MULTIWATT8 [ETC]
MULTIWATT; 数瓦
| 型号： | MULTIWATT8 |
| 厂家： | 
ETC |
| 描述： | MULTIWATT |
| 文件： | 总2页 (文件大小：306K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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Thermal Data
MULTIWATT Family
8,11,15 leads (JEDEC MO-048 )
8 leads
11 leads
PACKAGE MATERIAL LIST
15 leads
item #
material
thickness
thermal
conductivity
leadframe
slug
copper
0.5 mm
1.5 mm
3.9 W/cm°C
3.9 W/cm°C
high thermal
conductivity Cu
die attach
soft solder
( tin / lead )
15-50 µm
3 mm
0.2 W/cm°C
0.0063W/cm°C
molding
compound
epoxy resin
Typical assembly configuration before molding :
Charts enclosed :
Rth(j-c) vs. die size and dissipating area
Rth(j-a) vs on board heat sink area
Zth(j-a) vs time width and die size
1)
2)
3)
February 1998
1/2
Thermal Data
MULTIWATT Family
Tcase = 150 ºC
Rth(j-c) (ºC/W)
5
4
3
2
1
0
silicon
diss. area
1)
die thickness = 375 µm
solder thickness = 25 µm
1
2
3
4
5
6
Dissipating area on die ( mm )
Rth(j-a) (ºC/W)
50
die size = 20.000 sq.mils
dissipating area = 2000 sq.mils
40
30
20
10
floating in air
mounted on PC board
2)
mounted on TH17023 heat sink
0
0
1
2
3
4
5
Dissipated Power ( Watt )
Transient Thermal Resistance (ºC/W)
100
SINGLE PULSE
30
Pd = 2 Watt, mounted on board
die size = 35.000 sq.mils
dissipating area = 2.000 sq.mils
10
3
1
3)
Pd = 2 Watt, mounted on board
die size = 175x195 sq.mils
dissipating area =16.000 sq.mils
0.3
0.1
0.03
0.001
0.01
0.1
1
10
100
1,000
Time or pulse width ( s )
2/2
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