MURA230T3/D [ETC]
Surface Mount Ultrafast Power Rectifiers ; 表面贴装功率超快整流器\n
| 型号： | MURA230T3/D |
| 厂家： | 
ETC |
| 描述： | Surface Mount Ultrafast Power Rectifiers
|
| 文件： | 总4页 (文件大小：43K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MURA230T3, MURA240T3
Preferred Devices
Surface Mount
Ultrafast Power Rectifiers
Ideally suited for high voltage, high frequency rectification, or as
free wheeling and protection diodes in surface mount applications
where compact size and weight are critical to the system.
http://onsemi.com
• Small Compact Surface Mountable Package with J–Bend Leads
• Rectangular Package for Automated Handling
• High Temperature Glass Passivated Junction
ULTRAFAST RECTIFIERS
2 AMPERES
• Low Forward Voltage Drop (0.95 Volts Max @ 2.0 A, T = 150°C)
J
300–400 VOLTS
Mechanical Characteristics:
• Case: Epoxy, Molded
• Weight: 70 mg (approximately)
• Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
MARKING
DIAGRAM
• Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
U5x
SMA
CASE 403D
PLASTIC
• Shipped in 12 mm Tape and Reel, 5000 units per reel
• Polarity: Polarity Band Indicates Cathode Lead
• ESD Protection: Human Body Model > 4000 V (Class 3)
ESD Protection: Machine Model > 400 V (Class C)
• Marking: U5F, U5G
x = F (230T3)
G (240T3)
ORDERING INFORMATION
MAXIMUM RATINGS
Device
Package
SMA
Shipping
Rating
Symbol
Value
Unit
MURA230T3
MURA240T3
5000/Tape & Reel
5000/Tape & Reel
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
V
V
V
RRM
SMA
RWM
DC Blocking Voltage
MURA230T3
MURA240T3
V
R
300
400
Average Rectified Forward Current
I
A
A
Preferred devices are recommended choices for future use
and best overall value.
F(AV)
@ T = 150°C
1.0
2.0
L
@ T = 125°C
L
Non-Repetitive Peak Surge Current
(Surge Applied at Rated Load Conditions
Halfwave, Single Phase, 60 Hz)
I
35
FSM
Operating Junction Temperature Range
T
J
–65 to
+175
°C
Semiconductor Components Industries, LLC, 2001
1
Publication Order Number:
February, 2001 – Rev. 0
MURA230T3/D
MURA230T3, MURA240T3
THERMAL CHARACTERISTICS
Characteristic
Symbol
Max
Unit
Thermal Resistance, Junction to Lead (T = 25°C) (Note 1.)
Psi
24
°C/W
L
JL
(Note 2.)
Thermal Resistance, Junction to Ambient (Note 1.)
R
216
θ
JA
ELECTRICAL CHARACTERISTICS
Maximum Instantaneous Forward Voltage (Note 3.)
v
Volts
µA
F
(i = 2.0 A, T = 25°C)
1.30
1.05
F
J
(i = 2.0 A, T = 150°C)
F
J
Maximum Instantaneous Reverse Current (Note 3.)
(Rated dc Voltage, T = 25°C)
i
R
5.0
J
(Rated dc Voltage, T = 150°C)
150
J
Maximum Reverse Recovery Time
t
rr
65
ns
(i = 1.0 A, di/dt = 50 A/µs)
F
1. Rating applies when surface mounted on the minimum pad size recommended, PC Board FR–4.
2. In compliance with JEDEC 51, these values (historically represented by R ) are now referenced as Psi
.
JL
θ
JL
3. Pulse Test: Pulse Width = 300 µs, Duty Cycle v 2.0%.
100
1000
100
T = 175°C
J
T = 175°C
J
10
1
T = 100°C
J
T = 100°C
10
1
J
0.1
T = 25°C
J
T = 25°C
J
0.01
50
100
150
200
250
300
350
400
50
100
150
200
250
300
350
400
V , REVERSE VOLTAGE (VOLTS)
R
V , REVERSE VOLTAGE (VOLTS)
R
Figure 1. Typical Reverse Current
Figure 2. Maximum Reverse Current
10
1
10
1
100°C
100°C
25°C
T
C
= 175°C
T
C
= 175°C
25°C
0.1
0.1
0.01
0.01
0.3 0.4 0.5 0.6 0.7 0.8 0.9
1
1.1 1.2 1.3 1.4
0.5 0.6 0.7 0.8 0.9
1
1.1 1.2 1.3 1.4 1.5
V , INSTANTANEOUS VOLTAGE (VOLTS)
F
V , INSTANTANEOUS VOLTAGE (VOLTS)
F
Figure 4. Maximum Forward Voltage
Figure 3. Typical Forward Voltage
http://onsemi.com
2
MURA230T3, MURA240T3
30
25
20
30
NOTE: MAXIMUM
CAPACITANCE AT
0 V = 29 pF
NOTE: TYPICAL
CAPACITANCE AT
0 V = 26 pF
25
20
15
10
15
10
5
0
5
0
0
4
8
12 16
20 24 28 32 36
40
0
4
8
12
16
20 24
28 32
36 40
V , REVERSE VOLTAGE (VOLTS)
R
V , REVERSE VOLTAGE (VOLTS)
R
Figure 5. Typical Capacitance
Figure 6. Maximum Capacitance
5
4
3
2
1
0.75
0.5
dc
dc
SQUARE WAVE
SQUARE WAVE
0.25
0
1
0
80 90 100 110 120 130 140 150 160 170 180
0
20
40
60
80 100 120 140 160 180
T , LEAD TEMPERATURE (°C)
L
T , AMBIENT TEMPERATURE (°C)
A
Figure 8. Current Derating, Ambient
Figure 7. Current Derating, Lead
(FR–4 Board with Minimum Pad)
4
3.5
3
dc
2.5
SQUARE WAVE
2
1.5
1
0.5
0
0
0.5
1
1.5
2
2.5
3
3.5
I , AVERAGE FORWARD CURRENT (AMPS)
F(AV)
Figure 9. Power Dissipation
http://onsemi.com
3
MURA230T3, MURA240T3
PACKAGE DIMENSIONS
SMA
CASE 403D–01
ISSUE O
S
A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
INCHES
DIM MIN MAX
MILLIMETERS
MIN
4.06
2.29
1.91
1.27
0.10
0.15
0.76
4.83
MAX
4.57
2.92
2.67
1.63
0.20
0.41
1.52
5.59
D
B
A
B
C
D
H
J
0.160
0.090
0.075
0.050
0.004
0.006
0.030
0.190
0.180
0.115
0.105
0.064
0.008
0.016
0.060
0.220
K
S
C
H
J
K
MINIMUM SOLDER PAD SIZE
0.157
4.0
0.0787
2.0
inches
mm
0.0787
2.0
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MURA230T3/D
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