MXA6500GP [ETC]

Low Cost, Low Noise ±1 g Dual Axis Accelerometer with Absolute Analog Outputs; 低成本,低噪声±1 g两轴加速度计具有绝对模拟输出
MXA6500GP
型号: MXA6500GP
厂家: ETC    ETC
描述:

Low Cost, Low Noise ±1 g Dual Axis Accelerometer with Absolute Analog Outputs
低成本,低噪声±1 g两轴加速度计具有绝对模拟输出

文件: 总6页 (文件大小:84K)
中文:  中文翻译
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Low Cost, Low Noise ±1 g  
Dual Axis Accelerometer with  
Absolute Analog Outputs  
MXA6500G/M  
VDD  
FEATURES  
Low cost  
TEMP  
Temperature  
Internal  
Resolution better than 1 milli-g  
Dual axis accelerometer fabricated on a monolithic  
CMOS IC  
On chip mixed signal processing  
No moving parts; >50,000 g shock survival rating  
5mm X 5mm X 1.55mm LCC package  
2.7V to 3.6V single supply continuous operation  
Compensated for Sensitivity over temperature  
Ultra low initial Zero-g Offset  
No adjustment needed outside  
VREF  
Sensor  
TP  
PD  
Oscillator  
TEMP  
No  
Connection  
CLK  
CLK  
Coarse  
Fine Gain  
Adj.  
Heater  
Control  
Gain Adj.  
Vref  
D/A  
Low Pass  
Filter  
Temp  
Xout  
A/D  
Buf.  
Buf.  
X aixs  
Comp.  
CLK TEMP  
CLK  
CLK  
CLK  
CLK  
Vref  
No  
Connection  
Coarse  
Fine Gain  
Adj.  
Gain Adj.  
Temp  
Low Pass  
Filter  
Y aixs  
Yout  
A/D  
D/A  
Comp.  
APPLICATIONS  
Tilt and motion sensing in cost-sensitive applications  
Smart handheld devices  
Acceleration  
Sensor  
CLK  
CLK  
CLK  
TEMP CLK CLK  
GND  
Computer security  
Input devices  
Pedometers and activity monitors  
Gaming controllers  
MXA6500G/M FUNCTIONAL BLOCK DIAGRAM  
Toys and entertainment products  
GENERAL DESCRIPTION  
The MXA6500G/M is a low cost, dual axis accelerometer  
fabricated on a standard, submicron CMOS process. It is a  
complete sensing system with on-chip mixed signal  
processing. The MXA6500G/M measures acceleration with  
a full-scale range of ±1 g and a sensitivity of 500mV/g @3V  
at 25°C. It can measure both dynamic acceleration (e.g.  
vibration) and static acceleration (e.g. gravity). The  
MXA6500G/M design is based on heat convection and  
requires no solid proof mass. This eliminates stiction and  
particle problems associated with competitive devices and  
provides shock survival greater than 50,000 g, leading to  
significantly lower failure rate and lower loss due to handling  
during assembly and at customer field application.  
The max noise floor is 1 mg/ Hz allowing signals below  
1 milli-g to be resolved at 1 Hz bandwidth. The  
MXA6500G/M is packaged in a hermetically sealed LCC  
surface mount package (5 mm x 5 mm x 1.55 mm height).  
It is operational over a -40°C to 85°C(M) and 0°C to 70°C(G)  
temperature range.  
Information furnished by MEMSIC is believed to be accurate and reliable. However,  
no responsibility is assumed by MEMSIC for its use, nor for any infringements of  
patents or other rights of third parties which may result from its use. No license is  
granted by implication or otherwise under any patent or patent rights of MEMSIC.  
©MEMSIC, Inc.  
800 Turnpike St., Suite 202, North Andover, MA 01845  
Tel: 978.738.0900  
www.memsic.com  
Fax: 978.738.0196  
MEMSIC MXA6500G/M Rev.B  
Page 1 of 6  
3/22/2005  
MXA6500G/M SPECIFICATIONS (Measurements @ 25°C, Acceleration = 0 g unless otherwise noted; VDD = 3.0V unless otherwise  
specified)  
MXA6500G  
Typ  
MXA6500M  
Typ  
Parameter  
Conditions  
Units  
Min  
Max  
Min  
Max  
SENSOR INPUT  
Each Axis  
Measurement Range1  
g
±1.0  
±1.0  
Nonlinearity  
Best fit straight  
line  
0.5  
1.0  
0.5  
1.0  
% of FS  
Alignment Error2  
Alignment Error  
degrees  
degrees  
±1.0  
0.01  
±1.0  
0.01  
X Sensor to Y  
Sensor  
Cross Axis Sensitivity3  
%
±1.5  
±1.5  
SENSITIVITY  
Sensitivity,  
Each Axis  
VDD = 3.0V  
475  
500  
525  
15  
475  
500  
525  
20  
mV/g  
%
Sensitivity Change over  
Temperature4  
Delta from 25°C  
Each Axis  
VDD = 3.0V  
ZERO g BIAS LEVEL  
0 g Offset  
0 g Offset  
1.20  
-0.10  
1.25  
0.00  
1.5  
1.30  
0.10  
1.20  
-0.10  
1.25  
0.00  
1.5  
1.30  
0.10  
V
g
mg/°C  
0 g Offset vs.  
Delta from 25°C  
@25°C  
Temperature4  
NOISE PERFORMANCE  
Noise Density, rms  
FREQUENCY RESPONSE  
3dB Bandwidth  
0.4  
17  
1.0  
19  
0.4  
17  
1.0  
19  
mg/ Hz  
15  
15  
Hz  
POWER SUPPLY  
Operating Voltage Range  
Quiescent Supply Current  
OUTPUTS  
2.7  
3.6  
2.7  
3.6  
V
mA  
@3.0V supply  
@3.0V supply  
2.0  
2.0  
PERFORMANCE  
Output High Voltage  
Output Low Voltage  
Current  
2.30  
2.30  
-40  
V
V
uA  
0.20  
100  
0.20  
100  
Source or sink @  
3.0V-3.6V Supply  
@3.0V supply  
Turn-On Time5  
75  
75  
mS  
TEMPERATURE RANGE  
Operating Range  
0
+70  
+85  
°C  
NOTES  
1
Guaranteed by measurement of initial offset and sensitivity.  
2
Alignment error is specified as the angle between the true and indicated axis of  
sensitivity.  
3
Cross axis sensitivity is the algebraic sum of the alignment and the inherent  
sensitivity errors.  
4 Defined as the output change from ambient to maximum temperature or ambient to  
minimum temperature.  
5 Output settled to within ±17mg.  
MEMSIC MXA6500G/M Rev.B  
Page 2 of 6  
3/22/2005  
ABSOLUTE MAXIMUM RATINGS*  
Supply Voltage (VDD ………………...-0.5 to +7.0V  
)
Storage Temperature ……….…………-65°C to +150°C  
Acceleration ……………………………………..50,000 g  
*Stresses above those listed under Absolute Maximum Ratings may cause permanent  
damage to the device. This is a stress rating only; the functional operation of the  
device at these or any other conditions above those indicated in the operational  
sections of this specification is not implied. Exposure to absolute maximum rating  
conditions for extended periods may affect device reliability.  
Pin Description: LCC-8 Package  
Pin  
1
2
3
4
5
6
7
8
Name  
PD  
TP  
COM  
NC  
NC  
Yout  
Xout  
VDD  
Description  
Power Down Control  
Connect to ground  
Common  
Do Not Connect  
Do Not Connect  
Y Channel Output  
X Channel Output  
2.7V to 3.6V  
THEORY OF OPERATION  
The MEMSIC device is a complete dual-axis acceleration  
measurement system fabricated on a monolithic CMOS IC  
process. The device operation is based on heat transfer by  
natural convection and operates like other accelerometers  
having a proof mass. The proof mass in the MEMSIC  
sensor is a gas.  
Ordering Guide  
Model  
Package Style  
Temperature  
Range  
A single heat source, centered in the silicon chip is  
suspended across a cavity. Equally spaced  
aluminum/polysilicon thermopiles (groups of  
LCC8  
RoHS compliant  
LCC8  
RoHS compliant  
MXA6500GP  
MXA6500MP  
0 to +70°C  
thermocouples) are located equidistantly on all four sides of  
the heat source (dual axis). Under zero acceleration, a  
temperature gradient is symmetrical about the heat source,  
so that the temperature is the same at all four thermopiles,  
causing them to output the same voltage.  
-40 to 85°C  
LCC8, Pb-free  
LCC8, Pb-free  
MXA6500GB  
MXA6500MB  
0 to +70°C  
-40 to 85°C  
All parts are shipped in tape and reel packaging.  
Caution: ESD (electrostatic discharge) sensitive device.  
Acceleration in any direction will disturb the temperature  
profile, due to free convection heat transfer, causing it to be  
asymmetrical. The temperature, and hence voltage output  
of the four thermopiles will then be different. The  
differential voltage at the thermopile outputs is directly  
proportional to the acceleration. There are two identical  
acceleration signal paths on the accelerometer, one to  
measure acceleration in the x-axis and one to measure  
acceleration in the y-axis. Please visit the MEMSIC  
website at www.memsic.com for a picture/graphic  
description of the free convection heat transfer principle.  
Note: The MEMSIC logo’s arrow indicates the -X sensing  
direction of the device. The +Y sensing direction is rotated 90°  
away from the +X direction following the right-hand rule. Small  
circle indicates pin one(1)  
MEMSIC MXA6500G/M Rev.B  
Page 3 of 6  
3/22/2005  
sensing to be achieved with the MEMSIC device (reference  
application note AN-00MX-007).  
PIN DESCRIPTIONS  
DD – This is the supply input for the circuits and the  
V
sensor heater in the accelerometer. The DC voltage should  
be between 2.7 and 3.6 volts. Refer to the section on PCB  
layout and fabrication suggestions for guidance on external  
parts and connections recommended.  
COM– This is the ground pin for the accelerometer.  
TP- This pin should be connected to the ground.  
Xout – This pin is the output of the x-axis acceleration  
sensor. The user should ensure the load impedance is  
sufficiently high as to not source/sink >100µA typical.  
While the sensitivity of this axis has been programmed at  
the factory to be the same as the sensitivity for the y-axis,  
the accelerometer can be programmed for non-equal  
sensitivities on the x- and y-axes. Contact the factory for  
additional information.  
Accelerometer Position Relative to Gravity  
X-Axis  
Y-Axis  
X-Axis  
Orientation  
To Earth’s  
Surface  
(deg.)  
90  
Change  
Change  
X Output per deg. Y Output per deg.  
(g)  
of tilt  
(mg)  
0.15  
1.37  
2.88  
(g)  
of tilt  
(mg)  
17.45  
17.37  
17.16  
16.35  
15.04  
12.23  
8.59  
5.86  
2.88  
1.37  
0.15  
Yout This pin is the output of the y-axis acceleration  
sensor. The user should ensure the load impedance is  
sufficiently high as to not source/sink >100µA typical.  
While the sensitivity of this axis has been programmed at  
the factory to be the same as the sensitivity for the x-axis,  
the accelerometer can be programmed for non-equal  
sensitivities on the x- and y-axes. Contact the factory for  
additional information.  
1.000  
0.996  
0.985  
0.940  
0.866  
0.707  
0.500  
0.342  
0.174  
0.087  
0.000  
0.000  
0.087  
0.174  
0.342  
0.500  
0.707  
0.866  
0.940  
0.985  
0.996  
1.000  
85  
80  
70  
60  
45  
30  
20  
10  
5.86  
8.59  
12.23  
15.04  
16.35  
17.16  
17.37  
17.45  
5
0
PD Pin 1 is the power down control pin. Pull this pin HIGH  
will put the accelerometer into power down mode. When the part  
goes into power down mode, the total current will be smaller than  
0.1uA at 3V.  
Changes in Tilt for X- and Y-Axes  
In normal operation mode, this pin should be connected to  
Ground.  
Resolution: The accelerometer resolution is limited by  
noise. The output noise will vary with the measurement  
bandwidth. With the reduction of the bandwidth, by  
applying an external low pass filter, the output noise drops.  
Reduction of bandwidth will improve the signal to noise  
ratio and the resolution. The output noise scales directly  
with the square root of the measurement bandwidth. The  
maximum amplitude of the noise, its peak- to- peak value,  
approximately defines the worst case resolution of the  
measurement. With a simple RC low pass filter, the rms  
noise is calculated as follows:  
DISCUSSION OF TILT APPLICATIONS AND  
RESOLUTION  
Tilt Applications: One of the most popular applications of  
the MEMSIC accelerometer product line is in  
tilt/inclination measurement. An accelerometer uses the  
force of gravity as an input to determine the inclination  
angle of an object.  
A MEMSIC accelerometer is most sensitive to changes in  
position, or tilt, when the accelerometer’s sensitive axis is  
perpendicular to the force of gravity, or parallel to the  
Earth’s surface. Similarly, when the accelerometer’s axis is  
parallel to the force of gravity (perpendicular to the Earth’s  
surface), it is least sensitive to changes in tilt.  
Noise (mg rms) = Noise(mg/ Hz ) *  
(Bandwidth(Hz)*1.6)  
The peak-to-peak noise is approximately equal to 6.6 times  
the rms value (for an average uncertainty of 0.1%).  
Following table and figure help illustrate the output  
changes in the X- and Y-axes as the unit is tilted from +90°  
to 0°. Notice that when one axis has a small change in  
output per degree of tilt (in mg), the second axis has a large  
change in output per degree of tilt. The complementary  
nature of these two signals permits low cost accurate tilt  
POWER SUPPLY NOISE REJECTION  
One capacitor is recommended for best rejection of power  
supply noise (reference figure below). The capacitor should  
be located as close as possible to the device supply pin  
(VDD). The capacitor lead length should be as short as  
MEMSIC MXA6500G/M Rev.B  
Page 4 of 6  
3/22/2005  
possible, and surface mount capacitor is preferred. For  
typical applications, the capacitor can be ceramic 0.1 µF.  
PCB LAYOUT AND FABRICATION SUGGESTIONS  
1. It is best to connect a 0.1uF capacitor directly across  
VDD and COM pin.  
2. Robust low inductance ground wiring should be used.  
3. Care should be taken to ensure there is “thermal  
symmetry” on the PCB immediately surrounding the  
MEMSIC device and that there is no significant heat  
source nearby.  
4. A metal ground plane should be added directly beneath  
the MEMSIC device. The size of the plane should be  
similar to the MEMSIC device’s footprint and be as  
thick as possible.  
5. Vias can be added symmetrically around the ground  
plane. Vias increase thermal isolation of the device  
from the rest of the PCB.  
Power supply noise rejection  
MEMSIC MXA6500G/M Rev.B  
Page 5 of 6  
3/22/2005  
LCC-8 LOW PROFILE PACKAGE DRAWING  
Hermetically Sealed Package Outline  
MEMSIC MXA6500G/M Rev.B  
Page 6 of 6  
3/22/2005  

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