1Mbytes external memory), MTD505 will also send a PAUSE packet with pause time equal to zero to
inform the remote node to retransmit packet.
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MTD505
TECHNOLOGY
(Preliminary)
3.6 Half Duplex Back Pressure Control
In half duplex mode, MTD505 provide a back pressure control mechanism to avoid dropping packets
during network conjection situation. When the “back pressure control enable” bit is set during power on
reset (LEDDATA[6] pin is external pull_high), it enables MTD505 supporting back pressure function in
half_duplex mode; When output port buffer queue’s on_using value reach the initialization setting
threshold value (same with the Xon_TH value), MTD505 will send a JAM pattern in the input port when
it senses an incoming packet , thus force a collision to inform the remote node transmission back
off and will effectively avoid dropping packets. If the “back pressure control enable” bit is not set, and
there is no free buffer queue available for the incoming packets, the incoming packets will be dropped.
3.7 MII Polling
The MTD505 supports PHY management through the serial MDIO/MDC interface. After power on
reset, the MTD505 write related abilities to the advertisement register 4 of connected PHY devices and
restart the auto_negotiation prcedure via MDIO/MDC interface using the predefined PHY addresses
increasingly from “01000”b to “01100”b. The MTD505 will periodically and continuously poll and update
the link status and link partner’s ability which include speed, duplex mode, and 802.3x flow control
capable status of the connected PHY devices through MDIO/MDC serial interface.
3.8 MAC and DMA engine
The MTD505’s MAC performs all the functions in IEEE802.3 protocol, such as frame formatting, frame
stripping, CRC checking, bad packet dropping, defering to line traffic, and collision handling. The MAC
Rx_engine checks incoming packets and drops the bad packet which include CRC error, alignment
error, short packet (less than 64 bytes), and long packet(more than 1518 bytes or 1522 bytes when the
“VLAN tag 1522 bytes receive enable” bit is set during power on reset). Before transmission, The MAC
Tx_engine will constantly monitor the line traffic using derfering precedure. Only if it has been idle for a
96 bits time (a minimum interpacket gap time, IPG time), actual transmmission can be started. For the
half duplex mode, MAc engine will detect collision; if a collision is detected, the MAC Tx_engine will
transmit a JAM pattern and then delay the re_transmission for a random time period determined by the
back_off algorithm (MTD505 implements the truncated exponential back_off algorithm defined in IEEE
802.3 standard). For the full duplex mode, collision signal is ignored.
The MTD505’s DMA engine performs the packets non_blocking transportation between MAC engine
and external memory according to a high speed switching procedure. The switching procedure is com-
pleted by address learning/routing process and buffer queue management operation.
3.9 EEPROM interface
MTD505 provide an auto load configuration setting function through a 2 wire serial EEPROM interface
to acess external EEPROM device(24C02) after power on reset . MTD505 can easily be configured to
support port_trunking, port_ VLAN, static entry, 802.3X flow control threshold setting , flooding port
assignment ...etc functions. The following table is the EEPROM contents mapping:
Recommended
EEPROM
Name
EEPROM Content Description
Value Under
Address
Basic Operation
EOB
00
Last EEPROM content address value
Aging Time bit [7:0]
8’h13
8’h2c
8’h01
8’hfe
8’hfd
8’hfb
8’hf7
8’hef
AgeLow
AgeHigh
VLAN0
VLAN1
VLAN2
VLAN3
VLAN4
01
02
03
04
05
06
07
Aging Time bit [15:8]
Port0 VLAN register
Port1 VLAN register
Port2 VLAN register
Port3 VLAN register
Port4 VLAN register
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Recommended
Value Under
Basic Operation
EEPROM
Address
Name
EEPROM Content Description
Reserved
Reserved
Reserved
08
reserved
reserved
reserved
8’hdf
8’hbf
8’h7f
09
0a
bit[7:4] --- the flooding port_no of Port1
bit[3:0] --- the flooding port_no of Port0
*ex1: bit[7:4] = “0011”b, means that if the incomin
packet of Port1 got the “un_routed” result, then
this incoming packet will be flooded to Port3.
UpLink10
UpLink32
0b
8’h0f
*ex2: bit[3:0] = “0111”b, means that if the incomin
packet of Port0 got the “un_routed” result, then
this incoming packet will be flooded to Port7.
(note: set value “4’hf”, means flooding to all the
other ports; set value “4’h8”~“4’he” is forbidden)
bit[7:4] --- the flooding port_no of Port3
bit[3:0] --- the flooding port_no of Port2
0c
8’h00
8’h00
(note: set value “4’hf”, means flooding to all the
other ports; set value “4’h8”~“4’he” is forbidden)
bit[7:4] --- reserved
bit[3:0] --- the flooding port_no of Port4
UpLink54
Reserved
0d
0e
(note: value setting “f”, means flooding to all the
other ports; value setting “8” ~ “e” is forbidden)
reserved
Broadcast threshold
Xon threshold
8’h00
8’hff
Broadcast TH 0f
Xon TH
Xoff TH
DisPort
10
8’h74
8’h30
8’h00
11
12
Xoff threshold
Disable Port
System control byte :
System Control 13
bit[0] --- enhanced back pressure enable,
8’h00
bit[7:1] --- reserved.
none
Reserved
StaticSA1
14 ~1f
Address 26 bit[2:0] --- means Port ID
20 ~26
27 ~ 2d
Address 25 bit[7:0] ~ Address 20 bit[7:0] ---
means static SA[47:0]
Address 2d bit[2:0] --- means Port ID
StaticSA2
Address 2c bit[7:0] ~ Address 27 bit[7:0] ---
means static SA[47:0]
3.10 Port Based VLAN
The MTD505 supports VLAN configuration by port based methodology. One port select the certain
ports to form its VLAN group by configuring the VLAN register. The packet (including broadcast packet)
is not forwarding to the destination port whose VLAN group is different from the source port.
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TECHNOLOGY
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3.11 Port Trunking
The port trunking function can also be implemented by VLAN registers. One trunk port isolates the
packet transmitting and receiving from the other trunk ports, which performs a logical trunk topology.
The non-trunk port should choose only one trunk port for transmitting, which can achieve the load bal-
ancing and maintain the packet sequences.
3.12 Memory Interface
Two kinds of external memory interface can be selected by user -- 1M byte memory (256K32 x 1) and 2
M bytes (256K32 x 2 or 512K32 x 1). Maximum 2M byte external memory can be used for packet buff-
ering. “-10 “ speed grade of SGRAM/SDRAM device is recommanded. The following table is the
SGRAM application pin connection :
Memory
Chip No
Memory Type
A[8]
CS0B
CS1B
256K32
256K32
512K32
x 1
A8
A8
A9
CS0B
CS0B
CS0B
NC
CS1B
A8
x 2
x 1
3.13 Internal MII Registers Acess and Control
The MTD505 support 2 serial pins (SDIO/SDC) for internal registers acess and control; The detailed
registers informations are presented in Section4.0 (Internal MII Registers).
3.14 LED Display
The MTD505 use 10 pins to output 2 kinds of LED display -- LEDDATA[7:0], LEDCLK1, LEDCLK2.
Using LEDCLK1 rising edge, LEDDATA[7:0] report Port7~0 link/receive activity led status. Using
LEDCLK2 rising edge, LEDDATA[4:0] report packet buffer utilization rating, and LEDDATA[7] report
external memory test result(after power reset, MTD505 will test external SDRAM automatically), LED-
DATA[6] report the buffer almost full alarm signal .
4.0 Internal MII Registers
The MTD505 implements 10 MII global registers and 4 per port registers, define as following tables:
TABLE 1. MII registers
GLOBAL REGISTERS
REG
NO
Bits
Name
R/W
R/W
Descriptions
Default
0
CtlReg0
CONTROL REGISTER 0
bit[0] = 1 --> switch to port 0 registers
bit[1] = 1 --> switch to port 1 registers
bit[2] = 1 --> switch to port 2 registers
bit[3] = 1 --> switch to port 3 registers
bit[4] = 1 --> switch to port 4 registers
bit[5] = reserved
8-0
9’h100
bit[6] = reserved
bit[7] = reserved
bit[8] = 1 --> switch to global registers
scan mode select 3-0
12-9
15-13
Scan port select
1
CtlReg1
R/W
CONTROL REGISTER 1
16’h3084
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MTD505 Revision 1.2 14/04/2000
MYSON
MTD505
TECHNOLOGY
(Preliminary)
TABLE 1. MII registers
GLOBAL REGISTERS
Descriptions
REG
NO
Bits
Name
R/W
Default
7-0
XON
XON threshold.
XOFF threshold.
While EEPROM is enabled, this register’s content will
be updated by EEPROM read XON/XOFF threshold
data automatically. After EEPROM read is done, this
register can be read/write by management cmd.
15-8
15-0
XOFF
default is 16’h3084(2M memory) or 16’h1838(1M mem-
ory)
2
3
CtlReg2
Aging
R/W
R/W
CONTROL REGISTER 2
16’d300
16’h000f
bit[15:0] can specify aging time.
While EEPROM is enabled, this register’s content will
be updated by EEPROM read Aging timer data auto-
matically. After EEPROM read is done, this register can
be read/write by management cmd.
CtlReg3
CONTROL REGISTER 3
bit[15:12] specify port 3’s uplink port ID.
bit[11:8] specify port 2’s uplink port ID.
bit[7:4] specify port 1’s uplink port ID.
bit[3:0] specify port 0’s uplink port ID.
default is 16’h000f.
15-0 Uplink reg0
CtlReg4
P.S this register’s write sequence is Jumper setting ==>
EEPROM content ==> MII management command.
4
R/W
CONTROL REGISTER 4
16’h0
bit[15:12] :reserved
bit[11:8] : reserved
bit[7:4] : reserved
15-0 Uplink reg1
bit[3:0] specify port 4’s uplink port ID.
default is 16’h0.
P.S this register’s write sequence is Jumper setting ==>
EEPROM content ==> MII management command.
5
6
CtlReg5
R/W
CONTROL REGISTER 5
bit[7:0] specify broadcast threshold.
bit[8] enable enhance backpressure.
Reserved.
16’hff
7-0
8
15-9
P.S this register can be writed by EEPROM content or
MII management command too.
RO/
RC
StsReg0
STATUS REGISTER 0
bit[4:0] outputs port4-0 RXDMA fifofull, bit[7:5] :
reserved.
7-0
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MTD505 Revision 1.2 14/04/2000
MYSON
MTD505
TECHNOLOGY
(Preliminary)
TABLE 1. MII registers
GLOBAL REGISTERS
Descriptions
REG
NO
Bits
Name
R/W
RO
Default
bit[12:8] outputs port4-0 TXDMA TPUR(fifoempty),
bit[15:13] : reserved.
15-8
7
StsReg1
STATUS REGISTER 1
0
1
2
3
4
5
6
7
8
9
10
BufBistDone.
BufBistErr.
BufInitDone.
AddrTblBistDone.
AddrTblBistErr.
LthTblBistDone.
LthTblBistErr.
MemBistDone.
MemBistErr.
EEDone.
FreeCntIs0.
15-11 Reserved.
CONTROL REGISTER 7
8
9
CtlReg7
CtlReg8
R/W
R/W
bit[4:0] output mii polling port4-0 flow control informa-
tion, bit[7:5] : reserved
7-0
bit[12:8] output mii polling port4-0 link information,
bit[15:13] : reserved.
15-8
"1" means flow control enable or link good.
CONTROL REGISTER 8
bit[4:0] output mii polling port4-0 speed information,
bit[7:5] : reserved.
7-0
bit[12:8] output mii polling port4-0 full information,
bit[15:13] :reserved.
15-8
"1" means 100M or full duplex.
PORT REGISTERS
1
2
3
4
StsReg1
StsReg2
StsReg3
CtlReg1
RO
RO
STATUS REGISTER 1
bit[10:0] output Port Tx queue head value.
Reserved.
10-0
15-11
STATUS REGISTER 2
bit[10:0] output Port Tx queue tail value.
Reserved.
10-0
15-11
RO
STATUS REGISTER 3
bit[10:0] output Port Tx queue count value.
Reserved.
10-0
15-11
R/W
CONTROL REGISTER 1
bit[7:0] select Port VLAN group.
Reserved.
7-0
15-8
14/19
MTD505 Revision 1.2 14/04/2000
MYSON
MTD505
TECHNOLOGY
(Preliminary)
"R/W" means read/writable.
5.0 Electrical Characteristics
5.1 Absolute Maximum Ratings
Symbol
Parameter
Power Supply Voltage
Input Voltage
RATING
-0.3 to 3.6
Unit
V
VCC
VIN
-0.3 to Vcc+0.3
-0.3 to Vcc+0.3
-55 to 150
V
VOUT
TSTG
Output Voltage
V
oC
Storage Temperature
5.2 Recommended Operating Conditions
Symbol
Parameter
Min.
3.0
0
Typ.
3.3
-
Max.
3.6
Unit
V
VCC
Power Supply
Input Voltage
VIN
Vcc
115
V
oC
oC
Commercial Junction Operating Temperature
Industrial Junction Operating Temperature
0
25
Tj
-40
25
125
5.3 DC Electrical Characteristics
Symbol
Parameter
Input Leakage Current
Tri-state Leakage Current
Input Capacitance
Conditions
Min.
Typ.
Max.
Unit
uA
uA
pF
pF
pF
V
IIL
no pull-up or down
-1
-1
1
1
IOZ
CIN
2.8
COUT
CBID3
VIL
Output Capacitance
2.7
2.7
4.9
4.9
Bi-direction buffer Capacitance
Input Low Voltage
CMOS
0.3*Vcc
VIH
Input High Voltage
CMOS
0.7*Vcc
2.4
V
VOH
VOL
RI
IOL=2,4,8,12,16,24mA
IOH=2,4,8,12,16,24mA
VIL=0V or VIH=VCC
Output High Voltage
Output Low Voltage
0.4
V
V
Input Pull-up/down resistance
75
KOhm
(Under recommended operating conditions and Vcc = 3.0 ~ 3.6V, Tj = 0 to +115 oC)
15/19
MTD505 Revision 1.2 14/04/2000
MYSON
MTD505
TECHNOLOGY
(Preliminary)
5.4 Electrical Characteristics
FIGURE 1. RMII timing
T1
REFCLK
T2
T4
CRSDV
RXD[1:0]
Valid
T3
TXEN
TXD[1:0]
Valid
Symbol
Parameter
RMII input setup time
RMII input hold time
RMII output setup time
RMII output hold time
Min.
Typ.
Max.
Unit
nS
Note
T1
T2
T3
T4
1
1
3
5
nS
nS
nS
FIGURE 2. MII timing
T5
RXCLK0
T6
Valid
CRS0/RXDV0
RXD0[3:0]
TXCLK0
T7
T8
TXEN0
TXD0[3:0]
Valid
Symbol
Parameter
MII input setup time
Min.
10
10
3
Typ.
Max.
Unit
nS
Note
T5
T6
T7
T8
MII input hold time
MII output setup time
MII output hold time
nS
nS
5
nS
16/19
MTD505 Revision 1.2 14/04/2000
MYSON
MTD505
TECHNOLOGY
(Preliminary)
FIGURE 3. Memory Write Timing
T5
MEMCLK
T6
T7
RASB
CASB
WEB
T8
T6 T7
T6
T7
AD[8:0]
Valid
Valid
T6 T7
DQ[31:0]
Valid
Symbol
Parameter
Memory clock cycle
Min.
Typ.
Max.
Unit
Note
T5
12
nS
Memory command/address/data
setup time
T6
6
2
nS
Memory command/address/data
hold time
T7
T8
nS
Row active to burst write
2
CLK
FIGURE 4. Memory Read Timing
T5
MEMCLK
RASB
T6
T6
T7
CASB
WEB
T8
T6 T7
T7
AD[8:0]
Valid
Valid
T9
T10
DQ[31:0]
Valid
17/19
MTD505 Revision 1.2 14/04/2000
MYSON
MTD505
TECHNOLOGY
(Preliminary)
Symbol
T10
Parameter
Min.
Typ.
Max.
Unit
nS
Note
Memory read data setup time
Memory ead data hold time
2
2
T11
nS
FIGURE 5. EEPROM timing
T11
EECLK
T13
T12
EEDATA
Valid
Symbol
Parameter
Min.
Typ.
Max.
Unit
uS
Note
T11
T12
T13
EEPROM clock cycle
10
EEDATA input setup time
EEDATA input hold time
1
1
nS
nS
FIGURE 6. LED Interface
LEDCLK1
LEDCLK2
LEDDATA
T14
T15
T16
Valid
Valid
Valid
Symbol
T14
Parameter
Min.
Typ.
20
5
Max.
Unit
uS
Note
Led display strobe period
LEDCLK setup time
LEDCLK hold time
T15
uS
T16
5
uS
18/19
MTD505 Revision 1.2 14/04/2000
MYSON
MTD505
TECHNOLOGY
(Preliminary)
6.0 128 pin PQFP Package Data
Dimension in inch
Min Norm Max
Dimension in mm
Symbol
D
1
Min Norm Max
A
A1
A2
B
-
-
-
0.134
-
-
-
-
3.40
-
D
0.010
0.25
102
65
0.107 0.112 0.117 2.73 2.85 2.97
0.007 0.009 0.011 0.17 0.22 0.27
103
64
C
0.004
-
0.008 0.09
-
0.20
D
0.906 0.913 0.921 23.00 23.20 23.40
0.783 0.787 0.791 19.90 20.00 20.10
0.669 0.677 0.685 17.00 17.20 17.40
0.547 0.551 0.555 13.90 14.00 14.10
D
1
E
E
1
e
L
0.020 BSC
0.50 BSC
0.029 0.035 0.041 0.73 0.88 1.03
L1
y
0.063 BSC
1.60 BSC
128
39
-
-
-
0.004
-
-
-
0.10
o
o
o
o
z
0
7
0
7
1
38
e
B
Note:
1.Dimension D1 & E1 do not include mold protrusion.
But mold mismatch is included. Allowable protrusion is .25mm/.010” per side.
2.Dimension B does not include dambar protrusion. Allowable dambar protru-
sion .08mm/.003”. Total in excess of the B dimemsion at maximum material
condition. Dambar cannot be located on the lower radius or the foot.
3.Controlling dimension : Millimeter.
y
See Detail B
See Detail A
Seating Plane
B
With Plating
Gage Plane
L
z
Base Metal
L1
Detail A
Detail B
19/19
MTD505 Revision 1.2 14/04/2000
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