PC-354NT [ETC]
Opaque Mini-flat Package AC Input Type Photocoupler(226.81 k) ; 不透明的微型扁平封装AC输入型光耦合器（ 226.81 K）\n
| 型号： | PC-354NT |
| 厂家： | 
ETC |
| 描述： | Opaque Mini-flat Package AC Input Type Photocoupler(226.81 k)
|
| 文件： | 总5页 (文件大小：224K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Op a q u e *, Min i-fla t P a c k a g e ,
AC In p u t Typ e
(Unit : mm)
■
■
Fe a t u re s
AC inputs
2. Opaque type, mini-flat package
Internal connection
diagram
(l-channel)
Subminiature type
Cathode
Anode/
.
.
(The volume is smaller than that of our
Emitter
Collector
conventional DIP
Isolation voltage between input and output
:3
by as far as
“
Employs double transfer mold technology
Hybrid substrates that require high density
mounting.
Programmable controllers
2.
“In
of
etc.
by
In
WARP
latest
any
In
any of
devices,
In
3 0 1
of
■
Ma x im u m
Parameter
Rating
Symbol
P
Unit
A
Forward current
Input
Peak forward current
Power dissipation
Collector -emitter voltage
-collector voltage
Collector current
6
1
—
50
–
Collector
Total
*zIsolation voltage
temperature
power
dissipation
150
170
m W
3
750
to
I
Storage temperature
*3 Soldering temperature
to
260
–
Pulse
ratio
for 1 minute
For 10
Classification
current transfer
)
Conditions
■
Ch a ra c t e ris t ic s
(Ta 25°C )
Parameter
Symbol
Conditions
MIN.
TYP.
Unit
—
voltage
1.4
v
A
v
Input
Terminal capacitance
Collector dark
V=O,
250-
—
= 20V, IF= O
10
—
output
Collector -emitter breakdown voltage
Emitter -collector breakdown voltage
Current transfer
—
—
6
CTR
lmA,
40 to
20
400
%
v
Collector -emitter saturation voltage
resistance
0.1
0.6
3
0.2
.
—
Floating capacitance
1.0
teristics
time
Response time
Fall time
t f
1 8
302
60
\
10
100
100
50
0
Ambient temperature T. (“(’)
Ambient temperature
250
1
100
\
100
()
30
temperature
Ambient temperature T:,
)
Fig. 6 F o r w a r d
R a t io
I
2.0
o
0.5
Forward voltage
ratio
303
Collector dark current I
.
(A)
Relative
transfer
Current transfer ratio
.
1
I
I
I
I
I
I
I
I
I
I
I
Collector-emitter
voltage
Collector current
(MA)
Input
-
0
Forward current
(mA)
Re flo w
■
Te m p e ra t u re
One time soldering reflow is recommended
within the condition of temperature and
time profile shown below.
(2)
When using another soldering method such
as infrared ray lamp, the temperature may
rise partially in the mold of the device.
Keep the temperature on the package of
the device within the condition of above
(l).
1
1
minute
2
minutes
1 . 5
.
refer to the chapter “Precautions for Use” .(Page
to
305
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