MV04L04T-080 [ETC]

Multilayer Chip Varistor for Surge;
MV04L04T-080
型号: MV04L04T-080
厂家: ETC    ETC
描述:

Multilayer Chip Varistor for Surge

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Document No  
Issued date  
Page  
TMVL-XXOS001D  
2014/04/18  
1/9  
Multilayer Chip Varistor for Surge and  
ESD Protection – L Type Series  
1. Features  
1.1 No polarity due to symmetrical current-voltage characteristics  
1.2 Excellent electro static absorption capability  
1.3 Variable capacitance  
1.4 Working Voltage from 5.5 to 35 VRMS5.5 to 45 Vdc  
1.5 Suitable for ESD Protection  
1.6 Structure  
2. Applications  
2.1 USB 3.0 Power and Data lines I/O Port protection  
2.2 Notebook and PC Computers  
2.3 Monitors and Flat Panel Displays  
2.4 IEEE 1394 Firewire Ports  
2.5 Video Graphics Cards  
2.6 SIM ports Mobile phone  
2.7 Digital Camera  
2.9 MP3/MP4 player  
2.10 LCD Module  
2.11 HUB/ Telecom/ Wireless LAN  
2.12 Keyboard  
TA-I TECHNOLOGY CO., LTD  
Document No  
Issued date  
Page  
TMVL-XXOS001D  
2014/04/18  
2/9  
Multilayer Chip Varistor for Surge and  
ESD Protection – L Type Series  
3. Type Designation  
MV  
06  
L
04  
T
080  
-
Internal Code  
Multilayer  
Varistor  
Size  
Type Series  
Max. Working  
Voltage  
Packaging  
TPaper tape  
040210K  
06034K  
Varistor  
Voltage  
040402  
060603  
080805  
121206  
181812  
0808V  
044V  
12012V  
1111V  
2525V  
33033V  
08053K  
1206 : 3K  
18121K  
4. Dimension  
L
W
D
E
Type  
mm  
mm  
mm  
mm  
0402  
0603  
0805  
1206  
1812  
1.00 ± 0.10  
1.60 ± 0.15  
2.00 ± 0.20  
3.20 ± 0.20  
4.50 ± 0.20  
0.50 ± 0.10  
0.80 ± 0.15  
1.25 ± 0.20  
1.60 ± 0.15  
3.20 ± 0.20  
0.6 max  
0.9 max  
1.0 max  
1.2 max  
2.0 max  
0.25 ± 0.10  
0.30 ± 0.10  
0.40 ± 0.20  
0.50 ± 0.20  
0.50 ± 0.30  
TA-I TECHNOLOGY CO., LTD  
Document No  
Issued date  
Page  
TMVL-XXOS001D  
2014/04/18  
3/9  
Multilayer Chip Varistor for Surge and  
ESD Protection – L Type Series  
5. Rating and Characteristics  
Clamping  
Voltage  
(MAX)  
Energy  
Absorption  
(MAX)  
Working Voltage  
Peak  
Current  
Typical  
Capacitance  
Part Number  
Breakdown Voltage  
(MAX)  
Size  
8/20μs  
(A)  
AC  
(VRMS  
DC  
(V)  
Unit Condition  
1mA (V)  
(V)  
10/1000μs (J)  
1KHz (pF)  
)
MV04L04T-080  
MV04L06T-120  
MV04L11T-180  
MV04L14T-240  
MV06L04T-080  
MV06L06T-120  
MV06L11T-180  
MV06L14T-240  
MV06L17T-270  
MV06L20T-330  
MV06L25T-390  
MV06L30T-470  
MV08L04T-080  
MV08L06T-120  
MV08L11T-180  
MV08L14T-240  
MV08L20T-330  
MV08L25T-390  
MV08L30T-470  
MV08L35T-560  
MV12L04T-080  
MV12L11T-180  
MV12L14T-240  
MV12L17T-270  
MV12L20T-330  
MV12L25T-390  
MV12L30T-470  
MV18L14T-240  
MV18L30T-470  
4
5.5  
9
8(7.5~10.5)  
12(10.2~13.8)  
18(15.3~20.7)  
24(21.6~26.4)  
8(7.5~10.5)  
20  
20  
20  
24  
35  
40  
20  
20  
30  
39  
44  
54  
65  
77  
20  
20  
30  
39  
54  
65  
77  
90  
20  
30  
38  
44  
54  
65  
77  
38  
77  
0.05  
0.05  
0.05  
0.05  
0.1  
0.1  
0.1  
0.1  
0.1  
0.1  
0.1  
0.1  
0.1  
0.1  
0.1  
0.2  
0.3  
0.3  
0.3  
0.3  
0.2  
0.3  
0.3  
0.4  
0.5  
0.6  
0.7  
2.3  
4.2  
200  
135  
50  
6
0402  
11  
14  
4
14  
18  
5.5  
9
20  
15  
45  
30  
650  
300  
210  
160  
145  
130  
110  
90  
6
12(10.2~13.8)  
18(15.3~20.7)  
24(21.6~26.4)  
27(24.3~29.7)  
33(29.7~36.3)  
39(35.1~42.9)  
47(42.3~51.7)  
8(7.5~10.5)  
30  
11  
14  
17  
20  
25  
30  
4
14  
18  
22  
26  
30  
38  
5.5  
9
30  
30  
0603  
30  
30  
30  
30  
80  
1400  
650  
350  
300  
220  
200  
150  
110  
3100  
800  
620  
700  
480  
400  
260  
3500  
1600  
6
12(10.2~13.8)  
18(15.3~20.7)  
24(21.6~26.4)  
33(29.7~36.3)  
39(35.1~42.9)  
47(42.3~51.7)  
56(50.4~61.6)  
8(7.5~10.5)  
80  
11  
14  
20  
25  
30  
35  
4
14  
18  
26  
30  
38  
45  
5.5  
14  
18  
22  
26  
30  
38  
18  
38  
100  
100  
100  
100  
100  
80  
0805  
100  
100  
100  
100  
100  
100  
100  
800  
800  
11  
14  
17  
20  
25  
30  
14  
30  
18(15.3~20.7)  
24(21.6~26.4)  
27(24.3~29.7)  
33(29.7~36.3)  
39(35.1~42.9)  
47(42.3~51.7)  
24(21.6~26.4)  
47(42.3~51.7)  
1206  
1812  
*The Clamping voltage was measured at 8*20 us standard current.  
TA-I TECHNOLOGY CO., LTD  
Document No  
Issued date  
Page  
TMVL-XXOS001D  
2014/04/18  
4/9  
Multilayer Chip Varistor for Surge and  
ESD Protection – L Type Series  
6. Reliability Test  
Environmental  
Specification  
Test Method and Description  
The specimen shall be subjected to 125 ± 2for 1000 ± 12 hours in a  
thermostatic bath without load and then stored at room temperature and  
normal humidity for 1 to 2 hours. The change of varistor voltage shall be within  
10 .  
High Temperature  
Storage/ Dry Heat  
Step  
Temperature  
-40±3  
Period  
30Min±3  
1 hour  
The temperature cycle of specified  
temperature shall be repeated five  
times and then stored at room  
temperature and normal humidity for  
one or two hours. The change of  
varistor voltage shall be within 10﹪  
and mechanical damage shall be  
examined.  
1
2
3
4
Room  
Temperature  
Temperature Cycle  
125±3  
30Min±3  
1 hours  
Room  
Temperature  
After being continuously applied the maximum allowable voltage at 85 ± 2℃  
for 1000± 2 hours, the specimen shall be stored at room temperature and  
normal humidity for one or two hours, the change of varistor voltage shall be  
within 10.  
High Temperature Load  
The specimen should be subjected to 40 ± 2, 90 to 95 RH environment,  
and the maximum allowable voltage applied for 1000 hours, then stored at  
room temperature and normal humidity for one or two hours. The change of  
varistor voltage shall be within 10﹪  
Damp Heat Load  
Humidity Load  
The specimen should be subjected to -40 ± 2, without load for 500 hours  
and then stored at room temperature for one or two hours. The change of  
varistor voltage shall be within 10 ﹪  
Low Temperature  
Storage/ Cold  
TA-I TECHNOLOGY CO., LTD  
Document No  
Issued date  
Page  
TMVL-XXOS001D  
2014/04/18  
5/9  
Multilayer Chip Varistor for Surge and  
ESD Protection – L Type Series  
7. Taping and Reel  
7.1 Packaging  
D
A0  
0.10  
B0  
0.10  
K0  
0.10  
P1  
0.10  
P2  
0.05  
P0  
0.10  
P3  
0.10  
W
0.20  
E
0.10  
F
0.05  
Symbol  
+0.10  
-0.00  
1.50  
1.50  
1.50  
1.50  
1.50  
0402  
0603  
0805  
1206  
1812  
0.85  
1.08  
1.42  
1.88  
3.66  
1.25  
1.88  
2.30  
3.50  
4.95  
0.65  
0.95  
1.04  
1.27  
1.74  
3.00  
4.00  
4.00  
4.00  
8.00  
2.00  
2.00  
2.00  
2.00  
2.00  
4.00  
4.00  
4.00  
4.00  
4.00  
2.15  
2.92  
2.58  
2.12  
4.34  
8.00  
8.00  
8.00  
8.00  
12.00  
1.75  
1.75  
1.75  
1.75  
1.75  
3.50  
3.50  
3.50  
3.50  
5.50  
Unitmm  
7.2 Reel Dimensions  
Symbol  
0402  
A
B
C
D
E
W
W1  
178±1.0  
178±1.0  
178±1.0  
178±1.0  
178±1.0  
60.0±0.5  
60.0±0.5  
60.0±0.5  
60.0±0.5  
60.0±0.5  
13.0±0.2  
13.0±0.2  
13.0±0.2  
13.0±0.2  
13.0±0.1  
21.0±0.2  
21.0±0.2  
21.0±0.2  
21.0±0.2  
21.0±0.2  
2.0±0.5  
2.0±0.5  
2.0±0.5  
2.0±0.5  
2.0±0.5  
9.0±0.5  
9.0±0.5  
9.0±0.5  
9.0±0.5  
13.6±0.2  
1.5±0.15  
1.5±0.15  
1.5±0.15  
1.5±0.15  
1.5±0.15  
0603  
0805  
1206  
1812  
TA-I TECHNOLOGY CO., LTD  
Document No  
Issued date  
Page  
TMVL-XXOS001D  
2014/04/18  
6/9  
Multilayer Chip Varistor for Surge and  
ESD Protection – L Type Series  
8. Recommended land patterns  
8.1 Solder pad layout  
A
B
C
D
0402  
0603  
0805  
1206  
1812  
0.4 ~0.6  
0.8 ~1.2  
1.0 ~ 1.5  
1.8 ~ 2.5  
2.5 ~ 3.3  
1.4 ~ 1.8  
2.2 ~ 2.8  
2.6 ~ 3.2  
4.2 ~ 5.2  
5.5 ~ 6.7  
0.5 ~0.6  
0.6 ~ 1.0  
1.2 ~1.5  
1.2 ~ 1.8  
2.8 ~ 3.6  
0.6 ~ 1.2  
0.9 ~1.5  
1.1 ~ 1.8  
1.2 ~ 1.8  
1.3 ~ 2.2  
(Unitmm)  
8.2 The SIR test of the solder paste shall be doneBased on JIS-Z-3284)  
8.3 Steel plate and foot distance printing  
Foot distance printing(mm/mils)  
>0.65mm/25 mil  
Steel Plate  
0.18mm  
0.15mm  
0.12mm  
0.10mm  
0.65mm/25 mils ~0.5mm/20mils  
0.5mm/20 mils ~0.40mm/16mils  
>=0.40 mm/16 mils  
TA-I TECHNOLOGY CO., LTD  
Document No  
Issued date  
Page  
TMVL-XXOS001D  
2014/04/18  
7/9  
Multilayer Chip Varistor for Surge and  
ESD Protection – L Type Series  
8.4 Reflow and temperature  
8.5 IR reflow Pb Free Process suggestion profile  
(1) The solder recommend is Sn96.5/Ag 3.5 of 120 to 150µm  
(2) Ramp-up rate (217to Peak) + 3/second max  
(3) Temp. maintain at 175 +/-25180 seconds max  
(4) Temp. maintain above 21760-150 seconds  
(5) Peak temperature range 245+20/-10time within 5of actually peak  
temperature (tp) 10~20 seconds  
(6) Ramp down rate +6 /second max.  
Perform adequate test in advance, as the reflow temperature profile will vary according to the conditions of the  
manufacturing process, and the specification of the reflow furnace.  
8.6 Resistance to soldering heat-High Temperature Resistance:260  
,10sec-3times.  
8.7 Hand Soldering  
In hand soldering of the Varistors. Large temperature gradient between preheated the Varistors  
and the tip of soldering iron may cause electrical failures and mechanical damages such as cracking  
or breakings of the devices. The soldering shall be carefully controlled and carried out so that the  
temperature gradient is kept minimum with following recommended conditions for hand soldering.  
TA-I TECHNOLOGY CO., LTD  
Document No  
Issued date  
Page  
TMVL-XXOS001D  
2014/04/18  
8/9  
Multilayer Chip Varistor for Surge and  
ESD Protection – L Type Series  
8.7.1 Recommended Soldering Condition 1  
(1) Solder:  
0.12~0.18mm Thread solder (Sn96.5:Ag3.5) with soldering flux in the core. Rosin-based and  
non-activated flux is recommended.  
(2) Preheating:  
The Varistors shall be preheated so that Temperature Gradient between the devices and the  
tip of soldering iron is 150or below.  
(3) Soldering Iron:  
Rated Power of 20W max with 3mm soldering tip in diameter.  
Temperature of soldering iron tip 380max,3-5sec ( The required amount of solder shall be  
melted in advance on the soldering tip.)  
(4) Cooling:  
After soldering. The Varistors shall be cooled gradually at room ambient temperature.  
8.7.2 Recommended Soldering Condition 2Without preheating)  
(1) Solder iron tip shall not directly touch to ceramic dielectrics.  
(2) Solder iron tip shall be fully preheated before soldering while soldering iron tip to the external  
electrode of Varistors.  
8.8 Post Soldering Cleaning  
8.8.1 Residues of corrosive soldering fluxes on the PC board after cleaning may greatly  
have influences on the electrical characteristic and the reliability (such as humidity resistance) of the  
Varistors which have been mounted on the board. It shall be confirmed that the characteristic and the  
reliability of the devices are not affected by the applied cleaning conditions  
8.8.2 When an ultrasonic cleaning is applied to the mounted Varistors on PC Boards.  
Following conditions are recommended for preventing failures or damages of the devices due to the  
large vibration energy and the resonance caused by the ultrasonic waves.  
(1) Frequency 29MHz max  
(2) Radiated Power 20w/lithr max  
(3) Period 5minuets max  
9. Operating and Storage condition of products  
9.1 Operating Temperature-50~85℃  
9.2 Storage Conditions:  
(1) Storage Temperature: -10~+40℃  
(2) Relative humidity: 75%RH  
(3) Varistor must be kept away from sunlight and stored in a non-corrosive atmosphere.  
9.3 Period of Storage: 1 year  
TA-I TECHNOLOGY CO., LTD  
Document No  
Issued date  
Page  
TMVL-XXOS001D  
2014/04/18  
9/9  
Multilayer Chip Varistor for Surge and  
ESD Protection – L Type Series  
10. ECN  
Engineering Change Notice: The customer will be informed with ECN if there is significant  
modification on the characteristics and materials described in Approval Sheet.  
11. Manufacturing Country & City:  
(1) TA-I TECHNOLOGY ( SU ZHOU ) CO., LTD. ( China – Su Zhou)  
Tel :(+86) 512-63457879 Fax : (+86) 512-63457869  
(2) TA-I TECHNOLOGY ELECTRONIC (DONGGUAN ) CO., LTD. ( China –Dongguan )  
Tel : (+86) 769-8339-47903 Fax : (+86) 769-8339-4794  
(3) FORTUNE TASK RESISTOR FACTORY ( China – Dongguan )  
Tel : (+86) 769-8339-47903 Fax : (+86) 769-8339-4794  
(4) TAI OHM ELECTRONICS ( M ) SDN. BHD. ( Malaysia – Penang )  
Tel :(+60) 4- 3900480 Fax : (+60) 4-3901481  
(5) P.T.TAI ELECTRONIC Indonesia ( Indonesia – Jakarta )  
Tel :(+62) 21-44820254 Fax : (+62) 21-44820256  
TA-I TECHNOLOGY CO., LTD  

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